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MicroLED Connect and AR/VR Connect 16 & 17 September 2026 | High Tech Campus, Eindhoven, Netherlands   MicroLED Connect and AR/VR Connect are the most important dedicated conferences and exhibitions in these fields still taking place this year, bringing together the entire industry and applied research community from around the globe.   👉Organised by TechBlick and MicroLED Association 👉Supported by Optica, EPIC Photonics, and Karl Guttag 👉375+ Participants 👉25+ Exhibitors 👉50+ Talks 👉8 Masterclasses 👉3 Tours 👉And a year-round program of curated online events A Look Back to 2025. Significant Growth in MicroLED Connect and AR/VR Connect  MicroLED Connect and AR/VR Connect 2025 was a huge success registrating over 30% YoY growth.   The program was world-class, featuring the likes of Google, Jade Bird Display, Lynx, Avegant, ASML, Swave Photonics, Brilliance RGB, Aledia, Mojo Vision and many more.   The participation was excellent too, including Apple, Meta, GoogleSamsung, Samsung Displays, Tianma, Sony, ASML, Huawei, Applied Materials, Bosch, Sensortec, GlobalFoundries, Lam Research, Thales, BAE Systems, Anduril Industries, Nokia, EssilorLuxotticaValeo, Garmin, ams-OSRAM, Haylo Ventures, ITEC B.V., Jabil Optics,  Fielmann Ventures GmbH, Sioux Technologies, and more A Look Back to 2024. The First Ever MicroLED Onsite Conference & Exhibition  MicroLED Connect 2024 was a huge success with superb participation and fantastic customer feedback - despite the ups and downs of the industry.   The program was world-class, featuring the likes of Google, Continental, Meta, TCL CSOT, Globalfoundries, and others.   The participation was excellent too, including Google, Mercedes-Benz, AUO, Samsung Electronics, Tianma, Swatch Group, Continental Corporation, GlobalFoundries, Huawei Technologies, Kulicke & Soffa, Infineon Technologies, Sony,  TCL CSOT, Konica Minolta, Toray Engineering, Coherent, Aixtron, Jabil Optics, ITEC B.V., ams Osram,  imec.xpand, Omdia, CEA-Leti,  Carux (Innolux),  Samsung Display, Snap Inc, Lam Research, Samsung Venture Investment,  Collins Aerospace, Garmin, Lumileds, and many more 2026: Growth of MicroLED Connect + Launch of AR/VR Connect  In 2026 we expect further growth at both MicroLED Connect and AR/VR Connect. We will also launch Optical I/O Connect! Stay Tuned! This show is now an established high-quality event and a firm fixture of the calender for the industry. Confirmed speakers already include Meta, Google, Sony, Applied Materials, EssilorLuxottica, Avicena, UC Santa Barbara, University of Rochester, Hongshi Intelligence and others. See here . Book Your Exhibition Packages It is time to book your spot to exhibit at MicroLED Connect and AR/VR Connect. The booth spaces are assigned on a first come first served basis. The spaces are very limited.  Our unique packages offer 👉Onsite exhibition 👉Conference attendance 👉Onsite talk (depending on package) 👉Online talk 👉Email marketing 👉Virtual booth 👉Annual passes 👉and moreThe floorplan below shows the available spaces (white). All others are already booked or reserved If interested please contact khasha@techblick.com

Mention droplet dispensing and you may immediately think of lab-on-a-chip (LoC) devices. Indeed, LoC devices rely on droplet dispensing systems or pipettes to distribute liquids for disease diagnostics. However, the application of droplet dispensing extends beyond life sciences. It finds various applications in consumer electronics (home inkjet printers), optics (lens arrays for fiber optics), life sciences (LoC systems, medical inhalers) as well as electronics manufacturing (dispensing solder droplets for flip chip bonding — attaching semiconductor chips to a substrate by flipping them onto tiny solder bumps) [1]. How does droplet dispensing work? Dispensing droplets manually involves using a syringe or micropipette to release individual droplets, and is common in laboratories for liquid handling. Micropipettes are engineered to deliver highly reproducible volumes and can reduce human variability, but achieving this precision requires proper technique and therefore subject to inter‑individual imprecision [2]. Automated droplet dispensing systems, in contrast, offer superior reliability by accurately jetting (drop-on-demand jetting systems ) or extruding ( direct ink writing  systems) single discrete volumes of materials from a nozzle to a precise location. The target volume of each drop can range widely, from picoliters in microelectronics to microliters in lab applications. Achieving consistent volume is crucial in droplet dispensing for accuracy and reproducibility [3]. Droplet dispensing applications Electronics manufacturing Potting electronics Molten lead-free solder droplets dispensed with 100 µm spacing © Wang, C.-H. et al. , CC BY 4.0 Droplet dispensing plays a critical role in electronic packaging. For example, advanced micro droplet dispensers use piezoelectric or magnetostrictive actuation to jet precise adhesive or encapsulant droplets [4]. This has significantly improved the consistency and placement of the smaller droplets, increasing assembly speed and supporting higher-density, miniaturized devices [5]. Another key application in electronics manufacturing is solder droplet printing for circuit assembly. One demonstrated system [6] uses a heated pneumatic printhead to directly jet molten solder droplets onto PCB pads, where they solidify to form electrical interconnects. Such droplet-based metallization methods (including solder jetting and nanoparticle ink printing) avoid the steps of reflow ovens or wire bonding, potentially streamlining electronics assembly [6]. Optics Printed thermally activated delayed fluorescence droplets in 4 × 4 mm 2  square patterns with 200 DPI, adapted from © Kant, C., et al . , CC BY 4.0 In the optics and display industry, droplet dispensing technologies are used to fabricate fine optical structures and deposit light-emitting materials with great control. Inkjet printing of display layers has emerged as a promising alternative to vapor deposition in OLED and quantum-dot displays. Solutions of organic light-emitting or quantum dot materials are dispensed as microliter droplets into millions of pixel wells, then cured to form uniform thin films [7]. Another optical application is making microlens arrays (MLAs), used to enhance light extraction or sensing in miniaturized cameras, 3D displays, and sensors. By jetting or printing UV-curable polymer droplets to form a smooth micro-lens, droplet dispensing bypasses molding steps and allows high fill-factors over large areas, enabling rapid prototyping of optics on flat or flexible substrates [8]. In-vitro diagnostics (IVD) The construction of an immunodiagnostic chip supporting the movement of reagent droplets, adapted from © Hu, X., el al ., CC BY 4.0 In lab-on-a-chip assembly and operation, droplet-based systems precisely manipulate microliter and nanoliter droplets of fluids for assays. For example, a recent platform [9] demonstrated fully automated immunoassays by using magnetic beads to shuttle droplets between processing steps, running multiple tests in parallel on a disposable chip, and achieved sensitivities comparable to conventional lab methods.  Unlike continuous-flow microchannels, droplet-based approaches in point-of-care testing minimize sample volume, cut assay time, and allow in situ integration of functions (mixing, incubation, detection) that would otherwise require bulky instruments. They also provide a controlled, contamination-limited environment for biochemical reactions [10]. