Authors: Steliyan Vasilev1, Melanie Hoerr1, Michaela Kasdorf1, Sven Boehmer2 13E Smart Solutions, Krefeld, Germany 2ZSK Stickmaschinen GmbH, Krefeld, Germany steliyan@3esmartsolutions.de 1. Introduction Embroidery was historically a means of adorning fabrics with intricate patterns, a testament to human skill. However, in the modern era, this ancient art form has significantly evolved. In recent years, embroidery has undergone a profound transformation, emerging as a pioneering technology at the intersection of artistry and functionality. This article delves into the possibilities which embroidery offers for the production of Smart and E-Textiles, exploring technical intricacies, advantages, and challenges related to embroidered conductive traces. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us [steliyan@3esmartsolutions.de ] for a special attendee discount 2. Solutions for the E-Textiles Production Made Possible by Embroidery E-Textiles represent a fascinating synergy between traditional textiles and modern technology, serving diverse sectors like automotive, aerospace, sports and fitness, medical, home textiles, and wearable technology. Thanks to the exceptional precision and high degree of automation of embroidery technology, it is ideal for integrating functional elements into textiles, such as sensors, actuators, antennas, or electrodes. By use of conductive threads and specialized attachments for automated integration of electronic components, embroidery techniques, originally developed for aesthetic purposes, now enable reliable and scalable E-Textiles production. Embroidery makes possible the following innovative solutions, among all: Integrating and Interfacing Electrical Components and PCBs Semi-Automated Integration In decorative embroidery, the Appliqué technique is utilized to attach pre-made textile patches to the carrier fabric. This same method can be used for semi-automatic placement of printed circuit boards (PCBs). After the manual placement and adjustment of the PCB, the embroidery machine takes over, automatically fixing it to the fabric and establishing the electrical connections at the interface pads. Automated Integration Embroidery machines equipped with automated Sequin Placement Devices can be configured to incorporate functional sequins into textiles (Fig. 1a). Functional sequins can be equipped with SMD soldered components, such as LEDs or RFID chips. For larger circuit boards, whether rigid or flexible, embroidery machines fitted with automated PCB Placement Devices can precisely position and secure the PCBs to the textile (Fig. 1b), followed by embroidery of the electrical connections. Automated integration is especially valuable for achieving reliability and reproducibility in the production of E-Textiles on a large scale. Figure 1 Automated integration of functional LED sequins (a) and PCBs (b) by using automated Sequin Placement Device and PCB Placement Device from ZSK Stickmaschinen GmbH Embroidery of Complete Electrical Circuits By embroidering conductive traces onto fabric, placed PCBs and peripheral components can be electrically connected to each other, as well as to power sources or external circuitry. This approach allows for the automated integration of complete electrical circuits into textiles during a single production step. Integration of Conductive Fibers and Wires Tailored Wire Placement (TWP) and Tailored Fiber Placement (TFP) techniques allow precise conductor placement for applications such as illumination, textile-based heating, RFID antennas, and more. Embroidery of Conductive Areas With conductive threads, conductive areas in various shapes and sizes can be embroidered. These areas can serve a multitude of functions, including wide conductive traces, sensors, electrodes, and antennas, expanding applications from automotive control elements to advanced medical devices. 3. Advantages of Embroidered Conductive Traces Embroidery of conductive traces has opened up new horizons for Smart and E-Textiles, driven by several distinct advantages: Versatility in Design and High Precision Embroidery offers unparalleled versatility in design. Complex patterns and intricate geometries become feasible, catering to diverse application needs. The precision achieved in embroidery ensures that these designs are replicated accurately and consistently. Flexibility and Breathability One of the standout features of embroidered conductive traces is their inherent flexibility. They easily integrate with the carrier fabric, preserving its natural drape. Unlike printed circuits, embroidered traces allow textiles to breathe, enhancing wearability in clothing and comfort in various applications. Durability and Washability Embroidered conductive traces exhibit impressive durability. They withstand the rigors of daily use and multiple washing cycles, remaining fully functional over extended periods. This longevity contributes to the reliability and sustainability of embroidered E-Textiles products. Enabling Direct Connection to Electrical Components and PCBs Embroidery facilitates the direct integration of conductive traces with electrical components and printed circuit boards (PCBs). This approach eliminates the need for additional connectors or complex wiring, enhancing the product’s reliability and comfort and reducing production costs. 