Picture: Ms. Jennifer Lin, AUO Corporation Vice President of Innovation Development, and Mr. Ness Benamran, Aledia Chief Financial Officer, announced the partnership in the presence of the Minister of Economic Affairs of Taiwan, Mr. Kung Ming-Hsin Grenoble, France & Hsinchu, Taiwan - April 10th 2026 -AUO Corporation ("AUO") and Aledia today announced a strategic partnership to develop a new generation of microLED display technology combining high brightness, low power consumption, and high resolution. The collaboration will integrate Aledia's high-voltage microLED {µLED) technology-based on its proprietary 3D nanowire architecture-onto AUO's advanced display backplane. MicMiD project for enhanced microLED displays The project has been selected as part of the France-Taiwan cooperation funding program, announced in Paris on March 31, 2026, in the presence of representatives from both governments and industry. The objective is to enable energy-efficient, high-performance displays addressing the growing demand for next-generation display technologies. By combining AUO's expertise in display engineering and system integration with Aledia's microLED technology designed for high-volume semiconductor manufacturing, the partnership aims to accelerate the industrialization of microLED displays and support their adoption across emerging applications. Beyond display use cases, the collaboration also opens opportunities in adjacent domains such as optical interconnects for Al data centers...

Author: Jurgen Westerhoff | jurgen.westerhoff@spgprints.com Why printed electronics projects succeed or fail at the business case stage Printed electronics has moved well beyond the experimental phase. Applications such as RFID antennas, in-mould heaters, biosensors, and energy components are increasingly transitioning into industrial-scale production. The technical promise is clear: lightweight designs, scalable manufacturing, and new functional integration possibilities. Yet many projects stall at a critical point — not because the technology fails, but because the business case remains unclear. In most development trajectories, technical feasibility comes first. Teams focus on whether the application works: signal performance, resistance levels, feature resolution, and material compatibility. These are essential steps. Without them, there is no viable product. However, technical validation alone does not justify investment. A recurring issue in printed electronics projects is that financial validation happens too late. Organizations often confirm that a product works before asking whether it can be produced profitably, reliably, and at scale. This creates a structural risk. By the time cost models, yield assumptions, and capital requirements are analysed, significant time and resources have already been committed. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in ...

How the SPS ASTRON QX Series Advances Cylinder Printing for Printed Electronics Author: Ron Hayden | ron@rhsolutionsllc.com Figure 1: The automatic 4-post SPS ASTRON QX57 - The newest generation of STOP cylinder screen printing machines In printed electronics, a few microns can determine whether a device performs as intended or fails entirely. Conductive traces must align precisely with dielectric layers, resistive elements must maintain consistent geometry, and each deposited layer must deliver repeatable electrical performance. Achieving this level of consistency depends on one critical factor: the stability of the printing platform. Applications such as membrane switches, capacitive sensors, automotive HMI interfaces, and flexible electronics rely on the controlled deposition of conductive, dielectric, and resistive inks. Each layer must be printed with high positional accuracy while maintaining uniform ink thickness across the substrate. Even minor variations in the print process can affect conductivity, resistance, or sensor response. Figure 2: Live video of SPS Astron QX57 operating For manufacturers of functional devices, printing stability is not simply a measure of visual quality. It is fundamental to product reliability. To meet these requirements, new press architectures are emerging that move beyond the mechanical drive systems traditionally used in cylinder screen printing. The SPS ASTRON QX series represents a significant step in this evolution. Built around a f...

Researchers and product developers continually push the limits of precision and resolution in material dispensing. Dot dispensing in electronics and other advanced fields such as additive manufacturing, chemical engineering, and biomedicine provides the fine control needed for cutting-edge applications, enabling features such as fine solder paste application, DNA microarrays (a kind of biochip), or adhesive micro dots. How dot dispensing works In dot dispensing (a form of drop-on-demand printing), a small volume of functional material is ejected from a nozzle to form a droplet (”dot”) that lands on a substrate at a specified location. Each dot is typically on the order of microliters, nanoliters, or even picoliters in volume. The process is digitally controlled: each droplet is generated only when and where needed, allowing precise patterning and minimizing waste. By adjusting process parameters (such as pressure pulses or actuator voltage), the system controls the volume of each drop and thus the dot size on the substrate. Applications of dot dispensing The applications of dot dispensing include microelectronics packaging (e.g., solder paste, conductive adhesives), flexible printed electronics, microfluidics fabrication, biomaterial and cell-based bioprinting, LED phosphor dispensing, underfill encapsulation, and the construction of microstructured sensors and actuators for electronic skin and wearable technology. They provide high accuracy, repeatability, and scalability c...

