top of page

Agenda

Speakers from some of the world's leading companies will present on their requirements and research, with many new announcements.  You will learn about the needs and case studies from key end-user companies.  You will also hear about the latest innovations from companies involved in the fields of  Additive, Sustainable, Flexible, Printed, R2R, Hybrid, 3D, Structural, Soft, InMold, Textiles, Stretchable, Wearable Electronics.

Confirmed Talks (agenda to be announced shortly) - Work in progress

Day 1 | 12 June

Keynote Presentations | Ballroom C
TechBlick
Khasha Ghaffarzadeh

TechBlick

Khasha Ghaffarzadeh

Welcome & Introduction

9:00 AM

More

Asahi Kasei
Masayuki Abe

Asahi Kasei

Masayuki Abe

Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology

9:05 AM

More

The supply chain that delivers products and services to end consumers is constantly changing and is exposed to various risks such as diseases, counterfeit crimes, geopolitics, natural disasters, and economics. In order to solve these issues, it is important to visualize the end-to-end status of individual products from upstream to downstream, and to upgrade and optimize the SC based on the visualized data. One of the solutions is the realization of smart logistics and flexible sensors for understanding the status of individual products. Asahi Kasei has developed RFID labels with submicron resolution R2R electrode printing technology and a data platform using blockchain. In this presentation, we will introduce the submicron resolution R2R electrode printing technology and RFID labels, as well as the roadmap toward smart logistics and the data platform. 2. R2R electrode printing technology with submicron resolution The line width that can be achieved with existing printing processes are generally several tens of microns, and the most advanced ones are about 10 microns, but the line width of the process we have developed has an ultra-high resolution of about 250 nm. To achieve this, we developed in- house the three elements, those are conductive nano ink, submicron-resolution cylindrical mold (SRM), and the R2R high-definition printing process. The key element is the SRM, which is fabricated using a proprietary electron beam lithography process for cylindrical rollers. Furthermore, the unique R2R printing process incorporating this SRM achieves low-cost production through continuous printing. 3. RFID labels with guaranteed authenticity By using our technology, we develop an "authenticity-assured" RFID label. The label consists of submicron to several microns wide metal wires embedded with a special pattern to detect counterfeiters. The label is therefore designed to ensure the authenticity of the product to which it is affixed, while enabling RFID-based product identification and communication. In addition, the label can be attached to various products because it is transparent in appearance and does not interfere with the design. The RFID has a general dipole antenna shape, and the communication distance can be designed according to the required specifications, with a maximum distance of several meters. When read by the IoT edge device developed at the same time, it determines whether the label is manufactured by Asahi Kasei or not, and generates digitalized information with the product ID. 4. Roadmap We develop a platform configuration for digitizing label information attached to individual products and preventing tampering. Currently, only RFID labels with guaranteed authenticity are available, but in the future, flexible sensors with measurement functions for various physical quantities will be developed to create an infrastructure for the realization of smart logistics.

Energy Materials Corporation
Thomas Tombs

Energy Materials Corporation

Thomas Tombs

Commercializing High-speed Production of Perovskite Solar Panels

9:25 AM

More

Energy Materials Corporation (EMC) is scaling up to manufacture Perovskite solar panels for multi-GW/year production volumes using high speed roll-to-roll equipment. The methodology of EMC’s commercialization approach is described, including the steps to go from lab scale inks and methods to high-speed prototype demonstrations and culminating with full scale production of finished panels. The challenges and equipment for all stages of the commercialization process are reviewed. EMC’s projected cost per Watt for manufacturing perovskite solar cells at the GW-scale is shown to be a fraction of the best-case projections for Silicon solar cells, which enables local manufacturing in regions with high energy and labor costs.

Voltera
Jesus Zozaya

Voltera

Jesus Zozaya

Multi-layer Flexible Displays using Electroluminescent Ink

9:45 AM

More

This research unveils a cutting-edge technique for prototyping multi-layer flexible displays using electroluminescent ink. Additively deposited using a direct ink writing dispensing system, this ink opens up new use cases for functional information display and aesthetic appeal. These inks can be printed on diverse substrates, such as glass, paper, and plastic, enabling a new dimension in creative and interactive packaging solutions across various industries.

