Roartis, a Belgian, privately owned company, develops and manufactures adhesives, coatings, resins and sintering materials for electronic applications. Since 2008, their focus has been on high reliability markets and applications, in the field of medical, semiconductor, automotive, defense, aerospace, heady-industries, etc. Based on a business model of customized solutions, technical support and excellence in quality, the company has been steadily growing over the past years with its broad portfolio of over 400 commercial products for various electronic applications. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped The portfolio includes electrically conductive adhesives, micro-encapsulants, high power sintering pastes, thermally conductive materials, UV-curable adhesives, etc. Roartis’ portfolio is marketed under the brands IQ-BOND®, IQ-CAST® and IQ-SINTER®. Recently, a new line of functional inks has been introduced, targeting applications for printing circuitry on flexible substrates including PET, PEN, PC, PVC, TPU, etc. The new range of products, branded IQ-INQ® will be launched during the upcoming Techblick event in Berlin, Germany and covers apart from Ag-based inks also other metal options, as well as dielectric materials. Where over the past years, many suppliers have emerged for traditional 2D compatible conductive inks compatible with screen, inkjet, gravure or slot die printing, a newer technology in this emerging market is the field of 3D-shaped electronics, and more specifically In-Mold-Electronics (IME). IME is the process of developing and producing embedded circuitry in 3D shaped electronics by means of thermoforming and/or molding processes. This new emerging market of IME and 3D-shaped electronics requires inks, specifically develop to address the technical challenges of this market. Technical challenges to be addressed by IME-compatible conductive inks include high elongation, thermoformability, adhesion, fine line printability and high conductivity. These properties should enable to print electronic circuitry on a 2D substrate prior to converting it into a functional 3D electronics circuit. Figure 1: IQ-INQ® 1002 screen printed on flat substrate, followed by thermoforming Together with leading research institutes, active in the design and evaluation of printed and in-moldelectronics, Roartis optimized its electrically conductive ink IQ-INQ® 1002, specifically targeting bestin-class thermoformability, combined with good conductivity and fine line printability. IQ-INQ® 1002 was evaluated in comparison to 5 leading competitive “thermoformable” conductive inks, with regards performance of electrical resistivity versus elongation, printability, and adhesion. On various substrates, including PVC, PC, PET, PA, TPU it was shown to provide low resistivity with highest elongation (> 50%) and excellent adhesion. Conductive tracks of 60 µm, with equally 60 µm were successfully printed, resulting in intensely thermoformed 3D shapes, with good electrical functionality. The selected chemistry is suitable for screen printing on most high speed industrial screen printing equipment, and will cure at temperatures as low as 80°C. For further information, please contact info@roartis.com, or contact us via our website www.roartis.com. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped

