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DuraTech Industries Licenses TactoTek® Technology to Sell, Design and Produce Injection Molded Structural Electronics (IMSE®), Creates North America Supply Chain for IMSE Solutions OULU, FINLAND/LACROSSE, WISCONSIN, USA (XX April 2022) – TactoTek® (www.tactotek.com), the Finland-based company that develops Injection Molded Structural Electronics (IMSE®) technology, and DuraTech Industries (“DuraTech”, www.DuraTech.com) announced that DuraTech has licensed TactoTek IMSE technology. DuraTech is a TactoTek Design and Innovate licensee with rights to sell, design, and produce parts that use TactoTek’s intellectual property which includes 44 patent families with over 130 granted patents, as well as extensive trade secrets and know-how for designing and producing IMSE parts. DuraTech will create and deliver IMSE solutions for its customers in North America and around the world from production facilities in the USA. DuraTech has a long history as a high-quality manufacturer of in-mold printed electronics (IME). Their IME solutions have resonated with a range of markets including home appliances, medical, industrial, automotive and consumer electronics. TactoTek IMSE technology is an advanced form of IME that incorporates electronic components such as LEDs for illumination, and system-in-package (SiP) electronics for intelligence, within 3D injection molded structures, expanding the capabilities and use cases for smart surfaces. According to Peter Johnson, President of DuraTech, “Our customers have been asking for more electronic functionality in IME parts and for that we need to work with TactoTek. TactoTek is the clear leader in advancing the technology domain by integrating electronic components within smart surfaces. For DuraTech, becoming a TactoTek licensee expands our offerings for existing customers and opens new opportunities to do what we do best: reliably mass produce high quality parts.” TactoTek’s Design and Innovate licensing includes rights to commercially use TactoTek intellectual property, training materials for designing and manufacturing IMSE parts, detailed design and production information for TactoTek reference designs, information on materials, components, and material stacks verified to automotive and aviation industry standards for producing IMSE parts, and engineering support services. “DuraTech is a great match for TactoTek licensing—we focus on advancing and industrializing IMSE technology, and they focus on producing parts for their customers”, stated Jussi Harvela, TactoTek CEO. “By making IMSE solutions more accessible in markets beyond automotive, and with production in North America, our relationship opens new business opportunities for DuraTech and further confirms TactoTek’s go-to-market licensing model for IMSE technology”. About TactoTek TactoTek is the leading provider of Injection Molded Structural Electronics (IMSE®) solutions that integrate printed circuitry and electronic components into 3D injection molded smart surfaces. Leading IMSE use cases include human-machine interfaces (HMI), connectivity and electronic styling features for automotive, smart home, appliances and other markets. IMSE technology is a greener solution: it uses 50-70% less plastics and generates up to 60% less greenhouse gas equivalents than conventional electronic equivalents. TactoTek develops and industrializes IMSE technology, creates mass production ready IMSE prototypes, and licenses IMSE technology for 3rd party IMSE part design and global mass production. TactoTek is funded by international leaders in finance and industry committed to advancing technology solutions that benefit consumers and the environment. TactoTek investors include Conor Venture Partners, 3M Ventures, Repsol Energy Ventures, Faurecia Ventures, Voima Ventures, Tesi, Nidoco AB and Cornes Technologies Limited. For more information, please visit www.tactotek.com. About DuraTech Industries DuraTech Industries is a custom graphics manufacturer specializing in In-Mold Electronics and printed electronics. DuraTech also offers screen, digital or flexo printed products including In-Mold Decorating labels, overlays and pressure sensitive products, and membrane switches. Services include supplier-managed inventory and bin stocking. The USA manufacturing facility is ISO 9001:2015 certified. The China facility is ISO 9001:2008 certified. DuraTech has been serving Fortune 500 companies in the medical, appliance, electronic, OME, automotive and aerospace markets for over 44 years. www.duratech.com Media Contacts TactoTek Pasi Järvenpää, VP of Marketing, pasi.jarvenpaa@tactotek.com Media kit: https://www.tactotek.com/media/press-kit/ DuraTech Margo Merola, margo.merola@duratech.com