FLEXOO
Jean-Charles Flores

FLEXOO

Jean-Charles Flores

Mass customization & mass production of Smart Sensors

10:05 AM

More

Mass customization & mass production of Smart Sensors
As we specialize in delivering end-to-end solutions for smart sensors and electronics, from initial development to final manufacturing, we will highlight in this presentation how it is possible to enable the mass production of smart sensing elements in record time. We will present our strategy to go toward mass customization and give examples for e-mobility & renewable energy storage, military, automotive and logistic applications.

About the author
Jean-Charles Flores is a creative technologist with passion for innovation and a gift for connecting people, ideas and technologies. He started his industrial carrier at Ciba and then BASF where he worked as scientist, technologist and program manager for more than a decade. In 2019, he founded anthos iD_ and in 2023, co-founded Flexoo where his mission is to stir the tremendous creative power of Flexoo’s team into developing always smarter sensors that seamlessly integrate into our daily life. Jean-Charles holds a PhD in Material Sciences and an Engineering degree from the National Chemistry School of Montpellier.

About the company
Flexoo, based in Heidelberg, Germany, is a leading provider of printed electronics and sensors, dedicated to driving innovation and delivering high value to its customers. A unique manufacturing setup, characterized by flexibility, quality, and unparalleled productivity, sets the company apart as the ideal partner for mass production of smart sensors and electronics.

Exhibition Networking Event

10.25AM

Track 1 | Ballroom C
GE Aerospace
Joint presentation

joint

GE Aerospace

Printed Electronics for Embedded RF Die Packaging

11:15 AM

More

Felippe J Pavinatto

Felippe J Pavinatto

Additive Electronics manufacturing is employed at GE Aerospace as an enabler for
devices and systems in the areas of harsh environment sensing, electronics packaging, power electronics, and structural health monitoring (SHM), as well as telecommunication systems and soft robotics. The possibility of using direct-write printing to fabricate conformal devices on non-planar aerospace surfaces using innovative materials and inks is the focus of our printed electronics team. In this talk, we will present the latest developments on the use of high-resolution 3D printed ceramics and micro-dispensing and aerosol jet printing for the fabrication of embedded electronics packaging for radiofrequency (RF) devices. The manufacturing of a multilayer circuit with a 4 x 4 array of low-noise amplifier (LNA) RF chips embedded in alumina will be described. This will include details on material selection and process development for conductive via, dielectric moat ramp and printed RF interconnects fabrication. In conclusion,the performance of a unit cell in the array will be presented to demonstrate the viability of using printed materials and methods for 3D packaging RF devices.

Printed Electronics for Embedded RF Die Packaging

11:15 AM

Akoneer
Joint presentation

joint

Akoneer

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

11:35 AM

More

Tadas Kildusis

Tadas Kildusis

Selective Surface Activation Induced by Laser (SSAIL) technology allows creating Cu traces on any dielectric material (organic, glass, ceramic, etc.). In first part of this talk we are presenting our results for high throughput 10-25 µm trace formation on FR4 and PET for PCB/FPC production. In the second part we discuss 1-25 µm traces on PI, EMC and glass for semiconductor packaging. This enables novel methods for PCB/FPC and semiconductor packaging avoiding chemical etching, masks and reducing power consumption and waste.

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

11:35 AM

Holst Centre
Joint presentation

joint

Holst Centre

Additive manufacturing for 3D structural microelectronics

11:55 AM

More

Hylke Akkerman

Hylke Akkerman

Over the years, electronics and its components have continuously developed towards a higher density, but largely in the same rigid flat form factor of PCBs. To achieve higher density electronics in complex 3D arrangements, TNO at Holst Centre has developed a multi-material additive manufacturing process named “3D additive lithography for electronics” (3D-ALE). With this fabrication process a scanning DMD-based light engine is used to pattern photopolymers down to 10 um structures. Within the patterned photopolymer cavities are designed for component placement (particularly suitable for bare-die components) and tracks for metal paste filling to fabricate the circuitry. Continuous successive layer-by-layer build-up allows for complex high-density electronics in 3D structural embodiments.