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Bioprinting Bioprinting process © Ng, W. L., & Shkolnikov, V ., CC BY 4.0 Beyond diagnostics, droplet dispensing has a broad spectrum of expansive applications in the life sciences. In bioprinting, for example, droplet dispensing systems deposit bioink droplets containing living cells, growth factors, or other biomaterials to fabricate tissues and organoids (lab-grown miniature organs/tissues), achieving precise placement of cells at high speed [11]. This precise spatial control supports the recreation of cellular microenvironments, which is essential for studying cell-to-cell interactions, disease progression, and tissue regeneration [11]. Key considerations of droplet dispensing As seen in the applications above, a wide variety of materials can be dispensed as droplets, from metals and functional nanomaterials to polymers and bioinks. However, dispensing materials at micro to nanoliter scales comes with several important considerations. Clogging: Dried residue from volatile solvents or particulate matter in the fluid can block nozzles. In addition to frequent cleaning, it may be necessary to adjust material viscosity using additives or by changing the temperature. Inconsistency in placement and volume: Droplet volume can drift due to changes in printing parameters (e.g., drawback force) [12]. Air currents, static charge on the substrate, or inconsistent drop velocities can also affect placement. Choosing a high-precision droplet dispenser and implementing environmental controls, such as using an enclosure, are critical for consistent results. To learn more about dispensing best practices, check out How to Dispense Adhesives . Conclusion Droplet dispensing is increasingly important in electronics manufacturing and the life sciences, enabling precise miniaturization. Recent work [13] suggests that adaptive intelligent control will be key to maintaining consistent droplet formation and ejection characteristics, and future advances may allow dispensers to self-tune to different liquids for optimal performance. Ready to learn more about materials dispensing? Explore these resources: Blog: What Is Dot Dispensing? Blog: What Are Precision Fluid Dispensing Systems? Application overview: Solder Paste Printing Looking for proof-of-concept of your droplet dispensing applications? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Lindemann, T., & Zengerle, R. (2008). Droplet Dispensing. Encyclopedia of Microfluidics and Nanofluidics , 402–411. https://doi.org/10.1007/978-0-387-48998-8_361 .  [2] Lippi, G., Lima-Oliveira, G., Brocco, G., Bassi, A., & Salvagno, G. L. (2017). Estimating the intra- and inter-individual imprecision of manual pipetting. Clinical Chemistry and Laboratory Medicine (CCLM) , 55(7). https://doi.org/10.1515/cclm-2016-0810 .  [3] Nikapitiya, N. Y. J. B., Nahar, M. M., & Moon, H. (2017). Accurate, consistent, and fast droplet splitting and dispensing in electrowetting on dielectric digital microfluidics. Micro and Nano Systems Letters , 5(1). https://doi.org/10.1186/s40486-017-0058-6 .    [4] Zhou, C., Li, J. H., Duan, J. A., & Deng, G. L. (2015). The principle and physical models of novel jetting dispenser with giant magnetostrictive and a magnifier. Scientific Reports , 5(1). https://doi.org/10.1038/srep18294 .  [5] Nature Research Intelligence. (n.d.). Fluid Dispensing and Microelectronics Packaging . https://www.nature.com/research-intelligence/nri-topic-summaries/fluid-dispensing-and-microelectronics-packaging-micro-82301 .  [6] Shu, Z., Fechtig, M., Florian Lombeck, Breitwieser, M., Zengerle, R., & Koltay, P. (2020). Direct Drop-on-Demand Printing of Molten Solder Bumps on ENIG Finishing at Ambient Conditions Through StarJet Technology. IEEE Access , 8, 210225–210233. https://doi.org/10.1109/access.2020.3040035 .  [7] Xiong, J., Chen, J., Li, Y., Yue, X., Fu, Y., & Yin, Z. (2025). Large-area OLED substrate printing path planning method based on multi-head GAT imitation learning to solve partitioned integer programming. Scientific Reports , 15(1). https://doi.org/10.1038/s41598-025-08355-x . [8] Zhong, L., Liu, W., Gong, H., Li, Y., Zhao, X., Kong, D., Du, Q., Xu, B., Zhang, X., & Liu, Y. J. (2025). Electrohydrodynamically Printed Microlens Arrays with the High Filling Factor Near 90%. Photonics , 12(5), 446–446. https://doi.org/10.3390/photonics12050446 .  [9] Hu, X., Gao, X., Chen, S., Guo, J., & Zhang, Y. (2023). DropLab: an automated magnetic digital microfluidic platform for sample-to-answer point-of-care testing—development and application to quantitative immunodiagnostics. Microsystems & Nanoengineering , 9(1), 1–12. https://doi.org/10.1038/s41378-022-00475-y .  [10] Trinh, T. N. D., Do, H. D. K., Nam, N. N., Dan, T. T., Trinh, K. T. L., & Lee, N. Y. (2023). Droplet-Based Microfluidics: Applications in Pharmaceuticals. Pharmaceuticals , 16(7), 937. https://doi.org/10.3390/ph16070937 . [11] Ng, W. L., & Shkolnikov, V. (2024). Jetting-based bioprinting: process, dispense physics, and applications. Bio-Design and Manufacturing , 7(5), 771–799. https://doi.org/10.1007/s42242-024-00285-3 . [12] Wang, W., Chen, J., & Zhou, J. (2016). An electrode design for droplet dispensing with accurate volume in electro-wetting-based microfluidics. Applied Physics Letters , 108(24). https://doi.org/10.1063/1.4954195 .  [13] Jiang, J., Chen, X., Mei, Z., Chen, H., Chen, J., Wang, X., Li, S., Zhang, R., Zheng, G., & Li, W. (2024). Review of Droplet Printing Technologies for Flexible Electronic Devices: Materials, Control, and Applications. Micromachines , 15(3), 333. https://doi.org/10.3390/mi15030333 . Join the flagship TechBlick events in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature. In California: The Future of Wearables Reshaped    In Berlin: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California Register before 15 March 2026 for early bird rates  The Largest and Most Important Additive Electronics Show in North America! This is the most  important and the largest conference and exhibition  in North America dedicated to additive, printed, flexible, hybrid, wearable, stretchable, soft electronics. Exhibition floor : Almost sold out.  Agenda:  Shaping up to be our strongest yet. Featuring:  NextFlex Innovation Days  Co-locating:  Wearables RESHAPED Exhibition Floor Almost Sold Out ­ The exhibition floor is almost sold out with over 90% of the available spots booked. Act now and book your place! Visit here to download the info package including detailed pricing and benefits descriptions. Tom Keenan will also be your primary point of contact (tom@techblick.com) The Only Truly Global Package Worldwide Our packages are the only truly global option, combining the opportunity to exhibit in the USA and Europe with year-round global digital marketing and engagement. The key benefits include: Onsite exhibition (California  and/or  Berlin shows) 2 or more full onsite conference & exhibition passes 6 or more annual online passes Onsite talk (silver and gold packages only) Online talk Email marketing Social media support Virtual booth

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive ( ACA) bonded components. This paper focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).   Human machine interfaces and control displays should be easy to understand for the operator. Highlighting essential information depending on mode or status of the equipment creates a focussed and minimal atmosphere without distraction. Visual appearance and coloured feedback of touch icons by RGB controlled backlight LED’s is featured by transparent capacitive touch technology in Flexible Hybrid Electronics (FHE) circuitry. A FHE-Touch foil integrated with a FPCA-LED assembly enables a fully flat, flexible interface system that can be integrated in curve products and surfaces. Touch icon buttons can be completely hidden or made invisible when backlight is switched off. Figure 1 - User interface by Metafas Application demonstrator Figure 1 shows a user interface with capacitive touch buttons to use with backlighting. The FHE module is placed on top of a flexible FPC with RGB-LEDs that will respond to the touch actuation. The product is made by a combination of screen-printed PEDOT touch electrodes and inkjet printed silver traces. The transparency of PEDOT electrodes allows for the backlighting and lightguide. Figure 2 shows this transparency of the blueish PEDOT electrodes printed on a PEN film. Figure 2 The transparency and conductivity of the PEDOT electrodes depends on the layer thickness. This sample has a PEDOT layer of only 350 nm thickness. This results in a sheet resistance  of 320 Ω/sq. The PEDOT screen-printing paste is commercially available. DoMicro is capable to screen print on films up to 150x150 mm on the Aurel C1010 screen-p rinter. Metafas screen prints series up to 1,000 pieces on 1,000x700 mm.   