Tadas Kildušis | Akoneer: How does the laser-induced surface activation compare to traditional lithography in terms of process flow and material usage?
00:02:22 - 00:02:55
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Summary of the clip:
How does the laser-induced surface activation compare to traditional lithography in terms of process flow and material usage?
The SSAIL (selective surface activation induced by laser) process involves using a laser to pattern a clean substrate, typically glass, without any pre-processing, additives, or coatings. Following laser patterning, the substrate undergoes chemical activation and electroless plating. Copper plates selectively onto the laser-processed areas, creating a conductive trace. This is fundamentally different from lithography, which typically involves applying a photoresist, exposing it to UV light through a mask, developing the resist, etching away unwanted material, and then removing the resist.
The SSAIL process is described as a semi-additive process, meaning that material is selectively added only where it is needed, unlike subtractive processes like etching. A key advantage of this approach is the strong adhesion of copper to the substrate, resulting from a chemical bond formed between the copper and the substrate. This strong adhesion extends to vias and other features, enhancing the overall reliability of the circuit.
In this short video, you can learn:
* How laser surface activation enables selective plating on dielectric materials.
* The difference between theSSAIL process and traditional lithography.
* The benefit of strong chemical adhesion between the plated metal and the substrate.
📋 **Clip Abstract** This segment details the core steps of the SSAIL process, highlighting its departure from traditional lithographic techniques by using laser-induced surface activation for selective electroless plating. The resulting chemical bond ensures high adhesion between the copper and the substrate.
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#SSAILProcess, #LaserSurfaceActivation, #ElectrolessPlating, #ChemicalAdhesion, #AdvancedPackaging, #PrintedElectronics
This is a highlight of the presentation:
Making of multilayer glass HDI PCB
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00:04:22 - 00:04:55
What are the cost implications of using SSAIL compared to established methods like screen printing and lithography?
What are the cost implications of using SSAIL compared to established methods like screen printing and lithography?
The speaker addresses the cost-effectiveness of the SSAIL technology in relation to other established methods for creating conductive patterns. While a precise cost analysis is not provided, the speaker positions SSAIL's cost profile relative to screen printing and lithography. Screen printing is generally considered a low-cost method, particularly for high-volume production of simple patterns. Lithography, on the other hand, is typically more expensive due to the complex equipment, materials, and multi-step processes involved.
The speaker states that SSAIL is "probably more costly than screen printing" but "way less costly than lithography." This suggests that SALSA occupies a middle ground in terms of cost, potentially offering a balance between the simplicity and low cost of screen printing and the high resolution and precision of lithography. The actual cost will depend heavily on the specific application, volume, and performance requirements.
In this short video, you can learn:
* The relative cost positioning of SSAIL compared to screen printing and lithography.
* That SALSA is more expensive than screen printing.
* That SSAIL s less expensive than lithography.
📋 **Clip Abstract** This segment briefly discusses the cost of the SALSA process, positioning it as more expensive than screen printing but less expensive than lithography, suggesting a balance between cost and performance.
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#SSAIL, #ScreenPrinting, #Photolithography, #PatterningCosts, #SemiconductorProcessing, #PrintedElectronics
00:08:35 - 00:09:39
What are the challenges associated with stacking multiple layers of glass substrates with copper traces, and how does the presented mechanical polishing process address these challenges?
What are the challenges associated with stacking multiple layers of glass substrates with copper traces, and how does the presented mechanical polishing process address these challenges?
The primary challenge in creating multi-layer glass PCBs using the SSAIL process arises from the "mushrooming" effect during electroless plating. Because the plating process is chemical, copper tends to deposit not only within the laser-etched grooves but also on the surrounding surface, creating protrusions that extend beyond the glass substrate. When multiple glass substrates with these protruding copper traces are bonded together, gaps form between the layers, leading to potential reliability issues.
To address this, a mechanical polishing step is introduced. This polishing process removes the excess copper from the surface, effectively planarizing the copper traces and ensuring they conform to the shape of the grooves. This planarization is crucial for achieving a uniform and reliable bond between the glass substrates, eliminating the gaps and ensuring good electrical contact between the layers. The polishing step is enabled by the strong adhesion of the copper to the glass, which prevents the traces from being dislodged during the process.
In this short video, you can learn:
* The "mushrooming" effect during electroless plating and its impact on multi-layer stacking.
* How mechanical polishing is used to planarize copper traces and eliminate gaps between layers.
* The importance of strong copper adhesion for the success of the polishing process.
📋 **Clip Abstract** This segment explains the challenges of stacking glass substrates due to copper overgrowth during plating and introduces a mechanical polishing step to remove excess copper, ensuring a flat surface for reliable bonding in multi-layer structures.
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#ElectrolessPlating, #CopperPlanarization, #GlassSubstrateStacking, #MechanicalPolishing, #AdvancedPackaging, #HighDensityInterconnects