Additive manufacturing for 3D structural microelectronics

11:55 AM

NanoPrintek
Joint presentation

joint

NanoPrintek

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

12:15 PM

More

Masoud Mahjouri-Samani

Masoud Mahjouri-Samani

NanoPrintek presents its disruptive “dry multimaterial printing” technology that transforms the current printing ecosystem. This presentation highlights the unparalleled capability of this technology and shows how it can print directly from metals and semiconductors to insulators and composites (even from scraps and rocks!) and on various substrates. The current printing ecosystem is liquid-based, which heavily suffers from major drawbacks, including i) the need for a complex and pollutive supply chain, ii) expensive and extensive ink formulation processes, iii) surfactants and contaminants, iv) limited printing inks, and v) the need for high-temperature post-processing. This talk presents NanoPrintek’s disruptive inkless multimaterial printing technology, where various materials can be printed seamlessly from solid sources. The key technology advantages include 1) on-demand and in-situ generation of various pure nanoparticles without contaminations, 2) in-situ and real-time laser sintering of nanoparticles on various substrates with no post-processing, 3) multimaterial printing of hybrid and tunable nanocomposite materials and structures. This supply-chain resilient, clean, and highly cost-effective technology transforms the electronics printing ecosystem to a new realm where pure, multimaterial, multifunctional, and hybrid materials are printed on demand, enabling various applications in the electronics, healthcare, automotive, aerospace, defense, and energy industries.

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

12:15 PM

Lunch & Exhibition Break
Joint presentation

joint

Lunch & Exhibition Break

Lunch & Exhibition Break

12:35 PM

More

Lunch & Exhibition Break

12:35 PM

Kateeva
Joint presentation

joint

Kateeva

Billions of drops per second, where do you want them?

2:05 PM

More

Kent Ubellacker

Kent Ubellacker

Electronics and display industry applications push the limits of inkjet printing in terms of accuracy and volume control. It’s one thing to meet these objectives in a laboratory environment, but an entirely different experience to scale to production. Materials in use such as optical light emitting diodes, quantum dots, and numerous encapsulants create a challenging environment for inkjet nozzle reliability and performance.Drop placement correction is one core technology to maintain high quality printing. Used in tandem with highly reliable printing equipment and world class printing algorithms, high accuracy can be achieved in applications ranging from multi thickness layer printing to discrete pixel printing.

Billions of drops per second, where do you want them?

2:05 PM

Komori America Corporation
Joint presentation

joint

Komori America Corporation

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

2:25 PM

More

Doug Schardt

Doug Schardt

Application of micro-LEDs in a wide range of products is expected and with the ever-increasing trend towards miniaturization, very small and precisely placed print is a requirement. This presentation will examine the smallest diameter bump that can be accurately produced with gravure offset.Current bonding techniques using ACF can be improved by moving to solder paste bonding which is expected. Solder paste itself works very well with gravure offset with the main requirement of small, precise solder bumps.Within the process of gravure offset printing creating and maintaining the minimum possible bump size is determined by two main variables and the presentation examines those variables and reveals the smallest possible bump diameter that can be created using gravure offset and solder paste.

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

2:25 PM

Quantica
Joint presentation

joint

Quantica

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

2:45 PM

More

Marcel Strobel

Marcel Strobel

In the world of printed electronics, challenges in technology and material limitations have remained a barrier to more widespread adoption. This talk will explore the transformative potential of leveraging high viscosity materials for inkjet printing. Marcel will dive into Quantica’s NovoJet inkjet printing technology, showcasing its capability to expand the repertoire of printable materials. Additionally, the presentation will delve into new avenues for applications in printed electronics, shedding light on the exciting possibilities ahead.