Around the PEDOT electrodes the electrical circuit is printed with a silver nanoparticle (NP) ink. This circuit is shown in figure 3. The inkjet printing technology allows for small contact pads to interconnect the QFN packaged driver IC. This IC has pad sizes of 250 µm at a pitch of 500 µm. Using this inkjet printing technology, DoMicro is capable of printing at a pitch down to 100 µm. The inkjet printed circuit is a 2-layer circuit with inkjet printed insulator to separate crossing top and bottom silver traces. For this inkjet printing process the SUSS MicroTec PiXDRO LP-50 inkjet printer is used. Both the UV curable insulator ink and silver ink are commercially available. Sintering of the NP is performed in a box oven at 150°C for 30 min. Figure 3 The PEN substrate and silver circuit do not allow for a standard soldering process for integration of components. An ACA is used to make a thermocompression bond between the IC and passive components and the printed circuit. Figure 4 shows an FHE touch module after assembly of the components. The Pick&Place process is performed with a Fineplacer Pico having an alignment accuracy of 5µm. Figure 4 The FHE touch module can, for example, be connected to a flexible LED FPC, such as shown in Figure 1. This interconnection is achieved using ACA through a thermocompression bonding process. The process, carried out with the Fineplacer PICO, enables strong and reliable interconnections at relatively low bonding temperatures of around 160 °C. These bonds ensure high reliability without short circuits, while preserving the flexibility of the transparent printed electronics touch circuit in combination with the LED FPC. We are exhibiting at the Future of Electronics RESHAPED. The event will take place in Berlin  on 21-22 October 2026. Please register for the event, meet us in person and see our technology in action.   Conclusions and outlook Screen-printed electrodes with transparent conductive polymer PEDOT are useful for touch applications in combination with backlight. The presented process steps show how such FHE touch modules could be made. Many designs of these touch button circuits are possible. Besides FHE modules with touch buttons, this printing process also allows for other transparent touch applications, e.g. trackpads or touch screens. DoMicro can support the technology for manufacturing as well as the hardware and system integration . Metafas complements this by bridging the gap towards industrial scalability and manufacturability.   Strong collaboration DoMicro and Metafas have collaborated for many years, supported by their close geographical proximity. DoMicro develops advanced inkjet printing processes and technology for micro assembly and 3D packaging of FHE and micro devices. While DoMicro focuses on R&D and prototyping with transparent PEDOT electrodes, inkjet-printed circuitry, and micro-assembly, Metafas transforms these innovations into reliable products. With expertise in membrane switches, printed electronics, and advanced foil-based HMI applications, Metafas develops and produces small and medium series using advanced techniques.   By combining the capabilities of DoMicro and Metafas, high-performance devices can be made, pushing the boundaries of flexible hybrid and printed electronics. Cleanroom Imagine, create, ACCOMPLISH   DoMicro provides R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations.   Metafas operates a fully automated INO screen printing line for advanced printed electronics, using in-house screen fabrication and product finishing. A structured product and process launch system enables FHE technologies – such as transparent PEDOT-based HMI foils – to evolve into volume production for industrial, medical, and consumer applications.   If you are challenged by the market and looking for a partner to move your ideas into realization, contact us. We really do IMAGINE, CREATE AND ACCOMPLISH. Let's meet! DoMicro is an exhibitor at several inspiring events this year. We start at Nanotech Tokyo, 26 to 30 January, at the Netherlands Pavilion, booth number AT-L02. From 24 to 26 February, you can find us at LOPEC in Munich, Germany, at Booth B0 514. And through various activities from TechBlick including exhibition at the Future of Electronics RESHAPED Berlin (21 and 22 OCT 2026) we can connect as well and share our mutual passion for innovation. If you are looking for a partner to move your ideas into realization, let’s cross boundaries together! Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California https://www.techblick.com/electronicsreshapedusa Join us and 600+ others from around the world next June at the heart of the  Silicon Valley  to RESHAPE the Future of Electronics together, one layer at a time, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... This event stands as the largest show in the USA dedicated specifically to Additive, Printed, Hybrid and 3D Electronics. It unites the entire global community—connecting end-users and manufacturers with equipment providers, material developers, and applied researchers. The 2026 edition is expected to welcome more than  600 attendees  and  80 exhibitors , supported by  three parallel conference tracks , alongside  masterclasses and technical tours  designed to bridge innovation with real-world deployment. A major highlight for 2026 is the partnership with  NextFlex , the US-based consortium at the centre of the Printed and Hybrid Electronics ecosystem. The inclusion of the NextFlex Innovation Day further strengthens the event’s position as the definitive North American meeting point for the community. “Electronics RESHAPED USA has firmly established itself as the premier event for our industry in North America, consistently selling out year after year. This is now the home of Printed, Additive, and Hybrid Electronics. By bringing the show to the heart of Silicon Valley for the first time, we expect record-breaking growth. If you are active in, using, or exploring these technologies, this is the definitive place to be.” Dr Khasha Ghaffarzadeh, CEO

To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick Engineering Functionality: Sensors Sensors are at the heart of modern technology - integrated into devices we use every day to enhance healthcare, fitness, safety, and comfort. From monitoring vital signs to enabling smart industrial systems, sensors are transforming the way we interact with the world. Depending on the application, sensors come in many forms, each with its own materials, requirements, and performance considerations. Below are a few examples of sensors that are key to next-generation sensor innovation. Biosensors & Electrochemical Sensors:  Measure biological and chemical reactions by generating signals proportional to analyte concentration. PTC Heaters:  Regulate temperature through self-limiting properties that enhance safety and efficiency. Temperature Sensors:  Monitor and maintain optimal conditions using precise electrical signals. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend These sensors find use across  wearable ,  diagnostic , and  industrial  applications, each with distinct design and material needs: Wearables Flexible and stretchable materials Stretchable inks Adhesive layers (for housing-to-patch or multilayer adhesion) Conductive skin contact layers Diagnostics Rigid or flexible substrates Microfluidic integration Specialized ink selection Sputtered precious metals Biochemical compatibility Industrial Durability under harsh conditions Long-term stability Resistance to temperature, moisture, and mechanical stress When designing any sensor,  key factors  such as  biocompatibility, sensitivity, selectivity, stability, and durability  must guide every decision. Material Selection Process: Define the use case Identify biological, mechanical, and electrochemical requirements Select candidate materials Prototype, test, and optimize Validate performance Sensors are more than components - they’re the foundation of innovation across industries. As demand grows for smarter, more connected, and more sustainable technologies, material and design choices will define the next generation of performance. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend

Electronics encapsulation refers to the process of enclosing and protecting electronic components, circuits, or chips in a durable material or “package.” The encapsulating material (sometimes called a molding compound or potting compound) serves as a barrier against environmental factors like moisture, dust, and harsh chemicals, and shields the device from mechanical stress and vibration. Over the decades, encapsulation approaches have evolved significantly. Historically, hermetic encapsulation (a method of sealing sensitive electronic components inside airtight metal or ceramic enclosures) was common, as it completely blocked moisture and gases. This was especially important in aerospace or military-grade devices [1].  Since the 1970s, the industry has shifted toward polymer-based plastic encapsulation due to its low cost, ease of processing, and high throughput. Today, encapsulating components usually involves applying polymer resins (epoxies, silicones, polyurethanes, etc.) using automated dispensing, molding, or conformal coating systems.  Common types of encapsulation Potting electronics Schematic of an encapsulated PCB assembly, adapted from © Hu C., et al ., CC BY 4.0 In the context of electronics and semiconductors, potting and encapsulation are often used interchangeably. Potting is an encapsulation process where an entire electronic assembly or a larger section of a circuit is placed into a mold (often referred to as a “pot”) and then filled with a potting material (typically a resin) to cure into place. Potting applications include: Submersible or outdoor electronics in harsh environments High-voltage circuits (to prevent arcing) [2] Tamper-resistant  designs Dam and fill A chip partially encapsulated using dam and fill © Tabrizi, H. O., et al ., CC BY 4.0 A less common variant of potting, dam-and-fill involves first dispensing a high-viscosity “dam” around the component, then flooding the enclosed area with a lower-viscosity encapsulant. Unlike potting, which submerges the entire assembly, dam-and-fill targets only specific areas, allowing precise control over material placement while minimizing resin use. This makes it useful for precision applications or components that require partial exposure, such as optical sensors or fluid-contact electrodes, though it is less widely used than potting or glob-top methods. Direct encapsulation A glob of silicone encapsulant dispensed on interdigitated combs, adapted from © Lamont, C., et al ., CC BY 4.0 Direct encapsulation refers to dispensing an encapsulation material directly over a semiconductor die or electronic component mounted on a substrate (e.g., a PCB) and then curing it in place. It is a direct method because the encapsulant is applied only to the needed area on the board, without needing a dam or a pot. Once cured, the dispensed material forms a hardened “glob” that covers the device and its wire bonds. As such, direct encapsulation is also called glob-top encapsulation. It is widely used in: High-density PCBs Miniaturized packages where space and weight are constraints We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Common encapsulation materials Modern electronic devices use a range of encapsulation materials, from rigid thermoset resins to flexible elastomers, chosen based on the application requirements. Epoxy PCBs encapsulated with different materials (PDMS, epoxy and epoxy with hermetic feedthroughs and optional P3HT coating) © Novak, M, et al ., CC BY 4.0 Epoxy resins are rigid thermosetting polymers often filled with silica to improve thermal conductivity and mechanical properties. They are the most widely used encapsulants in both semiconductor packaging and industrial electronics due to their strong adhesion, mechanical strength, and chemical resistance. Pros Epoxy encapsulants form a hard, rigid shell with excellent adhesion, mechanical strength, and chemical resistance. They are electrically insulating and can be formulated for flame retardance and high temperature resistance. Cured epoxies are moisture resistant and have low water permeability, which allows them to protect electronics in humid conditions [3]. Cons The rigidity of epoxy can be a drawback in critical applications with extreme temperature swings or mismatched thermal expansion. Repeated heating and cooling may lead to delamination or cracks in the encapsulation or at the interface [3]. Silicone A pressure and temperature sensor encapsulated with PDMS © Sang M., et al ., CC BY 4.0 Silicones, particularly polydimethylsiloxane (PDMS), are flexible elastomers used when mechanical flexibility or biocompatibility is needed. Common in medical electronics and wearable devices, they can be applied as soft coatings, gels, or flexible encapsulants. Pros Silicone encapsulants are soft and elastic after curing and reduce stress on sensitive components. In one study [3], a silicone encapsulant successfully protected chronically implanted PCBs, maintaining encapsulant integrity and adhesion during 30-day accelerated aging in saline. Silicones have excellent thermal stability and remain functional from roughly -40 °C up to 175 °C  or more, a range over which they maintain consistent properties. Cons Silicone encapsulation is not hermetic – moisture can slowly diffuse through, which can be problematic in very moisture-sensitive devices [4] Silicone doesn’t adhere as strongly to many substrates compared to epoxy, and its low surface energy makes it easy for it to “ wet out ” and flow into crevices, which can lead to poor adhesion if not primed. Polyurethane Neural-stimulating electrodes with a bioresorbable dynamic covalent polyurethane (b-DCPU) encapsulation layer © Choi, Y.S., et al ., CC BY 4.0 Polyurethanes (PU) are polymers formed by reacting diisocyanates with polyols, resulting in urethane linkages [5]. They strike a balance between the hardness of epoxies and the softness of silicones, offering moderate flexibility and toughness, and are useful in soft robotics, wearables, and implantables. Pros Polyurethanes are semi-flexible (softer than epoxies but stiffer than silicone) and offer good electrical insulation and vibration damping. They tend to cure to a less rigid state, putting less stress on delicate parts [5].  PU potting compounds also exhibit good adhesion [5]. Cons PU generally cannot withstand high temperatures  as well as epoxies and silicones.  PU is generally not as impermeable  to water as epoxies. In a humid environment, a PU encapsulate is more likely to allow moisture ingress. Conclusion Encapsulation is a fundamental part of the electronics manufacturing process, providing protection against harsh environmental conditions like moisture, chemicals, and mechanical stress. The choice of encapsulant directly affects device reliability, making it a key design consideration for both conventional and advanced electronic systems. Interested in learning more about electronics encapsulation? Check out these resources: White paper: Printing a Flexible PCB with Silver Ink on PET Application: Adhesive Dispensing Systems Blog: What Is Thermal Interface Material (TIM)? Want to explore dispensing encapsulants with NOVA ? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Inamdar, A., Driel, V., & Zhang, G. (2025). Electronics packaging materials and component-level degradation monitoring. Frontiers in Electronics , 6. https://doi.org/10.3389/felec.2025.1506112 . [2] Du, S. Baek. Y., Wang, G., & Bhattacharya, S. (2010, November 1). Design considerations of high voltage and high frequency transformer for solid state transformer application. IEEE Xplore . https://doi.org/10.1109/IECON.2010.5674991 .  [3] Adam, C., M Münch, P Kleinschnittger, Barth, T., & Krautschneider, W. H. (2024). Rapid prototyping of molds for the encapsulation of electronic implants using additive manufacturing. Additive Manufacturing Meets Medicine (AMMM) . https://doi.org/10.18416/AMMM.2024.24091858 . [4] Lamont, C., Grego, T., K. Nanbakhsh, A. Shah Idil, Giagka, V., A. Vanhoestenberghe, Cogan, S., & Donaldson, N. (2021). Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: a comparative long-term ageing study. Journal of Neural Engineering , 18(5), 055003–055003. https://doi.org/10.1088/1741-2552/abf0d6 .  [5] Bonomo, M., Taheri, B., Bonandini, L., Castro-Hermosa, S., Brown, T. M., Zanetti, M., Menozzi, A., Barolo, C., & Brunetti, F. (2020). Thermosetting Polyurethane Resins as Low-Cost, Easily Scalable, and Effective Oxygen and Moisture Barriers for Perovskite Solar Cells.  ACS Applied Materials & Interfaces , 12(49), 54862–54875. https://doi.org/10.1021/acsami.0c17652 .  Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature The Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

10 Feb 2026 | London | Free event Technology is reshaping every aspect of our lives, and the loan ecosystem is no exception. Advances in emerging technologies within the loan market such as Generative AI, Legal Tech, and Distributed Ledger Technology (DLT) are driving a wave of innovation, automating previously manual tasks, streamlining documentation, and enhancing transparency across transactions. But the critical question remains: how do we adapt, adopt, and utilise these solutions?  LMA Edge is a brand new event dedicated to showcasing new technologies in the lending sector. It prioritises interaction, offering high-impact networking opportunities through exhibition, tech demos, case study and collaboration stage talks, and curated 1:1 meetings. Tomi Popoola, CEO of Slash Finances and Lord Holmes, Member of the UK House of Lords are the confirmed keynote speakers. Tomi will share insights on From Innovation to Operating Model: How AI, Cloud and Automation Are Transforming Corporate Lending for Real-World Impact, exploring how emerging technologies are reshaping lending models and driving tangible outcomes across the market. Lord Holmes will examine the role of emerging technology in the UK, reflect on current trends and the future outlook, and consider the evolving intersection between technology and the loan markets. Why it matters:  Accelerate digital execution, reduce operational cost and risk, and align on standards that improve interoperability across the loan lifecycle. Who should attend:  CTO (loan markets/technology), COO/Head of Loan Operations, Head of Agency/Trustee, Senior Investment & Portfolio Managers, Head of Data/AI. Outcome:  See the vendor landscape, engage on practical use‑cases, and shape near‑term pilots.

Authors: Anaghim Nasri, R&D Engineer Quentin Maerklen, Process Engineer   Water-based graphene inks are emerging as a groundbreaking solution for next-generation heating technology. By leveraging graphene’s exceptional thermal and electrical conductivity, these inks enable thin, flexible heating elements that deliver high heat output with minimal power. Importantly, sustainability is becoming a key market driver, with growing demand for water-based, responsibly sourced graphene inks as eco-friendly alternatives to metal-based conductive materials.   This article explores how water-based graphene inks provide efficient and uniform heating, their environmental advantages over conventional carbon-based inks, and the role of Blackleaf in driving this innovation forward. As the demand grows for eco-friendly heating (from automotive seats to building systems), water-based graphene inks offer a powerful combination of performance, sustainability, and scalability.   Introduction: Blackleaf Inks for Next-Generation Heating One of the pioneers bringing this technology to market is Blackleaf, a French graphene manufacturer and ink developer. Blackleaf has positioned itself as a leading producer of graphene and formulated inks in Europe, with a capacity of over 120 tons per year of graphene products by 2027, all produced in-house in France. Blackleaf’ s product portfolio includes ready-to-use graphene conductive inks for a variety of uses. Notably, the company has focused on graphene-based heating inks as a core offering that can be applied in two complementary forms- as flexible heating films or direct heating coatings on surfaces. This allows integration into diverse scenarios. We are exhibiting at the Future of Electronics RESHAPED. The events will take place in Berlin  on 21-22 October 2026 . Please register for the event, meet us in person and see our technology in action.    Key Properties of Graphene Inks  Graphene inks offer a unique combination of high conductivity, low-temperature processing, and compatibility with industrial printing. The key properties below illustrate why they outperform conventional carbon and metal-based formulations.   2.1. High Electrical Conductivity Graphene’s high charge-carrier mobility enables low-resistance films at low solid content. While conventional carbon inks require >25–30% solids to reach 20–30 Ω/sq/mil, Blackleaf’s water-based formulations achieve 8–15 Ω/sq/mil with only 6–8% solids.This ensures: Efficient Joule heating at low voltage. Lower energy consumption. Resistance tunability via mesh, deposition thickness, and curing profile. 2.2. Low-Temperature Processing Graphene inks cure at <150 °C, reducing energy demand during manufacturing and enabling deposition on flexible polymer substrates. This contrasts with metal-based inks (e.g., silver nanoparticle systems requiring >250 °C sintering) and helps lower the overall carbon footprint of production.   2.3. Tunable Rheology & Broad Printability Formulations can be engineered for multiple coating/printing processes, including screen printing, spray coating, and slot-die/bar coating. Key rheological traits include: Controlled thixotropy. Stable viscosity under shear. Excellent wetting on polymeric surfaces.   2.4. Strong Substrate Adhesion Optimized binder–graphene interactions provide robust adhesion on a wide range of substrates, including PET, PU, PC, textiles, and paper (see Figure 1 ), ensuring mechanical stability under bending, heating cycles, and long-term use.     Figure 1.  Compatibility of Graphene-Based Heating Inks with Rigid and Flexible Substrates Table 1.  Performance Overview of Blackleaf water-based graphene inks. a The curing temperature depends on the target application and the substrate used. A minimum drying temperature of 90 °C  is required to ensure proper film drying.   Table 1  compares the electrical performance of graphene inks processed by different coating and printing techniques, showing that sheet resistance strongly depends on deposition method and film thickness. Spray coating yields thicker films (~25 µm) with lower sheet resistance, while screen printing produces thinner layers (~12–15 µm) with higher resistance. All films were cured on treated PET at low temperatures (120–150 °C), confirming process compatibility. Overall, the results demonstrate that sheet resistance can be tuned by controlling deposition technology, thickness, and curing conditions to meet different heating performance requirements.   