Speaker: Alan Burk | Company: ALMAX | Date: 13-14 October 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Azar Alizadeh | Company: GE Healthcare | Date: 13-14 October 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Manabu Ito | Company: Toppan | Date: 9-10 March 2022 | Full Presentation Flexible thin film transistors (TFT) attract a lot of attention due to its applicability to foldable smartphones, IoT sensors, and photodetectors. For this application, organic TFT had been regarded as a most promising candidate thanks to its soft nature of the component materials. However, organic TFT suffers from its low mobility, poor stability and immature production process. In this talk, we would like to introduce our highly bendable IGZO TFT. Without employing the neutral plane concept, the TFT can withstand one million times bending tests at a curvature radius of 1 mm for the first time. After one million times bending tests, any noticeable deterioration in device characteristics are not observed. We see a big potential for the application for flexible sensor devices. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Masaaki Sugimoto | Company: Elephantech | Date: 9-10 March 2022 | Full Presentation Elephantech Inc. is a start-up that manufactures and sells Flex PCB that are manufactured in an environmentally friendly manner by utilizing inkjet printing and copper plating under the mission of “Making the world sustainable with new manufacturing technologies”. Moving forward, we will work not only on Flex PCB manufacturing but also on printing a wide variety of functions such as 3D wiring formation or sensor production through a method in which digital data is used to layer various materials only on necessary parts. We will realize a sustainable future by spreading our environmentally friendly technology that has been optimized by digital technologies. In this presentation, I would like to introduce our newly developed interconnections using nickel nano-ink, show the progress of EMI shield manufacturing technology for electronic components, and present the results of our fine-line fabrication trials combined with laser ablation and optical patterning. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb a...

X-Ray Detectors Speaker: Sandro Francesco Tedde | Company: Siemens Healthcare | Date: 13-14 October 2021 | Full Presentation The fabrication of medical and industrial X-ray imaging detectors that combine minimum fabrication costs and high performances is the major challenge since decades. Due to their strong X-ray absorption, high carrier diffusion lengths and mobility-lifetime (μτ) product hybrid inorganic-organic perovskites like Methylammonium Lead Triiodide (MAPbI3) are highly recommended as novel X-ray converting materials. Here we present a two-step manufacturing process of a microcrystalline MAPbI3 based imaging X-ray detector which decouples the fabrication of the several hundred micrometer thick absorber layer and its integration on the pixelated backplane. Microcrystalline MAPbI3 devices show an excellent sensitivity of 9300 µC/(Gyaircm²) with a μτ-product of 4E-4 cm²/V. The resulting X-ray imaging detector with 640x480 pixels, reveals a high-resolution capability of 6 line-pairs (lp)/mm simultaneous with an outstanding low detection limit of 0.22 nGyair/frame. Our findings stress the great potential of this material class for X-ray detector applications. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused ...

Speaker: Steve Statler | Company: Wiliot | Date: 13-14 October 2021 | Full Presentation After 4+ years of R&D, working with some of the largest pharma, CPG, retail and logistics companies, Wiliot has leant a lot of lessons about brining intelligence and connectivity to new classes of everyday things. Hear the latest on how the technology behind these self-powered compute devices is evolving, the applications that will be impacted and the implications for the ecosystem of brands and IoT companies that are engaged in this new area. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Nouhad Bachnak | Company: Sunway Communications | Date: 9-10 March 2022 | Full Presentation Functional integration requires more and more interconnects to be realized in smallest space. 3D-MID offers solutions meeting both interconnect and space requirements. The 3D-MID technology is currently in a phase of transformation; it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 to 10 isn’t an improvement, that’s a giant leap. This leap will allow to use 3D-MID on Chip- and IC-Substrate level for mass production and at lower costs. The current status and new developments of 3D-MID technology at Sunway Communication will be shown in this presentation" Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Didier Muller | Company: Clayens | Date: 9-10 March 2022 | Full Presentation Plastronics is a new branch of the electronics industry, setting the electronic circuitry directly at the surface of plastic parts, or inside its structure. The different processes of the plastronics (LDS, 2K molding, IME, …) gives possibilities to designers and engineers, depending upon the kind of application: antenna, HMI, lighting, sensors etc. For customers and users, it permits new experience: surfaces, shapes, and aspects. After highlighting some key manufacturing processes and their possibilities and limits, this presentation will show potential or existing applications. As a conclusion, we will raise some key challenges and hard points the plastronics is facing, such standardization, recycling, … Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...