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

2:45 PM

Notion Systems
Joint presentation

joint

Notion Systems

Advanced Patterning with EHD and Inkjet

3:05 PM

More

Maximilian Mosberg

Maximilian Mosberg

One of the founding ideas of Notion Systems was to replace the current subtractive process chains with additive process steps in electronics manufacturing. The n.jet inkjet platform is used to produce electronic displays, printed circuit boards, semiconductor components, as well as high precision optical 3D parts, covering the full range of solutions from lab to fab. Main inkjet applications are coating, dispensing or patterning. Patterning can easily be done with inkjet printing, as it is a digital printing process with drop-on-demand functionalities. Depending on the print head and the material used, resolutions of 20 µm are possible. Despite the fact that this is an interesting technology for any industries, there are limitations with this technology for certain display or semiconductor applications. For this reason, Notion Systems has invested in a collaboration with Scrona AG of Switzerland, which has developed an EHD printing technology.Electrohydrodynamic (EHD) printing is a new high-resolution printing technology that enables maskless, direct-write, non-contact, conformal and additive patterning at the micron scale with a variety of ink systems and materials. Print resolution exceeds that of conventional inkjet printing by two to three orders of magnitude, it paves the way for additive printing in applications dominated by photolithographic microfabrication and enables entirely new devices made from micro-scale building blocks.MEMS multi-nozzle printheads with ultra-high print resolution, enabling applications with resolution greater than 1 μm. This Research and development tool is targeted to advanced development labs in various fields of micro-fabrication and digital additive manufacturing.

Advanced Patterning with EHD and Inkjet

3:05 PM

Joint presentation

joint

Exhibition & Refreshment Break

3:25 PM

More

Exhibition & Refreshment Break

3:25 PM

VTT
Joint presentation

joint

VTT

Advancing printed and hybrid electronics from concepts to pilot factory manufacturing

4:10 PM

More

Antti Kemppainen

Antti Kemppainen

Printed and hybrid electronics technologies are currently being developed for elastic wearable smart patches for health and medical applications. Also thin flexible smart labels are highly interesting for several industries to improve transparency, efficiency and security of the logistics throughout their product life cycle. Today with printed and flexible electronics solutions for practically any function required can be developed, but the bottleneck is often in upscaling. In this presentation the speeding up the upscaling utilizing VTT’s Printocent Pilot Factory is discussed. Development of printing, component assembly, postprocessing and testing is described.

Advancing printed and hybrid electronics from concepts to pilot factory manufacturing

4:10 PM

Raytheon | An RTX Business
Joint presentation

joint

Raytheon | An RTX Business

Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics

4:30 PM

More

Daniel Hines

Daniel Hines

Additive manufacturing (AM) methods are coming of age and being used to not only fabricate structural and prototype parts but also to fabricate high-quality electronic components and circuits. Direct-write (DW) printing is emerging as one of the more promising AM methods for the fabrication of printed circuitization, printed interconnects, and other printed passive circuit components. These printed hybrid electronics (PHE) fabrication methods provide specific advantages for heterogeneous integration at both the package and board levels, for RF electronics, and for conformal electronics. Examples include: i) rapid prototyping, ii) printed interconnects, and iii) new form factors for integrating electronics directly into structural parts. Such PHE fabrication capabilities will be highlighted primarily in terms of manufacturing methods for next-gen electronics.

Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics

4:30 PM

CondAlign AS
Joint presentation

joint

CondAlign AS

Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

4:50 PM

More

Morten Lindberget

Morten Lindberget


CondAlign’s range of adhesive ACFs for low-temperature, low-pressure bonding of electronics components is well suited for the Flexible and Hybrid Electronics (FHE) area. These products offer electrical and mechanical bonding of components to flexible (and rigid) substrates at room temperature with no heat or other post curing required. With a typical bonding pressure of ca 0,1 – 0,3 MPa, instant functionality is immediately achieved.These adhesive ACFs contain a pressure sensitive adhesive material comprising conductive particles. The particles are aligned in z-direction with the patented technology, creating an anisotropic conductive film. The process is well suited for continuous roll-to-roll production and is implemented in CondAlign’s coating line. The alignment allows for significantly reduced use of particles (while still maintaining good electrical conductivity in Z-direction), which again leads to a) reduced material cost compared to traditional ECAs, b) retaining the initial polymer properties very well (adhesiveness, softness, flexibility, transparency etc),and c) reduced environmental impact through reduced particle content, as well as reduced energy consumption in the bonding process. The reduced environmental impact is documented by an independent part (CEMAsys), which shows a considerable reduction in CO2 emission, compared to two traditional processes: Reflow soldering, and bonding with silver filled epoxy. Extensive in-house and customer tests have been performed, regarding temperature cycling and humidity stability, in-plane and through-plane resistance, mechanical stress, capacity to lead current, adhesiveness etc.

Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

4:50 PM

Northrop Grumman
Joint presentation

joint

Northrop Grumman

Advanced Electronics for Space Systems of the Future

5:10 PM

More

Anthony  DeCicco

Anthony DeCicco

Modern day advanced technology for electronics are on track for major use cases and applications for terrestrial purposes. But the environments of space and getting there, lead to a set of new challenges that may force us to reinvent how we will produce systems that will reside in space. This talk will discuss those challenges and offer some suggestions on where the technology needs to go. It will also investigate which are candidates for actually producing these articles, not just for space, but in space which could include on orbit, or on planetary or lunar surfaces. The need is there. The technology is not. Come see why.

Advanced Electronics for Space Systems of the Future

5:10 PM

Joint presentation

joint

Drinks Reception (ends at 7pm)

5:30 PM

More

Drinks Reception (ends at 7pm)

5:30 PM

Track 2 | Room 3545
Linxens
Joint presentation

joint

Linxens

Merging technologies for tomorrow’s medical wearables

11:15 AM

More

Alix Joseph

Alix Joseph

Medical wearables are rapidly transforming the healthcare landscape, holding immense potential to revolutionize preventive care, disease management, and patient engagement. As the demand increases, the construction of such device require to merge very diverse technologies and to make them work together. The expansion of biosensors, their integration into wearable sensors together with skin adhesive and flexible materials, and the continuous growth of communication technologies such as NFC and Bluetooth lead to infinite combination for another level of medical monitoring.

Merging technologies for tomorrow’s medical wearables

11:15 AM

TracXon
Joint presentation

joint

TracXon

Trillion-Sensor Economy Enabled by Printed Electronics.

11:35 AM

More

Ashok Sridhar

Ashok Sridhar

The "trillion-sensor economy" metatrend prophecy is coming true. To realize its full potential in an effective and responsible manner, a re-think in the way sensing systems are manufactured, exploited and recycled, is necessary. Printed Electronics is emerging as a key-enabler for large-scale and sustainable manufacturing of sensing systems. TracXon, a fully-integrated foundry for Printed Electronics, is helping several B2B customers in realizing their ambition to be part of this trillion-sensor economy. In this talk, some application examples are presented.

Trillion-Sensor Economy Enabled by Printed Electronics.

11:35 AM

Spark Biomedical
Joint presentation

joint

Spark Biomedical

Wearable Neuromodulation

11:55 AM

More

Alejandro Covalin

Alejandro Covalin

Wearable technology is rapidly transforming our lives, extending far beyond fitness trackers and smartwatches. In healthcare, wearables are set to revolutionize how we diagnose and treat medical conditions. While most current medical wearables focus on sensing physiological data for diagnostics, there is also a growing need for wearable therapeutics. A new frontier is emerging in this space: wearable neuromodulation therapy. This innovative approach uses miniaturized devices for targeted neural stimulation, offering promising treatments for many conditions. Advancements in printed electronics—celebrated for their flexibility, MRI compatibility, ease of use, and affordability—are paving the way for the widespread adoption of this groundbreaking therapy.

