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Author: Dr. Lena Reinke | lena.reinke@panacol.de Perovskite-based (PSC) and organic photovoltaic (OPV) cells represent a promising frontier in renewable energy generation technologies due to their potential for lightweight, flexible and potentially cost-effective solar power generation. However one of the critical challenges in the commercialization and long-term reliability of OPV cells is their encapsulation. Effective encapsulation protects the delicate photoactive materials from environmental factors such as moisture, oxygen and mechanical stress. Adhesives play a crucial role in this encapsulation process, offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Encapsulation adhesives for OPV or PSC cells must meet several stringent criteria: Moisture and Oxygen Barrier: As the active materials are sensitive towards humidity and/or oxygen, the adhesive should therefore provide good barrier properties to prevent a degradation caused by moisture or oxygen ingress. The adhesive barrier properties can be tuned using to different strategies. One can either use quite hydrophobic raw materials to chemically prevent the ingress of water molecules or the cross-linking properties of some multifunctional components can build up a dense polymer network after curing so that the water ingress is blocked mechanically. UV stability: The adhesive should also withstand prolonged exposure to sunlight without turning yellowish or getting brittle. This is especially important for PV applications that will be used outside. Adhesion strength: It is important to ensure the mechanical integrity of the devices. Therefore, the adhesive needs to firmly bond the encapsulant material to the PV cell layers. Within initial tests, we check the adhesive performance by conducting T-Peel tests. Often it is very helpful to use a pretreatment technology such as corona or plasma to ensure sufficient surface energy and thus an enhanced T-Peel strength. Compatibility: While sufficient adhesion strength is crucial, we also need to address the compatibility between the adhesive and the active layers. While an effective binding towards plastic substrates can often be provided by using monomeric raw materials, those can be quite harmful for the sensitive photoactive materials especially if a pronounced polarity is present. To overcome this issue, chemists need to balance out the ratio between oligomeric and monomeric compounds. We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   For the encapsulation process, there are several types of adhesives that can be interesting. Epoxy-based formulations are widely used as they typically bring chemical resistance and thermal stability. This is due to the durable bonds that are formed during the polymerization process and accompanied by significantly improved barrier properties. Acrylic-type adhesives are also commonly used, especially if it comes to more challenging substrates as for example PET. Here, the required flexibility can be achieved more easily as for the usually more rigid epoxies. An additional advantage for acrylic-based adhesives is the typically faster polymerization. As time often is a critical criteria the curing speed should always be taken into consideration. In Table 1 a qualitative comparison between the two adhesive groups is listed. Table 1 Qualitative comparison of the main features of epoxy- and acrylate-based adhesives. It is obvious that for both adhesive types there are advantages and drawbacks. This is caused by the adhesive’s properties influencing each other. The best example is that the barrier properties of a flexible acrylate-based adhesive are often worse in comparison to a highly crosslinked material. On the other hand, the flexibility of an adhesive also strongly influences the adhesion properties on flexible substrates positively. Therefore, it is required to balance out the adhesive’s flexibility and barrier properties. Another interesting binding task for adhesives is the contacting of the PV cells. To address this topic, it is possible to use electrically conductive adhesives. Those adhesives typically have the drawback that a deep frozen storage and delivery is required as the metal particles tend to settle down. As the particles block UV light, a photoinduced curing is also not possible often resulting in a slow curing speed and high temperatures that are required for curing. With Elecolit 3648, Panacol has developed an adhesive that can be cured under relatively mild conditions (see table 2). The comparatively low viscosity of about 10.000 – 15.000 mPas (at shear rate 10, 25 °C) allows it to be dispensed easily. Table 2 Possible curing parameters for Elecolit 3648. The previously mentioned adhesive properties are complemented by the adhesives' impressive flexibility which allows Elecolit 3648 to be used within flexible PV devices. Join us at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this article, we discuss the theme of volume manufacturing with printed electronics highlighting talks, masterclasses and tours from the likes of Flexoo, Avery Dennison Smartrac, SPGPrints, db-Matik, Beckermus Technologies, Printed Electronics Limited, Voltera, Tracxon, ImageXpert, Fraunhofer IZM, Quantica, Inuru, ScreenTec, etc In a previous article, we have already highlighted some of the talks focused on wearable, bio, and/or medical sensors as well as on digital and 3D additive electronics. In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Flexoo will outline their ability to offer mass customization as well as mass production with a specific focus on smart sensors and labels. Flexoo - a spin-off from InnovationLab GmbH with the direct acquisition of Heidelberg Printed Electronics GmbH - has created unique capabilities, covering all scales of R2R production from development to prototyping, to small volume production, to extremely large volume. In this talk, you can learn how this one-stop-shop approach enables the development and production of products with printed sensors, printed circuits, printed antennas, printed heaters, and beyond. SPGPrints will take you through the journey of scaling up Printed Electronics production along the 3 C’s of de-risking industrialized production using real-life customer cases: Cost, Capacity, and Certainty. They will also cover critical technical and application-design considerations for mass production, including how to balance pattern design, inks, substrates, and production methods. Furthermore, they will discuss how rotary screen printing enables cost-effective and high-throughput manufacturing with superb resolution and excellent thickness control, and they will offer a detailed cost comparison of flat versus rotary screen printing. Avery Dennison Smartrac will outline their developments in green printing in the digital landscape, showing how their approach can scale to mass production. This is an excellent development, combining the long-standing expertise of Avery Dennison Smartrac in R2R production of hybrid electronics with green additive manufacturing techniques. Beckermus Technologies will outline the key challenges of interconnections between chips and flex substrates, especially in R2R hybrid electronic manufacturing. This is a critical technological step in enabling roll-to-roll manufacturing of flexible hybrid electronics. Beckermus Technologies will offer insights based on its years of real-time FHE manufacturing experience, discussing different interconnect material and process technologies. Voltera will present the latest developments using their unique digital