Digital additive manufacturing of electronics is a key technology development frontier, shaping the future of electronics, making electronics production additive, on-demand, customized, sustainable, and 3D. All the key innovations in this field from around the world will be showcased at the TechBlick’s Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023. This event brings together the entire industry in one place, offering 68 live talks, 12 expert-led masterclasses, 4 tours, 78 tabletop exhibitors, and over 600 attendees. In this article, we highlight some of the key innovations which will be discussed as part of the programme in Berlin. Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D. Apply the following coupon: Save100Euros Learning from the masters The programme starts on 17 OCT 2023 with masterclass and tours. Here you will have the opportunity to learn about 3D Printed Electronics: This class will be led by Martin Hedges, Founder of Neotech AMT GmbH, one of the leading firms in building 3D printed electronics machines with deep expertise. Martin will teach us about all the key deposition processes and system-level approaches enabling different types of 3D Printed Electronics. Electrohydrodynamic Printing (EHD): This class will offer an introduction to EHD printing, an emerging additive electronics technology overcoming fundamental barriers of conventional inkjet printing. This class will be offered by Patrick Galliker, CEO of Scrona, a leading company pioneering this technology in Zurich,Switzerland. For those who are interested, we will then take you on a tour of the facilities at Quantica3D, a company developing a technique for multi-material jetting of high-viscosity materials. Start-up Innovation and Applied Research As part of the programme you will hear from a number of exciting start-ups, developing truly novel technologies. Here is a short and non-exhaustive summary: Dry [Ink-Less] Multi Material Printing Technology: Dr Mahjouri-Samani, Founder of NanoPrintek, will explain about its dry multi-material printing technology, enabling ink-less additive digital deposition of pure nanoparticles, which are generated in-situ and on-demand with bulk-like properties, followed by real-time laser-sintering to multi-layer structure without any further post processing. Electrochemical Printing of Multi-Material Electronics: Dr.Viktorova, CEO and Founder of, Syenta, will join us from Australia to explain about Syenta’s patented fabrication method for multi-material 3D printing using electrochemistry. This method combines electrochemical with three-dimensional control of electrode positions to culminate in a new process for 2D patterning and 3D printing of metals, semiconducting materials as well as polymers into complex shapes with ultra small feature sizes. This method does not rely on nanoparticles and therefore does not need post-treatment and allows for nearly bulk material properties. Dry Digital Plasma Deposition without Curing: Dr. Prasad from Space Foundry will present the technology they developed at NASA. Here, the aerosol goes into a print head - where a plasma is generated. The aerosolized ink will interact with the plasma, tailoring in-situ the properties of the aerosolized ink. Here, ink properties are changed not by wet processes, but in the dry plasma process, eliminating both pre-processing of ink properties and post-processing the printed pattern. Continuous Laser-Assisted Deposition of Standard Materials: This is a multi-material production process that relies upon the LIFT (laser induced forward transfer) technology, enabling digital, precise, high-resolution, and high-volume deposition of most industrial materials including high viscosity ones like standard solder pastes. In this talk, Mr. Javice from ioTech Group will explain the advances in this technology, showcasing how different materials with high-resolutions can be printed for applications ranging from semiconductor packaging to flexible electronics. Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets: Dr. Cormier from Rochester Institute of Technology is one of the best-known figures in printed electronics and additive manufacturing. He will explore the use of on-demand liquid metal droplet jetting to fabricate printed circuit patterns, showing how one can achieve solid metal traces whose conductivities match that of the bulk metal on temperature sensitive flexible polymer substrates and/or 3D structures. Importantly, the process uses inexpensive wire, rather than nanoparticle ink, as the feedstock material. Pre and post-processing steps normally used with nanoparticle ink processes, such as substrate cleaning and ink drying + curing, are eliminated. Manufacturing A Tool for Every Additive Electronics Project: One of the challenges for flexible hybrid electronics is that it is not easy to prototype and later manufacture ideas. This has slowed down, and continues to slow down, the industry as whole, throttling idea-to-product conversion. Jesus Zozaya, CEO of Voltera, will explain how they are addressing these pain points. Their modular dispensing platform enables users - be they academics and researchers or engineers in large companies - to rapidly and digitally prototype designs and ideas on various substrates with materials and properties that can be easily transferred into high-volume screen printing. This breaks down one of the long-standing barriers in the idea-to-manufacturing transition in this field. In parallel, Voltera is building a collaborative ecosystem that further lowers barriers to the realization of ideas based on flexible hybrid electronics. Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production: Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In this presentation, George Boedler, CEO of Inkatronic, will draw up his 25+ years of experience in inkjet technology to give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully. This talk is recommended for those who wish to achieve mass production of electronics with inkjet. Advancing the State-of-the-Art 3D Printed Electronics with SMT integration: In recent years, 3D printer technology that can manufacture bare PCBs using digital printing technology for both conductors and insulators has been developed. However, it is essential to optimize the SMT process in accordance with the transformation of the bare PCBs manufacturing process for the practical application of this technology. In this talk, Tominaga-san from Fuji will introduce a novel machine that combines the additive manufacturing process of bare PCBs and low-temperature SMT technology. Next generation of resolution in additive technology: Inkjet has well known limits including resolution and viscosity. Here, Lukas from XTPL explains how their Ultra-Precise Deposition can deposit functional materials with a wide range of viscosities with micro-level precision on planar as well as non-planar surfaces. Furthermore, he will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Redefining Coatings in Electronic Packaging with Digital Selective Metallic Coating: This is an innovative technique to digital yet site-selectively deposit thin coatings of metal onto 2D and 2.D surfaces, replacing expensive vacuum PVC techniques which also require masking and wet etching. In this talk, Franz Vollman from Heraeus showcases how they have developed a turnkey ready-to-deploy industrial solution, consisting of particle-free inks with industrial wafer-based inkjet printers, covering any standard CAD design into customized thin metallization films in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver. Franz will also explain the key applications including EMI shielding of semiconductor packages for 5G applications. Applications of Ultraprecision Aerosol Deposition in 3D Printing and Packaging: Aerosol jet technology offers digital & ultraprecise deposition methods, over 2D and 3D surfaces, with excellent resolutions. David Keicher from IDS will give an overview about different ways to advanced the art and the application of aerosol deposition. 3D Printed Electronics is Powerful when combined with CHIPS: 3D Printed Electronics saves space and enables new designs in 2.D and 3D. In this talk, Kenneth Church, CEO of nScrypt, explains how one can deposit conductors and electronics and how one can place and integrate active components onto surfaces. Furthermore, he will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time, making this technique ready for mass production. Cicor Group: Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way. Karl-Heinz Fritz will give an overview about different ways to make best use of the capability. In addition, there will be a vibrant exhibition showcasing the entire depth and breadth of additive and printed electronics including all advances in digital and 3D additive electronics. For example, you can visit Quantica3D, Notion Systems, Hummink, Suss Microtech, DoMicro, and many more onsite. Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D. Apply the following coupon: Save100Euros