Wearable Neuromodulation

11:55 AM

GE HealthCare
Joint presentation

joint

GE HealthCare

Sustainability in single use medical sensors/devices

12:15 PM

More

Gurvinder Singh Khinda

Gurvinder Singh Khinda

Sustainability has become one of essential part of a product life cycle and biomedical industry is not an exception rather it is one of major industry using wide ranges of single use medical products. Addressing sustainability of these products is important especially due to their biohazard nature and sanitation issues. This presentation will cover ongoing effort to address cost and sustainability issues of single use devices through use of Flexible Hybrid Electronics (FHE) manufacturing, evaluation of novel materials usage, introduction of environmentally conscious design practices, and life cycle assessment methodologies. Examples of two additively manufactured demonstrators: single-use vital sign monitor system (SUVSM) and single-use ECG leads (SUEL) will be discussed showing feasibility and benefits of FHE manufacturing approach.

Sustainability in single use medical sensors/devices

12:15 PM

Joint presentation

joint

Lunch & Exhibition Break

12:35 PM

More

Lunch & Exhibition Break

12:35 PM

Copprium
Joint presentation

joint

Copprium

Conductive Ink Technologies: Shaping Innovation and Opportunity

2:05 PM

More

Edward  Tierney

Edward Tierney

Conductive Ink Technologies: Shaping Innovation and Opportunity

2:05 PM

Carnegie Mellon University
Joint presentation

joint

Carnegie Mellon University

Soft & Stretchable Electronics with Liquid Metal

2:25 PM

More

Carmel Majidi

Carmel Majidi

Over the past decade, there’s been tremendous advancements in soft and highly stretchable circuitry for use in epidermal electronics for health monitoring, wearable computing, and soft robotics. As these technologies continue to improve, there is increasing interest in new material architectures that allow for manufacturing scale-up, printability over large areas, and robust interfacing with surface-mounted microelectronics. One promising approach is to use metal alloys like eutectic gallium-indium (EGaIn) that are liquid at room temperature and which can be incorporated as microfluidic inclusions within a soft elastomer substrate. As the surrounding elastomers stretches, the fluidic inclusions can elongate and maintain electrical connectivity. Moreover because of their high electrical conductivity, EGaIn can support digital circuit functionality and potentially replace the rigid metallic interconnects that are used in current circuit boards. In this talk, I will present several approaches for using EGaIn as electrical interconnects and conductive inks for stretchable electronics. This includes efforts to create circuits composed of microfluidic channels of liquid metal that directly interface with the pins of packaged microelectronic chips. I will also present recent efforts to combine EGaIn and soft elastomers to create composite materials composed of percolating networks of microscale EGaIn droplets (along with other metallic particles) within a soft elastomer matrix. Soft polymers blended with liquid metal exhibit unique combinations of high electrical or thermal conductivity, high stretchability, and low elastic stiffness. In particular, I will show how these composites can be formulated to function as printable conductive inks and thermal interface materials. Applications include soft printed circuits that maintain stable electrical resistance under strain, elastic transducers capable of sensing and actuation, and thermal interface materials for high performance computing.

Bio: Carmel Majidi is the Clarence H. Adamson Professor of Mechanical Engineering at Carnegie Mellon University, where he leads the Soft Machines Lab. His research group develops novel material architectures that allow machines and electronics to be soft, elastically deformable, and biomechanically compatible. This includes research with liquid metal and shape memory materials for creating “artificial” skin, nervous tissue, and muscle for applications in soft robotics and wearable computing. Prof. Majidi has received Young Investigator awards from DARPA, ONR, AFOSR, and NASA, is an author on >200 journal publications, has 28 issued patents, and is co-founder of several spin-off companies.