printer, focusing on the use case of multi-layered printed battery applications. While this machine is not a volume manufacturing machine, it could play an important role in accelerating the design-to-fabrication process. This is because it enables digital and software-controlled development and prototyping of complex multilayer devices using high-viscosity pastes, which could then be transitioned directly to mass production techniques like screen printing. This is significant because many other digital prototyping techniques rely on inkjet and are thus limited to low-viscosity inks with nanomaterials that cannot be screen printed. Printed Electronics Limited (PEL) will share their unique experiences in prototyping and small production (10 pcs to 2500 pcs) across the resolution spectrum. PEL’s unique capabilities cover the entire resolution spectrum from 1 µm to 1 mm. Their capabilities include superfine inkjet (SIJ), aerosol, screen printing, inkjet, and viscous jet deposition. Even with their screen printers (Microtec printers), they can achieve down to 30 µm linewidths with <15 µm print-to-print accuracy. Furthermore, they can print between 2-14 layers per device, including through-hole printing. db-Matik will present their capabilities, outlining their full turnkey solutions for electronic manufacturing on flexible substrates. This includes printing as well as assembly lines, covering circuit printing as well as component placement on films. Additionally, their solutions offer testing as well as singulation. They are an excellent partner for anyone looking to set up or expand a printed electronics production line. Expert-Led Masterclasses The event also includes fantastic masterclasses dedicated to manufacturing. ScreenTec will discuss how to manufacture wearable sensors. ScreenTec is a well-established printing house with deep expertise and experience in wearable sensor manufacturing. Beckermus Technologies will hold a class on interconnect technologies for flexible hybrid electronics, covering key technologies such as various solders and conductive adhesives. This is a must-attend class for anyone interested in placing components onto films in flexible hybrid electronics manufacturing. ImageXpert will hold a class showing how to optimize an inkjet printing process for electronic or functional manufacturing. This is a must-attend class for anyone wishing to develop and/or manufacture with inkjet printing. TracXon will discuss roll-to-roll (R2R) flexible hybrid electronics manufacturing, covering all steps from R2R printing to R2R assembly and testing. TracXon has robust expertise here, given their own work with R2R screen printing, R2R sintering/curing, and assembly. Printed Electronics Ltd will hold a class covering all digital additive electronics manufacturing tools, from inkjet to aerosol to EHD printing and dispensing, and beyond. This is an excellent overview class for those wishing to apply digital methods to develop or manufacture electronics. Tours We also have several tours related to the theme of manufacturing. Fraunhofer IZM: This is an extremely popular tour, showcasing Fraunhofer IZM’s deep and wide capabilities and expertise in all aspects of advanced PCB and assembly technology, as well as in hybrid soft electronics, integrating electronics with soft substrates such as textiles. Inuru: This is a unique tour showcasing the world’s first and only printed OLED lighting factory. This is possibly the only facility worldwide dedicated to inkjet printing of thin and flexible OLED lighting. Quantica GmbH: Here, you can see the workshop and machinery of Quantica, who offers jetting heads for high-viscosity digital printing of electronics. This is a much-needed technology that promises to break the limits of inkjet printing, making digital functional printing finally a versatile production method. Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, printing houses, and more. This is the place to visit if you intend to develop, prototype, or manufacture with printed and/or flexible hybrid electronics. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here .

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. ISC Konstanz - Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells Oxford Suzhou - Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode OE Technologies - Roll2Roll High-Volume Manufacturing of OPVs Perovskia Solar AG - Perovskite solar cells for low-light applications   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells ISC Konstanz  |  March 2022 Screen printed Cu-pastes for high efficient back-contact silicon solar cells? In this slide deck you can learn about: ✅Accelerated growth of photovoltaics ✅Market growth of PVs and impact on silver consumption ✅Benefits of Copper vs Silver ✅Requirements for Cu based metallization ✅Properties of copper ink from Copprint ✅Back contact solar cells: ISC’s ZEBRA cell ✅Replacement of Bus Bars in ZEBRA ✅Line resistance Cu busbars ✅Results cell IV characteristic ✅Peel force results: soldering and ECA ✅Climate chamber tests ✅Thermal cycling results ✅Damp heat results ✅Conclusion and Outlook Download Presentation Slides 2. Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode Oxford Suzhou  |  JAN 2024 Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode? In this slide deck you will learn about: ✅Inverted Perovskite Solar Cells ✅Inverted Perovskite Solar Cells with Al as cathode ✅Characterization of TOASiW12/Al interface ✅Performance of the inverted PVSCs ✅Air stability the inverted PVSCs ✅Chemical reactions between perovskite and Al ✅In-situ optical microscope images ✅Conclusion Download Presentation Slides 3. Roll2Roll High-Volume Manufacturing of OPVs OE Technologies  |  JAN 2024 Roll2Roll High-Volume Manufacturing of OPVs? In this slide deck , you can learn about ✅R2R process flow ✅R2R Printed OPVs | Smart Manufacturing ✅Automated Coating Station & Vision System ✅In-Line Metrology & Quality Control tools ✅Design and Result Collection ✅OET’s R2R Printed OPVs Manufacturing ✅World’s 1st R2R Automated Manufacturing Line for IPVs (Integrated OPVs) ✅BI(O)PV [Building Integrated OPV] PILOT DEMONSTRATION SITES ✅Agri(O)PV PILOT DEMONSTRATION SITES ✅VI (O)PV PILOT DEMONSTRATION SITES ✅Towards GigaFactory Download Presentation Slides 4. Perovskite solar cells for low-light applications Perovskia Solar AG  |  DEC 2022 Inkjet printed perovskite solar cells? In these slides you can learn from: ✅The Technology ✅Indoor energy harvesting ✅Design Freedom ✅World's first self-charging health tracker ✅Electrical specifications and data ✅Technical developments ✅Damp heat test ✅Sun illumination test including under 11K Lux ✅Production facility Download Presentation Slides

Why You Should Join TechBlick's The Future of Electronics RESHAPED? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of Smart Surfaces and Sensors  including  the automotive and human-machine interface sections. highlighting talks, masterclasses, and tours from the likes of Forvia, Momentive and BSC Computer, Motherson Innovations, Global Access Diagnostics (GADx), Datwyler, Würth Elektronik Group, Metafas, Holst Centre, and Arkema and KEMET. In a previous article, we already highlighted talks focused on wearable, bio, and/or medical sensors.   In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Forvia  - a global automotive supplier - will join us to give an invited keynote talk, outlining their strategy for automotive interiors using printed electronics including smart surfaces. The presentation will cover the specific use cases under development, and will zoom in on specific applications for interior lighting, which is currently the main focus for smart light and surface lighting.  Furthermore, some insights on exterior applications will be shared. Würth Elektronik Group  will outline the state of the art of the industrial stretchable PCBs, which is a novel method for 3D form copper-based stretchable PCBs to create smart surfaces with 3D shapes and with bulk-like properties and good solderability. This technique is a direct alternative to ink-based in-mold electronics (IME). Metafas  will outline its progress on InMold Electronics. This is a promising development as this printed electronics business evolves from screen-printed membrane switches towards more complex printed systems like complex IME products. Holst Centre  will also join us as a masterclass instructor, giving a class on InMold Electronics technology. This class not only covers the key aspects of IME but also uniquely focuses on life cycle analysis (LCA) as well as end of life (EOL) of IME. These are critical themes as one perception of IME is that the embedded electronics can not be readily recycled or recovered. Momentive and BSC Computer will present their unique DEA or Dielectric Elastomer Actuator technology which are capable of replacing small motor-gear units. These DEAs consist of stacks of thousands of individual silicone layers with conductive coatings. The motion dynamics depend heavily on the silicone base material used and the dimensions of the stacks. This talk not only introduces the technology, how it is made and how it must be run and integrated, but also showcases applications including ones that will soon be launched. Datwyler will also present on how to make elastomers smart either by embedding conventional active electronics or using the elastomers themselves as sensors and actuators. Here you will learn about the possibilities of technical solutions for sensing and actuation, and their needed design environments and read-out and analytics, as well as applications. You will see examples with printed and integrated electronics, magnetic active polymers and use of elastomers for bio signal monitoring. Arkema and KEMET will join as masterclass instructors, giving a class on electroactive polymer sensors and actuators. In this must-attend class, the participants will learn about the different types of EAP, the unique property of EAPs with a specific focus on ferroelectric ones, their deposition and processing conditions as well as many applications in flexible electronics from AR/VR to medicals Motherson Innovations will join us to discuss their developments with printed electronics, covering automotive (its main business) as well as other applications. This talk will cover applications developments such as integrated touch sensor, heated toilet seats, heated armrest, integrated ambient lighting, transparent 2D sensors for interactive lighting, printed lighting, and others. Marquardt GmbH - a mechatronic specialist with over a billion EUR revenue - will present its insights on what opportunities exist for printed electronics also beyond cost optimisation and what obstacles are still to be overcome. Marquardt is well placed to assess applicability of printed electronics versus conventional solutions in many fields as it can draw up ten years of dedicated experience and as it is a series supplier in automotive (control elements, vehicle access and driver authorization, battery management systems), white goods and power tools as well as off-road and agriculture sectors.

Author: Mr Naveen Balla, info@hamamatsu.de The production of printed electronics represents a transformative approach to manufacturing electronic devices. Switching from complex technologies like etching or lithography to a printing process significantly simplifies production, offering a cost-effective, versatile, and straightforward pathway to fabricating electronic components on various substrates. As a result, printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells. While already common in various industries, production equipment for printed electronics still has room for improvement to optimize manufacturing efficiency. One important aspect of this optimization, especially when using metal nanoparticle inks, is the sintering process. The sintering step includes fusing the metal nanoparticles in ink ensuring the required low resistivity of the finished circuits. For this task, heating ovens, NIR emitters, and broadband flash lamps are established technologies, but they suffer from drawbacks that limit the speed or efficiency of production. In this article, we present five aspects of printing equipment that can be improved by switching to laser sintering. Table 1: Comparison of different sintering methods We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. 1. Reducing the footprint of the printing machine Furnaces for sintering printed electronics can be large, particularly for serial production. As the sintering process in the oven takes a few to tens of minutes, it typically does not match the production rate of the preceding printing process. To maintain high production rates, more furnaces or long conveyors are required, resulting in a large machine footprint. Laser sintering offers a solution for developing more compact machines. Since the sintering process using NIR laser takes only milliseconds, it can be performed on the conveyor directly after printing, making roll-to-roll processes possible. For machines with limited space, laser sintering provides even more flexibility. As the laser light is coupled into a fibre, it can be flexibly guided over longer distances, allowing separation of the light output from the laser source and its electronics. This minimizes the space required at the light output, enabling smaller sintering machines for confined production areas. Laser sintering is the process where laser is used to heat metal nano/ micro particles to the point that they fuse without completely melting. 2. Increase production speed Switching from a furnace-based sintering process to laser sintering reduces space requirements and helps increase production speed. While the sintering process in a hot air oven takes a few to tens of minutes, NIR laser light sinters the metal ink within milliseconds. This allows high printing speeds and ensures that the sintering step is no longer the production bottleneck. Laser sintering significantly enhances production speed due to the easily scalable laser power, which maintains precise focus with line optics. Depending on the ink and substrate, laser technology allows for speeds of several hundred millimeters per second in roll-to-roll production, substantially increasing output rates. Example of Hamamatsu's SPOLD® laser sintering of conductive inks. 3. Optimizing energy efficiency Energy efficiency is now one of the most important aspects of any production process. Minimizing energy consumption is essential to meet sustainability goals and to reduce production costs, given rising energy prices. The production of printed electronics involves many energy-intensive processes. One example is the sintering step, which requires intense heating to achieve the desired conductivity of the ink, often exceeding 100°C, depending on the nanoparticles. It is an energy-intensive process with significant production costs. Large ovens, commonly used for this process, must heat both the part and the air inside the oven to the target temperature, consuming substantial amounts of power, often 60kW or more. Alternative sintering technologies, such as photonic sintering, also demand considerable power. For instance, flash lamps used during a roll-to-roll process require 5kW of electrical power or more. Laser sintering offers a more energy-efficient solution, due to its high conversion efficiency from electrical power to light power and excellent conversion rate. Typical laser sources for laser sintering, such as the Hamamatsu SPOLD® [1,2] consume around 1kW, while still enabling fast roll-to-roll production. This improved efficiency can significantly reduce production costs over the lifetime of a production machine. Table 2: Comparison of different sintering temperatures for different nanoparticle inks on glass substrates.