top of page
TechBlick Blog

15 July 2019

Introduction of R2R printing technology for submicron resolution electrodes and applied devices

Speaker: Abe Masayuki | Company: Asahi Kasei | Date: 9-10 March 2022 | Full Presentation For high performance and practical use of printed electronics devices, it is important to have a printing technology that can industrially form electrodes with submicron resolution. We have developed our own electron beam lithography technology as a patterning technology for cylindrical plates in order to achieve both mass productivity and high resolution. We have also developed our own metal nano-ink with an average agglomerate diameter of less than several tens of nanometers, as well as our own R2R printing process and equipment. I will introduce these technologies and the hybrid type transparent RFID tag produced by applying these technologies. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

8 July 2019

Screen printed Cu-pastes for high efficient back-contact silicon solar cells

Speaker: Jan Lossen | Company: ISC Konstanz | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

24 June 2019

Inks for printed Electronics

Speaker: Philipp Hölzl | Company: ELANTAS Europe GmbH | Date: 9-10 March 2022 | Full Presentation This presentation will show you a short overview of the newest inks at ELANTAS Europe for printed electronics. Starting with the new fine line ink for different applications, like conductive pattern, sensors and more. Going ahead with a UV curable silver conductive ink for screen printing. This could be interesting for a roll to roll production to print RFID Antennas efficient and flexible. At least we would like to introduce our silver conductive ink for InMold electronics with an outstanding performance in the field of thermoforming. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

10 June 2019

JetSelectiv®: Ultra-thin and eco-friendly selective metallization process

Speaker: Samuel Stremsdoerfer | Company: Jet Metal Technologies | Date: 9-10 March 2022 | Full Presentation Jet Metal Technologies is a company created in 2007 in Lyon, France, that provides metallization turnkey solutions. The Jet MetalTM technology uses the simultaneous spraying of 2 water-based solutions that instantly grows a very thin layer of metal directly onto the surface thanks to a chemical oxidoreduction reaction. This metallization principle only requires spraying equipment at ambient pressure and temperature. Due to the use of painting tools (booth, spraying gun, pump...), this unique technology perfectly suits in-line production and can be considered as environmentally friendly as it only uses water-based solutions (CMR & solvent free) but also no curing step. Recently, a need has been identified concerning patterns metallization and so the Jet MetalTM traditional process evolved towards selective metallization with the patented JetSelectiv® process, relying on the use of a negative mask applied with traditional ink printing methods (screen printing, inkjet, flexography...) then removed during the metallization process to reveal fine metallic patterns. Fig 1: Spraying technology to create a metallic film Fig 2: R2R JetSelectiv® process equipment Regarding printed electronics, JetSelectiv® is particularly interesting as it deposits, without any curing step, a pure silver layer that has a conductivity as high as 90% of silver’s bulk conductivity (63 MS/m)....

TechBlick Blog

8 July 2019

Recent developments in Flexible Hybrid Electronic technologies

and their applicability for successful manufacturing strategies. Speaker: Enid Kivuti | Company: Sheldahl Flexible Technologies | Date: 9-10 March 2022 | Full Presentation The presentation will provide an overview of proven paths to improve time to market, cost of ownership and user experience in scaling up production of Flexible Hybrid Electronics for the Industrial, Medical and Automotive markets. Beginning with material choice and available manufacturing schemes and concluding with proposed applications, we will touch on available technologies and their governing design rules. We will review recent developments that enable finished products to improve user experience and some key learnings from a conductive ink sensor design. Finally, we will provide a couple of examples of scalable FHE applications that meld the use of existing capital assets with the rapidly evolving industry options to deliver improved products. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about pr...

TechBlick Blog

1 July 2019

Recent developments in Flexible Hybrid Electronic technologies

and their applicability for successful manufacturing strategies.
Speaker: Marco De Angeli | Company: Flex | Date: 9-10 March 2022 | Full Presentation The presentation will provide an overview of proven paths to improve time to market, cost of ownership and user experience in scaling up production of Flexible Hybrid Electronics for the Industrial, Medical and Automotive markets. Beginning with material choice and available manufacturing schemes and concluding with proposed applications, we will touch on available technologies and their governing design rules. We will review recent developments that enable finished products to improve user experience and some key learnings from a conductive ink sensor design. Finally, we will provide a couple of examples of scalable FHE applications that meld the use of existing capital assets with the rapidly evolving industry options to deliver improved products. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see htt...

TechBlick Blog

17 June 2019

Digital, Multi-Materials, Non-Contact Large Area Printer

Speaker: Ralph Birnbaum | Company: IO Tech 3D Printing | Date: 9-10 March 2022 | Full Presentation The electronics industry is characterized by a multitude of steps involving many technologies and materials, from the naked PCB to the packaging and assembly of semiconductor devices. All these steps and applications are carried out by many different machines and processes. But at the root of them, several of these steps involve one form or other of depositing a material on a substrate. There are subtractive processes, e.g. etching, additive processes, such as screen printing, and digital processes, such as jet dispensers. In this paper we present a Continuous Laser Assisted Deposition (C.L.A.D.) technology that combines the benefits of all these approaches in advanced manufacturing. It has the productivity of screen printing, with the flexibility of dispensing and the precision of jetting. C.L.A.D. technology can deposit highly viscous materials on large areas. The technology is mesh-free, nozzle-free and contactless, meaning lower maintenance costs. As an additive manufacturing technology, it involves less material wastage, and enables new designs. Combining multiple steps into one station is less labour-intensive, and most importantly of all, it uses standard materials.” Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round...

TechBlick Blog

3 June 2019

Metal-complex silver inks for EMI shielding and conformal metal coatings for semiconductor packaging

Speaker: Melbs LeMieux | Company: Electronink | Date: 9-10 March 2022 | Full Presentation EMI shielding is a critical aspect of semiconductor packaging and chip/wafer manufacturing that ultimately enables OEMs to provide more communication and performance features using less space, weight, and providing more form factors in their products Sprayable metal-complex films developed and commercialized by Electroninks and Merck/EMD offer high performance metalization allowing OSATS and EMS ease of production with more sustainable manufacturing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

CONTACT US

KGH Concepts GmbH

Mergenthalerallee 73-75, 65760, Eschborn

+49 17661704139

venessa@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH

Registration number HRB 121362

VAT number: DE 337022439

  • LinkedIn
  • YouTube

Sign up for our newsletter to receive updates on our latest speakers and events AND to receive analyst-written summaries of the key talks and happenings in our events.

Thanks for submitting!

© 2026 by KGH Concepts GmbH

bottom of page