4. Challenges and State-of-the-Art Solutions for Embroidered Conductive Traces While there are clear advantages to using embroidered conductive traces, there are also associated challenges. In the following sections, we will outline the primary challenges and present state-of-the-art solutions to address them. a) Compensation for High Yarn Resistivity One of the main challenges in utilizing conductive embroidery threads is their intrinsic high resistivity of up to a few hundred Ohms per meter. To address this challenge, several state-of-the-art solutions have emerged: Multiple Passes and Use of Conductive Bobbin Thread A method to compensate for the high resistivity of the conductive thread is to embroider multiple passes using the so-called running stitch. Each pass adds to the overall conductivity, effectively acting like parallel resistors (Fig. 2a). Additionally, incorporating a conductive bobbin thread enhances conductivity by further reinforcing the electrical path (Fig. 2b). As an additional benefit, multiple embroidered passes compensate for the inhomogeneity in resistance throughout yarn length due to local damages in a single yarn pass during use, increasing the reliability of the E-Textiles product. Figure 2 Equivalent circuit of embroidered conductive trace with one, two, and three passes (a), and conductive embroidery (yellow) and bobbin (green) thread (b) Conductive Traces Embroidered as Filled Areas An alternative approach for reducing resistivity is to embroider conductive traces as filled areas, using the fill stitch rather than the running stitch. The high density of stitches in the filled areas enhances the overall trace conductivity. To ensure sufficient electrical contact between the stitches along the stitch direction, an underlayer must be added beneath the fill stitch, angled to the primary stitch direction (Fig. 3) [1]. Figure 3 Embroidered area with fill stitch without (a) and with a grid underlayer (b) b) Avoiding Conductive Thread Damage during Embroidery During embroidery, stitching directly into the conductive yarn can damage it, compromising electrical properties. Therefore, special attention must be given to the digitizing of the embroidery design to avoid placing stitches over previously embroidered threads as well as repetitive stitching in the same spot. To mitigate this while embroidering multiple running stitch passes, a swing factor can be introduced in the digitizing program, altering the stitching path slightly with each pass. This minimizes localized stress on the yarn, preserving its integrity and conductivity. Fig. 4 illustrates a conductive trace with four passes and an added swing factor, shown as a visualization in the embroidery machine’s programming software (a) along with a photograph of the embroidered trace (b). Figure 4 Conductive trace with four passes for increased conductivity and added swing factor, shown in the digitizing software (a) and after embroidery (b). When adding a swing factor, corners pose a specific challenge, leading to repeated puncturing at the same location (Fig. 5a). Rounding corners in the embroidery design is essential, as it significantly reduces the risk of stitching into the yarn, maintaining its electrical properties (Fig. 5b) [1]. Figure 5 Running stitch with three passes and an added swing factor, with multiple punctures in sharp edges (a) and without multiple punctures in rounded corners (b) c) Enabling Crossing and Insulation of Conductive Traces Complex E-Textiles designs often require multiple closely adjacent or intersecting conductive traces. Without proper insulation, unwanted electrical connections can occur when these traces come into contact. Adding non-conductive bridges between traces prevents unintended short circuits and maintains the desired electrical paths. Insulating bridges can be created by embroidering multiple layers of satin stitch with non-conductive thread, as depicted in Fig. 6a. It is crucial to ensure that the stitch directions of the bridge layers are angled in relation to the intersecting conductive traces. Covering conductive traces with non-conductive thread can also be used for insulation towards the surrounding environment. Fig. 6b illustrates an example of covered conductive traces connected to moss-embroidered electrodes for body signal acquisition. The covering prevents direct contact with the skin outside the electrode areas. For applications requiring waterproofing of the conductive traces, seam sealer in the form of tape or liquid, or dispensed polymer coatings can be utilized. Figure 6 Covering conductive traces with non-conductive thread to create insulating bridges between intersecting traces (a) and as a method of insulation towards the surrounding environment (b). 5. Conclusion The integration of conductive traces into textiles through embroidery offers a promising avenue for the development of Smart and E-Textiles. While the advantages of embroidered conductive traces make them a compelling choice for a wide range of applications, there are technical hurdles. Fortunately, various state-of-the-art solutions have been developed to address these challenges, ensuring that embroidered conductive traces can meet the demands of diverse applications. As technology advances and the demand for Smart Textiles grows, continued research and innovation in the field of technical embroidery will be essential. With ongoing efforts to refine techniques and materials, we can expect to see even more sophisticated and reliable embroidered E-Textiles, opening up new possibilities in wearable technology, healthcare, fashion, and beyond. References [1] McCann, J., & Bryson, D. (2023). Smart Clothes and Wearable Technology, Second Edition. Elsevier. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Contact us [steliyan@3esmartsolutions.de ] for a special attendee discount