[3] We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   4. Enabling the use of thermo-sensitive materials One of the significant advantages of printed electronics is the versatility of substrates, enabling electronics to be integrated into various materials like packaging or clothing. However, high sintering temperatures, typically around 200°C for materials like silver nanoparticles, limit the substrates that can be used. For instance, plastics such as polyethylene (PE) begin to soften at temperatures above 70°C, making it impractical to sinter them in furnaces operating at 200°C or higher. Laser sintering provides the solution. As ink and substrates have different absorption properties, it is possible to select a wavelength where the light is only absorbed in the ink while the substrate remains transparent. As a result, only the ink is heated to the required sintering temperature while the substrate remains unaffected. This allows thermo-sensitive materials, such as plastic foils, to be used, which is advantageous for the packaging industry. However, heat dissipation from the ink into the substrate can still indirectly heat and damage it. Therefore, it is essential to tailor the heating illumination to the properties of the materials. Laser sintering has many advantages over photonic sintering using flash lamps as the optimum wavelengths can be chosen depending on the application. The Hamamatsu SPOLD®, for example, is available at 940nm (optional 808nm), minimizing substrate heating compared to the broader spectrum of tungsten lamps. The laser also offers more precise control of power compared to flash lamps, allowing fine adjustment to stay below the melting temperature of the substrate. This precise control further reduces potential substrate damage, crucial when printing on highly thermo-sensitive materials like PET. Hamamatsu's LD irradiation light source (SPOLD®) 5. Reducing ink costs In addition to the flexibility of substrates, one of the significant advantages of printed electronics is the low production cost. Laser sintering can further reduce costs by switching to less expensive inks. Due to the silver nanoparticles dissolved in the ink, it becomes quite an expensive consumable. Indeed, cheaper alternatives, like copper or aluminium offer similar conductivity values but require different sintering parameters to find the optimum conductivity, strength, and adhesion results. For this optimization, the flexibility of laser sintering is beneficial. Hamamatsu collaborates with several ink manufacturers worldwide to support manufacturers when switching ink materials. Together, they test several micro and nano ink formulations to find their optimum sintering parameters, giving customers a head start when switching to cheaper inks. Laser Sintering increases productivity Switching to laser sintering can significantly impact the productivity of printed electronics production. The laser adds the necessary flexibility to your process and enables the optimization of important parameters like resistivity, density, and adhesion by choosing the optimum ink type, laser power, or conveyor belt speed. Application tests are essential to maximize this increase in productivity. Hamamatsu Photonics supports customers with dedicated application engineers who conduct sintering tests to identify the optimum set of parameters. This simplifies the transition to new laser sintering technology and ensures customers get the most out of their printed electronics production. For more information on our SPOLD® device or on this topic, please contact: info@hamamatsu.de References [1] Hamamatsu Photonics, LD irradiation light sources (SPOLD®): www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers [2] Hamamatsu Photonics, "Weld, Solder, Cure or Sinter with SPOLD®":   www.youtube.com/watch?v=I0sLZBR9u_I [3] A Review on Printed Electronics, 2021: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts: doi.org/10.3390/jmmp5030089 Save the Date! The Future of Electronics RESHAPED 2025 | USA | Europe

25 & 26 Sept 2024 | High Tech Campus, Eindhoven, Netherlands Introducing the Program - MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies MicroLED Connect is the world's first dedicated MicroLED conference and exhibition. We have put together a fantastic world-class program of talks, masterclass, exhibitors, and company tours, featuring the likes of Google, Meta, TCL CSOT, Continental, GlobalFoundries, Konica Minolta, Toray Engineering, Coherent, Applied Materials, Aixtron, and many others. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. Here, we discuss the theme of MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies , highlighting talks, masterclasses, and tours from the likes of Yole, Omdia, Hendy Consulting, and UBI Research. The microLED industry is backed by the largest companies in the display industry, and has the support of the world's consumer electronics industry. But the technology is still at an early stage, and the road to success is not yet clear. MicroLED-Connect will present a great opportunity to understand the current status of the industry, learn the different roadmaps, understand the key application areas and what the near- and far-future holds for microLEDs. Yole Intelligence: They will present a talk on MicroLED Status and Roadmap, outlining the market, the value chain, and emerging applications as well as segmented and detailed market forecasts. Yole is one of the best analyst groups in the field and can thus deliver deep insight into technology roadmap and market forecasts Omdia:  In one of the closing keynotes, Jerry Kang from Omdia will join us onsite to offer a MicroLED industry update. He will offer his analysis of the state of the industry, outlining key challenges and offering detailed market forecasts segmented by technology, application, and process. Omdia is also a key reference point in the display industry, with many in the value chain relying on their information, analysis and insights to develop their go-to-market as well as technology strategies in the display sector. Masterclass UBI Research: They will instruct a masterclass on AR and VR technologies, reviewing the key technologies, applications and market trends. UBI Research is a well-established and highly respected Korean market research firm in the display industry with excellent access to the key players in the display value chain. This is a superb opportunity to learn the latest on AR/VR technologies. Hendy Consulting: Ian Hendy is one of the best regarded consultants in the display industry, uniquely offering strategic outlooks on technology and market developments. He will offer an insightful analysis of the competitiveness of MicroLEDs vs both QLED and QDEL. He will outline how one can track market developments and consider technology breakthroughs required to enable the required price reductions. This is an excellent opportunity to learn from and engage with one of the best consultants in the field.

