Speaker: Pierre Ball | Company: BeLink Solutions | Date: 9-10 March 2022 | Full Presentation Printed Electronics technology requires robust industrialization processes to ensure high volume production success. BeLink Solutions with legacy experience in conventional electronics as well as screen printing for the automotive market has combined both expertises to develop high volumes processes in Printed Electronics. Our objective is to support Printed Electronics market growth for Automotive, Industrial, Smart Home & Building customers by providing robust and reliable manufacturing processes.
Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Ben Harries | Company: Versarien | Date: 26-27 April 2022 | Full Presentation Simon and Ben will be introducing some of the opportunities and challenges of implementing 3DCP technology in the construction of buildings and infrastructure, along with some of the emerging benefits of using graphene additives in printing materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Chisato Oyama | Company: Komori Corp | Date: 24-Jun-22 | Full Presentation We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes. For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer. We have also tried to print and reflow the solder paste. Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively. We will report the details on the day. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Tommy Höglund | Company: DP Patterning | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Francois Jeanneau | Company: Novasentis | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Simon Ayley | Company: Water Research Centre. | Date: 26-27 April 2022 | Full Presentation Simon and Ben will be introducing some of the opportunities and challenges of implementing 3DCP technology in the construction of buildings and infrastructure, along with some of the emerging benefits of using graphene additives in printing materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Dilek Ozgit Butler | Company: Zinergy UK | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Sabine Heusing | Company: Leibniz Institute for New Materials | Date: 24-Jun-22 | Full Presentation Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced. The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze. It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high tra...