Kyosuke Michigami | Panasonic Industry Co., Ltd. [michigami.kyosuke@jp.panasonic.com ] Introduction Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard subtractive printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant properties which make it compatible with high-volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products. Currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with conventional surface mount (SMT) assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of these conventional FPCs. Fig1. Comparison of existing FPC materials (polyimide and TPU) and a target ULTRA pliable circuit board Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped . For special attendee discounts please contact us [[michigami.kyosuke@jp.panasonic.com] Development of Copper Clad Stretch (CCS) To address the limitations imposed by (1) the stiffness of polyimide and (2) the poor heat durability of TPU, the researchers developed an innovative approach using a copper-clad pliable and stretchable thermosetting resin. This construction is abbreviated CCS for Copper Clad Stretch technology; meaning it can be stretched, unlike conventional copper clad laminates (CCLs). The same resin system is used for both the circuitry layer and the insulative coverlay. The coverlay construction consists of a PET protective film, uncured resin, and polyimide release liner. The unique thermosetting polymer technology can be used in both fully-cured and un-cured format depending on the application. The polyimide release liner in the coverlay also acts as a mechanical support for the soft circuit board during SMT process discussed later in the paper. Fig2. Product portfolio achieved with thermosetting polymer technology Heat Durability Assuming exposure to typical SAC (Tin-Silver-Copper alloy) reflow conditions in the SMT process, the researchers conducted a solder float test at 288°C for 10 seconds and confirmed that no blistering or delamination of the CCS occurred (Fig.3). And the bare film made by etching CCS showed pliability and stretchability even after the solder float. On the other hand, TPU which is a thermoplastic resin, melted almost instantaneously and turned out to be incompatible with this SMT process. Fig3. Heat durability test (solder float) Mechanical Properties The resin of CCS is much more pliable than polyimide, leading to accommodation of various device form factors such as twisting and bending (Fig.4). Therefore, it is well-suited for non-planar and dynamic applications in healthcare, wearables, and the like. Fig4. Various form factors achieved with CCS resin A 10%-stretch cycle test for 10,000 cycles was conducted using a serpentine-patterned CCS (Fig.5). The sample finished the test without any failures in copper pattern. That means CCS has durability for stretch and is suitable for application requiring movements. Fig5. Stretch cycle test of serpentine patterned CCS CCS Compatibility with Standard FPC Fabrication Processes CCS was evaluated for standard PCB double-sided processes compatibility which consist of mechanical drilling, wet desmear, plating, chemical etching, coverlay patterning-molding, and surface mounting technology (SMT). The CCS could pass through the process. The polyimide release liner in the coverlay acted as a support structure for avoiding deformation during SMT. Fig6. Circuit fabrication process Conclusion This new CCS technology exhibits pliability and stretchability not possible with polyimide FPC products. Because of the temperature-resistant thermosetting resin system, CCS is compatible with reflow in the SMT process that TPU cannot withstand. As a result, CCS can be a foundational technology for building more pliable, conformable, and even stretchable devices utilizing conventional FPC manufacturing processes. As a use case of CCS, a reconfigurable intelligent surface (RIS) has been developed by researchers in Osaka University to effectively deliver the radio waves in 6G band (Fig.7, Ref.1). The radio waves at these frequencies are easily blocked by buildings and other physical structures. Researchers in Osaka University fabricated a metasurface reflector that can be attached to various locations and whose angle can be adjusted by expanding and contracting. By the combining a metasurface pattern and the inherent stretchability of CCS, it is possible to reflect radio waves efficiently. Fig7. Reconfigurable anomalous reflector fabricated on a stretchable elastic substrate. (a) Photograph of a prototype. (b) Schematic of a dynamic control of the reflection direction. (c) Photograph of a stretched sample mounted on a fixture. (d) Photographs of the sample before and after a stretch In addition to the research noted above, there are many product development projects in progress using the CCS technology. Panasonic Industry is proceeding with the development of CCS technology together with our customers and preparing for mass production. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped . For special attendee discounts please contact us [[michigami.kyosuke@jp.panasonic.com] About us Panasonic Industry Co., Ltd. Electronic Materials Business Division Leading-Edge Materials for Circuit Boards, IC Packaging and Printed Electronics Panasonic Electronic Materials provides high-performance polymer-based products for Printed Circuit Board fabrication and Semiconductor packaging with industry-recognized brands like MEGTRON, Felios, Hiper and ECOM. These products are widely used in networking, automotive, aerospace, mobile, industrial, and other sectors where quality, reliability, and performance are paramount. Based on our core competency with thermosetting polymer chemistry, Panasonic research engineers in Osaka, Japan are developing a suite of game-changing new materials branded as BEYOLEX for printed electronics and related applications. We are working with OEM customers, research consortia, universities, and industry partners world-wide to bring these technologies to market. For quesitons please contact: Kyosuke Michigami | Panasonic Industry Co., Ltd. [michigami.kyosuke@jp.panasonic.com ] [Ref.1] Reconfigurable anomalous reflectors with stretchable elastic substrates at 140 GHz band Kato, Y.; Yonemura, K.; Seki, K.; Kambara, R.; Sanada, A. Nanophotonics, 2022, 12(13) https://doi.org/10.1515/nanoph-2022-0758 Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped . For special attendee discounts please contact us [[michigami.kyosuke@jp.panasonic.com]

