Ryan Banfield | Heraeus Electronics: Beyond new chemistry, how does this solderable polymer unlock process efficiencies in manufacturing?
00:06:13 - 00:06:34
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Summary of the clip:
Beyond new chemistry, how does this solderable polymer unlock process efficiencies in manufacturing?
The speaker emphasizes that the new solderable polymer material represents more than just a new chemistry; it unlocks process efficiencies. This advancement allows manufacturers to utilize the same attachment methods they have employed for decades, simply by implementing this new process. Additive technology, in general, offers advantages such as increased sustainability and a reduced manufacturing footprint compared to subtractive technology.
Additive technology is typically greener and more cost-effective, providing greater flexibility in form factors through the use of flexible substrates. The ability to directly attach circuits and components onto these substrates, without relying on two-part epoxies, removes a significant historical inhibitor. This capability extends the applicability of printed electronics into sectors like power electronics and traditional CMOS-based additive technologies.
The speaker identifies the crucial missing link as the method for bonding components or chips onto printed electronic substrates. This new material eliminates the need for connectors, enabling direct bonding using the SAC305 material process. By overcoming the limitations of two-part epoxies, this innovation facilitates advancements in wearable technology, the health industry, automotive applications, and the Internet of Things.
In this short video, you can learn:
* How the new material streamlines manufacturing processes by integrating with existing methods.
* The sustainability and cost benefits of additive technology compared to subtractive technology.
* The expanded application areas enabled by direct component attachment without epoxies.
š **Clip Abstract:** This segment explains how the solderable polymer not only introduces a new material but also enhances manufacturing efficiency, promotes sustainability, and broadens the scope of printed electronics applications. It highlights the practical benefits for manufacturers.
š Link in comments š
#SolderablePolymer, #AdditiveManufacturing, #PrintedElectronics, #ComponentBonding, #WearableTech, #IoTDevices
This is a highlight of the presentation:
Bridging the Gap Between Additive and Subtractive Technologies: the Solderable Polymer Revolution.
More Highlights from the same talk.
00:00:45 - 00:00:47
Why is a solderable polymer necessary when high-temperature fired materials have been available for decades?
Why is a solderable polymer necessary when high-temperature fired materials have been available for decades?
The speaker introduces the concept of a solderable polymer material and poses the question of its necessity, given the existing high-temperature fired materials. He highlights his extensive experience in the printed electronics industry, spanning approximately 25 years. He notes that since the advent of the membrane switch in the mid-1970s, the industry has been aiming to replace traditional subtractive technology.
However, the speaker argues that the focus should shift from replacement to augmentation and support. He suggests leveraging the knowledge and advancements from the traditional technology industry and integrating them into the printed electronics sector. The core limitation of the polymer thick film industry, according to the speaker, lies in solderability.
The ability to attach components directly to the substrate has been restricted to two-part or one-part epoxy-based materials, which present challenges such as long pot life, viscosity changes over time, evolving processing parameters, extended cure cycles, and low attachment rates. The speaker asserts that solder, in every aspect, is superior to epoxy-based materials due to its snap cure, higher conductivity, enhanced mechanical strength, and improved reliability in demanding applications.
In this short video, you can learn:
* The historical context of printed electronics and its relationship with subtractive technologies.
* The limitations of epoxy-based materials in printed electronics applications.
* The advantages of solder over epoxy in terms of performance and reliability.
š **Clip Abstract:** This segment introduces the need for solderable polymers by contrasting them with existing solutions like epoxies and high-temperature materials, highlighting the limitations of current approaches in printed electronics. It sets the stage for understanding the benefits of the new material.
š Link in comments š
#SolderablePolymer, #PolymerThickFilm, #ComponentAttachment, #EpoxyAdhesives, #PrintedElectronics, #ElectronicPackaging
00:03:33 - 00:03:52
How does the temperature limitation of existing polymer thick films restrict design capabilities in printed electronics?
How does the temperature limitation of existing polymer thick films restrict design capabilities in printed electronics?
The speaker identifies a major industry gap concerning the temperature limitations of solderable-based materials, specifically in polymer thick films. Many of these materials degrade at temperatures around 200 degrees Celsius, making them unable to withstand traditional solder reflow processes. This limitation significantly restricts design capabilities, preventing the full utilization of the advantages offered by soldering techniques.
Furthermore, the speaker addresses issues related to silver migration and the oxidation of copper particles in older solderable polymers. Copper particles, when used in these polymers, tend to oxidize during the reflow process, especially without an inert gas environment. This oxidation can lead to the softening and reflowing of the polymer matrix, causing the inks to flow out and resulting in poor bond quality.
These issues highlight the reasons why polymers have been historically unsuitable for solder reflow processes. Additionally, the high temperatures involved in soldering can damage certain substrates, which presents another limitation when using solder in specific applications. The speaker emphasizes that the missing link has been a polymer-based material capable of positively reacting with the solder reflow process, particularly the SAC305 process.
In this short video, you can learn:
* The temperature constraints of traditional polymer thick films.
* The problems associated with silver migration and copper oxidation in solderable polymers.
* The need for a polymer material that can withstand solder reflow processes without degradation.
š **Clip Abstract:** This section details the temperature-related challenges and material limitations that have historically hindered the use of solderable polymers in printed electronics, emphasizing the need for a more robust solution. It explains why existing materials fail under standard solder reflow conditions.
š Link in comments š
#PolymerThickFilms, #SolderReflowLimitations, #CopperOxidation, #SAC305Compatibility, #PrintedElectronics, #ElectronicPackaging