3D Microelectronics Without Limits: High Resolution Printing for the Next Generation of Integration

Foil laminated stereolithography (f-SLA) is emerging as a key enabler in the shift from planar electronics to fully spatial, ultra miniaturized systems. By combining high resolution UV structuring with a scalable process for conductive material deposition, this approach unlocks free form architectures, embedded bare die integration at 10–20 µm scale, and vertical interconnects formed directly during the print process. Recent demonstrators—from millimeter scale multi chip assemblies to high precision die to die interconnects—show how 3D design freedom accelerates innovation in space, defense, medical instruments, and advanced packaging applications.
The 3D printed microelectronics platform we have developed targets high resolution electronics integration in free-form structures, less complex value chains, short lead times and a route towards a more sustainable electronics manufacturing.