Authors: Kai Keller and Lina März Introduction There are three big topics that shape the production environment of today and tomorrow: digitalization, additive manufacturing, and preserving natural resources/zero waste. Very tightly timed supply chains and globally distributed and connected production processes are already real and only possible because of digitalization. Additive manufacturing knocks on the door of many industrial areas, such as automotive and aerospace. Preserving natural resources and zero waste will become standard in many areas and will be the financially most convenient opportunity. Printed circuit boards (PCBs) are manufactured mainly in Asia but distributed just-in-time all over the world. In our laptops, cars, trains, planes, TV's, audio systems, mobile phones, we all use dozens of them every day, without even realizing it. The recent stress that has been put on these supply chains also lead to investments into new facilities in North America, Europe, as well as South East Asia. So many decision makers in electronics manufacturing are currently concerned with the question which technologies they are going to use for the newly built facilities.[ See for example SEL’s story in PCB007 Magazine, Vol. 13, Number 8, August 2023, https://pcb.iconnect007.com/ ] Today, the production process for PCBs is mainly subtractive, indicating that lots of expensive resources are wasted, are not reused, and eventually increase the costs. This means PCB manufacturing is at home in a global, digital world but will eventually suffer from subtractive processing, waste of resources, and more complex applications and layouts. Inkjet printing by nature is a digital technology, from image processing to discrete droplet deposition. It is also an additive manufacturing technology. Expensive materials are only deposited where they are needed, and even the amount of material can be adjusted locally. Three dimensional structures are possible without any extra effort. This indicates that inkjet printing is preserving resources and minimizing waste. This article will describe the process of applying a solder mask layer by means of inkjet printing in the PCB production. It will briefly describe a PCB and outline the benefits that inkjet printing brings. This will be followed by a detailed description of the steps that were necessary to establish a stable industrial process. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your special attendee discount [Authors: Kai Keller ] Why Inkjet Printing for Deposition of Solder Mask on PCB's? Typically, a uniform solder mask layer is deposited by a coating technology such as curtain coating or screen printing. Also, dry films are available. All have in common that they cover the whole board. After a drying step, the design is transferred onto the board via a photo mask. For each design, an own photo mask needs to be created. Alternatively, direct imaging processes with a laser are used. After illumination, the dried film is developed, and the unwanted areas are stripped and washed away. A final curing step is performed in order to achieve the full functionality. Typically, this consists of a so-called UV bump and thermal curing in a belt oven. By summing up all the equipment needed, it's no wonder that a single production line can easily be dozens of meters long and requires a lot of staff with different skills. The inkjet technology in contrast locally deposits the UV-sensitive material and pins it in-situ with an LED lamp. The image is loaded digitally and can be changed after each board and even be adjusted to each board individually. It is saved digitally and does not use any footprint. After the same final cure from the conventional process, the board is finished. This indicates that PCB manufacturers can drastically reduce the amount of production steps that translates in less investment cost and space for machinery and less consumption of electricity and consumables and therefore a very fast return on investment. Figure 1 shows the process flows of the conventional and the inkjet process. Besides, these economic and environmental aspects inkjet exclusively opens the door to a unique combination of other features that gives the PCB production industry a new level of freedom. This allows the industry to be prepared for new applications such as high frequency and 5G. Figure 2 shows an inkjet-printed solder mask on a PCB and gives an overview of some unique features. In contrast to the conventional deposition technologies, where the layer thickness is the same over the whole board, with inkjet printing, the thickness can be adjusted locally without any extra effort. There are a lot of reasons why this is beneficial for the PCB manufacturing process. Let us name three: - Thickness zero, i.e., no solder mask where it is not required, in order to safe material or increase process stability. - A locally adapted thickness to ease subsequent SMD assembly. - Higher thickness at conductor or pad edges to reach higher break-through voltages. In summary, the main advantages are as follows: Digital production technology Additive manufacturing allows for locally adjustable thickness of layers New features are possible Labeling functions come for free Up to 80% less ink, as it is only print where required Higher yield Reduced space Reduced energy consumption Very fast return on investment What Are the Requirements and What Makes Inkjet Printing of Solder Mask Tricky? The requirements of the solder mask are defined in several