In this article, we highlight a number of printing process innovations that are advancing the state of the art in printed and additive electronics and are addressing critical existing limitations to open new opportunities. Here, we will go on a quick tour from analog screen printing to digital printing to ink-less laser printing. In this journey, we will make many short stops covering screen printing, capillary printing, inkjet printing,  EHD printing, micro-dispensing, LIFT printing, dry printing and beyond.  Wit over 25 images, tables, charts as well as 13 videos, we cover the following points Screen printing: State of the art ultrafine line printing High production speed in screen printed metallisation Rotary screen printing for PV metallisation Alternative PV metallisation methods (1): Capillary printing Digital printed electronics/additive electronics Can we scale up inkjet printing in functional printing? How to digitally print high viscosity pastes? Digital multi-material laser printing of high viscosity pastes in printed electronics and electronics manufacturing High viscosity digital printing AND ultra fine resolution well beyond inkjet or LIFT Digitally printing higher viscosity levels at ultrafine resolution without e-field? High Pressure Capillary Printing - high resolution, high aspect ratio and high viscosity printing without e-fields, satellites or splashing? Printed Electronics / Additive Electronics without inks? SSAIL Process: Additive laser-induced metallis...

Fraunhofer IAP | Quantum Dot Color Conversion in MicroLED – A Material Perspective - Quantum Dot (QD) materials for color conversion in MicroLED displays. Key topics include high quantum efficiency QDs, tailored ink formulations, and EHD-Jet printing techniques for high-resolution applications. The session explores QD stability, ligand optimization, and methods to close the green and red gap in MicroLED displays. Saralon GmbH | Conducting Copper Ink for Printed Electronics: An Application-Based Journey - Saral Copper Ink as an alternative to costly silver-based inks for printed electronics. The session covers copper ink’s stable conductivity, processability via conventional screen printing, and its application in low-cost, high-demand sectors. It highlights challenges and benefits for future electronics manufacturing. INTLVAC THIN FILM | ICARUS: Indium Solder Bump Deposition System- Focusing on improving indium solder bump deposition, addressing pattern hole closure, dendritic growth prevention, and enhancing bump quality. Insights on system stability and reliability for semiconductor assembly and MEMS packaging will also be discussed. Flexoo | Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services- Exploring mass-customization in high-end sensing solutions. Topics include the production of BaMoS and MiniMoS sensors, battery behavior analysis at the cell level, advanced wiring solutions, and the role of digitalized processes in manufacturing ef...

Author: Voltera Due to their thin profile and lightweight design, flexible membrane keyboards are useful in a variety of industries, such as portable electronics, toys, games, home appliances, medical equipment, automotive, and aerospace. This project is an example of using Voltera’s NOVA materials dispensing system to print a functional flexible membrane keyboard.   YouTube video:  Printing a flexible membrane keyboard with silver ink   Contact: sales@voltera.io  or +1 888-381-3332 ext: 1   Summary of Materials and Tools MATERIALS USED ACI SS1109 Stretchable Silver Ink ACI SI3104 Stretchable Printed Insulator T4 Solder Paste Sn42Bi57.6Ag0.4   SUBSTRATES USED Polyethylene terephthalate (PET) FR1 (to secure the controller)   TOOLS AND ACCESSORIES Nordson EFD 7018333 dispensing tip Nordson EFD 7018424 dispensing tip Arduino Micro, A000053 Tactile metal switches Keyboard cover skin Headers Diodes   We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Project Overview Purpose The purpose of this project is to demonstrate how NOVA prints multilayer electrical circuits on a highly flexible substrate (PET), and dispenses ink with high precision on sections that are as small as 250 µm W × 40 µm H. Figure 1: Three-layered print with crossovers Design layout We divided the layout into three layers: Base conductive layer (ACI SS1109 stretchable silver ink) Dielectric layer (ACI SI3104 stretchable printed insulator) Top conductive layer (ACI SS1109 str...

TechBlick's The Future of Electronics RESHAPED USA - Why You Should Join Us? The Future of Electronics RESHAPED USA is less than three months away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. See the program here. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this particular article, we focus on process innovation, highlighting a diverse set of technologies, including multi-head molten metal jetting, R2R LIFT printing, microscale laser sintering for 3D metal interconnect, DLP for complex interposes, direct write spatial atomic layer deposition, and stable aerosol jetting. In subsequent articles, we will focus on wearable and printed electronics, 3D electronics, sustainable electronics, material breakthroughs, manufacturing advances, novel applications, process innovations, and more.
It is time to join the global Additive, Printed and 3D Electronics movement: The Future of Electronics RESHAPED USA
🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World The early bird rates expire on 25 April 2025 .
 
