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On-Site Masterclasses

There will be two parallel tracks of industry-led masterclasses on 11 June 2024, the day before the conference and exhibition. 

 

Each 45-min masterclass will cover a technology or application detail, offering an insightful blend of practical, technological and application knowledge. These masterclasses be delivered by industry experts and may involve live demonstrations

Contact Chris@TechBlick.com if you have any queries.

All MCs
Track 1
Track 2
Track 3
Start Time
Boston, USA
Masterclasses | Track 1

9:00 AM

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Conductive Inks and Pastes: Technologies and Applications

Alan Brown

Nagase ChemteX America

In this masterclass, we will be discussing the different types of conductive inks and how they are used in various applications. As part of that we will also discuss the type of testing which is done on conductive inks for these applications to ensure the proper ink is selected.

10:00 AM

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Liquid Metal Technology: Technologies, Applications, Practice and State-of-the-Art

Michael Dickey

NC University

Liquid metals based on gallium have remarkable properties: melting points below room temperature, water-like viscosity, low-toxicity, and effectively zero vapor pressure (they do not evaporate). These properties are useful for making best-in-class stretchable conductors. Despite the large surface tension of liquid metal, they can be patterned into non-spherical shapes (cones, wires, antennas) due to a thin, oxide skin that forms rapidly on its surface. This course will discuss patterning techniques, applications, and emerging opportunities with liquid metals.

11:00 AM

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Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications.

Christophe Sansregret

MiQro Innovation Collaborative Centre (C2MI)

Flexible hybrid electronics are devices that combine rigid surface mounted components and flexible substrates. Such device exploits the performance and reliability merits of semiconductor technologies while capitalizing on the flexibility and low cost of printed electronics. However, effecting the interconnections necessary for this integration in a repeatable and reliable fashion is no simple task. This course will provide an overview of available interconnect technologies along with their respective strengths and shortcomings, drawing from both theory and practical experience.

12:00 PM

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Full R2R Process Flow for Flexible and Hybrid Electronics with Test and Verification Aspects

Tuomas Happonen

VTT

Advanced manufacturing technologies enable processing of flexible and hybrid electronics in roll format for high-volume throughput. This class presents a full R2R process flow including printing, assembly and converting steps before injection over-molding for the final FHE element. The course discusses challenges when involving several processing methods and pilot lines, and provides recommendations and practical guidelines for a smooth process flow from roll to element. In addition, available test and verification methods along the production chain will be presented for both quality control and reliability assessment.

Start Time
Boston, USA
Masterclasses | Track 2

9:00 AM

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Digital Additive Manufacturing of Electronic Devices: Inkjet, Aerosol, Dispensing, EHD printing and beyond

Mark Poliks

Binghamton University

Additive manufacturing of electronic devices and interconnects continues to advance with the evolution of new printing methods and associated conductive and dielectric material inks. This tutorial will review printing methods, materials, and applications. The ability to print smaller circuit features, ground planes, filled vias and printed “wire bonds” that interconnect the substrate to silicon devices will be described. Recent results from studies on medical and industrial sensors, printed RF components, high-temperature electronics, and high-power wide- bandgap SiC power electronics packages will be included.

10:00 AM

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3D Printed Electronics

Martin Hedges

Neotech AMT

3D Printed Electronics (3D PE) is the Additive Manufacturing of electronics and complete mechatronics systems using digital driven printing and assembly technologies. In this class, you will learn about all aspects of (3D PE): 1. What is 3D Printed Electronics / What are its uses and benefits? 2. 3D Printed Electronics Processes, Systems & Strategies 3. Current Markets & Applications 4. Active Research & Future Perspective

11:00 AM

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Wearables for Healthcare Applications

Charlotte Kjellander

TNO Holst

Wearable skin sensors or ‘the smart skin’ offer new ways for remote monitoring to support the accessibility to and sustainability of healthcare systems along the entire care cycle: from healthy lifestyle to screening, diagnosis and post treatment surveillance.

Recent advances in technology printed electronics, in miniaturization of sensors and in photonics, have significantly contributed to the wearable technology. All of these sensors can be integrated into stretchable, flexible and breathable wearables which can be worn during weeks.