norms, mainly by the IPC – Association Connecting Electronics Industries. IPC originated from the Institute for Printed Circuits. We will now describe some challenges that one faces when depositing a solder mask onto a PCB by means of inkjet printing. First of all, the solder mask ink itself is a sophisticated material. Actually, one has to develop two materials. As an ink, it needs to have a very low viscosity, must be a Newtonian fluid, and must allow for perfect jetting in the tiny nozzles. After curing, the material needs to be extremely stable to mechanical impact and withstand harsh temperature cycles (-30 °C to +170 °C) and strong chemicals, e.g., during Ni-Au plating. Another point is the surface. A board when it just arrives to the solder mask deposition consists of two different surfaces: the glass fiber compound (FR4) and the copper (Cu). Unfortunately, the surface energy of these areas largely differ. While the ink stays quite well on FR4, it spreads tremendously on Cu. In addition, the height difference between FR4 and Cu can be more than 200 μm. This can have a large impact on the deposition accuracy. Every PCB job is different. This indicates that PCBs can vary in size and thickness. Because of previous production processes, they can have bows and warpages and because of the still often manual handling even kinks. As if this was not enough, PCBs have many holes of different radii ranging from 0.1 mm up to 5 mm, of course randomly distributed over the whole area. Still, for a good performance, often absolute drop placement accuracies in the range of ± 20 μm are required. This calls for highest demands in the substrate table design and the jetting performance. The requirements and properties of the solder resist and the printed solder resist layer are anchored in IPC-SM-840. Properties can be verified using selected test methods. The test procedure and instructions for carrying it out can be found in the test manual IPC-TM-650. Typically, the properties are divided there into visual, physical, electrical, mechanical, and chemical properties/requirements. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your special attendee discount [Authors: Kai Keller ] How to Get to Inkjet Printed PCB's To realize the application of inkjet printing, the solder mask onto PCB's different aspects have to be taken into account, such as the choice of ink and printheads, the process development, and the machine design. Figure 3 gives an overview of typical factors that define the process and printing machine. Although the overview is generic, most of the items are relevant for the inkjet solder mask process. The process development of each application follows the following route: Printhead selection Ink selection & material compatibility Waveform development Print process implementation System development (optional) On-site process support It is a common misconception, especially in time critical projects, to take the second or third step before the first. Maybe it is possible to produce a nice appearing PCB for a proof of concept, but in production, stability and more importantly predictability are crucial. Solid results based on systematic and repeatable tests are helping to identify the process window, maximize customer satisfaction, and to reduce costly field operations. Data Handling In the PCB industry, gerber is the dominating file format. Like in any other area, the conversion from vector data to discrete/digital images comes at the expense of truth to detail. Photoplotters and lasers both have this loss, but as they are operating in the range of several 10 000 of dpis, the artifacts are small. For inkjet printing, with feature sizes in the range of 30 to 80 μm and resolutions in a similar range, more care has to be taken for converting the print images. Figure 4 visualizes the challenge. The raster image processor has to make a discrete decision based on the vector layout and the printing resolution, whether it generates a printed dot or not. For low printing resolutions, this can lead to artifacts, such as visible steps and missing dots. A high resolution would increase the level of detail but would lead to an overflow of ink or increased thickness. We have developed a conversion algorithm that considers the vector file, the real drop diameter on the substrate, and the printing resolution and adjusts the droplets in such way that the maximal level of detail can be achieved without increasing the resolution and thus not compromising throughput. As mentioned before, conventional solder mask processes are subtractive, indicating that the full board is covered with ink and then structured. This indicates that the appearance and the geometry of inkjet-printed structures are by nature different. If one would now just use the conventional processing recipes, the result would be far from optimal. This is why, for inkjet, new design rules needed to be developed in close cooperation between technology providers, like Notion Systems and technology users, our partners, and clients. This ensures that the printed result looks more alike their conventional counterparts. Machine Concept At Notion Systems, we have developed a machine concept, that is shown in Figure 5 that can be used either in manual mode or be upgraded to operate fully automated with load and unload. Our print unit covers the full substrate width with up to 20 000 nozzles, each firing more than 20 000 tiny droplets per second. The vacuum table is designed in a way that it can hold different sizes of PCBs without any mechanical clamps. An integrated and automated non-contact cleaning system ensures that the printheads are always in good condition. The machine is easy to operate and is designed so that all important parts can be reached easily. Print Images Figures 