Soft & Stretchable Electronics with Liquid Metal

2:25 PM

Electroninks Incorporated
Joint presentation

joint

Electroninks Incorporated

Novel Uses for Metal−Organic Decomposition (MOD) Inks with an Emphasis on Copper

2:45 PM

More

Michael Vinson

Michael Vinson

Novel Uses for Metal−Organic Decomposition (MOD) Inks with an Emphasis on Copper

2:45 PM

Heraeus Electronics
Joint presentation

joint

Heraeus Electronics

Functional electronic inks as an enabler for the latest advancements in healthcare

3:05 PM

More

Ryan Banfield

Ryan Banfield

2022 healthcare spending in the U.S. alone was $4.5 trillion and grew at an annual rate of 5.3% between 2017 and 2022. The sheer size of the market provides a major opportunity for suppliers at all points of the value chain, especially if they have enabling technology that facilitates the megatrends surrounding healthcare. These drivers include: A rapidly growing elderly population due to increased life expectancy. Technology advancement is growing at the rate of Moore’s law, driven by device miniaturization. The availability of huge data, driving the use of artificial intelligence and data analytics. An increasing focus on cost reduction. A tightening labor market, which has led to staff shortages, especially for nurses. A stringent regulatory environment, which slows approval of new products. An increased awareness of health and fitness by consumers, leading to wider adoption of wearables. These drivers have resulted in a rapid shift in point of care from the provider to ambulatory, home, and virtual care options. Also, the increasing availability of low-cost portable and wearable sensors facilitates the shift to remote points of care.For decades, functional electronic inks have proven to be a dependable, cost-efficient and energy efficient technology for highly reliable electronic circuitry and components, especially for medical devices. One of the main advantages over other processes is that functional electronic inks use an additive process, whereas the various conductor, resistor, and dielectric pastes are screen-printed or deposited by other means, then cured or fired in succession to form the circuit or electrode. This reduces waste. Also, most functional electronic inks have been developed without toxic substances subject and are RoHS and REACH compliant. Screens are relatively easy to manufacture and allow for flexibility in circuit design. Screen printing technology is capable of feature sizes from hundreds of microns down to 30 microns or less. The continuing drive to print smaller and thinner features enables device miniaturization. Functional electronic inks may be tailored for new form factors such as 3D, flexible, and stretchable substrates. These unique advantages make functional electronic inks the technology of choice for medical device electronics and medical sensors.In this presentation, we will summarize how functional electronic inks enable current and future devices that directly address the trends in the healthcare industry. Heraeus Electronics, with its extensive portfolio of functional electronic inks and pastes and matched systems is in a prime position to support these advancements.

Functional electronic inks as an enabler for the latest advancements in healthcare

3:05 PM

Joint presentation

joint

Exhibition & Refreshment Break

3:25 PM

More

Exhibition & Refreshment Break

3:25 PM

Loomia Technologies
Joint presentation

joint

Loomia Technologies

Integration Techniques for Electronic Textiles: Bridging Hard and Soft Materials

4:10 PM

More

Madison Maxey

Madison Maxey

Explore practical integration strategies for seamlessly incorporating the Loomia Electronic Layer - a type of E-textile- into various fabrics, trims, and plastics. Delve into the nuanced considerations of each method, with a focus on understanding their advantages, limitations, and ideal applications. This session aims to equip attendees with the knowledge needed to effectively scale electronic integration within trims, providing valuable insights for product developers working at the intersection of rigid and flexible materials. From automotive PU leathers to performance fabrics for AR/VR, this discussion offers practical guidance for navigating the challenges of integrating electronics into textiles and sheet materials.

Integration Techniques for Electronic Textiles: Bridging Hard and Soft Materials

4:10 PM

Parc/SRI International
Joint presentation

joint

Parc/SRI International

Textile-based Audio Recording System

4.30PM

More

Nicole Heidel

Nicole Heidel

Active smart textiles are reaching a turning point, moving from systems that collect low-rate data from the wearer to complex, distributed systems that collect large amounts of data from the surrounding environment. This move is pushing on the demands of integration, power, and on-textile data analysis. SRI International is leading a team as part of the IARPA SMART ePANTS program where we will integrate an audio recording system into a garment.In this talk, I will discuss the challenges to integration and our approach to solving them. I will discuss our audio recording performance thus far, as well as some potential options for on-garment power.Further, I will discuss how we work collaboratively with our garment designers to integrate the entire system into a wearable garment that is both stylish and high performing.