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. anthos iD | i-components | High Performance Barrier Solutions for Thin Film PV Applications Coatema | The pathway to digital fabrication of printed electronic products Crystalsol | Printed CZTS photovoltaic technology FOM Technologies | The role of slot-die coating in the future of photovoltaics Verico Technology Holdings Inc | Verde | Speeding commercialization through early engagement with contract manufacturers   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. i-components | High-Performance Barrier Solutions for Thin Film PV Applications anthos iD |  DEC 2022 In this slide you can learn about high performance barrier solutions for thin film PV: ✅CIGS module structure and the appropriate barrier sheet/foil ✅Module certification with Full Test Sequence - IEC 61215 ✅Module quality tests ✅Module certification results (Damp Heat, thermal cycling & humidity freeze tests) ✅Insulation & wet leakage current tests Download Presentation Slides 2. The pathway to digital fabrication of printed electronic products Coatema |  JUNE 2022 In this slide deck you can learn about upscaling OPV production with slot die coating ✅Overview of the different solar cell types ✅Production chain modules ✅Progress on flexible roof integrated PV from 1999 ✅Development history of OPV at Coatema since 2008 ✅New Lab2Fab process approach - Process feasibility study ✅Upscaling to production ✅Proof of production process in Greece – Flex2Energy ✅Agrivoltaics and expected market ✅Inline process control, Inline process integration and measuring points ✅Automatic anomaly detection for time series ✅Slot die coating for 3rd Gen PV ✅Drying technologies for 3rd Gen PV ✅Today`s equipment for today 3rd Gen PV   Download Presentation Slides 3. Printed CZTS photovoltaic technology Crystalsol |  JAN 2024 In this slide you can learn about a unique printed CZTS photovoltaic technology ✅ Printed CZTS Photovoltaic Technology ✅CZTS- (Kesterite-) powder production ✅Powder-composition (EDX elemental analysis) ✅Tunable cell voltage (Voc) of CZTS monograins ✅Stability of Kesterites of different Chalcogenide-ratios ✅2 Parts: Powder Synthesis (high T.) and Module-Printing (low T.) ✅crystalsol mono grain cell ✅Modul-printing in a continuous Roll-to-Roll-Process ✅Efficiency potential ✅Crystalsol ́s confirmed solar cell efficiency ✅Lifetime testing ✅Temperature Coefficient ✅BIPV elements   Download Presentation Slides 4. The role of slot-die coating in the future of photovoltaics FOM Technologies |  DEC 2022 In this slide you can learn about slot die coating for the future of photovoltaics ✅World PV landscape ✅Perovskite-based tandem time evolution ✅ Non-scalable vs. scalable efficiency gap ✅ Perovskite-based PV upscaling potential ✅Cycle time analysis ✅ Scalable vs. non-scalable efficiency development ✅Scalable vs. non-scalable efficiency development Download Presentation Slides 5. Speeding commercialization through early engagement with contract manufacturers Verico Technology Holdings Inc | Verde |  JAN 2024 In this slide you can learn about Speeding commercialization through early engagement with contract manufacturers ✅Verde Slot Coating ✅Rapid transfer between coating techniques (automated spin coating to slot coating to full-scale roll-to-roll) ✅ Operation of coating line   Download Presentation Slides

23 & 24 October 2024 | Berlin, Germany TechBlick Future of Electronics RESHAPED - Why Join? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of Additive and 3D Electronics , highlighting talks, masterclasses, and tours from the likes of European Space Agency, Yole Group, Decathlon, LPKF Laser & Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, and Henkel and Tecna-Print, Printed Electronics Ltd, ImageXpert, and Quantica. In follow-up articles, we highlight many more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, smart surfaces, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Advanced Electronic Packaging is emerging as a key target application for additive and 2.5D/3D electronics. To this end, we have invited Yole Intelligence - a leading market and technology analyst in the field - to give a keynote, reviewing the latest technology and market trends and drivers, as well as the potential emerging role of new additive manufacturing processes. Furthermore, the innovation and manufacturing landscape in Europe will be discussed and reviewed. Next, we have invited ESA (European Space Agency)  to also give a keynote, focusing on the many motivations to explore, develop and adopt additive manufacturing of electronics (AME) for the space industry. AME offers many unique capabilities, including, but not limited to, local / European ecosystem, green manufacturing, weight reduction, agile manufacturing, and innovative complex designs not achievable using other means. We have also invited NextFlex  to join us as a keynote speaker, offering a US centric view of the latest innovation and manufacturing developments for flexible hybrid electronics (FHE). NextFlex is extremely well placed to offer this perspective as it is at the center of the FHE technology in the US, bringing the ecosystem together, helping with funding, and also at the same time advancing the technology. Elephantec will join us from Japan to present on its development to enable sustainable and green additive manufacturing of electronics with inkjet. Elephantec is an innovative company in this field, having developed a unique method to sustainably and semi additively manufacture copper based flexible PCBs with properties identical to the wasterful and resource-intensive chemically-etched conventional FPCBs. This approach is based on inkjet printing a special in-house copper formulation as a seed layer with strong adhesion followed by Cu plating to mass manufacture FPBCs. This is one of the most advanced developments in this field. Fuji Corporation will also join from Japan to report the latest on its additive electronic printer, enabling not just the printing of multilayer 2.D and 3D PCBs but also the integration of SMT components in the same machine. This is an important advancement of the art and technology in the field as it is non trivial to achieve PCB printing as well as SMT mounting and integration in the same machine with a stable and smooth process. This will open the door to many applications requiring additive and sustainable manufacturing of electronics with fine features and complex designs. Nano OPS will join us from the USA to present their unique directed assembly-based printing method for electronic and advanced packaging manufacturing at not just micro but also the nanoscale! This is truly an innovative approach and radically different from all those based on inkjet or aerosol or similar techniques. Here, a lithographically patterned mask on a wafer creates the openings which are selectively filled - with excellent uniformity and high-aspect ratio at high throughputs - with a range of materials using the directed fluidic. This process enables high-quality nano-scale printing of thin and high-aspect-ratio structure based on a wide menu of materials on silicon wafers at high throughputs without requiring