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Plug&Use portfolio of printed-flexible sensors Author: Aakash Grewal Tel. +49 7264 702-49-128, E-Mail a.grewal@binder-connector.de Printed electronics for sensors is proven to be a solution for the challenges faced by conventional sensor industry. The ability to integrate the sensor and even fabricate it over any type of geometry makes it unique. In this quest, binder provides individual and customized solutions for flexible and printed Force Sensing Resistors for applications ranging from Automotive to Medical sector. The sensors are ready-to-connect and can be offered as completed device. Binder ITZ, the innovation and technology center located in Bad Rappenau, serves as the hub for new technologies and products developed by Franz Binder GmbH & Co. Elektrische Bauelemente KG (Neckarsulm). Drawing upon our expertise in chemistry, electronics, physics, and process development, we specialize in applying printable electronic components directly onto 3D surfaces with utmost precision, achieving a seamless fusion of functionality and design. Our strength lies in delivering customer-specific solutions for diverse geometries and substrates. As pioneers in key printed electronics technologies such as printed sensors, Electroluminescence, heating elements, and fine conductive lines, we possess the unique ability to make any form of surface geometry conductive. Moreover, the rising demand for printed force sensors, specifically Force Sensing Resistors (FSR), underscores their versatility in applications ranging from robotic fingertips to sensitive touch buttons in car infotainment system. FSRs, characterized by a polymer thick film (PTF) design, exhibit a decrease in resistance as the applied force on the active surface increases. Optimized for touch control of electronic devices, FSRs possess properties akin to load cells and strain gauges, making them sought-after components in various industries. The know-how of Force Sensing Resistors (FSRs) FSR is a type of sensor that changes its resistance when a force is applied. With the increase in applied force, the resistance of the sensor decreases hence allowing the detection of physical pressure, squeezing, and weight. Talking in the context of Printed Electronics, it means, a conductive polymer that exhibits variation in electrical conductivity when force is applied, for example, a printed Carbon/Graphite layer pressed against Interdigitated Silver electrode layer. The resistance change in the FSR can be measured using appropriate circuitry, such as a voltage divider or a Wheatstone bridge configuration. By monitoring the resistance, the magnitude of the applied force can be determined. By leveraging their unique principle, FSR sensors enable precise and responsive interaction with electronic systems, enhancing user experience in a variety of contexts. Although not being extremely precise, for most touch-sensitive applications FSRs are good cost vs. benefit deal. Flexible Sensor Realisation The challenge of printing an FSR sensor, which is also reproducible, is realised at our facility using Screen printing technology. Due to the very homogeneous deposition of conductive pastes with screen-printing, it is chosen to depose very finely spaced interdigitated silver electrodes on PET substrate. The other side of the sensor contains the active material Carbon paste, which is also printed on PET substrate. In between a plastic spacer is used. The idea behind this thicknesseswas to print low-cost material to obtain as good functioning as possible. Spacer material plays a crucial role in the functioning of sensor as it separates the two layers and depending on the thickness, the amount of force is determined. Different thickness of the tapes are tested. Another important task is to test the FSR sensor after fabrication as it is important to see in how much area we are applying force and what is the outcome. For that, specific masses of the same diameter as that of conductive film is taken and the resistance against the applied force is measured. The flexible substrate used for the FSR sensor provides much needed flexibility to integrate with any application and at any surface. The round shape can easily be customized as per application. Electronics of the Sensor The mechatronics of the sensor is also done in-house at Binder ITZ by a demonstratorhighly qualified team of Electronics Engineers. The demostrator is also presented in the image. The shunt-mode FSR proved to be an efficient solution in detecting force or pressure and convert these stimuli into user-specific data to read. At Binder ITZ, we are doing high-end research and provide solutions to our customers with much more eco-friendly and yet fully functional sensor with much lower production cost compared to conventional sensor fabrication methods. About binder binder, headquartered in Neckarsulm, Germany, is a family-owned company characterized by traditional values and one of the leading specialists for circular connectors. Since 1960, binder has been synonymous with the highest quality. The company works with more than 60 sales partners on six continents and employs around 2,000 people worldwide. The binder group includes the binder headquarters, 16 affiliated companies, two system service providers as well as an innovation and technology center. In addition to Germany, the binder sites are located in Austria, China, France, Hungary, the Netherlands, Singapore, Sweden, Switzerland, the UK, and the USA. 1. FSR sensor Arduino circuit schematic and relationship graph. Photo: binder 2. Layout of printed FSR sensor in ShuntMode Construction. Photo: binder 3. Printed Flexible FSR by binder ITZ. Photo: binder 4. Electronics & signal of Printed sensors by Binder ITZ (Functional Prototype) Fields of application Human Machine Interfaces Robotics and Automation Medical and Healthcare Automotive Industry Virtual Reality and Gaming Sports and Fitness Industrial and Manufacturing Internet of Things Wearable Technology Aerospace and Defense We are Speaking & Exhibiting at "Innovations Festival" event on 22 June 2023. Explore the program and register for free now Features Ready-to-connect and, if required, pre-assembled Customizable as per demand and application Integrated with a complete circuit to assist other applications Self-sustaining and communicating printed circuit Company address: Franz Binder GmbH & Co. Elektrische Bauelemente KG Roetelstrasse 27 D-74172 Neckarsulm/Germany Tel. +49 (0) 7132 325-0 Fax +49 (0) 7132 325-150 info@binder-connector.de www.binder-connector.de

