High Precision at Light Speed: Laser-Assisted Die-to-Wafer Assembly for microLEDs and Integrated Photonics

We have developed an innovative and proprietary release stack that enables the rapid release of microcomponents with adaptive pitch and high selectivity using a low-cost laser source. Our technology demonstrates exceptional scalability and flexibility, allowing for the transfer of both mini- and microLEDs. In our R&D environment at Holst Centre, we achieved submicron transfer precision with a yield exceeding 99.9% on a sample set of over ten thousand microLEDs. This advancement is compatible with die-on-demand release from ultrahigh-density wafers, achieving edge-to-edge die spacing as small as just a few micrometers.

In addition to ultrasmall microcomponents, we have also applied our release concept to thin sub-mm components, such as Indium Phosphide (InP) coupons for integrated photonics. In our R&D environment, we demonstrated a transfer precision of less than 0.5 microns for InP coupons that are only a few micrometers thick, with aspect ratios of up to 10.