any etching. Notion Systems will also present their latest advances in bringing additive manufacturing of electronics to mass production. Notion System has unique expertise worldwide both on commercial scale and feature resolution. On the commercial scale, they have delivered machines to print in PCB production as well as OLED displays (latest delivery was a Gen 6 machine!), whilst on the feature resolution front they have advanced inkjet as well as EHD printer technology, taking the resolution down to a few micrometer range. Exxelia Micropen will also join us from the USA to showcase their unique additive dispense technology, which allows them to print conductive traces, traces and markets on a variety of medical devices with 2D or 3D shapes. This is an advanced manufacturing capability - especially targeting the medical sector - as it is a direct process with good precision, as it can handle a variety of materials with broad viscosity, and as it can be applied to different device shapes using its impressive 5-axis of movement. Henkel and Tecna-Print will co-present on the stage, reporting the latest on their advancements of 3D pad printing, which is pushed forward by the closer collaboration of these machine and material innovators. This is a unique process that enables one to print inks and pastes onto 3D shaped surfaces with applications in 5G antennas and others. This process is a printing-based alternative to the well-established LDS (laser direct structuring) process used widely in many corners of the electronic industry to metallize 3D shapes. Of course 3D and/or (semi)additive electronic manufacturing is not limited to printing. In fact, several other processes exist. Other alternative processes include Laser Direct Structuring (LDS) or coated microAM. Here we will hear from Decathlon , explaining how they have applied and tested the LDS processes on a headlamp product. Here, the motivation is to reduce the CO2 emission by switching away from typically etching-based electronics manufacturing. In this talk, you will learn not just about how LDS can be leveraged in this particular product, but also about the carbon footprint of this process vs conventional technologies as well as the economic evaluation of this process from an end user point of view. We will also hear from Horizon Microtechnologies , who will report on a novel technique that combines micro-scale additive manufacturing (3D printing) with functional conformal coating to enable photopolymer-based precision 3D printing of parts with electronic functionality. This is a unique approach in that it brings electronic functionality to existing precision 3D printing processes. Here we can see how this process can be applied to develop high-frequency RF devices and electronics. LPKF Laser & Electronics will join us to present their work. This time they will introduce their semi additive method to enable the integration of brittle glass into 3D packaging. Glass has incredible properties for advanced packaging, but is brittle and difficult to process. LPKF will report on its breakthrough Laser Induced Deep Etching (LIDE) process which enables the process of glass, addressing the material’s brittleness and also facilitating its integration into existing semiconductor and advanced packaging processes. This theme of additive and 3D manufacturing is so critical to the future of electronics that we have dedicated two masterclasses and a tour to it. This is an excellent chance to learn the latest! First, you will have the chance to learn about digital additive manufacturing of electronics in 2D, 2.5D and 3D from Printed Electronics Ltd. Here, you can learn about all the key processes including inkjet printing, aerosol, EHD, microdispensing and others. This is a must-attend class for anyone wishing to have an overview of these technologies and their applications. Next, you can learn from ImageXpert on how to optimize inkjet processes for printed electronics. This is a critical technique as inkjet printing is an art and without the tools and know-how to optimize the process - from waveform selection to all the other parameters - one can not succeed in establishing a stable manufacturing process in good time. This is a must-attend class for anyone wishing to inkjet print functional materials. Finally you can visit Quantica - an innovative Berlin company developing novel printheads that enable the digital printing of high-viscosity functional materials, breaking the conventional viscosity limits of inkjet printing that several constraints the material choice and enabling new products, new materials and even new business models with digital printing of electronics.

Why Join TechBlick's Future of Electronics RESHAPED? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of wearables, e-textiles, and printed medical sensors , highlighting contributions from the likes of Meta, Air Force Research Laboratory, X-Trodes, Creative Materials, PolyPhotonix, Light Tree Venture Group, Nagase ChemteX, Texavie, Danish Technological Institute, Sun Chemical, Nanoleq, Profactor, ScreenTec, and Elitac Wearables. In follow-up articles, we highlight many more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, smart surfaces, additive and 3D electronics, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Wearable Sensors Meta wil join us from the US to present, offering an overview of the current state of non-invasive biopotential sensors for future wearable electronics including EEG, ECG, and EMG. Non-invasive biopotential wearable sensors offer many clear benefits over conventional approaches, hence the growing market interest. Furthermore, Meta will highlight the challenges as well as promising future prospects for these sensors, including their integration into wearables devices and potential influence on human-computer interactions. X-Trodes will join us to discuss their soft electrode array technology for wearable skin electro-physiology. This is a technology that enables electrophysiology to be applied outside labs into freely behaving humans in their normal daily activities. This is an impressive solution, combining printed dry electrodes with wireless sensors, data storage, and automated data analysis. Here you can learn about the underlying technology, benchmarking data vs clinic-based conventional solutions, and the future roadmap. ScreenTec will join us as a masterclass instructor , offering a real manufacturer’s perspective on commercial development and mass production of printed wearable sensors. This is a must-attend class for anyone interested in the field as it offers unique insights, helping understand real technical and cost requirements for printed wearable sensors. Danish Technological Institute(DTI) will also present on its one-stop-shop approach. This is an important ecosystem development which will help accelerate idea-to-product especially in the European ecosystem. You can learn how this one-stop-shop can guide you in the development of wearable sensors and e-textiles from feasibility studies to design to prototyping and even small scale manufacturing. Electronic Textiles Texavie will join us from Canada to present on their novel smart apparel