Carolyn Ellinger, Chris O’Connor, Chris Liston, Emily Rej, Tom LeBlanc Eastman Kodak Company Kodak has a long history of manufacturing quality film products – starting with silver halide imaging films for consumers, including the iconic KODACHROME. Kodak is continuing to build on that history, manufacturing a variety of industrial film products for strategic business partners in many industries – from automotive to battery to healthcare. Built on expertise in coating, printing, and image quality, printed electronics products and contract manufacturing services offer customers modern functionality rooted in decades of manufacturing excellence. Flexible heaters were first developed in the late 1800s, around the same time as Kodak was starting to manufacture film products While these first flexible heaters were textile based, they operate on the same resistive heating principles as today’s flexible film heaters. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your discounted passes With new technologies come new challenges and limitations, and “hidden” heaters are being deployed to improve the functionality of a broad range of electronic systems. Temperature-limited electronic devices, such as LCDs, require heating to be able to operate in cold environments. Outdoor sensors require that ice and snow be removed from their front surface to ensure their operation. Each of these applications (many many more) require transparency and heating. However, while each application nominally requires “heat” and “transparency” – the requirements and form-factors of these transparent heaters vary across applications, and from device to device. Kodak’s manufacturing process for fabricating highly transparent patterned heating films delivers designs optimized for individual customers, various integration paths, and a myriad of end-devices. The copper micro-wire designs are manufactured with 2-μm imaging resolution, enabling ultimate freedom in macroscale and microscale optimization. The fully additive, roll-to-roll printed electronics manufacturing process produces copper micro-wires by printing a catalytic ink in the desired pattern, and then electrolessly plating copper to the specified height allowing for independent control of transparency and sheet resistance. As described in this white paper, Kodak works with customers to determine the optimum heater design. Figure 1a illustrates a simple approach in designing for a desired power density at a given system voltage. Figure 1b illustrates just a few of the many possible designs for uniform transparent heating. Figure 1a. Example of heater designs for system optimization. Each heater has the same heated area, same transparency, but have been tuned to a different resistance (R) to achieve the required power density (PD) and the supply voltage of a given application. Figure 1b. Example heater patterns. How do resistive heaters work? Resistive heaters function by Joule heating, also known as Ohmic heating, where the flow of electric current through a conductor produces heat. All conductive materials exhibit this resistive heating phenomenon, with the heating response varying based on the specific properties of each material. Resistance is defined as the resistance to the flow of current at a given voltage bias, or R = V/I. Heater power is a function of the amount of current that is driven through an element of a given resistance: P = I2R = V2/R. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your discounted passes Therefore, a heater with a higher resistance will require less current to generate the same power. Conversely, a conductive trace with low resistance will have lesser heating when current is applied than a higher resistance trace. In typical operation, heaters are driven by a constant voltage power supply, and a heater with a lower resistance will consume more power and heat to a higher temperature. The resistance of any heater is a combination of the pattern of the resistive element and the electrical properties of the material used. The resistance of conductors of a given thickness can be expressed as sheet resistance (Rs) in Ohm/square, so the end-to-end (terminal) resistance of any conductive pattern is Rs*L/W where L/W is the number of squares. Consequently, at a given operating voltage, the power per unit area or power density (PD) is proportional to 1/R, and 1/Rs for square heater element as shown in Figure 2. Figure 2. Power density of a square heater at various voltage levels as a function of sheet resistance. What Sets the Kodak Technology Apart? Kodak’s cleanroom manufacturing leverages Kodak’s long history of innovation in material science, image science, printing, deposition, and roll-to-roll manufacturing to produce patterned micro-wire films with the unprecedented combination of high transparency, neutral color, low reflectance, and low sheet resistance. Cleanroom manufacturing minimizes electrical yield losses and ensures that parts will be free of transparency-reducing particulate going into final integration. The fully additive, roll-to-roll process features ~2 µm imaging resolution to produce fine copper micro-wires as narrow as 5 µm in width, by first printing a patented catalytic ink and then electrolessly plating copper to the desired height. The process enables the ability to independently tune sheet resistance and transparency, the ability to manufacture films with highly conductive traces leading to more resistive heating elements, and the ability to form multiple devices or electrical elements on a single substrate in a single roll to roll manufacturing flow – on one or both sides of the substrate. The design tools of the Kodak process enable functional heater designs without sacrificing transparency through a combination of mesh design (line dimensions, gaps, curves and angles), copper thickness, and the resistive path of the heater. Not only can the Kodak process support freeform design--only limited by imagination--other supporting elements such as traces, bond pads and even non-conductive or graphic can be additively included. Transparent mesh designs are readily obtainable with visible light transmission (VLT)>85% with Rs from 1 to 5 Ohm/square, as illustrated in Figure 3. Figure 3. Kodak copper micro-wire mesh performance for a variety of mesh patterns represented the ratio of pitch to linewidth (LW) and copper thicknesses. The design freedom that comes from patterning via printing enables not only the pattern selection optimized for transparency, but also optimization of the overall design of the heater for a given system. For example, if the application has a square area that requires uniform heating a possible heater design would be a single square patch of resistive heater, but in this case the power density achievable would be limited by both the sheet resistance of the heater and the operating voltage available in the system. Typically, an application will have specified power, temperature and voltage requirements and a heater must be designed to operate at those conditions. Figure 4 illustrates how heaters may be designed using the mesh designs of Figure 3, with a reference shown at 100 W/m2 and the design choices depending on the supply voltage. For example, if a 3V power supply is chosen then a three-leg heater design is preferred, but if a 12V power supply is chosen, then a 3-leg heater would not be suitable and a 7-leg heater is preferred. Figure 4. Illustration of heater designs to obtain a desired power density versus supply voltage. Ready-to-Integrate Transparent Heaters Kodak is seeking strategic integration partners for transparent conductive heaters. Products and devices from this manufacturing line include all benefits discussed above, and ready-to-integrate films can be supplied for evaluation. Contact Information For more information on Kodak’s micro-wire technology and enabling manufacturing process, please contact: sales.printedelectronics@kodak.com. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 at www.TechBlick.com/ElectronicsReshaped. Contact us for your discounted passes

In this illuminating presentation, Michael Petersen will walk us through the transformative path of medication adherence advanced by smart packaging technology. Focusing on remarkable innovations like Information Mediary Corp's Med-ic smart blisters and CertiScan solutions, Petersen will provide a comprehensive insight into how these pioneering tools have decoded complex adherence puzzles and driven industry momentum, albeit slowly. By tracing the arc from traditional to smart adherence packaging, Petersen aims to showcase the remarkable potential of digitization in healthcare while acknowledging the challenges and the gradual pace of progress. Attendees will come away with a deeper understanding of the power of smart adherence packaging to reduce clinical uncertainties and improve patient outcomes, despite persistent industry inertia. This discourse forms an integral part of the larger dialogue about the transformation of healthcare through technology at the TechBlick event in Berlin SAVE THE DATE