Arnold Kell, National Research Centre of Canada SAVE THE DATE

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Human Machine Interfaces (HMI) of electronic devices are currently undergoing significant changes. Followed by the trend of using smart phones for „everything“, nearly all electronic devices show significant changes in the user interface. In industries such as automotive, white goods or consumer electronics, the displays become touchscreens, the mechanical buttons become capacitive touch buttons and even gesture control is reality. This trend also includes significant change in the surfaces, as they are becoming seamless, large and more and more 3D shaped. Printed Silver and PEDOT based transparent conductive films enable this trend as they are flexible, with high conductivity and high optical performance. They can be integrated together with decoration to glass and plastic surfaces in flat, curved or 3D shapes. Besides the trends and the technology, also showcases of different industries such as automotive and white goods are presented, as well as the ideas how they will further develop along the roadmap. SAVE THE DATE

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Speaker: Sima Hannani Company: Electronink SAVE THE DATE

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Airbus Dennis Hahn Presentation of an animated movie of our end-to-end vision on how we imagine the printed electronics technology may impact the aviation industry. Introducing our current status of technology testing (hopefully with some breathtaking photos) and open topics such as customization software, max automation and end of life processes. Q&A. SAVE THE DATE

Karl Guttag, President, KGOnTech The presentation will give a quick overview the common optical designs and display devices used in AR systems today including their advantages and disadvantages. The presentation will include a discussion of which optical designs and display devices work well together. The optics designs include large combiner (bug-eye), birdbath, freeform, diffractive waveguide, reflective waveguide, and holographic mirror. The display devices include LCOS, DLP, LCD, Micro-OLED, and MicroLED.

Tomas Sluka, CEO & Co-Founder, Creal For Augmented Reality to spread and reach common usage levels, the visual experience needs to be entirely healthy and natural for the user. This is why CREAL has developed a unique AR display that combines light field imagery with ordinary highly transparent ophthalmic lenses, providing a true-to-life depth perception for the human eye and a customizable prescription with the classical aesthetic look of the lenses. While almost all AR glasses providers today are lumbered with trade-offs between focal depth, image resolution, and lens aesthetic, CREAL’s newest display finally enables an AR visual experience that “has it all”. This talk with introduce how.

Steliyan Vasilev ​ Embroidery is a textile manufacturing technique that has its roots in historic hand-stitched garment design. However, with the invention of computers, this textile manufacturing technique has seen a resurgence due to its high levels of material optimization. Embroidery allows the textile engineer to place single fibers, yarns, fiber bundles, or even wires with high precision in a variable, predesigned geometry. Because of this high precision, embroidery is highly applicable for integrating functionality into textiles through textile sensors, actuators, or electrodes. Three types of embroidery technologies are commonly used and defined in the literature. These include chain and moss stitch embroidery, standard embroidery as well as tailored fiber, wire, or tube placement. Each of these methods can be utilized in varying ways for the mass production of smart textiles. The embroidery technology offers enormous possibilities for the automatic integration of conductive fibers and electronic components into textiles to create e-textiles. E-textiles are in development for decades but only a few products could make it to the market. The main reason for this lack of products on the market is the high production costs. Manual production steps increase the production costs and lead to high product costs. Furthermore, reproducibility cannot be guaranteed or manually created products. The high level of automation of the embroidery process finally allows the mass production of e-textiles

Aart-Jan Hoeven | International Project / Technology Manager The technology for integrating dies is an important enabler for the realization of advanced applications. This includes applications with power modules. Critical steps for the integration of such modules are in the micro assembly, for example in the wire bonding and the die attach. This presentation will highlight results from work on these steps in a project for prototyping power modules for electric vehicles (EVs). Important for applications such as EVs and renewable energy supplies is the availability of reliable and efficient power modules. These are needed for converting from AC to DC, from DC to AC, for driving an electric motor and for various other purposes. SiC-based solutions are often preferred for high end applications, because they offer a higher efficiency, higher switching frequencies, reduced switching losses, higher operation temperatures and a better robustness as compared to traditional silicon components. A challenge in the integration of power modules is in the wirebonding. The problem is that wirebonding is a major source of failures because of thermal or mechanical stress, and therefore causes a reduced life time. Improved micro assembly processes can bring solutions for this problem.