High Efficiency Heating with Graphene Inks   3.1 Use-Case Integration of Printed Graphene Heating Films The experimental investigations reported in this work were carried out on flexible graphene-based heater patches specifically designed for high-efficiency surface heating. These ultra-thin devices can be integrated or bonded onto a wide variety of substrates wherever localized heat input is required. Figure 2.  Architecture of a Printed Graphene heating film with Copper Busbars and Polymer Encapsulation. As illustrated in Figure 2 , heaters combine a graphene heating layer with copper electrodes on a polymer substrate, optionally laminated with a polymer topcoat, and are supplied with a pressure-sensitive adhesive to enable straightforward mounting.   They are engineered to deliver surface power densities up to 6 W·cm⁻² with a maximum operating temperature of 250 °C, while maintaining excellent thermal uniformity thanks to the high in-plane conductivity of the graphene ink and the resulting direct thermal transfer to the heated surface.  Figure 3.  Direct Deposition of a Graphene Heating Film for Tank Heating Application. As shown in Figure 3 , patch geometry and overall dimensions are tailored to the application, and the devices remain highly flexible, with a bending radius down to 2 mm, making them suitable demonstrators for the high-efficiency heating performance of the graphene inks evaluated in the following sections.   3.2. Thermal tests – Endurance (8 h at 75 °C) To assess the stability of heaters manufactured with water-based graphene inks, a representative flexible patch was supplied with 160 W under a maximum voltage of 230 V for 8 h. Under these conditions, and with the mounting configuration described above, the device reached a steady-state temperature of 75 °C as displayed in Figure 4 . Figure 4.  Thermal endurance test (8 hrs, T=75°C, P=160W). Figure 4  shows a slight increase in the equilibrium temperature throughout the experiment. This drift is distributed to variations in the ambient temperature, as the external temperature T ext  exhibited the same upward trend as the temperature measured on the heater surface. Table 2 . Statistical Summary of Resistance Data The corresponding evolution of resistance is summarized in Table 2 . Over the 8 hrs period, the resistance decreased by 11.5 Ω, i.e. about 4 %, with values ranging from 280.5 Ω to 269.0 Ω (mean 271.5 Ω, standard deviation 2.3 Ω). This behaviour is consistent with the negative temperature coefficient (NTC) of the graphene-based coating: the resistance decreases slightly as temperature increases, before reaching a stable value. No degradation, delamination or visible damage of the heater was detected after the endurance test, indicating that the integrity of the patch was preserved.   3.3 Thermal tests – Cycling (100 cycles from ambient to 75 °C) Using the same experimental setup, a thermal cycling protocol was applied over 100 cycles between 40 °C and 75 °C, for a total duration of 27 h. To reach 75 °C more rapidly in each cycle, the input power was slightly increased to 180 W ( Figure 5 ). Figure 5 . Thermal cycling illustration: 100 Cycles at 180 W between 40°C and 75°C. Figure 6 . Illustration of thermal cycling over a 3-hour segment (10 cycles). For clarity, Figure 6 presents only the first 10 cycles over a 3-hour window. During these initial cycles, a modest decrease in resistance of approximately 3 % was observed, after which the resistance stabilized and remained constant over the remaining 90 cycles. As in the endurance experiment, no macroscopic damage or change in appearance of the heater was observed at the end of the test, confirming that the patches withstand repeated thermal loading between 40 °C and 75 °C.   Potential application to low-temperature floor heating for energy retrofits The combination of high-power density, mechanical flexibility, and stable operation demonstrated above suggests that heaters based on water-based graphene inks are suitable candidates for low-temperature radiant floor heating, particularly in the context of energy renovation. In such systems, flexible patches can be laminated or bonded onto intermediate substrates (e.g. underlays, boards, or prefabricated panels) and subsequently covered by conventional flooring materials such as laminates, engineered wood or ceramic tiles, provided that appropriate dielectric and mechanical protection layers are implemented (see Figure 7 ). Figure 7. Representation of a graphene-based printed underfloor heating system developed at Blackleaf. The tunability of sheet resistance and heater geometry enables precise control of power density while maintaining safe current and voltage levels. The observed negative temperature coefficient behavior may further contribute to safety by limiting local overheating. Combined with water-based inks and scalable printing processes, these heaters are well suited for large-area, flexible manufacturing, with future work focusing on durability, environmental resistance, and system-level integration for building-scale applications. Further work should therefore address long-term mechanical fatigue under foot traffic, moisture and humidity resistance, dielectric withstand under building-standard test protocols, and system-level integration (insulation layers, floor build-up, control strategies) to fully validate these printed heaters as a viable technology for low-temperature, energy-efficient floor heating in renovation scenarios     Water-Based Formulation: Key Enabler for Sustainable Printed Heating Technologies   Water-based graphene inks represent a major shift in the development of next-generation printed heating solutions. Unlike traditional conductive inks that rely on organic solvents such as NMP, DMF, toluene, or glycol ethers, water-based formulations eliminate volatile organic compounds (VOCs) and significantly reduce toxicity during manufacturing and end-use. This not only improves operator safety but also simplifies processing, waste handling, and regulatory compliance. Beyond their environmental benefits, water-based graphene inks provide significant operational and economic advantages at the manufacturing level. By eliminating organic solvents, they drastically reduce maintenance requirements on printing and coating equipment: no solvent residues, fewer nozzle or mesh obstructions, and faster cleaning cycles. Water replaces costly solvent-based cleaning agents, lowering consumable usage while minimizing operator exposure to hazardous chemicals. Additionally, the absence of aggressive solvents extends the lifetime of pumps, seals, tubing, screens and elastomer components, which are typically degraded by solvent-based formulations. Because water-based inks do not require solvent-extraction systems, safety infrastructure becomes simpler and less expensive. Overall, water-based ink processing enables lower operational expenditure (OPEX), higher equipment uptime, greater throughput stability, and reduced production complexity, which is particularly advantageous for large-scale deployment of printed heating technologies.   Conclusion Water-based graphene inks represent a key enabling technology for next-generation heating elements, combining high electrical performance with low environmental impact. Continued improvements in graphene exfoliation, formulation, and printing compatibility are expected to further expand their functionality toward smart, energy-efficient heating systems. In this context,  Blackleaf  plays a central role by delivering industrially scalable, sustainably produced graphene inks capable of addressing both performance and regulatory requirements. By bridging advanced materials science with real-world manufacturing constraints, graphene-based heating films are positioned to transition from emerging solutions to widely adopted technologies across sectors aerospace (leading-edge anti-icing systems), electric vehicles (interior comfort heating) and building applications (radiant heating panels).   Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped (in California) and  Perovskite Connect (in Berlin) .

