Carolyn Ellinger | Eastman Kodak: What are the key factors that enable Kodak to achieve both low sheet resistance and high optical transparency in their roll-to-roll manufacturing process?
00:05:06 - 00:05:13
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Summary of the clip:
What are the key factors that enable Kodak to achieve both low sheet resistance and high optical transparency in their roll-to-roll manufacturing process?
Kodak's roll-to-roll manufacturing process is capable of achieving a sheet resistance of less than one ohm per square while maintaining greater than 85% optical transparency. This performance is attributed to a combination of factors, including the materials used, the printing techniques employed, and the design of the conductive patterns. The speaker highlights that these results are not unusual for their organization.
The use of a geometric mesh pattern, as mentioned earlier in the presentation, is crucial for achieving high optical transparency. By creating a network of conductive lines with open spaces in between, light can pass through the substrate, resulting in a transparent conductive film. The specific geometry of the mesh, including the line width and pitch, can be optimized to achieve the desired balance between conductivity and transparency.
Furthermore, the electroless deposition of copper, combined with the inorganic passivation layer, contributes to both the low sheet resistance and the long-term stability of the conductive film. The speaker notes that while lower sheet resistance is possible, it would come at the cost of optical transparency, indicating a trade-off that must be carefully considered based on the specific application requirements.
In this short video, you can learn:
* The typical sheet resistance and optical transparency values achieved by Kodak.
* The role of geometric mesh patterns in achieving high transparency.
* The trade-off between sheet resistance and optical transparency.
π **Clip Abstract** This segment discusses Kodak's ability to achieve low sheet resistance (less than 1 ohm/sq) and high optical transparency (greater than 85%) in their roll-to-roll process, highlighting the importance of geometric mesh patterns.
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#RollToRollManufacturing, #GeometricMesh, #ElectrolessCopper, #TransparentConductors, #FlexibleElectronics, #TouchscreenDisplays
This is a highlight of the presentation:
Flexo for High-Resolution Roll-to-Roll Manufacturing
More Highlights from the same talk.
02:20 - 03:35
How does Kodak print low-void, high-aspect-ratio copper microwires down to 6-8 microns using flexography and electroless deposition?
How does Kodak print low-void, high-aspect-ratio copper microwires down to 6-8 microns using flexography and electroless deposition?
Kodak leverages its legacy in roll-to-roll additive manufacturing to print functional electronics using flexography in a cleanroom environment. At a design resolution of 12,800 DPI (approx. 2 microns per pixel), the process routinely achieves 6 to 8-micron physical features on web substrates.
The core of Kodak's microwire technology lies in printing a catalyst followed by electroless copper deposition rather than electrochemical plating. This enables the formation of isolated conductive islands and complex rectilinear meshes without requiring continuous electrical connections across the entire design layout during processing.
In this short video, you can learn:
* How flexographic printing of catalysts coupled with electroless copper deposition creates independent, isolated conductive islands.
* The trade-offs between a design-level 2-micron pixel resolution and real-world 6 to 8-micron features on substrate.
* Why electroless deposition provides greater design freedom compared to traditional electrochemical plating methods.
π **Clip Abstract** This clip details Eastman Kodak's high-resolution flexographic printing and electroless plating process for creating copper microwires. Carolyn Ellinger explains how printing catalysts enables independent conductive features down to 6-8 microns without requiring electrical connections for electroplating.
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#ElectrolessDeposition, #FlexographicPrinting, #CopperMicrowires, #CatalystPrinting, #PrintedElectronics, #RollToRollManufacturing
16:07 - 17:23
What are the hidden registration and tolerance pitfalls when transitioning from sheet-to-sheet to true roll-to-roll flexographic printing?
What are the hidden registration and tolerance pitfalls when transitioning from sheet-to-sheet to true roll-to-roll flexographic printing?
Transitioning printed electronics from sheet-to-sheet prototyping to high-volume roll-to-roll (R2R) production introduces complex mechanical variables, especially regarding layer-to-layer alignment. Unlike sheet-based systems where individual sheets can be dynamically aligned and adjusted relative to the print tooling, true R2R printing keeps the web continuously connected under tension.
In a high-speed flexographic system, the print tooling is a rigid analog cylinder. Consequently, registration tolerances must accommodate web tension, substrate deformation, and cumulative runout, requiring designers to negotiate functional product specifications rather than relying on the idealized, per-sheet adjustments possible in low-volume R&D.
In this short video, you can learn:
* The fundamental registration differences between dynamic sheet-to-sheet alignment and continuous roll-to-roll printing.
* How rigid analog print cylinders and a connected moving web affect layer-to-layer alignment tolerances.
* Strategies for reconciling design tolerances with the physical realities of high-speed web tension and material properties.
π **Clip Abstract** Carolyn Ellinger highlights the core challenges of scaling printed electronics from sheet-to-sheet to continuous roll-to-roll manufacturing. She emphasizes that managing registration and layer-to-layer alignment on a continuous web requires adapting to rigid analog tooling and web tension.
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#RollToRollRegistration, #FlexographicPrinting, #WebTensionControl, #SubstrateDeformation, #PrintedElectronics, #FlexibleElectronics
07:01 - 08:05
Why is 3D aspect ratio management critical when moving from silver inks to printed copper microwires?
Why is 3D aspect ratio management critical when moving from silver inks to printed copper microwires?
While X and Y dimensions define the resolution and footprint of a circuit, the Z-dimension (ink thickness) dictates electrical and optical performance. Flexography bridges the gap between thin inkjet printing and thick-film screen printing, but controlling ink spread during drying and curing remains a major challenge.
To bypass the lateral spreading associated with thick silver inks, Kodak utilizes a hybrid approach: printing an ultra-thin catalyst layer to minimize initial line-width expansion, then building up vertical thickness via electroless copper plating. This maintains high aspect ratios with low feature resistance while keeping the overall trace width extremely narrow.
In this short video, you can learn:
* Why controlling the Z-axis (aspect ratio) is just as critical as X-Y resolution in printed electronics.
* How thin catalyst printing followed by electroless copper buildup prevents ink spreading.
* The positioning of flexography relative to screen printing and inkjet technologies in terms of deposited thickness.
π **Clip Abstract** Carolyn Ellinger explains the crucial role of aspect ratio and the Z-dimension in high-resolution printed electronics. She highlights how printing a thin catalyst layer followed by electroless copper plating prevents the ink-spreading issues common to thick silver printing.
π Link in comments π
#ElectrolessCopperPlating, #CopperMicrowires, #FlexographicPrinting, #HighAspectRatioTraces, #PrintedElectronics, #AdditiveMetallization