technology aimed at personalized therapy and wellness solutions. This innovative approach combines advanced yarn sensor technology and flexible smart textiles with machine learning, AI and data analytics to provide real-time monitoring and personalized feedback with high accuracy and fidelity. This is a unique approach both at the hardware level but also at the level of creating a full solution encompassing all steps from wearable sensors, hardware, and data analysis. Nanoleq will join us to present its novel silicone-based non-invasive dry electrode technology, which enables capturing ECG with HR and HRV, EMG or EEG in high quality, or to even stimulate muscles and nerves. This novel mass production-ready technology is based on silicone dry and washable adhesive electrodes, designed to be integrated into intelligent textile garments using thermo adhesive systems common in standard textile bonding. PROFACTOR will present a digital inkjet-based method of integrating electronic circuits and sensors onto textiles. Most alternative approaches use screen printing or some type of conductive fibers or yarns. The digital printing offers unique customization advantages inaccessible to alternative methods. In this talk, an inkjet-printed breath rate sensor, accelerometer and pulse sensor were integrated on a stretchable fabric and evaluated under conditions akin to human respiration. Elitac Wearables will join us as a masterclass instructor , offering a class on integration methods of electronics including sensors, actuators, interconnects, power, etc into textiles. The interaction method is a complex yet crucial theme in e-textiles influencing design, manufacturing, and functionality. This class draws upon years of experience, helping the participant navigate the design process and select the right solutions to create smart wearables and electronic textiles. This is a must-attend class. Materials Air Force Research Laboratory will join the conference from the US to discuss liquid metals as printable materials. Liquid metals are a unique and emerging class of conductive materials that offer truly unmatched stretchability, meaning that they could be integrated into or onto textiles, fibers, etc to enable various sensors and circuits. This is an important development since the advancement of wearables and e-textiles - and generally soft and stretchable electronics - is not possible without further material advancements. Sun Chemical will present the latest insights on biosensor ink technology. This is crucial since inks play a foundational role in any printed biosensors. As the application space evolves including the rise of continuous monitoring and applications with prolinted skin or analyte solution contacts, the material requirements for ink systems change. Here, you will learn the latest trends and technical developments. Nagase ChemteX will also present the latest results on their washable and stretchable ink systems. This is an important contribution as the focus is on the latest developments in the washability of conductive inks in conjunction with various substrate and material systems, a vital feature and figure-of-merit for any wearable or e-textile system based on printed electronics. Creative Materials will also offer critical insights into ink and material selection for skin patch printing and manufacturing. This is important because careful selection of materials and patch geometry ensure maximum durability and user comfort. There are many considerations including thickness, moduli for mechanical matching of ink and substrate systems, chemical compatibility, interfacing joints, etc. Here you can learn how to design multivariable experiments to optimize the final device bill of materials Light Therapy Light therapy is growing in importance. Flexible electronics inevitably play an important role in this area. To this end, we have organized several interesting talks and visits. Light Tree Venture Group will present its large-area flexible LED foil system that can be integrated into various products for wearable therapy devices. This is a mass-produced product with unique features and unique manufacturing methods. PolyPhotonix will also present its novel wearable OLED-based sleep mask that enables the treatment of diabetic eye diseases using light from thin OLEDs integrated into the sleep mask. This is an innovative product backed with strong data and is also in use. Finally - when it comes to flexible lighting - you will have a unique opportunity to visit the Inuru factory in Berlin - the first company in the world that will mass-produce flexible OLED lighting with inkjet printing. This -to our minds - is one of the most exciting projects in printed electronics and is a tour that should not be missed!

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. b-science | Solid Electrolyte / High Energy Negative Electrode Permutations for High Energy Li-ion Batteries - an Innovation & Patent Analysis CIDTEC | In-situ solidification: path towards semi-solid-state batteries mass production ETH Zurich | Enhancing Sodium Battery Performance with Freeze-Cast NASICON Solid Electrolytes Amprius | Transforming Electric Mobility Empa | Thin-film solid-state batteries: from micro-devices to monolithically-stacked bulk batteries The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024. Explore the preliminary agenda here. 1. Solid Electrolyte / High Energy Negative Electrode Permutations for High Energy Li-ion Batteries - an Innovation & Patent Analysis b-science | FEB 2023 In this presentation, you can find an innovation and patent analysis on Solid Electrolyte / Negative Electrode Permutations for High Energy Li-ion Batteries, including: ✅ Outline of Possible Permutations – Solid Electrolyte / Positive Electrode ✅Solid Electrolyte Parameter Space – Porosity & Interface Area ✅ION Storage Systems & University of Maryland ✅ Halide ‘Catholytes’ Improve Overcharge and Heat Release Characteristics in Combination with Sulfides ✅Toyota / Panasonic ✅ Coating of LATP and NMC Allows for Improved Material Compatibility ✅ What Polymers and salts Can be Used? ✅ ProLogium (semi-solid electrolyte) ✅Hypothesis- vs. Data-driven Product Development ✅Si Nanostructures On Carbon or Current Collector Foils | Cost Target: <20 USD/kg Si ✅Porous Si | Probable Cost Target: <10 USD/kg Si ✅Micro-scale, Bulk Si, | Probable Cost Target: USD <5/kg Download Presentation Slides 2. In-situ solidification: a path towards semi-solid-state batteries mass production CIDTEC | FEB 2024 In this presentation you can learn about in-situ solidification for semi-solid-state battery mass production: ✅SSB manufacturing | In-situ solidification is the key? ✅Innovative semi-SSB by in-situ solidification ✅Lithium metal semi-SSB: Concepts, Electrochemical performance @ 25oC and summary of results ✅Lithium ion semi-SSB: Concepts, Electrochemical performance @ 25oC and summary of results ✅ Development roadmap Download Presentation Slides 3. Enhancing Sodium Battery Performance with Freeze-Cast NASICON Solid Electrolytes ETH Zurich |  FEB 2024 In this presentation, you can learn about the enhancement of sodium (Na) batteries with freeze-cast NASICON solid