Author: Varun Vohra, Engineering Department Manager, Brilliant Matters | v.vohra@brilliantmatters.com Organic Photovoltaics (OPVs) for Solar Heat Gain (SHG) Mitigation Buildings are among the largest contributors to global energy consumption and greenhouse gas emissions, accounting for a significant portion of worldwide energy-related CO₂ output. They are responsible for roughly one-third of global final energy use, with operational energy demand dominated by heating, ventilation, and air conditioning (HVAC). In modern commercial and high-performance residential buildings, HVAC systems typically represent 30% to 60% of total building energy consumption [1]. In recent years, buildings with high glazing ratios or window-to-wall ratios (WWRs) exceeding 70% have become increasingly common worldwide. This trend has been enabled by advances in high-strength glazing materials and window-frame engineering, which allow large glass façades to be implemented safely while enhancing daylight access and spatial openness for occupants. However, high WWRs also substantially increase cooling demand, often making HVAC systems the dominant contributor to building electricity consumption, accounting for more than 75% of total electrical use in some cases [2]. Conventional glazing lets through a large fraction of near-infrared (NIR) solar radiation (700–2500 nm), which carries more than half of the sun’s thermal energy. Transmitted NIR radiation is absorbed by interior surfaces and re-emitted as ...

Author: Kyle Pucci | pucci@imagexpert.com At ImageXpert, we design inkjet development platforms with one goal in mind: enabling users to develop, validate and scale applications with confidence. In this context, curing is no longer a downstream step. In advanced functional and industrial applications, even small changes in UV dose, wavelength or timing can determine whether a printed layer performs as intended—or fails later during testing or scale-up. Collaborative Success Traditionally, curing has been treated as a secondary consideration in inkjet R&D, often handled using stand-alone lamps or externally controlled units. However, as applications become more demanding, this separation can limit development accuracy and process understanding. To overcome this, ImageXpert has partnered with IST INTECH to bring fully integrated UV-LED curing directly into our JetXpert printing platforms. By embedding it within the core system architecture, ImageXpert enables users to treat curing as a fully controllable and optimisable process parameter—alongside jetting, motion and fluid behaviour. Adjustable Operating Window A defining strength of ImageXpert equipment is flexibility. Our platforms are built to support a wide range of applications, allowing users for example to evaluate different fluid chemistries and viscosities, jetting and long-term reliability, layer application and thicknesses, print process speeds and quality seamlessly. All towards end-use requirements—and within...

21 & 22 OCT 2026 Berlin, Estrel Congress Centre co-located with the TechBlick Electronics RESHAPED Show echBlick is launching the Sustainable Electronics RESHAPED conference and exhibition - an event dedicated to Sustainable Electronic Materials, Resource Efficient Electronic Manufacturing, and Circular Designs. This event will be co-located with the Future of Electronics RESHAPED in Berlin on 21 and 22 OCT 2026 - our flagship event dedicated to additive manufacturing of electronics. The synergy is natural. Additive electronics enables material-efficient, low-energy, and resource-conscious manufacturing, making it intrinsically aligned with sustainable and circular electronics. The combined event will feature 650 participants, 85 exhibitors and over 100 conference talks. World-Class Program We will curate a fantastic program. In fact, confirmed speakers include Signify Research, AT&S, AUMOVIO, 4MOD, PrintOCell, Fraunhofer IZM, Yamagata University, Silicon Austria Labs GmbH, University of Maryland, Auburn University, DP Patterning, EMPA and others Exhibition - special pricing We are offering a special exhibition package to our Sustainable Electronics RESHAPED exhibitors. The special pricing is possible thanks to our close collaboration with the Smart Textile Alliance. Please contact tom@techblick.com for further information regarding pricing and the details of the packages...

The status quo of additive manufacturing and inkjet printing How EHD technology is pushing the boundaries EHD in practice – applications for industry Implementation of EHD technology into the Notion Systems ecosystem The status quo of additive manufacturing and inkjet printing Author: Simon Rihm | Notion Systems |https://www.linkedin.com/in/rihmsimon/ (1) The status quo of additive manufacturing and inkjet printing Over the past two decades, additive manufacturing has undergone a profound transformation, evolving from a technology primarily confined to prototyping into a cornerstone of modern industrial production. This transformation is driven by its high flexibility, strong potential for customization, shorter development cycles, and efficient use of materials. By depositing material only where needed, additive processes significantly reduce waste compared to conventional methods - an advantage that is particularly important for expensive or scarce materials such as titanium alloys or high-purity metals. Additionally, additive manufacturing enables the production of complex structures that are difficult or impossible to achieve with traditional techniques, leading to lighter and higher-performance components. The growing significance of additive manufacturing is especially evident in the electronics and semiconductor industries. These fields are defined by ongoing miniaturization, increasing integration density, and extremely stringent precision requirements. Convent...