In this Masterclass you will learn about the Vital Signs wearable patch – an open platform for measurements of biophysical read-outs as well as about its potential applications for remote monitoring for well-being and heath. What is more, we will share how next generation wearable technology platform can address healthcare needs. We will also address challenges on the road ahead concerning manufacturing, durability of wear and signal reliability.

12:00 PM

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Screen Printing, Curing, and Testing/Post-Processing: Technologies, Practice, State-of-the Art

John Crumpton

Celanese

There are many details involved with screen printing. “Best practices” are discussed for proper set-up to ultimately to help improve control of thick film deposition. This class provides a understanding of the printing process to enable troubleshooting and solving printing problems. Along with printing, the drying/curing process is also a critical step, and the different types of drying process and equipment are described with recommendations on how to setup for optimum properties. Once dry, products need to be tested for performance, Test methods for measuring electrical, physical, and mechanical properties of processed parts will be touched on with recommendations for suitable equipment and materials.

Start Time
CET
Masterclasses | Track 3

9:00 AM

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Navigating the Market Landscape: Qualifying Ideas and Overcoming Barriers in Printed Electronics

Molex

Wladimir Punt

The technology of printed electronics has the capacity to boost efficiency, and create fresh opportunities for innovation in many markets such as automotive and medical. This session will prioritize the exploration of goto-market experiences over the technology itself, offering valuable insights into the obstacles and challenges that may arise when introducing a new technology.
Attendees can expect to gain a deeper understanding of the hurdles and barriers that come with introducing printed electronics to the automotive market through discussions on industry standards, customer-specific norms, quality management, product requirements, regulatory compliance, and potential contractual or safety issues.
This session will also offer a sneak preview of potential go-to-market scenarios in the medical industry, showcasing how printed electronics can be utilized and which entry barriers might apply.

10:00 AM

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Wearable Sensors for Healthcare Applications

TNO at Holst

Charlotte Kjellander

With rising prevalence of chronic diseases, healthcare organizations are dealing with resourcing issues, enormous pressure on personnel, long patient waiting lists, and missed health screening appointments, further pressurized by the consequences of the recent coronavirus pandemic.

This more than ever highlights a need in a sustainable healthcare from economic, social, and environmental perspective.

Wearable skin sensors or ‘the smart skin’ offer new ways for remote monitoring to support the accessibility to and sustainability of healthcare systems along the entire care cycle: from healthy lifestyle to screening, diagnosis and post treatment surveillance.

Recent advances in technology printed electronics, in miniaturization of sensors and in photonics, have significantly contributed to the wearable technology. All of these sensors can be integrated into stretchable, flexible and breathable wearables which can be worn during weeks.

In this Masterclass you will learn about the Vital Signs wearable patch – an open platform for measurements of biophysical read-outs as well as about its potential applications for remote monitoring for well-being and heath. What is more, we will share how next generation wearable technology platform can address healthcare needs. We will also address challenges on the road ahead concerning manufacturing, durability of wear and signal reliability.

11:00 AM

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3D Structural In-Mold Electronics: New Design Freedom and New Design Rules

TactoTek

Karthikesh Raju

In-Mold Electronics (IME) is a proven technology for bringing functionality into mechanical structures, making formerly dead spaces alive and functional. Basic IME in its simplest form - flat or mildly curved surfaces augmented with printed wiring - offers straightforward solutions for eg. for touch sensing, antennas, and heating elements.

More complex functionality requires basic IME to be augmented with existing components, such as LEDs and control systems in case of complex lighting. Design wise, IME with thermoplastic electronics substrates and plastic wirings offers a platform for thermoplastic electronics: A contemporary cost-effective solution for mass produced 3D electronics and true smart surfaces.

Integration of electronic functionalities, mechanical support, and decorative materials into a single monolithic structure instead of multiple distinct parts leads directly to drastic reduction of materials and logistics needed. Further, the additive process of printing electronics directly onto thin substrate diminishes the environmental load implied in using traditional PCBs and wet etching methods.
In the masterclass, we discuss the overall 3D structural IME solution with real-life applications and demonstrators concerning the main manufacturing and design aspects. Special emphasis is given to the changes in design rules going from traditional PCB electronics with separate mechanical parts to formable structural electronics.

12:00 PM

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Technologies for High-Resolution R2R Manufacturing

Eastman Kodak

Carolyn Ellinger

The use of printing techniques to manufacture flexible electronics is now commonplace for a range of products – from consumer electronics to medical tests to automotive components. Product requirements drive choices in manufacturing techniques. This talk will review features that can be delivered by different print methos for comparison against a diverse set of end-use requirements.