Textile-based Audio Recording System

4.30PM

AFFOA
Joint presentation

joint

AFFOA

Democratizing the Toolkit for E-textile System Integrators

4:50 PM

More

Michelle Farrington

Michelle Farrington

Due to the lack of standardization for components often used in the development of soft systems, the system integration design role often requires a complex set of material decisions to be made, often with a lack of performance data, both in the textile and electrical domains. This results in a significantly longer time from idea to prototype to production product, and a commensurately heavier investment than the typical electronic system requires. To open the design space to soft systems, AFFOA is developing a library of fully tested components to augment the datasheets provided by the manufacturers, along with combining system integration techniques to these components to test their in-device performance.

Democratizing the Toolkit for E-textile System Integrators

4:50 PM

SunRay Scientific
Joint presentation

joint

SunRay Scientific

Increased Functionality for IoT through Flip Chip Die Attach of Wire-Bondable Chips on Flexible Hybrid Electronics (FHE)

5:10 PM

More

John Yundt

John Yundt

Using Magnetically Aligned ZTACH® ACE
Smart label product tags (e.g. RFID tags) are ubiquitous for inventory control and asset security but require ever more functionality to support the Internet of Things (IoT). There are many options on the market for functional die with advanced capabilities beyond ID logging, such as environmental or positional recording. However, these chips are often designed for wire bonding interconnection; preventing them from being readily used in Flexible Hybrid Electronics (FHE) applications. SunRay Scientific will present success of flip chip attachment of a commercially available NFC bare die designed for wire bonding using a standard SMT line. The die were attached using a novel anisotropic conductive epoxy, ZTACH® ACE, for flexible hybrid electronics (FHE). Implementation of a successful interconnection with flip-chip bonding is nontrivial, but there are significant advantages to be found with success. Attaching a die using a flip-chip bonding requires fewer process steps than wire bonding. The size of the circuit is significantly reduced through the elimination of the wire bond pads around the periphery of the die. Flip chip bonding is also more amenable to the materials used in FHE than wire bonding. These advantages combined with the low temperature and high-speed processing of ZTACH set the stage for mass produced inexpensive connected FHE sensors. The ZTACH® ACE material is composed of a binary epoxy resin loaded with ferromagnetic particles that have a high electrical conductivity coating. During the curing of the epoxy, a magnetic field is applied
using SunRay’s patented ZMAG® Magnetic Pallet, causing the ferromagnetic particles to align in columns forming a low electrical resistivity path through the thickness of the epoxy (and between the components and matching bonding pads), while maintaining very high electrical isolation laterally between pads. The epoxy upon cure also serves as an underfill eliminating the need for an additional process step. ZTACH® ACE material and processing reshapes current FHE packaging via single-step packaging of mixed electronic components that otherwise cannot handle elevated pressure and high temperature during assembly. Additionally, lower profile component attachment is enabled on flexible substrates so smart labels are not limited by rigidity and thickness, allowing addition of security features and integrated sensing, while decreasing costs and meeting performance requirements. This emerging anisotropic conductive epoxy is compatible with SMT lines’ sheet-to-sheet (S2S) processing. The goal of this talk will be to demonstrate the possibilities of transitioning existing wire-bondable functional bare die to FHE systems using ZTACH® ACE and existing SMT infrastructure. With additional process development, this approach of enabling manufacture of enhanced capability IoT systems using existing die and SMT infrastructure could be made widely available to US contract manufacturers.

Increased Functionality for IoT through Flip Chip Die Attach of Wire-Bondable Chips on Flexible Hybrid Electronics (FHE)

5:10 PM

Joint presentation

joint

Drinks Reception (ends at 7pm)

5:30 PM

More

Drinks Reception (ends at 7pm)

5:30 PM

Closing Presentations

Drinks Reception & Exhibition

5:40 PM

Day 2

The Analyst-led agendas for TechBlick events are put together by industry experts and attract many of the leading global organisations involved in emerging technologies.  All participants will also have access to over 340 on-demand presentations, expert led- masterclasses and exclusive networking sessions on the virtual TechBlick platform too.

bottom of page