Additive manufacturing for 3D structural microelectronics

Over the years, electronics and its components have continuously developed towards a higher density, but largely in the same rigid flat form factor of PCBs. To achieve higher density electronics in complex 3D arrangements, TNO at Holst Centre has developed a multi-material additive manufacturing process named “3D additive lithography for electronics” (3D-ALE). With this fabrication process a scanning DMD-based light engine is used to pattern photopolymers down to 10 um structures. Within the patterned photopolymer cavities are designed for component placement (particularly suitable for bare-die components) and tracks for metal paste filling to fabricate the circuitry. Continuous successive layer-by-layer build-up allows for complex high-density electronics in 3D structural embodiments.