6-10 show some examples of inkjet-printed solder masks structures. They highlight what is possible today. Summary and Outlook The solder mask on a PCB is perfectly suited for inkjet printing. The reduction of production steps decreases the cost and space requirements. Inkjet printing produces results that meet all requirements specified in the relevant norm for solder mask IPC 840. In addition, inkjet printing enables the implementation of useful and in its combination unique features, such as no mask in holes, locally adjusted thickness, or smart labeling. Yet, soldermask is not the end of the story, there are many more subtractive processes in electronics manufacturing that need a closer look and possibly a replacement, if one considers what is possible with additive processes in general and inkjet technology in particular, today. Questions? Please write to kai Keller and Lina März Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your special attendee discount [Authors: Kai Keller ]

Speaker: John Yundt Company: SunRay Scientific In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues. SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were made for die-to-die bonding and Ball Grid Arrays (BGA) on Polyimide. Test results will show the thin ZTACH® ACE bond, typically 25 – 75 microns thick, provides superior adhesion, low contact resistance, and mechanical robustness on a range of rigid, semi-rigid and flexible substrates during electromechanical testing. Updates on progress towards achieving ≤ 50-micron pitch will be shared. SAVE THE DATE

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer. SAVE THE DATE

Authors: Lena Reinke lena.reinke@panacol.de | Tobias Kaposi: tobias.kaposi@panacol.de Paradigm shifts and disruptive technologies typically combine with, and often rely on generational changes. Such a shift can be seen in today’s photovoltaics development, where organic photovoltaics (OPV) is creating radically new applications in consumer electronics. They include indoor light harvesting to extend battery life of wearables, and outdoor energy generation with performance previously unimaginable from conventional photovoltaics. The same is true for flexible electronics. Manufacturers are redefining the boundaries of volumetric form factor, functionality, and design flexibility in consumer and automotive electronics. A critical contributor to these technology advancements has come from the advancement of bonding technologies. Adhesives now go beyond the basic benefits of sound structural bonding and provide additional functionality to the assembly. This has become the industry standard. Working in conjunction with our highly valued partners and customers, Panacol has successfully developed a range of multi-functional adhesive selections for applications in OPV and flexible electronics. For OPV applications, these adhesives provide higher resistance to environmental stresses. Adhesives for barrier foil lamination optimize the critical interplay between the pretreatment, foil, stack, and adhesive. New conductive adhesives efficiently adhere and protect electrical connections for SMD components in flexible packaging. In all cases, the specific requirements of the application and its assembly process are key factors to consider when making an adhesive selection. Significant benefits can be realized when an optimal pairing is achieved with the component design, assembly, (UV) adhesive properties, and the curing process. Component and process design is afforded much greater flexibility. High throughput processes, including reel-to-reel, can be run with greater efficiency which reduces total cost of operation. Finished products can also possess more functionality and durability. If this all sounds too good to be true, you may be right! As with all other new disruptive technologies, there are many challenges to overcome. Established component designs, assembly processes, and product sourcing criteria used for conventional photovoltaics and flexible electronics must be modified to adapt to the new adhesive technologies. In some cases, the adhesives themselves may need to be slightly modified to better match the intended application and process. However, when the combined efforts achieve a successful balance, mass production becomes more efficient, and it produces a better product. Overcoming these challenges requires cooperation between product manufacturer and the adhesive manufacturer. As such, Panacol is continuously trying to broaden its network of technology partners and active customers. We welcome the opportunity to work with manufacturers who are bringing their own disruptive technology to the photovoltaic and flexible electronics assembly markets. Caption: Schematic illustration of the manufacturing process of flexible OPVs using adhesives. Photo: Panacol. Note: The photographic material may only be published in connection with the associated article. We can shape a new supply chain together! If you are interested in learning more about our products, come visit us at our booth at TechBlick in Berlin on October 17th and 18th. Or for immediate assistance, please contact Lena Reinke or Tobias Kaposi at: lena.reinke@panacol.de Tel.: +49 (0) 151 550 65571 tobias.kaposi@panacol.de Tel.: +49 (0) 151 550 65581 We look forward to reshaping the future of photovoltaics and flexible electronics together with you! About Panacol Panacol-Elosol GmbH was founded in 1978 as a German subsidiary of the Swiss Panacol AG in Frankfurt. In 2008, Panacol was acquired by Munich-based Dr. Hönle AG, a leading global supplier of industrial UV equipment technology. As a member of the Hönle Group, Panacol is a knowledgeable and reliable provider of adhesives, coatings, and UV/LED curing equipment for OEM and contract manufacturers.