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding. 3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage. In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time. SAVE THE DATE

Rechargeable anode-less solid-state lithium microbattery technology has numerous advantages over conventional alternatives. These include higher volumetric energy density (VED), significantly faster charging with a simpler charging infrastructure and the ability to deliver higher discharge pulses than Li-ion alternatives. These flexible form factor, multi-layer stacked batteries built on stainless steel are key to enabling space constrained wearables, hearables and IoT applications. Addressing the difficult challenges of manufacturing scale-up on the path to commercialization requires addressing a number of challenges ranging from materials supply chain and roll-to-roll battery fabrication management to high-speed test and novel ultrathin packaging. Some examples of these coupled with battery performance will be presented. SAVE THE DATE

Harsha Kolli Company: Printed Energy Printed Energy, early-stage US based hard science company with deep expertise in electro chemistry, printed electronics, and manufacturing automation. The current focus is on flexible, printed, and thin batteries integrated into fully built-up circuits for a complete device such as active RFID. These batteries are non-toxic, environmentally friendly and can be manufactured in any shape and size based on customer requirements. Some of the applications include, smart tags and labels, wearables, medical supplies, tags for timed sporting events, and many other internet of things (IoT) uses. Even though Printed Energy is starting to enter the market, the team has been working on development of thin printed batteries for many years. The unique value that Printed Energy brings to its customer is the ability to manufacture fully integrated device that is cost competitive with coin-cell battery devices. Our proprietary manufacturing line allows us to enter the market and deliver high quality devices at a highly competitive price. Printed Energy’s initial product offering includes delivering disposable Active RFID tag solutions to an existing market with roadmap that includes Semi-Passive tags, temperature loggers and wearable cosmetic/medical patches. SAVE THE DATE

TechBlick, the leading platform for emerging technologies, has reported high demand for attendee places at the second version of its in-person event which takes place on 17 & 18 October at The Estrel, in Berlin - https://www.techblick.com/electronicsreshaped The Future of Electronics RESHAPED conference and exhibition is the most important upcoming industry event in additive, sustainable, flexible, hybrid, wearable, structural and 3D electronics. As well as a world-class agenda and exhibition the event will also feature expert-led masterclasses and company tours to some of the innovative organisations in the Berlin area. The exhibition booths sold out in early June and the exhibition floor has grown by 50% compared to the 2022 event. Over 78 exhibitors from around the world, representing the entire value chain and innovation spectrum, will be in Berlin. See a full list of exhibitors here Khasha Ghaffarzadeh, CEO of TechBlick reported "We were surprised at the high demand for exhibition booths and fortunately we were able to secure some additional exhibiting space. We have seen the same high demand for attendee places with companies excited by the quality of the speaker programme, and exhibitors. This event will be where the world’s printed electronics industry connects and does business and is an important event in the emerging technologies calendar" The world-class agenda represents all the key research institutes and companies from around the world and covers all the key innovations and application frontiers. It features speakers such as Meta, Volvo, Signify, InkSpace Imaging, Beko, Airbus , Wiliot, GE Healthcare, Epicore Biosystems, Toppan, Heraeus, Mycronic, Cicor, and many more. See the full speaker list here. Events are also about learning and experiences, which is why TechBlick has designed a fantastic day of expert-led masterclasses and tours on Monday 16 October (the day before the conference & exhibition). For further information click here. Attendee places are limited and demand is high so be sure to book your place soon. The summer attendee early bird expires on 13 September https://www.techblick.com/electronicsreshaped

