top of page

The Future Of Electronics RESHAPED - Exhibition Grows By 50% Over 2022

TechBlick is excited to announce that the exhibition at their Future of Electronics RESHAPED event has grown by 50% over this event in 2022 and is sold out with 4 months to go. This year’s show takes place on 17 & 18 October at The Estrel in Berlin and looks to reshape the future of electronics. 78 leading global organisations will be exhibiting and attendees will experience the latest technologies and products - see

This premier conference and exhibition looks to re-shape the future of electronics focusing on the key topics of printed, flexible, sustainable, additive, hybrid, wearable, textile, 3D, structural and in-mold electronics. This unmissable event will attract a global audience from innovators and material suppliers to equipment makers, manufacturers and a large number of end users.

The world-class agenda too has been announced and confirmed speakers include: META, Volvo, Signify, GE Healthcare, Williot, Panasonic, Airbus, BEKO, Space Foundry, LIFE Group, Cicor, Raynergy Tek and many more. In total over 60 speakers will present over the 2 days and an agenda can be seen below.

Agenda 1 - 17 October

Keynote Presentations

09.05AM • TechBlick • Welcome & Introduction

09.10AM • Meta • Additive Manufacturing for Future High Volume Manufacturing of Electronic Devices

09.30AM • Volvo Cars • Evolution of lighting in automotive interiors: how will the future look*

09.50AM • Signify • Additive manufacturing & lighting: status, future and challenges*

10:10AM InkSpace Imaging • Flexible printed arrays and their use in wearable medical devices and MRI imaging*

10.40AM • Beko • Can additive electronics help in the white goods industry*

10.40AM • Exhibition Networking Event

Track 1

11.30AM • Wiliot • Ambient IoT – Scaling from billions to trillions, saving supply chains and the planet

11.50AM • Smooth & Sharp • Functional Layer – A Comparison with same Printed Circuit Pattern on Different Polyester Film before and after 3D Thermoforming

12.10PM • SODAQ • Sustainable Transportation Solutions: Exploring the Benefits of Smart Labels and Low Power Technologies

12.30PM • TracXon • Opening up new business models in Printed Electronics by leveraging advancements in roll-to-roll manufacturing

12.50PM • SMART Industry Consortium/Purdue University • Smart devices for digital agriculture, food, healthcare and infrastructure

1.10PM • Lunch & Exhibition

2.50PM • FUJI Corporation • Innovation in electronics by integration of additive manufacturing and SMT

3.10PM • NanoPrintek • A Dry Multimaterial Printing Technology

3.30PM • Space Foundary • Precision digital plasma deposition: deposit multilayer structure without curing *

3.50PM • Syenta • Electrochemical Printing of Multi-Material Electronics *

Track 2

11.30AM • GE Healthcare • Skin electrode adhesive performance testing

11.50AM • Epicore Biosystems • Wearable Devices for Sweat and Hydration Monitoring

12.10PM • Quad Industries • Printed Electronics – a true booster for innovation in Wearables

12.30PM • Neurosoft Bioelectronics SA • Soft Implantable Electrodes to Interface with the Brain a Gateway to BCI

12.50PM • Information Mediary • Real World Smart Packaging For Pharmaceuticals*

1.10PM • Lunch & Exhibition

2.50PM • Soplast • Towards manufacturing of 3D automotive parts with integrated electronics using stretchable liquid metals*

3.10PM • PolyIC/Kurz • Smart HMI Surfaces With Inmolded Touch Sensors & Decoration*

3.30PM • BeLink Solutions • The exciting journey from electronics manufacturing to printed electronics manufacturing

3.50PM • Panacol • The way to smarter light-curable barrier sealants for flexible OPV R2R production

4.10PM • Exhibition Networking Event

Closing Presentations

4.45PM • Voltera• A Tool for Every Additive Electronics Project

5.05PM • Panasonic Industry • Ultra-Pliable Circuit Board Technology

5:35 PM • Exhibition Networking Event

Agenda - 18 October

Track 1

09.00AM • TBC • TBC*

09.20AM • VTT • Towards roll-to-roll manufacturing of green wearable electronics

09.40AM • TNO at Holst • Laser-Assisted High-throughput microLED Integration

10.00AM • Danish Technological Institute • Sustainable materials and processes for printed electronics

10.20AM • Yamagata University • Flexible Printed Carbon-based Sensors and Their Applications