SAVE THE DATE

Speaker: Andrzej Pepłowski CEZAMAT, Warsaw University of Technology After years of extensive research and development in biomedical wearables, focusing on chemical and physical measurements, we have gained significant expertise in their manufacturing. Our extensive knowledge of ink dynamics, colloid mechanics, and material characterization enables us to understand the underlying phenomena in technological processes. Starting from material composition and preparation to printing and device operation, we effectively translate our expertise into scientific advancements. Through quantitative and reproducible methods, we establish the foundation for groundbreaking innovations in printed electronic SAVE THE DATE

Zackary Davis Danish Technological Institute The demand for flexible, stretchable and sustainable electronic solutions is growing rapidly due to the growth in eHealth, automotive, smart buildings and other similar application areas. At the core is printed electronics, which uses printing technologies such as screen, flexographic and inkjet printing, together with functional materials and inks to fabricate electronics directly onto plastic foils, paper or textiles. To de-risk European industry to adept these novel materials and technologies, Danish Technological Institute (DTI), has established a One-Stop-Shop, which facilitates European industry with consultancy, development and pilot production. DTI can take novel ideas and perform proof of concept projects, develop these into full prototypes and in many cases, upscale prototypes to a pilot scale. Furthermore, DTI can provide support throughout the entire value chain, from materials to final products. In this presentation, you will witness DTI's work on novel material formulations, particularly focusing on bio-based and sustainable printable materials, including copper-based and transparent silver nanowire inks. DTI will showcase various fully functional demonstrators and prototypes they have developed, ranging from wearable EMG sleeves and heated undergarments to crystal lighting and embedded sensors in drones. DTI Printed Electronics is also heading a vast network through the formation of the open innovation test bed, Sustainatronics. This collaborative initiative involves leading research and technology organizations, as well as industries across Europe, accessible through a single-entry platform. Through Sustainatronics, you can access dedicated services as well as infrastructure access to the best printed electronics laboratories in Europe. SAVE THE DATE

In the dynamic landscape of retail stores, bars, clubs, and seasonal markets, the need for effective product visibility becomes even more evident. Illumination technologies are amongst the highly effective means for brand distinction and impactful visual communication. As consumer awareness around sustainability continues to grow, conventional electronics integration in product packaging faces criticism due to concerns about electronic waste and its environmental impact. Commercialization of printed and hybrid electronics provided an alternative solution offering the potential to minimizing electronic waste. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Hybrid and printed electronics use various light technologies and easily integrate into different package forms and in-store marketing tools. Within this context, there is a huge demand for ultra-thin flexible labels with preferred OLED lighting technology. Brand managers, package designers and developers face the challenge of seamlessly integrating OLED illumination into the visual language of products, particularly for bottles’ flexible labels. Years of effective market adoption of our technology platform SaralLight© with LED, EL or OLED embedded illumination approaches, brought us to the point to evaluate today’s market readiness enough for taking a step back and embracing the broader industry view. This perspective led to the creation of a new set of Saral Inks©: SaralOLED Label Ink set. With this novel ink set and know-how transfer, we empower printing and packaging industry to produce self-powered flexible labels with embedded OLED in-house. Figure 1 Flexible self-powered OLED la bels: What you produce and how it looks with your graphics The appeal of OLED labels for in-store marketers and packaging innovators Designed to facilitate the creation of flexible OLED-embedded labels, SaralOLED Label Ink set aligns perfectly with market needs, forging a path towards efficient and interactive visual communication. It is known that Organic Light Emitting Diode (OLED) is super eco-friendly. And, recent technological advancements made it possible to produce OLED pixels in a very thin and lightweight structure on plastic substrates that make them ideal for flexible labels illumination. This sets OLED apart from the more common LED illuminated hybrid electronics. LEDs offer cool colour variations, high efficiency and brightness but leave limited space for flexibility. LEDs are point light sources with relatively bulky structure. However, the production process of flexible OLEDs has remained complex. Some small-scale printing is being conducted at universities or research centres under certain circumstances, but mass production technology using regular printing machines is still not available. Market-ready flexible OLEDs are currently produced using highly sophisticated vacuum deposit technology that makes them relatively expensive to produce and use. Having said that, a distinct pattern of increasing market demand for OLED embedded illuminated labels for in-store marketing is evidently traceable. We're presenting SaralOLED Label Ink set to assist