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In this illuminating presentation, Michael Petersen will walk us through the transformative path of medication adherence advanced by smart packaging technology. Focusing on remarkable innovations like Information Mediary Corp's Med-ic smart blisters and CertiScan solutions, Petersen will provide a comprehensive insight into how these pioneering tools have decoded complex adherence puzzles and driven industry momentum, albeit slowly. By tracing the arc from traditional to smart adherence packaging, Petersen aims to showcase the remarkable potential of digitization in healthcare while acknowledging the challenges and the gradual pace of progress. Attendees will come away with a deeper understanding of the power of smart adherence packaging to reduce clinical uncertainties and improve patient outcomes, despite persistent industry inertia. This discourse forms an integral part of the larger dialogue about the transformation of healthcare through technology at the TechBlick event in Berlin SAVE THE DATE

Speaker: Alan Wu Company: Smooth & Sharp The RFID business continues to grow. The global RFID market is anticipated to continue to grow in 2023, according to several market researches, it projects a market value of US$14~15 billion in 2023. Retail apparel continues to dominate the UHF industry in terms of tag number and market size. The 2023 forecasts nearly 23~24 billion UHF RFID labels will be used in retail apparel tagging. In the latest study series into the UHF RFID market, predicate UHF RFID label shipment will rise to 80~90 billion by 2028, with a 25 percent compound annual growth between now and 2026. All these billions of UHF RFID label are designed for single-use, they will be discarded right after customer bring them home. Almost all these ten billions of RFID labels are made with etched antenna on plastic, a lot of pollution during chemical etching process and leave waste plastic after use. In this presentation, S&S will unveil the first and only ISO certified Biodegradable RFID antenna by using Additive Manufacturing SAVE THE DATE

Karl-Heinz Fritz Company: Cicor Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way. This presentation will give an overview about different ways to make best use of the capabilities SAVE THE DATE

Speaker: Sven Hujo Company: Delo Flexible electronics have the great potential to reshape the upcoming decade from automotive interior design to smart textiles. In this presentation the potential of new functional polymers will be highlighted, which are on the one hand side capable to ensure flexibility and on the other hand side long term reliability. The property profile of functional polymers or adhesives is able cover a wide range of bonding and coating applications in flexible electronics. To ensure both electrical and mechanical connection of SMDs on flexible substrates it is possible to dispense non-conductive (NCA) and isotropic conductive adhesives (ICA) together to combine their benefits. For this reason, adhesive solutions are important for the introduction of new flexible electronic devices and applications to the market. SAVE THE DATE

Speaker: Teemu Alajoki Organization: VTT SAVE THE DATE

With ambient IoT standards emerging from IEEE and 3GPP and adoption of Bluetooth based ambient IoT rapidly scaling from hundreds of millions to billions, it’s important to understand this new segment of the Internet of Things. The original vision of a pervasive IoT was limited by low cost tags that required expensive infrastructure (RFID), or high cost tags with low cost infrastructure (cellular and LP WAN). Ambient IoT is on a trajectory to scale to trillions of connected things by having low-cost tags and low or even no cost infrastructure. In this talk we review the emerging standards, architecture, and applications for ambient IoT. SAVE THE DATE

Neural implants have the potential to restore lost or impaired nervous system functions through electrical stimulation or recording of the brain. However, current neural implants suffer from a fundamental limitation: a mechanical mismatch with the soft host tissue of the central nervous system which can cause poor electrode-tissue contact, unspecific stimulation or recording, and chronic scarring. At Neurosoft Bioelectronics, we have developed soft neural electrodes that address these limitations. Our electrodes are made of more compliant materials that seamlessly interface with the brain, promoting the long-term bio-integration of the devices and reducing surgical risks opening new avenues in the field of Brain-Computer Interfaces (BCI). SAVE THE DATE

With the growing incidence of record high temperatures, extended heat waves and extreme weather events, it is increasingly important for physically active people to take steps to avoid heat-related complications and optimise performance under hot conditions. Maintaining proper hydration is a key part of this process. However, both the rate and salt content of sweat can vary significantly by person, actvity type and intensity, and weather conditions among other factors. Thus there is a need for personalised monitoring devices tailored to the individual and the type of activity. For athletes, workout routines typically have pre-defined intensities and durations with known weather conditions. Capturing sweat profile snapshots under a variety of conditions enables predictions of hydration needs for future workouts, with an accuracy depending on the number and variety of snapshots. A single-use wearable of the type presented in this talk provides an efficient and cost- effective way to capture these snapshots. Some of the unique design and manufacturing challenges involved in bringing such devices to market will be discussed. For industrial workers, physical activity can extend over longer durations, be highly variable in intensity, and occur multiple times during a single day under variable weather conditions. Moreover, overheating impairs both physical strength and mental acuity, raising the likelihood of workplace injuries. Such workers benefit from a continuous monitoring device that provides instantaneous feedback and can be worn on a daily basis. Various aspects of the design of such a platform and how it differs from the single- use device will be presented. SAVE THE DATE