There are multiple, readily available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). There is a further distinction between print technologies for the range of inks that can be printed, as well as the volume of ink that can be deposited in a single-pass.

We will review a high-level comparison between print technologies – mapping the technical capabilities of each to the features required for end products. Advantages of these additive R2R technologies will be covered - looking beyond the “obvious” potential materials savings over subtractive technologies for potential benefits to both the manufacturer and the end-product stakeholders.

The discussion will extend to ways to achieve the best performance from various print systems. Working examples will be primarily taken from Kodak’s high-resolution flexographic functional printing system, however broader insights will be shared. We will explore how best to take full advantage of “addressable resolution” and print speed in print systems, with attention to various process elements that must be considered and controlled.

Company Tours | 11 June 2024

Boston is a hotbed of innovation with an excellent university, pioneering companies as well as applied research centres

 

In the afternoon of 11 June 2024, we will be organising several guided tours to  the state-of-the-art research centres and companies  in and around Boston, allowing you to experience the best-in-class facilities first hand.

We will be announcing more tours, over the next few weeks. These tours are open to attendees on the morning masterclasses. Places on the tours will be allocated on a first come, first served basis.
 
The tours will leave at 1.30pm and attendees should meet at the registration desk.  Transportation will be provided and the tours are expected to return to the UMass by 6.00pm.

AFFOA
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This tour is limited to 30 people, and places will be allocated on a first come, first served basis.

 

Advanced Functional Fabrics of America (AFFOA) is revolutionizing the textile industry by transforming traditional textiles into sophisticated devices and systems, enabling novel products that use fabrics as a service.

 

Your visit to AFFOA headquarters will include a guided tour, technology demonstrations, and the opportunity to ask any questions you may have about the Institute’s capabilities and focus areas.

 

This visit will also include a presentation from AFFOA’s Chief Strategy Officer, Michelle Farrington, who will share in more detail the activities taking place in the advanced fabric ecosystem, promising new technologies, and innovative partnerships that will shape the future of advanced functional fabrics.

affoa.org

E Ink Holdings Inc
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This tour is limited to 40 people, and places will be allocated on a first come, first served basis.  E Ink is a 45 minute drive from UMASS and transportation will be provided.

E Ink is the originator, pioneer and commercial leader in ePaper technology. The company delivers its advanced display products to the world's most influential brands and manufacturers, enabling them to install extremely durable, low power displays in previously impossible or unimaginable applications and environments.
 
E Ink’s corporate philosophy centers around delivering revolutionary products, excellent user experiences, and environmental benefits through advanced technology development. E Ink has pledged reaching NetZero by 2040 and RE100 by 2030 and is committed to joining international initiatives related to carbon reduction. The Company participates in programs such as RE 100, EP 100, The Climate Pledge, and SBTi science-based targets. E Ink has adopted the TCFD framework to disclose financial impacts of climate-related risks and opportunities.
 
In this visit, attendees will learn about recent advancements in E Ink technology, tour the Company’s History Wall and participate in a hands-on demonstration of ePaper fabrication: laser cutting, lamination and module operation.

www.eink.com/about

Boston harbour Tour

30 people can join this tour, which will be allocated on a first come, first serve basis on the 11th June.

You and your colleagues can take a 2-hour narrated inner Boston harbour tour including a turn-around in front of, The USS Constitution, the oldest commissioned naval vessel in the United States.

See our website

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Quantica

Digital Printing of high viscosity pastes

This tour is limited to 20 people, and places will be allocated on a first come, first served basis.  Quantica is a 25 minute drive from Estrel Congress Center, transportation will be provided. 

Quantica is a manufacturing company that specializes in the design and development of advanced additive technology. Its flagship technology, the NovoJet printhead, enables users to jet new materials with high-viscosity fluids and materials with high particle loading. 

Prior to the tour, Quantica will give a 30-minute presentation about the company and technology. Exploring: 

  • A high-level overview of various digital printing techniques for electronics including inkjet printing

  • Bottlenecks and limitations of the current technology including the difficulty to print high viscosity fluids

  • How Quantica’s technology overcome these bottlenecks

www.quantica3d.com

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All Tours
Tour 1