10.40AM • Exhibition Networking Event

11.30AM • Coatema • Upscaling OPV into production tech

11.50AM • The Warming Surfaces Company • Digitalizing heating for a sustainable future

12.10PM • Sinovia Technologies • Flexographically Printed OLED Indicator and Passive Matrix Displays

12.30PM • Inuru • Manufacturing thin printed OLED lighting: scale up and real applications*

12.50PM • SamwonAct • Metal Pattern Transferring Printing Technology

1.10PM • Lunch & Exhibition

2.50PM • Metafas • The mass production of a smart textile sock that measures stress behaviour

3.10PM • Loomia Technologies • Automotive Interior Lighting and Heating: Powered by Electronic Textiles

3.30PM • LifeSense Group • Wearable sensors and e-textiles to empower peoples health*

3.50PM • Mycronic AB • Sustainable, digital production of wearable soft-stretchable electronic devices

4.10PM • Exhibition Networking Event

Track 2


09.20AM • Heraeus • Review of industrial applications of printed electronics

09.40AM • NScript • 3D Printed Electronics is Powerful when combined with CHIPS

10.00AM • XTPL • Solution for printed micro-electronics. Next generation of resolution in additive technology

10.20AM • IoTech Group • Digital, Laser-Based, Multi-Materials, Non-Contact Printing of Low and High Viscousity Materials*

10.40AM • Exhibition Networking Event

11.30AM • ElectronInks • Metal Complex Inks for Semiconductor Packaging*

11.50AM • IDS • Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging

12.10PM • Printed Electronics Ltd • Superinkjet: going beyond limits of inkjet*

12.30PM • Neotech AMT • Advances in 3D Printed Electronics

12.50PM • Brewer Science • Printed Water Sensors: From Design to Commercialization*

1.10PM • Lunch & Exhibition

2.50PM • Exeger • Mass Screen Printed DSSC Photovoltaics: Powering IoT Applications*

3.10PM • Solliance • TBC*

3.30PM • Imprint Energy • Ultrasafe Printed Batteries for Smart Electronics

3.50PM • Ensurge • Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries

4.10PM • Exhibition Networking Event

Track 3

09.00AM • TBC • TBC*

09.20AM • Toppan • Highly bendable oxide TFT withstanding over one million bending cycles*

09.40AM • Raynergy Tek • Progress of Organic Semiconductor based NIR-SWIR Image Sensor*

10.00AM • SmartKem • Next Generation MicroLED Displays

10.20AM • Brilliant Matters • Materials Developments for Stable, Scalable and Efficient Organic Solar cells

10.40AM • Exhibition Networking Event

11.30AM • CEZAMAT, Warsaw University of Tech • From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables

11.50AM • SunRay Scientific • Multilayer Silicon RF System-in-Package Technique Using Magnetically Aligned ACEs*

12.10PM • X-trodes • Printed Electrode Arrays: Unleashing the Power of Skin Electrophysiology*

12.30PM • Rochester Institute of Technology • Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets*

12.50PM • Celanese • Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

1.10PM • Lunch & Exhibition

2.50PM • CONTAG AG • A versatile toolbox for innovative mechatronic systems in industrial applications

3.10PM • Cicor Group • Printed sensors using aerosol jet technology

3.30PM • MINT Soldering Solutions • An innovative method to achieve IPC compliant Inter-Metallic Compounds when soldering on printed electronics

3.50PM • Trackwise Designs • Length-unlimited multilayer flexible printed circuits

4.10PM • Exhibition Networking Event

Closing Presentations

4.55PM • Airbus • The Printed Future At Airbus

On Monday, 16 October, TechBlick are hosting 12 expert-led masterclasses, in three parallel tracks, covering themes such as:

  • 3D Printed Electronics

  • Printed Batteries

  • Ink Formulation

  • Electrohydrodynamic Printing

  • Printing HMIs

  • Sustainable Electronics

  • R2R Nanoimprint Lithography

  • Wearable Sensors

  • InMold Electronics

  • R2R Printing

  • Interconnect Technologies for FHE

In the afternoon there will be four company tours to some of the leading organisations located in Berlin, a centre of excellence for these technologies.

For further information and to discover more about the current earlybird attendee passes, please contact Chris Clare at


Subscribe for updates

Thank you!

bottom of page