Speaker: Carolyn Ellinger | Company: Eastman Kodak Company| Date: 10-11 March 2021 | Full Presentation Print technologies are being used today in the manufacture of consumer products, including flexible electronics and optics. There are multiple available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). Resolution and speed are only part of the story, one also needs to understand the latitude for useable inks and the volume of those inks that can be deposited at speed in a single-pass process with good pattern fidelity. EKTAFLEX functional printing solutions enable flexographic processes to achieve sub-10-micron on-substrate features. This talk will focus on the advantages of high-resolution flexography, and how these small features sizes can be used to create advantaged products. Included will be a review of both the innate capabilities of flexography and application specific benefits over other print technologies, such as drop-on-demand inkjet. Examples of both additive and subtractive processing via high resolution flexography will be discussed. Real case studies will be presented, including Kodak’s own additive, roll-to-roll (R2R) manufacturing process for copper micro-wire patterns on flexible substrates used for transparent RF devices, such as antennas and EMI shields. In addition, success cases from partners’ use of Kodak’s EKTAFLEX plates for functional printing will also be shared – illustrating not just the benefit of the technology but Kodak’s dedication to enabling partners to achieve their product and performance milestones. Carolyn Ellinger General Manager Printed Electronics & V.P. Kodak PE Tech, LLC @ Eastman Kodak Company Bio Carolyn Ellinger is General Manager, Printed Electronics at Eastman Kodak Company and V.P. Kodak PE Tech, LLC, a subsidiary of Eastman Kodak Company. She received a B.S. degree in chemical engineering from the State University of NY at Buffalo, and an M.S. degree in chemical engineering from the University of Rochester. In her 25+ years at Kodak, she has held technical positions in film systems, flexible displays, nanotechnology and semiconductor devices, MEMS-based devices, spatial ALD, and printed electronics. Her research has resulted in peer-reviewed journal articles, multiple contributed and invited presentations, over 70 Granted US Patents, and numerous improvements to Kodak products. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Gleb Yushin | Company: Sila Nanotechnology | Date: 9-10 Feb 2022 | Full Presentation Advancements in the capabilities of lithium-ion batteries have slowed down in the last decade. As conventional electrode materials approach their theoretical limits, substantial gains in battery energy density only come as a trade-off in safety or performance. This talk will introduce an innovative drop-in-replacement nanocomposite, silicon-based anode powder that offers over five times higher gravimetric capacity than graphite and enables up to 20% more energy density today over state-of-the-art lithium-ion, enabling radical product innovation, without performance compromise. This material is shipping today. With Sila’s industrialized and scaled scientific innovation, wearables, portable electronics, and electric vehicle manufacturers can create breakthrough products today that will benefit our environmental impact tomorrow. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

New effective but proven technology for Graphene and Graphene Oxide! The Taylor Reactor, utilizing the transit flow area between Laminar and Turbulence called ‘Taylor Flow’ can overcome the current challenges during the development and mass production. The presentation will show the advantages with the various publications 1) Reaction time reduction while getting high yield 2) High quality 3) Tailored size and 4) Easy scale up.

Speaker: Patrick Malenfant | Company: National Research Council Canada (NRCC) | Date: 10-11 March 2021 | Full Presentation This presentation covers our progress in high purity semiconducting single-walled carbon nanotube (sc-SWCNT) enrichment and transistor fabrication via solution based processes. I will highlight our recent progress in understanding sc-SWCNT enrichment using conjugated polymers (isolation of high purity sc-SWCNT), with special consideration given to the effects of solvent parameters and doping on the yield/purity of the final product. Fully printed transistors combining R2R gravure and inkjet-printing will be described as well as our recent progress in realizing “limitless” R2R gravure printed TFT backplanes capable of driving an e-paper display. Patrick R. L. Malenfant*(1), Jianfu Ding(1), Jianying Ouyang(1), Zhao Li(1), Chang Guo(1), Jacques Lefebvre(1), Paul Finnie(1), Francois Lapointe(1), Gyoujin Cho(2) (1)National Research Council Canada, 1200 Montreal Road, Ottawa, ON, K1A 0R6, Canada. (2)Dept. of Biophysics, Sungkyunkwan University (SKKU), South Korea Patrick Malenfant Director of Research Development @ National Research Council Canada (NRCC) Bio Dr. Patrick Malenfant studied chemistry at the University of Ottawa (BSc 1995), Cornell University (MSc 1997), and the University of California - Berkeley (PhD 2000). He has 10 years of industrial R&D experience including a one year postdoc at IBM's TJ Watson Research Center and 9 years at the GE Global Research Center where he developed nanomaterials for Aerospace, Healthcare, and Organic Electronics applications. He joined the National Research Council of Canada in 2010 as a Senior Research Officer. He is currently the Director of R&D in the Security and Disruptive Technologies Research Center overseeing activities in Quantum Science, Printed Electronics and Structural Materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Benjamin Park | Company: Enevate Corporation | Date: 9-10 Feb 2022 | Full Presentation Why bother with fast charge for EV batteries? Charge rate goes beyond driver convenience - it addresses core EV adoption issues such as addressing the fact that only 20% of cars have access to overnight charging, fast charging helps improve existing infrastructure utilization, and it supports drivers becoming more comfortable with less expensive vehicles that have shorter range lowering the price for those vehicles. Enevate is a battery technology company supplying breakthrough Extreme Fast Charge Technology with its pure silicon-dominant cells that are solving these crucial EV adoption issues. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