Ehsan Faegh Company: CCL Industries, Imprint Energy The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems. In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount. Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor. Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential. Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption. Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products. SAVE THE DATE

Speaker: Gari Arutinov Compay: Holst/TNO .With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield SAVE THE DATE

Author: Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro Advanced packaging of semiconductor-based sensors brings very specific interconnection requirements. These often are related to a very narrow pitch of the interconnections or the fragility of the sensor. Different interconnection methods may also be needed because of the orientation of the sensing area or the integration of the sensor in Flexible Hybrid Electronics. DoMicro has developed an interconnection process for micro assembly of semiconductor-based sensors. This interconnection process is described as inkjet printed wire bonding. This article highlights results from recent work on an application with complex sensors. Furthermore, it includes a perspective on the competitive advantages brought by inkjet printed wirebonds. Conventional interconnection methods Figure 1. Inkjet printed wire bonds for the interconnection of microprocessor bare die Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro for your discounted attendee passes Figure 1 shows a sample with interconnections made with inkjet printed wire bonding. This printing method can be considered as 2.5D printing. Depending on the sensor and integration and processing challenges, the inkjet printed wire bond interconnection method brings advantages over conventional interconnection methods. Reduced heights: Thin integration of bare die sensors for flexible hybrid electronics can be done for BGA or QFN packages which are soldered to the PCB. These typically are made with wire-bond interconnections from the sensor die to a lead frame. This results in a relative thick package. Integration of the bare (and thinned) die directly on the flexible circuit reduces the total height. The inkjet printed wirebond interconnection method can be used to interconnect bare dies to the flexible circuit without adding extra height to the package. Configuration choices: Some optical sensor chips have their contact pads on the same plane as the sensor area. Interconnection with the (Flexible) PCB can therefore not be done using flip chip methods with anisotropic bonding. An advantage with inkjet printed wire bonds is that different configurations are possible. Solutions for heat limitations: The limitations of the processing conditions of some opto-semiconductor sensors do not allow wire bonding or flip chip bonding. The temperature, pressure or ultrasonic energy of these interconnection methods can damage those sensors. Inkjet-printed wire bonds uses less harsh processing conditions. This is a non-contact interconnection method where only limited heat is required. Inkjet printed interconnections enable new (ultra-thin) applications Using inkjet printing technology, DoMicro has developed a state-of-the-art approach for micro assembly of demonstrators for advanced applications with for example ICs, passive components, sensors and LEDs. In previous work, DoMicro has worked on the integration of thinned bare dies using the inkjet printed wire bond interconnection method. The technology for integrating dies is one of the key enablers for the realization of new applications in flexible hybrid electronics (FHE), e.g. in in-mould electronics or smart glass. This approach was developed for a wireless IoT demonstrator with a face-up thinned bare die. The die was interconnected on its bond pads. This demonstrator is shown in Figure 2. As it is impossible to inkjet print conductive tracks via a steep vertical surface, a dedicated ramp structure guides and supports the inkjet-printed silver conductors. This innovative approach of contacting avoids any regular and height consuming wire bond loops with glob top or as applied in advanced packaging, a redefinition layer or substrate (RDL) interface. The ‘die first’ approach is creating minimal height for assembling and mounting dies in systems. It is very suitable for sensor ICs for which the active side should be face up and it offers a compatibility of material surface interaction. The wireless IoT demonstrator includes touch sensors and a Bluetooth chip. With the integration of ultra-thin bare dies, the total height of the demonstrator could be kept below 0.5 mm. Using a flexible substrate of only 50µm thick and bare dies of 40µm thick, the passive components and crystals are now the thickest parts of this demonstrator. This thin form-factor enables smooth integration of functionality in various surfaces, labels, fabric etc. Figure 2. wireless IoT demonstrator Advanced sensor interconnections Based on the work as described above, DoMicro is currently working on an interconnection solution for advanced photoelectric sensors. These are opto-semiconductor line sensors with a high spatial resolution. The top electrode of the sensor is patterned and consists of