Voltera Jesus Zozaya For years, researchers and product developers have searched for tools that will help get ideas out of their heads and into their hands. About a decade ago, we began to see the emergence of materials that showed promise for bringing these ideas to life. The term “flexible hybrid electronics” (or FHE) gave a name to what was trying to be accomplished. This growing field crosses a number of verticals and is utilized across seemingly endless applications, but there are still challenges that remain, including an incohesive value chain. At Voltera, we believe that collaboration is the answer. Since launching NOVA, our modular dispensing platform last year, we have been working with researchers, companies, and government agencies to collaborate and build a cohesive value chain. We believe that collaboration not only solves problems, but is also a catalyst for innovation. Behind every new idea is a team of people working to overcome obstacles. They are the academics researching new applications, scientists developing new materials, and hardware companies, like Voltera, who are developing the printing technology required to put your ideas into your hands.Voltera Jesus Zozaya SAVE THE DATE

SIJTechnology, Inc. | info@sijtechnology.com Key Features Super fine patterning Droplet volume：0.1fl(femtoliter)～10pl(picoliter) Wide range of viscosity Viscosity range：0.5～10,000 mPa·s (non-heated) Large variety of usable fluids Conductive ink, Insulating ink, Resist ink, UV ink, Solvent ink, Protein materials, etc. Technical summary Super Inkjet technology allows the ejection of super-fine droplets much smaller than the droplets ejected by a conventional inkjet printer - 1/10 smaller in size and 1/1000 smaller in volume, that enable to print in extremely high definition patterning even in a sub micro meter resolution with many type of functional materials as ink. Super Inkjet system for R&D is compact enough, so it can be placed on a desktop. The printer allows single micron scale patterns comparable to the photolithographic methods to be drawn directly under normal temperature and normal atmospheric pressure. Inks Thanks to the wide range of viscosity. Super Inkjet technology can print a wide variety of inks. For example: Conductive ink: Silver, Gold, Cupper nano inks. Polymers: Insulating ink, Resist ink, PEDOT/PSS, Adhesive glue. Functional materials: Organic semiconductor, CNT, catalyst, Q-dots Biomaterial: Protein, Cell-containing solution, DNA solution Example of applications In Tandem Contact-Transfer Printing for High-Performance Transient Electronics (Advanced Electronic Materials DOI: 10.1002/aelm.202200170) Super inkjet is used fabricated flexible Photodetectors on PI substrate and printed contact electrodes over the aligned ZnO Nano Wires were made using the Au ink. Inkjet-Printed Nanocavities on a Photonic Crystal Template (Advanced Materials DOI: 10.1002/adma.201704425) The authors have demonstrated femtoliter inkjet printing on a 2D PhC template, and the creation of reproducible and structurally tunable high-Q-nanophotonic cavities by drawing lines, dots and crossed strips. A particular attractive feature of this bottom-up fabrication approach is the ability to fine-tune to the sub-10 nm level the thickness of the material deposited on the PhC by controlling the number of printer passes. The coupling strength of PhC photonic molecules was also shown to be controlled simply by changing the separation of the printed strip cavities with submicron resolution. TechBlick Berlin on 17-18th October 2023 We will be exhibiting at the most important upcoming event for our industry - The Future of Electronics RESHAPED conference and exhibition on 17-18th OCT 2023. Please visit our booth or contact the SIJ team (info@sijtechnology.com) to learn more about the latest Super InkJet technology!

Speaker: Philippe Berrouard Company: Brilliant Matters With ever increasing energy needs, rising environmental regulations and a clear paradigm shift in the energy sector towards energy production from renewable sources, there is an immediate need for cost-effective and rapidly deployable renewables. Organic photovoltaics (OPVs) are a 3rd generation solar cell technology which can be mass produced using R2R printing methods and are made from earth abundant organic materials capable of efficiently harvesting light energy both in indoor and outdoor environments. Due to their incredible versatility, they can be made lightweight, flexible and partially transparent, which enables their use in many applications including agrivoltaics (greenhouses), IoT or building-integrated applications. This presentation will discuss some of the latest materials innovations from Brilliant Matters which enable the advancement of OPV technologies. SAVE THE DATE

In order to realize highly bendable oxide TFT, we have developed a novel organic / inorganic dielectric layer. Our IGZO TFT with organic/inorganic hybrid dielectric layer can withstand one million bending tests at a bending radius of 1mm without employing the neutral plane concept. Applications for wearable motion sensors are also demonstrated. SAVE THE DATE

This talk provides an analysis of the current electronic textile landscape, the USP of using these materials and where they can be valuable in industry. Attendees should walk away from this talk with a clear picture of the current technologies leading this field and when to choose an electronic textile over more standard electronic solutions like Flex PCBS. SAVE THE DATE

Thomas Kolbusch | Coatema SAVE THE DATE