MIT engineers have developed a paper-thin loudspeaker that can turn any surface into an active audio source. This thin-film loudspeaker produces sound with minimal distortion while using a fraction of the energy required by a traditional loudspeaker. The hand-sized loudspeaker the team demonstrated, which weighs about as much as a dime, can generate high-quality sound no matter what surface the film is bonded to. To achieve these properties, the researchers pioneered a deceptively simple fabrication technique, which requires only three basic steps and can be scaled up to produce ultrathin loudspeakers large enough to cover the inside of an automobile or to wallpaper a room. Used this way, the thin-film loudspeaker could provide active noise cancellation in clamorous environments, such as an airplane cockpit, by generating the sound of the same amplitude but opposite phase; the two sounds cancel each other out. The flexible device could also be used for immersive entertainment, perhaps by providing three-dimensional audio in a theater or theme park ride. And because it is lightweight and requires such a small amount of power to operate, the device is well-suited for applications on smart devices where battery life is limited. “It feels remarkable to take what looks like a slender sheet of paper, attach two clips to it, plug it into the headphone port of your computer, and start hearing sounds emanating from it. It can be used anywhere. One just needs a smidgeon of electrical power to run it,” says Vladimir Bulović, the Fariborz Maseeh Chair in Emerging Technology, leader of the Organic and Nanostructured Electronics Laboratory (ONE Lab), director of MIT.nano, and senior author of the paper. Bulović wrote the paper with lead author Jinchi Han, a ONE Lab postdoc, and co-senior author Jeffrey Lang, the Vitesse Professor of Electrical Engineering. The research is published today in IEEE Transactions of Industrial Electronics. A new approach A typical loudspeaker found in headphones or an audio system uses electric current inputs that pass through a coil of wire that generates a magnetic field, which moves a speaker membrane, that moves the air above it, that makes the sound we hear. By contrast, the new loudspeaker simplifies the speaker design by using a thin film of a shaped piezoelectric material that moves when voltage is applied over it, which moves the air above it and generates sound. Most thin-film loudspeakers are designed to be freestanding because the film must bend freely to produce sound. Mounting these loudspeakers onto a surface would impede the vibration and hamper their ability to generate sound. To overcome this problem, the MIT team rethought the design of a thin-film loudspeaker. Rather than having the entire material vibrate, their design relies on tiny domes on a thin layer of piezoelectric material which each vibrate individually. These domes, each only a few hair widths across, are surrounded by spacer layers on the top and bottom of the film that protect them from the mounting surface while still enabling them to vibrate freely. The same spacer layers protect the domes from abrasion and impact during day-to-day handling, enhancing the loudspeaker’s durability. To build the loudspeaker, the researchers used a laser to cut tiny holes into a thin sheet of PET, which is a type of lightweight plastic. They laminated the underside of that perforated PET layer with a very thin film (as thin as 8 microns) of piezoelectric material, called PVDF. Then they applied a vacuum above the bonded sheets and a heat source, at 80 degrees Celsius, underneath them. Because the PVDF layer is so thin, the pressure difference created by the vacuum and heat source caused it to bulge. The PVDF can’t force its way through the PET layer, so tiny domes protrude in areas where they aren’t blocked by PET. These protrusions self-align with the holes in the PET layer. The researchers then laminate the other side of the PVDF with another PET layer to act as a spacer between the domes and the bonding surface. “This is a very simple, straightforward process. It would allow us to produce these loudspeakers in a high-throughput fashion if we integrate it with a roll-to-roll process in the future. That means it could be fabricated in large amounts, like wallpaper to cover walls, cars, or aircraft interiors,” Han says. High quality, low power The domes are 15 microns in height, about one-sixth the thickness of a human hair, and they only move up and down about half a micron when they vibrate. Each dome is a single sound-generation unit, so it takes thousands of these tiny domes vibrating together to produce audible sound. An added benefit of the team’s simple fabrication process is its tunability — the researchers can change the size of the holes in the PET to control the size of the domes. Domes with a larger radius displace more air and produce more sound, but larger domes also have lower resonance frequency. The resonance frequency is the frequency at which the device operates most efficiently, and a lower resonance frequency leads to audio distortion. Once the researchers perfected the fabrication technique, they tested several different dome sizes and piezoelectric layer thicknesses to arrive at an optimal combination. They tested their thin-film loudspeaker by mounting it to a wall 30 centimeters from a microphone to measure the sound pressure level, recorded in decibels. When 25 volts of electricity were passed through the device at 1 kilohertz (a rate of 1,000 cycles per second), the speaker produced high-quality sound at conversational levels of 66 decibels. At 10 kilohertz, the sound pressure level increased to 86 decibels, about the same volume level as city traffic. The energy-efficient device only requires about 100 milliwatts of power per square meter of speaker area. By contrast, an average home speaker might consume more than 1 watt of power to generate similar sound pressure at a comparable distance. Because the tiny domes are vibrating, rather than the entire film, the loudspeaker has a high enough resonance frequency that it can be used effectively for ultrasound applications, like imaging, Han explains. Ultrasound imaging uses very high-frequency sound waves to produce images, and higher frequencies yield better image resolution. The device could also use ultrasound to detect where a human is standing in a room, just like bats do use echolocation, and then shape the sound waves to follow the person as they move, Bulović says. If the vibrating domes of the thin film are covered with a reflective surface, they could be used to create patterns of light for future display technologies. If immersed in a liquid, the vibrating membranes could provide a novel method of stirring chemicals, enabling chemical processing techniques that could use less energy than large batch processing methods. “We have the ability to precisely generate mechanical motion of air by activating a physical surface that is scalable. The options of how to use this technology are limitless,” Bulović says. “I think this is a very creative approach to making this class of ultra-thin speakers,” says Ioannis (John) Kymissis, Kenneth Brayer Professor of Electrical Engineering and Chair of the Department of Electrical Engineering at Columbia University, who was not involved with this research. “The strategy of doming the film stack using photolithographically patterned templates is quite unique and likely to lead to a range of new applications in speakers and microphones.” This work is funded, in part, by the research grant from the Ford Motor Company and a gift from Lendlease, Inc. For more information, visit: https://news.mit.edu/2022/low-power-thin-loudspeaker-0426

