Speaker: Gari Arutinov Compay: Holst/TNO .With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield SAVE THE DATE...

The scalable slot-die coating methods adopted within TNO enable fabrication of efficient perovskite solar devices with intrinsic stability using various material and layer combinations. Furthermore, several different encapsulation strategies are investigated to define a low-cost route to guarantee long term stable modules. Demonstration of a stable semi-transparent bifacial flexible perovskite module is a step forward on various applications, such as building- and vehicle-integrated PV (BIPV & VIPV) and noise barriers on highways. In this talk, we will give an overview of our story towards realizing a stable, efficient, and bifacial perovskite processed via roll-to-roll slot-die coating technique. SAVE THE DATE...

Ram Prasad Gandhiraman | Company: Space Foundry Inc SAVE THE DATE...

Micro electronic pattern and flat cable core manufacturing process with electroforming by roll to roll equipments. This process can be applied to the development of flexible flat-cable, copper electrode of solar cell and flexible electonic components. The first advantage of this process is that relative long and wide scale metal pattern could be produced. SAVE THE DATE...

The growing concern for the environment has led to a shift towards sustainable packaging and transportation solutions. This presentation will focus on the benefits of incorporating smart labels and low power technologies in transport packaging. We will discuss the various material choices available and how they impact the overall sustainability of the product. Additionally, we will provide a rough calculation of the total waste generated by traditional transportation methods and compare it to the waste generated by using printed electronics in smart labels and low power technologies to enhance logistics. Join us to learn how SODAQ's innovations and solutions can help reduce waste and promote a more sustainable future. SAVE THE DATE...

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Speaker: Georg Boedler Company: Inkatronic Inkatronic has over 25 years’ experience in inkjet technologies, and develops specialised industrial machines for mass production. Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In our presentation, we will give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully. SAVE THE DATE...

Thibaut Soulestin, PhD ; Lead Application Engineer at Henkel Printed Electronics; thibaut.soulestin@henkel.com Henkel Adhesive Technologies has developed a large material portfolio of conductive inks and coatings suitable for printed electronics technology. Our portfolio offers material solutions ideal for various smart surface technologies, including self-regulating foil heaters. Self- regulating foil heaters are enabled by Henkel’s Positive Temperature Coefficient (PTC) inks in combination with silver and dielectric inks. Understanding the origin of the PTC effect, typical characterizations, and basic design rules enable our customers to reveal the full potential of this technology. 1. Introduction to Henkel Positive Temperature Coefficient (PTC) carbon inks Different types of conductive polymer composites (CPC) exhibit positive temperature coefficient (PTC) properties. They have been extensively studied and some are commercially available. A vast majority is obtained by compounding a polymer binder with conductive fillers, mostly carbon-based. The increase in resistance of the conductive networks during heating is caused by the thermal expansion of the polymer and the change in the distance between the conductive fillers. The PTC effect usually occurs during the phase transition of the polymer matrix, the glass transition, or the melting. After the maximum PTC effect, if the temperature keeps rising, a negative temperature coefficient (NTC) effect can be observed due to th...