more than 250 individual pixels at a fine pitch of 100µm. The pixels need to be interconnected with the read-out electronic device which is packaged as a flexible COF (Chip On Film). This semiconductor sensor cannot withstand high temperature and pressure so the interconnection processes have to be adapted to these constraints. The processing steps are defined: Bonding the COF module on the top electrode of the sensor using a non-conductive adhesive. Inkjet printing the ramp structure that allows for a smooth transition in Z-direction from the sensor pixels to the COF contacts. Inkjet printing the interconnection traces between the 250 sensor pixels and the COF contacts. Sintering of the silver nanoparticle ink: laser sintering allows for low heat impact on the sensor. Packaging the sensor assembly. Figure 3. Sensor (1) and the COF (2) on top. Right image shows the alignment of the sensor pixels with the COF contacts at 100µm pitch. Printing the silver interconnection traces is done using a Pixdro LP50 inkjet printer from SÜSS MicroTec. This versatile inkjet printing platform offers benefits like UV pinning, substrate heating, choice of many industrial printheads and high placement accuracy. Figure 4. Inkjet printing on substrate for Flexible Hybrid Electronics using SÜSS MicroTec LP50 advanced research inkjet printer Alignment of the printing and bonding steps is critical for this interconnection method. The positioning accuracy needs to be within 10µm. Furthermore, the wetting behaviour of the inks needs to be controlled in order to reach the required track gap accuracy. On top of this ramp the silver interconnection traces are printed using a silver nanoparticle ink. The traces are about 2mm long and 50µm wide. They connect each pixel of the sensor to a contact of the COF module. This is schematically shown in Figure 4. Images of the printed interconnections and its height profile are shown in Figure 5. Height profiles of samples were characterized using Keyence 3D Laserscanning microscope. Figure 4. Schematic representation of the printed interconnections between the sensor pixels and the COF contacts. 1: Sensor 2: Ramp 3: Read-out electronics COF Figure 5. Top left: 3D image of the printed interconnection. Top right: microscope image of the printed traces on the sensor, ramp and COF contacts. Bottom: height profile of the silver traces (average of the blue lines in the top right image) Alignment of both the ramp print and silver interconnection print with respect to the COF and sensor contacts is possible with the required accuracy. This printing strategy results in sufficient evaporation of solvents of the printed silver ink which is required to minimize ink wetting that could short-circuit the traces. It was found that the resistance for the printed interconnections was ~2 Ω/mm. Following these steps, packaging was done with a combination of potting and encapsulation. This protects the interconnections while providing strain relief for the COF module. Conclusions and outlook A 2.5D inkjet printing process was used for micro-assembly of advanced opto-semiconductor sensors with a large number of fine pitch pixel contacts that needed to be interconnected to an FPC. Using the contactless inkjet technique, it was possible to print interconnections at a 100 µm pitch. Laser sintering can be used for creating conductivity while limiting the heat load on fragile sensors. All individual process steps are shown to be feasible as functionality was shown with the demonstrator sensor assembly. Next steps will focus on maturing the process integration, repeatability and reliability aspects. The work demonstrates that inkjet-printed interconnections for advanced sensors are feasible. This alternative interconnection method can be used in situations where conventional wire-bonding packages or flip-chip bonding processes are not applicable. IMAGINE, CREATE, ACCOMPLISH DoMicro BV is a technology company providing innovative manufacturing technology, application solutions and micro assembly technology for flexible hybrid electronics (FHE) and micro devices. DoMicro develops cutting edge inkjet printing processes and technology for micro assembly and 3D packaging. At the forefront of innovation DoMicro offers state-of-the-art R&D services and exploration of new capabilities and applications for customers with manufacturability in mind. The company delivers R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations. www.domicro.nl Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro for your discounted attendee passes

The growing concern for the environment has led to a shift towards sustainable packaging and transportation solutions. This presentation will focus on the benefits of incorporating smart labels and low power technologies in transport packaging. We will discuss the various material choices available and how they impact the overall sustainability of the product. Additionally, we will provide a rough calculation of the total waste generated by traditional transportation methods and compare it to the waste generated by using printed electronics in smart labels and low power technologies to enhance logistics. Join us to learn how SODAQ's innovations and solutions can help reduce waste and promote a more sustainable future. SAVE THE DATE