Speaker: Alan Wu Company: Smooth & Sharp The RFID business continues to grow. The global RFID market is anticipated to continue to grow in 2023, according to several market researches, it projects a market value of US$14~15 billion in 2023. Retail apparel continues to dominate the UHF industry in terms of tag number and market size. The 2023 forecasts nearly 23~24 billion UHF RFID labels will be used in retail apparel tagging. In the latest study series into the UHF RFID market, predicate UHF RFID label shipment will rise to 80~90 billion by 2028, with a 25 percent compound annual growth between now and 2026. All these billions of UHF RFID label are designed for single-use, they will be discarded right after customer bring them home. Almost all these ten billions of RFID labels are made with etched antenna on plastic, a lot of pollution during chemical etching process and leave waste plastic after use. In this presentation, S&S will unveil the first and only ISO certified Biodegradable RFID antenna by using Additive Manufacturing SAVE THE DATE

Karl-Heinz Fritz Company: Cicor Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way. This presentation will give an overview about different ways to make best use of the capabilities SAVE THE DATE

Speaker: Sven Hujo Company: Delo Flexible electronics have the great potential to reshape the upcoming decade from automotive interior design to smart textiles. In this presentation the potential of new functional polymers will be highlighted, which are on the one hand side capable to ensure flexibility and on the other hand side long term reliability. The property profile of functional polymers or adhesives is able cover a wide range of bonding and coating applications in flexible electronics. To ensure both electrical and mechanical connection of SMDs on flexible substrates it is possible to dispense non-conductive (NCA) and isotropic conductive adhesives (ICA) together to combine their benefits. For this reason, adhesive solutions are important for the introduction of new flexible electronic devices and applications to the market. SAVE THE DATE

Speaker: Teemu Alajoki Organization: VTT SAVE THE DATE

With ambient IoT standards emerging from IEEE and 3GPP and adoption of Bluetooth based ambient IoT rapidly scaling from hundreds of millions to billions, it’s important to understand this new segment of the Internet of Things. The original vision of a pervasive IoT was limited by low cost tags that required expensive infrastructure (RFID), or high cost tags with low cost infrastructure (cellular and LP WAN). Ambient IoT is on a trajectory to scale to trillions of connected things by having low-cost tags and low or even no cost infrastructure. In this talk we review the emerging standards, architecture, and applications for ambient IoT. SAVE THE DATE

Neural implants have the potential to restore lost or impaired nervous system functions through electrical stimulation or recording of the brain. However, current neural implants suffer from a fundamental limitation: a mechanical mismatch with the soft host tissue of the central nervous system which can cause poor electrode-tissue contact, unspecific stimulation or recording, and chronic scarring. At Neurosoft Bioelectronics, we have developed soft neural electrodes that address these limitations. Our electrodes are made of more compliant materials that seamlessly interface with the brain, promoting the long-term bio-integration of the devices and reducing surgical risks opening new avenues in the field of Brain-Computer Interfaces (BCI). SAVE THE DATE

With the growing incidence of record high temperatures, extended heat waves and extreme weather events, it is increasingly important for physically active people to take steps to avoid heat-related complications and optimise performance under hot conditions. Maintaining proper hydration is a key part of this process. However, both the rate and salt content of sweat can vary significantly by person, actvity type and intensity, and weather conditions among other factors. Thus there is a need for personalised monitoring devices tailored to the individual and the type of activity. For athletes, workout routines typically have pre-defined intensities and durations with known weather conditions. Capturing sweat profile snapshots under a variety of conditions enables predictions of hydration needs for future workouts, with an accuracy depending on the number and variety of snapshots. A single-use wearable of the type presented in this talk provides an efficient and cost- effective way to capture these snapshots. Some of the unique design and manufacturing challenges involved in bringing such devices to market will be discussed. For industrial workers, physical activity can extend over longer durations, be highly variable in intensity, and occur multiple times during a single day under variable weather conditions. Moreover, overheating impairs both physical strength and mental acuity, raising the likelihood of workplace injuries. Such workers benefit from a continuous monitoring device that provides instantaneous feedback and can be worn on a daily basis. Various aspects of the design of such a platform and how it differs from the single- use device will be presented. SAVE THE DATE

Ehsan Faegh Company: CCL Industries, Imprint Energy The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems. In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount. Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor. Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential. Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption. Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products. SAVE THE DATE

Speaker: Gari Arutinov Compay: Holst/TNO .With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield SAVE THE DATE