Author: Jesus Zozaya, CEO, Voltera, sales@voltera.io It was our pleasure to present a masterclass at TechBlick Berlin on advancements in printed electronics prototyping. As a follow-up, we’d like to share an example of a multilayer flexible circuit we printed on PET. To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick MATERIALS USED Voltera Conductor 3 silver ink ACI Materials FS0142 Semi-Sintering Conductive Ink ACI Materials SI3104 Stretchable Printed Insulator Voltera T4 solder paste Voltera solder wire Siraya Tech Tenacious Flexible Resin SUBSTRATES USED Normandy Coating polyethylene terephthalate (PET)  FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Voltera disposable nozzle   Nordson EFD 7018395 dispensing tip   Nordson EFD 7018424 dispensing tip   Nordson general purpose dispense tips  NE555DR timer LEDs Project Overview Purpose The goal of this project was to prototype a flexible multilayer LED wheel roulette circuit that was traditionally considered rigid and validate the redesign of the circuit. Design This project involves a multilayer flexible PCB for the LED roulette circuit and a traditional control board that powers it. We adapted the design of an LED roulette circuit, originally developed for a 3” × 4” FR4 board by ITIZ, Voltera’s authorized reseller in Korea. This new version is printed on a coated biaxially oriented PET substrate, allowing the circuit to remain flexible - even when populated with components. Figure 1: Original LED roulette circuit design by ITIZ We divided the LED roulette circuit design into three layers: Base conductive layer Dielectric layer Top conductive layer Figure 2: Voltera modified design of the LED roulette circuit Desired outcome We anticipated the circuit would function like a roulette wheel: each time the pulse generator is triggered, the LEDs on the flexible PCB light up in a rapid circular sequence before slowing down and stopping on a single LED. Functionality By printing a dielectric and crossover layer on top of the base conductive layer, we created a compact and lightweight LED roulette circuit without using jumpers. Each layer remained flexible after curing, and the circuit maintained its integrity even after encapsulation and repeated flexing.  When connected to power, pressing the switch on the control board caused the LEDs on the flexible PCB to light up, replicating the behavior of a roulette wheel as intended. We are Exhibiting. Visit our booth at the TechBlick event on June 10-11, 2026, in Mountain View, California, USA . Printing the control board This board controls the pulse signals and powers the LED roulette wheel circuit. We used V-One to print the circuit and reflow the components, which included: NE555DR timer LED Switch 47 µF capacitor 0.1 µF capacitor 10 nF capacitor 100 kΩ resistor 330 Ω resistor Figure 3: Schematic for the control board Figure 4: The control board Printing the flexible PCB This flexible PCB receives signals from the control board and lights up the LEDs as directed.  Base conductive layer This layer consists of a roulette-shaped circuit (90 mm L × 70 mm W) that connects to the control board, as well as power and ground terminals, with designated gaps for dielectric pads. Figure 5: Schematic for the base conductive layer Figure 6: NOVA print settings, base conductive layer Figure 7: Print result, base conductive layer Dielectric layer This layer consists of 29 dielectric pads that provide insulation for the top conductive layer. For better coverage, we printed two passes of dielectric ink. Figure 8: Schematic for the dielectric layer Figure 9: NOVA print settings, dielectric layer Figure 10: Print result, dielectric layer Top conductive layer This layer consists of 29 fine crossover traces that connect the paths to the power terminal and control board. To address potential gaps over height changes, we decreased the trace width to 100 mm to enhance trace continuity. Figure 11: Schematic for the top conductive layer Figure 12: NOVA print settings, top conductive layer Figure 13: Print result, bottom conductive layer Post-processing the flexible PCB Dispensing solder paste and reflowing the components Once the circuit was cured, we dispensed solder paste using NOVA and populated the components before reflowing them in an oven. Figure 14: NOVA print settings, solder paste Figure 15: NOVA dispensing solder paste Because the wires are not heat-resistant, we manually soldered them onto both the companion board and the flexible roulette circuit. Encapsulating the components To reinforce their connection to the substrate, we dispensed encapsulation resin using a syringe onto the components and cured the resin in a UV light box. Figure 16: Encapsulated circuit being cured in a UV light box Once cured, we manually soldered the wires of the control board and the wires of the flexible roulette circuit together. Figure 17: Soldering the wires together Challenges and advice Electrical shorts We encountered issues with shorts due to multiple crossover lines on the dielectric layer. To address this, we recommend printing a second pass of the dielectric layer to achieve a thicker insulating layer that better supports additional layers printed on top. Drastic height changes A second pass of the dielectric layer can result in significant height differences. To handle this, it is advisable to set a low probe pitch to ensure a more accurate height map and print a thicker crossover layer for improved contact on the top layer. Maintaining flexibility with components attached  To ensure the circuit remained flexible after populating components, we opted for smaller, more flexible components. This, combined with the use of a flexible substrate, encapsulant, and inks, allowed the circuit to bend without damaging the connections. Conclusion This project highlights the educational value of converting rigid circuit designs into flexible ones, allowing students to explore diverse materials and optimise print settings through experimentation. It also demonstrates the potential of prototyping flexible PCBs to replace electronics that were considered rigid, achieving lightweight, compact, and resilient designs. As flexible PCBs gain more popularity, hands-on experience with these technologies becomes essential for staying ahead in the rapidly evolving electronics industry. We invite you to explore our other projects  as we continue to explore the possibilities of flexible PCBs and printed electronics. Working with flexible PCBs? Book a meeting  to speak with one of Voltera’s technical representatives. We are exhibiting at the Future of Electronics RESHAPED events in 2026. The events will take place in California and Berlin . Please register for these events, meet us in person and see our machine in action.