In addition to the early bird rates, a special one-time promotion offers an
additional 200 USD discount.
 
Do NOT forget to bo...

Author: Steve Paschky Saralon now offers new ink sets for stretchable membrane switches, heaters, and electroluminescent display printing. Each of these sets contains all the essential ink components tailored to each application, simplifying your work for a seamless, high-quality experience. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston Last year, I wrote about our range of stretchable Saral Inks , designed for different substrates with various formulations like silver, carbon, and others. Since then, technology has continued to evolve, and so have the needs of the industry. We’ve been hearing from customers that they need stretchable inks that are not only conducting but also provide features like heating and capacitive touch, all while withstanding dynamic forces like bending, stretching, and twisting. One of our major focuses at Saralon has been on providing "ink sets"- collections of compatible inks that are designed for specific applications of Printed Electronics (PE). This approach aligns with our company’s mission: Simplifying Electronics Through InkTech. PE devices often require printing multiple layers of ink on top of each other, and one common challenge for developers is finding the right combination of inks that work well together. That’s where our Saral Inks Sets come in. For specific PE applications, we offer complete sets of inks that are compatible with one another, easy to print, and ensure a trouble-less printing pro...

In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge. R2R pilot hybrid electric manufacturing line for wearable sensors? | VTT What are the real applications of ACFs (anisotropic conductive films)? |  CondAlign How is micro-dispensing positioned and how fast can it print? |  XTPL How to print silver lines finer than human hair on Si photovoltaics |  Fraunhofer ISE How does the 3D additive lithography for additive electronic work? |  Holst Centre Why is there a need for direct gravure printing of manufacturing solder bumps? | Komori The Future of Electronics RESHAPED USA   Conference and Exhibition #AdditiveElectronics   #3DElectronics   #PrintedElectronics   #WearableElectronics   #FlexibleHybridElectronics   #WearableElectronics   #SustainableElectronics   #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: https://www.techblick.com/electronicsreshapedusa 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🛑🛑 In addition to the early bird rates, there is a special one-time promotion offering an additional 200 USD discount. Get your coupon here . The early bird rates expire on 25 April 2025. 🛑🛑 R2R pilot hybrid electric manufacturing line for wearable sen...

Wearable neurotechnology, printed electronics, OTFT displays, and light energy harvesting. Researchers at Stanford University are developing innovative neurosensing and neuromodulation technologies, including fNIRS headbands for monitoring mental states, ultrasound neuro-immunomodulation for treating Parkinson’s disease and stroke, and e-Skin EMG sensors for improved prosthetic control and gait correction. ChemCubed is advancing inkjet printing for multilayer electronics, using ElectroJet™ nanoparticle-free silver conductive ink and high-performance dielectric materials to create advanced circuit boards for capacitors, sensors, and antennas. SmartKem is scaling up its low-temperature OTFT technology for AMOLED and MicroLED displays, leveraging TruFlex™ organic materials that enable flexible, solution-based electronics with low-NRE processing and ULEF integration for ultra-low energy consumption. Epishine is eliminating the need for disposable batteries in connected sensors by harnessing ambient light energy, creating self-charging battery technology that extends device lifespan and reduces environmental impact. Essemtec is optimizing conductive adhesive dispensing for printed electronics manufacturing, improving reliability and efficiency through rheology optimization and jetting technology. Stanford University  | Looking ahead – Research topics in wearable neurotechnology innovations from Stanford University ChemCubed | Printing Dielectric Layers in Multilayer/Multimaterial...

Join the the Future of Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects. No other event in the world offers a deeper, more immersive experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED event.   Don't miss this opportunity to connect, learn, and RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable or 3D.    Explore & RESHAPE The Future of Electronics  NOW Register before 9 May before the next early bird expires Conference Agenda You can explore the full agenda here Rochester Institute of Technology | On-Demand Jetting of Molten Metal Droplets for Power Electronics Applications 09:15:00, 2025-06-11 Denis Cormier, United States Spark Biomedical | Wearable flexible circuit for Women's health 09:15:00, 2025-06-11 Alejandro Covalin United States University of Maryland | High temperature Copper inks with oxidation and corrosion resistance 09:15:00, 2025-06-11 Shenqiang Ren, United States Human Systems Integration, Inc. | Physiological Monitoring Garment for Air Crew Applications* 09:35:00, 2025-06-11 Brian Farrell, United States NASA (Goddard Space Flight Center) | 3D Printed Electronics for space flight missions 09:35:00, 2025-06-11 Margaret H Samuels, United States Priways | Air-stable cupper-nickel complex inks for Printed Electronics 09:35:00, 2025-06-11 Dr. Takeo Minari, Japan Boeing Research & Technolog...