packaging developers and printing firms in addressing this growing market demand. Simplifying the tech: A closer look Figure 2 is a graphical representation of the OLED embedded structure. This simplified overview is meant to break down the printed ink layers in a concise yet insightful manner. Figure 2 SaralOLED Label Ink set: ink components and printing structure The development of this novel ink set was only possible through a handful of key technology enablers: 1. Autonomous energy-producing functionality by SaralBattery Inks: With a focus on production scalability, design flexibility, and technological affordability, we've developed SaralBattery Inks for easy customization and screen-printing of batteries on lightweight recyclable substrates as an integrated part of the electronic circuit. Unlike market-available ready-to-use printed batteries on plastic, these inks work on biodegradable materials like paper too, enabling the creation of sustainable batteries. SaralBattery Inks set consists of seven inks that can be printed in series connection to increase voltage allowing customized solutions. Notably, the ink set features a specially designed layer between the anode and cathode, eliminating the need for a separate paper-placement process. This printed layer acts as an electronic insulator while being ionically conductive. Contribution of SaralBattery Inks as a part of SaralOLED Label Ink set means that there will be absolutely no need for the attachment of external batteries to the label. Instead, the power source will be printed as an integrated part of the production process. The produced label will keep self-powered functionality for several years. 2. Compact and stable structure using printable Saral Adhesive Inks: In SaralOLED Label Ink set, we have included three different adhesive inks with distinctive functionalities: Saral HotMeltGlue 800: Its main heat-activatedfunction is to laminate the cathode and anode sides of the printed battery. The key advantage of this ink is that it works when heated above 100°C. As the glue is not active in room temperature, after printing and drying, the printed sheets can be stacked on top of each other. This adhesive ink is solvent based, thermally dried and similar to all other components of SaralOLED Label Ink set, simply screen printable. Saral SilverGlue Alpha 600: This ink is specifically developed to easily attach SMD components and in this case, the OLED pixel to the label. Saral SilverGlue Alpha 600 is a two components silver based conducting glue that requires low temperature curing (110°C), suitable for paper, plastic and glass. Saral Silver Glue Beta 700: It is a specially designed anisotropic silver-based glue to electrically interconnect two substrates. This functional adhesive ink is heat activated and suitable for both paper and plastic. 3. Swift and reliable production facilitated by an all-in-one ink set: At Saralon, our mission is to simplify printed electronics through InkTech. Given that, we always consider the challenges and obstacles that printers may encounter during the production process and commercialization of technology. SaralOLED Label Ink Set is designed to ensure easy and successful production practice of self-powered OLED embedded labels on thin and flexible substrates insomuch as: It is a complete set of functional inks that work in the most harmonious and efficient way. Therefore, printers do not need investing extra time and cost to find compatible inks for various circuit parts. We’ve made it easy by providing this all-in-one set of inks. It is InkTech in the sense that Saral Inks always come with design files, printing guide and professional technical support. There exists a starter kit that includes all necessary inks in the minimum possible quantity and technical details for the printers, convertors and innovative electronics developers to have their own experiments and trials before ultimate decision making. About Saralon Saralon GmbH is an industry leader in the development of functional inks for printed electronics (Saral Inks) and provider of ready-to-use printed electronic applications based on Saral Inks. Keeping the need of printing companies in mind, Saralon GmbH has simplified the complete production process of Printed Electronics, which is called InkTech. InkTech is a combination of inks and production technologies for Printed Electronics. Apart from selling inks, Saralon provides complete production know-hows for ready-to-use applications. In order to create an application based on Printed Electronics, the integration of graphics printed objects with electronics must be done in a cost-effective way. Saralon GmbH, with its long expertise in the field of integration techniques, provides full support to printing companies to develop ready-to-use applications. If there's anything you'd like to discuss or if you require additional insights, please reach out to us: Saralon GmbH Lothringer Strasse 11 – Hall L 09120 Chemnitz, Germany inks@saralon.com +49 371 503 499 10 Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D.

Martin Hedges NeoTech AMT GmbH This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given. SAVE THE DATE

Speaker: Franz Vollman Company: Heraeus Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver. The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance. The maskless selective and precise deposition of the silver ink onto specific areas of the components avoids excess material and minimizes waste. No wet chemical processes are required, making this process environmentally friendly. With a factor 10 lower power consumption compared to sputtering, it has a much better CO2 balance, too. SAVE THE DATE