26 - 27 April 2022 | 14:00 - 21:20 CET | Virtual Event Platform Add Event to your Calendar Google Calendar | Microsoft Outlook Calendar | Office 365 Calendar | Yahoo Calendar TechBlick’s event on 26-27 April 2022 covers the full spectrum of Graphene, CNT, and 2D material-technical innovations, industrial progress, and application development. TechBlick brings together a handpicked world-class agenda consisting of end-users, manufacturers, promising start-ups, as well as renowned market analyst groups. Agenda Topics Covered: Graphene | Carbon Nanotubes (SWCNT, MWCNTs) | Boron Nitride | 2D Materials | Boron Nitride | Graphene-Silicon Anode | Battery Additives | Supercapacitors | Biosensors | Concrete and Cement Additives | Filtration Membranes | Composites and Plastic Additives | Fibers and Advanced Textiles | Gas Sensors | Memory Devices | Shielding | Conductive Fibers | Scale-Up | Quantum Electronics | Reflective Displays | Speaker Membranes and Transducers | Anti-Corrosion Coatings and Additives | Novel Manufacturing Methods | Functionalization | R2R CVD Growth and Transfer | Venture Capital Investment | Wafer Based Electronics

Speaker: Zheng Cui | Company: Printable Electronics Research Center China| Date: 10-11 March 2021 | Full Presentation A hybrid printing approach is presented for making embedded metal mesh as transparent conductive film, with the lowest sheet resistance of 0.03ohm/sq. while still maintaining 86% transparency. Roll-to-roll mass manufacturing of the metal mesh transparent conductive films have been realized for touch panels which have been commercialized in a number brand name display devices. The high surface conductivity of embedded metal mesh also opened up a number other applications in addition to touch panels, such as transparent EMI shielding, transparent heating, wearable thermal healing and high density flexible circuits, etc. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Company: Break | Date: 9-10 Feb 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

Speaker: Valentin Storz | Company: NanoDimension| Date: 10-11 March 2021 | Full Presentation The presentation discusses current applications and outlook for the new production technology with focus on Nano Dimensions AME Technology. Nano Dimension (Nasdaq: NNDM) is a provider of intelligent machines for the fabrication of Additively Manufactured Electronics. Customer cases form Hensoldt (DE), CBN-IIT (IT), L3Harris (US), Rehau (DE), UTS (AU) with Applications in the field of Rapid Prototyping of complex PCB, 3D Electronics, Sensors, Heterogeneous Integration and SiP and RF applications are presented. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Germann | Company: IDENTIVE | Date: 11-12 May 2021 | Full Presentation Bio Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM). Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda