a cost-effective way to create smart plastics solutions Speaker: Pierre Ball | Company: BeLink Solutions | Date: 12-13 October 2022 | Full Presentation This presentation will highlight the key principles of innovation in printed electronics by BeLink Solutions along 3 axes: Equipment Materials Processes Replacing incumbent technologies is usually challenging, but hybrid electronics technologies are opening up new solution and design areas that are driving the migration and expansion of the market from conventional electronics to the printed electronics market. Here we will not only address sensors and traces based on well-known conductive screen-printing techniques, but more importantly how to integrate any variety of SMT components and packages (BGA, fine pitch) with direct PCB-on-film integration. In other words, how to bridge the gap between both technologies (conventional and printed electronics) to foster new designs in 2D and 3D electronics? Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsresha...

Speaker: Lukasz Kosior | Company: XTPL | Date: 12-13 October 2022 | Full Presentation The Ultraprecise Deposition (UPD) technology is a novel additive manufacturing technique for advanced Printed µElectronics applications. UPD can be used for fabricating micrometer-size interconnections in microelectronic systems, as well as for making redistribution layers on chips and filing vias in semiconductor devices. UPD may be considered as a much-needed intermediary approach between printing of 2D planar structures and free-standing 3D architectures. This technology gives the ability to print metallic structures at micrometer scale on complex substrates, so that the printed features map the topography of the substrate. The UPD approach is based on a direct extrusion of highly-concentrated silver paste using a printing nozzle with the diameter in the range from 0.5 to 10 𝜇m. This defines the unique operating range for the UPD technology, compared to other printed electronics techniques: the combination of high-viscosity pastes and fine printed features. The process itself is governed by pressure, but the possibility to extrude such high-viscosity materials using such narrow nozzles is possible thanks to the simultaneous optimization of the paste, parameters of the process, as well as the printing nozzle (both in terms of the geometry and material properties). The key advantage of using the high-viscosity pastes is that the printed structures preserve their shape regardless of the wet...

Speaker: Peter Willaert | Company: Agfa | Date: 12-13 October 2022 | Full Presentation Agfa PRELECT Sintering silver inks are developed to offer significant advantages over standard PTF inks, as they will get you more conductivity out of the silver they contain. On top of that, PRELECT screen-, inkjet and spray coating inks offer finer features and thinner layers, and they enable digital workflows in Printed Electronics applications, as we will show in this talk. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Valentijn von Morgen | Company: DuPont Teijin Films | Date: 12-13 October 2022 | Full Presentation Continued advances in the Flexible and Formable Electronics is driving the material suppliers to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces. This talk will give a brief overview of PET and PEN product range meeting wide ranging application needs. Thereby the focus will be on the recent progress made with the development of Kaladex® PEN substrates for extreme processing requirements, formable PET films for in-mold electronics, films with ultra clean and smooth surfaces for ultra-barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates. DuPont Teijin Films (DTF) has launched many Mylar®, Melinex®, and Kaladex® polyester films through collaborations with partners in the flexible electronic industry as our DTF has proved to be uniquely capable of offering customised and affordable polyester substrate solutions Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berl...

Speaker: Shavi Spinzi | Company: Nano Dimension | Date: 12-13 October 2022 | Full Presentation This presentation will describe the industry drivers for increased electronic devices and circuits performance and packing density and how multi-level and multi-material Additively Manufactured Electronic (AME) technology enables corresponding innovative designs and fabrication from DC to mmWave applications. The presentation will focus on AME devices including design, materials, fabrication, and testing. This technology provides for electronic circuits not only in 2D but also in 3D where connections can be made without vias, but direct wiring between the electronic elements. The wires can be shielded and unshielded. Furthermore, the fabrication technology allows for traces with different thicknesses at the same level. Yielding fully functional boards with smaller size and lower weight, as compared to equivalent PCB fabricated ones. The presentation will include also devices with chip first embedded active ICs. Components such as capacitors, coils, band pass filters, and multilevel Fresnel lenses exhibit superior RF performance as compered Surface Mount Technology (SMT) of components. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT...

Speaker: Dominique Heilborn | Company: Novem Car Interior Design | Date: 12-13 October 2022 | Full Presentation Integration of lighting – both, styling and function – is in the center of upcoming interior concepts. This is achieved by merging components visually, applying holistic and scalable concepts and at the same time preserving a high level day time design. Traditional electronics concepts and injection molded electronics are reshaping the future of in vehicle electronics. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Rahul Raut | Company: MacDermid Alpha | Date: 12-13 October 2022 | Full Presentation Emerging electronic structures in consumer, automotive, medical and several other end-applications are rapidly moving towards integrated, interactive, smart interfaces from their current physical and mechanical forms (such as switches, connectors, housings, etc.). Electronics assembly, manufacturing and processing are also evolving to be compatible with the next generation of sleek, lightweight, compact form factors. Additionally, current megatrends such as sustainable and green electronics, and increasingly additive manufacturing approaches and fully automated assemblies will start to become mainstream. To enable and deploy these next generation smart structures and functional surfaces, a combination of smart materials and compatible processes are needed. In this paper, we present a holistic view from materials, high-volume manufacturing (HVM) approaches and sustainable processes. We discuss/review key building blocks of 3D smart structural platforms that represent an integrated approach, which covers: - Novel film substrates (for example, multifunctional PC Substrates for In-Mold Electronics), - Highly conductive and formable Silver Inks - High performance formable Dielectrics (Thermally curable), - Formable Structural and Electrically Conducting Adhesives (ECAs), and - Formable Encapsulants. We present performance and compatibility of an integrated multi-layer stacks that can b...

Speaker: Ryojiro Tominaga | Company: Fuji Corporation | Date: 12-13 October 2022 | Full Presentation We’ll introduce a novel electronics 3D printer which integrates resin printing, circuit printing, and low temperature Surface Mount Technology (SMT). Based on these three key functions, we named this machine “FPM-Trinity”. FPM-Trinity enables the manufacturing of uniquely shaped electrical devices within one day. This can drastically reduce the development time for electronic products, adding value to the process of creating new products. In this presentation, we’ll introduce key process technologies of the machine and its main features. In addition, we’ll show some of the samples which have made using FPM-Trinity. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...