electrolyte, including: ✅ Introduction: Freeze-Casting Process ✅ Na Super Ionic CONductors (NASICON) Solid Electrolytes ✅ Freeze-Cast Oriented Porous NATP ✅ Freeze-Cast Oriented Porous NATP: Sodium Stripping and Plating Tests ✅Freeze-Cast Oriented Porous NATP: Cathode Material Infiltration ✅Cathode Infiltration and Electrochemical Performance Download Presentation Slides 4. Transforming Electric Mobility Amprius |  FEB 2024 In these slides, you can learn about silicon anode batteries with a specific focus on Amprius' approach including: ✅ History of development and scalable ✅ Graphite vs Si, and 100% Si ✅ Comparing conventional graphite with pure Si vs Li metal (all with NMC811 as cathode) ✅ Si anodes: Evolution of energy density vs year by company and materials composition ✅Specific power vs specific energy at different discharge rates for Si (with LCO or NMC cathode) vs Graphite ✅ Results for 500 Wh/kg cells ✅External validation ✅ Results on ULTRA high-power high-energy cell platform ✅ Extremely fast charging results ✅ Applications Download Presentation Slides 5. Thin-film solid-state batteries: from micro-devices to monolithically-stacked bulk batteries EMPA |  FEB 2023 In this slide you can learn about thin film solid state batteries: ✅What are thin film solid state batteries - dimensions, structure, manufacturing methods, etc ✅All dry fabrication of thin film batteries ✅ Cathode: Li-rich NMC811 thin films ✅ Cathode: cycling of Li-rich NMC811 ✅ Separator: thin-film LLZO ✅ aLLZO as ultra-thin separator ✅ a-carbon interlayer for anode-free ✅ Plating and stripping of Li metal ✅ Ragone plot for thin-film batteries ✅ Monolithic tandem thin-film battery ✅Potential of monolithic multi-cell battery Download Presentation Slides

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. Aurimod | Personalized Auricular Vagus Nerve Stimulation – A New Method for the Treatment of Intractable Chronic Low Back Pain Mesomat | Stretchable piezo-resitive yarns for strain sensing in high-deformation systems Nagase ChemteX America | Conductive Ink Wash Testing 3E Smart Solutions | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology North Carolina State University | Liquid Metal Enabled Soft Electronics and E-textiles   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. Personalized Auricular Vagus Nerve Stimulation – A New Method for the Treatment of Intractable Chronic Low Back Pain Aurimod |  MAY 2023 In these slides, you can learn about personalized auricular vagus nerve stimulation. In particular, you can learn about: ✅ The problem statement and definition including stats on chronic backpain ✅ Neuromodulation methods ✅ Neuromodulation indicator for various conditions and body parts ✅Nervus Vagus and Role in Pain Modulation ✅ Clinical results on pain reduction ✅ Personalizing therpay ✅ The AuroMod Study Download Presentation Slides 2. Stretchable piezo-resistive yarns for strain sensing in high-deformation systems Mesomat |  DAC 2022 In these slides, you can learn about an innovative piezoresistive stretchable sensor including: ✅ Innovative piezoresistive stretchable sensor ✅ Composition and operating conditions ✅ Resistance vs time with various repeated strains ✅ Long-term performance ✅ Application in tyre monitoring - a full stack solution Download Presentation Slides 3. Conductive Ink Wash Testing Nagase ChemteX America   | APR 2024 In this presentation you can learn about washable conductive inks: ✅ Testing processing and objective for measuring washability ✅ Evaluation methods and samples ✅Change in resistance vs wash cycle of different inks/compositions on substrate A ✅ Impact of Substrate Download Presentation Slides 4. Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology 3E Smart Solutions |  APR 2024 In this presentation you can learn about driving reliability and scalability in electronic textiles and wearables via Embroidery Technology, including: ✅Embroidery of smart textile including PCB integration, textile electrodes and tailored placement of fibers and wires ✅ Considering and methods for (semi) automatic PCB integration and placement via embroidery ✅Applications, methods and results for electrode integration in smart textiles via embroidery ✅ Applications, machine, and mass production example for placement of functional and other fibres, wires and tubes in smart textiles via embroidery Download Presentation Slides 5. Liquid Metal Enabled Soft Electronics and E-textiles North Carolina State University | MAY 2023 In this presentation, you can learn about liquid metal-enabled soft electronics and e-textiles including: ✅ Eutectic gallium indium ✅ Role of surface oxide ✅ Patterning microfluidics ✅ Fibers with liquid metal ✅ Achieving conductive fibre with the stretchability of rubber ✅ Liquid metal-coated textiles ✅ Anti-bacterial properties ✅ Stretchable barriers and the benchmarking of properties of liquid metals   Download Presentation Slides

TechBlick, the leading platform for emerging technologies, has reported high demand for attendee places at the third version of its in-person flagship event which takes place on 23 & 24 October at The Estrel, in Berlin - https://www.techblick.com/electronicsreshaped The Future of Electronics RESHAPED conference and exhibition is the most important upcoming industry event in additive, sustainable, flexible, hybrid,  wearable, structural and 3D electronics. The event will offer a comprehensive and global curated agenda with three parallel tracks. Confirmed speakers include Forvia, European Space Agency, Meta, Decathlon, Airbus, Air Force Research Laboratories, Fuji, Datwyler, Motherson Innovations, Würth Elektronik, Avery Dennison, LPKF, Marquardt, Louisenthal Papierfabrik, imec, Nextflex, and many others. Khasha Ghaffarzadeh, CEO of TechBlick reported: “We have seen high demand for attendee places with companies excited by the quality of the speaker programme and exhibitors.  We have an attendee early bird ending this Friday, 12 July too. This event will be where the world’s printed electronics industry connects and does business and is an important event in the emerging technologies calendar" The exhibition floor will feature 80+ exhibitors with 90% of the booths already sold.  It represents cutting-edge technologies and products as well as the entire global value chains. It is the chance to see, touch and feel the latest in this exciting field. Events are also about learning and experiences, which is why TechBlick have designed a fantastic day of expert-led masterclasses and tours on Tuesday 22 October the day before the conference & exhibition). The 12 industry- and expert-led masterclasses cover many important applications, manufacturing methods, and materials. These are must-attend classes for anyone wishing to develop in-depth knowledge and practical understanding. You will have a choice of 4 tours to world-famous institutions like Fraunhofer IZM and Fraunhofer IAP as well as exhibiting printed electronics equipment makers and manufacturers like Inuru and Quantica. Attendee places are limited and demand is high so be sure to book your place soon.  The summer attendee early bird expires on 12 July -  https://www.techblick.com/electronicsreshaped