Speaker: Alan Brown | Company: Nagase ChemteX | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Mark Duarte | Company: Eastprint | Date: 13-14 October 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Manabu Ito | Company: Toppan | Date: 9-10 March 2022 | Full Presentation Flexible thin film transistors (TFT) attract a lot of attention due to its applicability to foldable smartphones, IoT sensors, and photodetectors. For this application, organic TFT had been regarded as a most promising candidate thanks to its soft nature of the component materials. However, organic TFT suffers from its low mobility, poor stability and immature production process. In this talk, we would like to introduce our highly bendable IGZO TFT. Without employing the neutral plane concept, the TFT can withstand one million times bending tests at a curvature radius of 1 mm for the first time. After one million times bending tests, any noticeable deterioration in device characteristics are not observed. We see a big potential for the application for flexible sensor devices. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

after Continuous Glucose Monitoring (CGM) devices Speaker: Robert Batchelor | Company: Nutromics | Date: 13-14 October 2021 | Full Presentation There is a clinical need for continuous monitoring of vital molecular biomarkers and drug concentrations. However, with the exception of venous oxygen and glucose, these concentrations are currently determined via lab tests. Lab testing costs valuable time, which is relevant for transient biomarkers and critically sick patients. Additionally, lab testing is intermittent at best, and requires infrastructure, reagents, and skilled operators, which aren’t always available in remote locations. Electrochemical aptamer-based (EAB) sensors, invented and developed by Prof. Kevin Plaxco at the University of California, Santa Barbara, can be adapted for multiple molecular targets, are reagent-free, and work in-vivo, thus enabling on-body wearable devices. Nutromics is integrating the EAB technology into a wearable ‘lab on the skin’ to meet the pressing clinical need of monitoring molecular biomarkers and drugs. In this presentation I will discuss the EAB sensor technology, how it compares with continuous glucose monitors, the advantages and limitations of the technology, and finally, the potential of Continuous Molecular Monitoring (CMM) wearable devices using EAB sensors. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Vinicius Zanchin | Company: SUNEW | Date: 11-12 May 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Adam Scotch | Company: Brewer Science | Date: 11-12 May 2021 | Full Presentation Bio Dr. Adam M. Scotch is currently Director of R&D, Smart Devices and Printed Electronics at Brewer Science in Springfield, MO. Prior to joining Brewer Science, Adam was Director of Manufacturing at antenna tech start-up Wafer for 3.5 years, responsible for product development, engineering, scale to manufacturing, and general operations. Adam held various technical leadership roles over 13 years in R&D at lighting company OSRAM, and lead the company’s efforts in printed electronics. His expertise is in materials science, process development, LED devices, and packaging. Prior to OSRAM, he was a National Research Council Postdoctoral Fellow at the National Institute of Standards and Technology (NIST). He holds 20 U.S. Patents and 9 refereed journal publications. Adam has a B.S. and Ph.D. in Materials Science and Engineering from Lehigh University, Bethlehem, PA. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Annika Müller | Company: Arburg| Date: 10-11 March 2021 | Full Presentation Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry. To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way. In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell. In the end, the plastic part is made out of a printed and functionalized foil – ready to use. Video https://www.youtube.com/watch?v=azzLwrlO4vU Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Bryan Germann | Company: Optomec | Date: 10-11 March 2021 | Full Presentation Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers. Bryan Germann Product Manager @ Optomec Bio Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Dávid Forgács | Company: Saule Technologies | Date: 10-11 March 2021 | Full Presentation Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: André Bausch | Company: Dr. Jean Bausch GmbH | Date: 10-11 March 2021 | Full Presentation Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG. The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions. Bio Mr. André Bausch was born 1969 in Cologne Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG Since 2007 Director of Bausch Articulating Papers Japan K. K. André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 . Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: James Lee | Company: Jones Healthcare Group | Date: 10-11 March 2021 | Full Presentation This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Nello Li Pira | Company: FIAT Research Centre | Date: 10-11 March 2021 | Full Presentation This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability. The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics. Nello Li Pira Head of Materials Labs @ FIAT Research Centre Bio Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda