Authors Wim Christiaens | Quand Industries | Wim.Christiaens@quad-ind.com Textiles are tactile, sensorial and visual. Qualities can be modified or even expanded when technology is added, transforming passive textiles into active and interactive devices, monitoring and detecting bodily functions due to their constant contact with our skin. Printed electronics are also more durable than traditional electronics and can withstand multiple washing cycles, crinkling, friction and sweating. The lower production costs and easy scalability of printed electronics also stimulate the development of new (IoT) applications and a larger adoption of e-garments and smart fabrics in general, which can promote a healthier lifestyle and reduce the risk of disease, accidents and injuries in many industries. Their integration is straightforward. After printing the sensors on TPU they can be transferred onto the textile material via hot press lamination. Both are well-established techniques. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. For special discounts on attendee passes please contact Wim.Christiaens@quad-ind.com Compared to traditional electronics manufacturing, printed electronics are easily scalable and low cost. They are durable, precise, efficient and comfortable to wear. They have excellent interconnectability. The PCB’s can be positioned in a remote spot, are small and don’t need ...

Stephan Harkema and Corné Rentrop | TNO at Holst Centre | stephan.harkema@tno.nl A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging are examples of market segments that follow this trend. Printed circuit boards (PCBs) are state-of-the-art when it comes to creating electronic functions, but pose challenges with respect to sustainability. These highly integrated electronic products, where plastics, metals and semiconductor components are seamlessly combined, are a challenge to recycle. The only suitable end-of-life scenario is still limited to shredding and incineration. With increasing electrification, digitization, broad wireless integration (IoT) and welfare, the amount of waste from electronics and electronic devices increases drastically. An estimated 1.2 Mtons of Printed Circuit Boards (PCBs) end up in the total amount of annual e-waste[1]. Only a third is recycled in environmentally sound facilities. This means that around 800 million kilograms may be traded, recycled in a non-compliant and polluting manner or may end up on a landfill. There is a more eco-friendly alternative to PCBs: Hybrid and Printed Electronics (HPE). This technology is a big step forward compared to PCBs, but much more is needed to achieve circular production of next-genera...

Authors: Kai Keller <kai.keller@notion-systems.com> and Lina März<lina.maerz@notion-systems.com>
Introduction There are three big topics that shape the production environment of today and tomorrow: digitalization, additive manufacturing, and preserving natural resources/zero waste. Very tightly timed supply chains and globally distributed and connected production processes are already real and only possible because of digitalization. Additive manufacturing knocks on the door of many industrial areas, such as automotive and aerospace. Preserving natural resources and zero waste will become standard in many areas and will be the financially most convenient opportunity. Printed circuit boards (PCBs) are manufactured mainly in Asia but distributed just-in-time all over the world. In our laptops, cars, trains, planes, TV's, audio systems, mobile phones, we all use dozens of them every day, without even realizing it. The recent stress that has been put on these supply chains also lead to investments into new facilities in North America, Europe, as well as South East Asia. So many decision makers in electronics manufacturing are currently concerned with the question which technologies they are going to use for the newly built facilities.[ See for example SEL’s story in PCB007 Magazine, Vol. 13, Number 8, August 2023, https://pcb.iconnect007.com/ ] Today, the production process for PCBs is mainly subtractive, indicating that lots of expensive resources are wasted, are not reused, an...

Speaker: John Yundt Company: SunRay Scientific In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues. SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were...

By Mikael Boedler, INKATRONIC GmbH | mb@inkatronic.com
Niederdorfstrasse 6, 4063 Hörsching Tel.: +43 7221 22298 In this article, we will discuss the different aspects of an effective ink delivery system. We will focus on a recirculating inkjet system as they are highly in demand in industry, especially where functional fluids come into play. Though recirculating printheads are mostly on the same price level as non-recirculating, gravity feed equivalents the ink supply system needed is much more intricate and as a result, significantly more challenging to implement (an example of a recirculating ink delivery system is shown in figure 1 below). The benefits of recirculating systems, however, are clearly outlined in the next section making it a worthy endeavour. Figure 1 - INKATRONIC Scalable Circulating Ink Supply. Advantages of Recirculating Inkjet Technology in Industry Improved Print Quality - Recirculating printheads maintain a consistent ink temperature and viscosity, resulting in more consistent droplet formation when jetting at various frequencies. This leads to a better print quality with sharper details and better lay-down accuracy. Reduced Nozzle failures - Continuous ink circulation helps prevent nozzle failures caused by ingesting air, ink drying out, or ink settling, ensuring uninterrupted printing. Faster Start-Up Times - most recirculating printheads can start printing immediately, whereas gravity-feed printheads may require cleaning cycles to recover missing noz...

Kyosuke Michigami | Panasonic Industry Co., Ltd. [michigami.kyosuke@jp.panasonic.com ] Introduction Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard subtractive printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant properties which make it compatible with high-volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products. Currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with conventional surface mount (SMT) assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of these conventional FPCs. Fig1. Comparison of existing FPC materials (polyimide and TPU) and a target ULTRA pliable circuit board Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped . For special attendee discounts please contact us [[michigami.kyosuke@jp.panasonic.com] Development of Copper Clad Str...

Authors: Steliyan Vasilev1, Melanie Hoerr1, Michaela Kasdorf1, Sven Boehmer2 13E Smart Solutions, Krefeld, Germany 2ZSK Stickmaschinen GmbH, Krefeld, Germany steliyan@3esmartsolutions.de 1. Introduction Embroidery was historically a means of adorning fabrics with intricate patterns, a testament to human skill. However, in the modern era, this ancient art form has significantly evolved. In recent years, embroidery has undergone a profound transformation, emerging as a pioneering technology at the intersection of artistry and functionality. This article delves into the possibilities which embroidery offers for the production of Smart and E-Textiles, exploring technical intricacies, advantages, and challenges related to embroidered conductive traces. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us [steliyan@3esmartsolutions.de ] for a special attendee discount 2. Solutions for the E-Textiles Production Made Possible by Embroidery E-Textiles represent a fascinating synergy between traditional textiles and modern technology, serving diverse sectors like automotive, aerospace, sports and fitness, medical, home textiles, and wearable technology. Thanks to the exceptional precision and high degree of automation of embroidery technology, it is ideal for integrating functional elements into textiles, such as sensors, actuators, antennas, or electrodes. By use of conductive threa...

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer. SAVE THE DATE...