Conference & Exhibition: 10 & 11 June 2026 | Masterclasses: 9 June 2026 Computer History Museum, Mountain View, California, USA Co-located with the Nextflex Innovation Day Exhibition spaces 75% sold already! Super early bird rate expiring 19 DEC 2025 The next Future of Electronics RESHAPED USA show will  move from the East Coast to the West Coast , taking place at the iconic Computer History Museum in Mountain View, California! Let's RESHAPE the Future of Electronics together, one layer at a time , on 10 & 11 June 2026 in Mountain View, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... Global Agenda Discover key breakthroughs RESHAPING the future of electronics. Discover more here The TechBlick team is currently curating the agenda. To get a sense of the calibre of our events, please explore all our previous events here . All these past events across all locations, technology topics and years are  also available to you with your annual pass. Super early bird attendee rates end on 19 DEC 2025. Secure your spot now Incredible Tradeshow Experience the innovations that will RESHAPE electronics Explore 75+ exhibitors will be joining us onsite, creating a vibrant tradeshow floor that reflects the state-of-the-art across the entire global value chain for additive, printed, hybrid, sustainable, wearable and 3D electronics.  The exhibition floor is already 75% full . Please secure your space now. Learn more and download the package here   Co-located with the Nextflex Innovation Day NextFlex is the linchpin of the printed and hybrid electronics ecosystem in the US, driving the development of a robust industrial base for hybrid electronics manufacturing. Learn more here In 2026, Nextflex will co-locate its popular Innovation Day with TechBlick’s Future of Electronics RESHAPED at the iconic Computer History Museum, creating a single must-attend event for the entire global community. Super early bird attendee rates end on 19 DEC 2025. Secure your spot now

As electronics demand greater miniaturization, multifunctionality, and integration, the materials enabling these advancements require significant consideration. Brewer Science is pioneering a new frontier in additive electronics by developing advanced functional materials, including printable low-loss dielectrics, encapsulants, and optical layers, that empower high-performance sensor systems and advanced packaging solutions. These innovations not only enhance device capabilities but also strengthen the domestic electronics supply chain, positioning the U.S. as a leader in next-generation electronics manufacturing.   The Challenge: Evolving Demands in Electronics Manufacturing Microelectronics manufacturing has long relied on proven techniques like photolithography and PCB fabrication, technologies that have enabled decades of innovation and remain essential to many high-performance applications. However, as the industry pushes toward greater miniaturization, multifunctionality, and integration, new manufacturing paradigms are emerging to meet these evolving demands. Additive manufacturing offers unique advantages in design flexibility, rapid prototyping, and integration of complex 3D structures. Yet, while structural additive manufacturing has matured, the development of functional materials, such as printable dielectrics, conductive materials, and encapsulants, remains a critical frontier. Brewer Science is helping bridge this gap by introducing advanced materials that complement traditional processes and unlock new possibilities for embedded sensing, flexible electronics, and real-time environmental monitoring.   Watch the presentation “Building Circuits from the Ground Up: Materials Innovation for Additive Electronics” by Dr. Adam Scotch at TechBlick 2025. It provides insight into the evolving demands in electronics manufacturing and explains why strategic material innovation is necessary to address the next generation of technology.   Brewer Science’s Breakthroughs in Functional Materials Brewer Science is addressing this gap by leveraging its deep expertise in polymer chemistry and semiconductor manufacturing. The company has developed a suite of functional inks and printable materials tailored for additive electronics, including: Low-loss dielectrics  for RF and high-frequency applications Functional inks  for measuring pressure, strain, temperature, and conductivity Encapsulants for environmental protection and mechanical stability Membranes  for monitoring water quality such as heavy metals and other contaminants These materials are compatible with a range of deposition techniques, including ink jet, microdispense, spray coating, and fine-line screen printing, which enables precision and scalability. Do not miss the flagship TechBlick event in Berlin on 22-23 October 2025 Enjoy a curated world-class agenda and masterclass program with four parallel tracks (over 100 speakers), experience and feel the latest technologies at a tabletop exhibition showcasing 90+ global exhibitors, and connect with customers and partners from around the world.   Real-World Impact: Water Quality Monitoring One of the most compelling applications of Brewer Science’s material innovations is in  real-time water quality monitoring . Using advanced sensor arrays built with these functional materials, Brewer Science has developed systems capable of detecting: Heavy metals: Lead (Pb), Cadmium (Cd), Copper (Cu) Hardness: Calcium (Ca), Magnesium (Mg) PFAS (Per- and Polyfluoroalkyl Substances) [AS1]   Nitrate pH Temperature Conductivity (Total Dissolved Solids, TDS) These sensors operate at  parts-per-billion (ppb)  sensitivity and can be customized to detect a wide range of analytes. When paired with  IoT technology , they enable remote, real-time monitoring of water sources from municipal facilities to rivers and streams. This capability not only improves testing speed and accuracy but also supports public health by identifying contaminants early and preventing exposure. By integrating these sensors into scalable, additive manufacturing workflows, Brewer Science is helping communities access safer water and empowering governments and industries to make data-driven decisions. Learn more about Brewer Science’s InFlect ®  water quality sensor system on their website.   Brewer Science’s 30-second overview video encourages viewers to question, “What is in your water?”    Enabling Domestic Resilience and Innovation With over 40 years of U.S.-based chemical manufacturing experience, Brewer Science is uniquely positioned to support domestic supply chain resilience. Its vertically integrated capabilities from synthesis and blending to packaging and quality control ensure consistent performance and scalability. This infrastructure supports rapid prototyping and commercialization of additive electronics, helping the U.S. close the gap with global competitors.     A Vision for Additive Electronics Brewer Science’s approach enables the construction of electronic circuits from the ground up, merging chips, packages, and PCBs into unified, multifunctional components. This holistic design philosophy opens the door to: 3D printed traces and vias  on complex surfaces Embedded RF and optical waveguides  for advanced sensing and communication Integrated sensor systems  with environmental protection and mechanical flexibility These capabilities are especially valuable for aerospace, defense, medical, and IoT applications where performance, size, and reliability are critical.     Brewer Science is looking forward to collaborating with you! Brewer Science is looking to integrate and bring its real-time water quality monitoring capabilities to the global market. If you have an application that could benefit with real-time water quality sensor system, we are eager to hear more. Please submit a request via the contact form on Brewer Science’s website .  Additionally, our InFlect ®   sensor systems offer customizable analytes. If you’re seeking to detect different analytes, please send us a message and we would like to innovate with you. Join the flagship TechBlick event in Berlin on 22-23 October 2025 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year the event will also feature the co-located  Perovskite Connect , the only event worldwide dedicated to the perovskite industry.  Learn more here Register Now Download Conference Handout