Laser-assisted microLED integration

The development of microLED displays has driven the need for high throughput and cost effective technologies for microLED mass transfer and integration, as conventional assembly technologies fail to provide the required accuracy and throughput. Building upon an extensive track record in the development of laser-assisted technologies for high resolution printing of multilayer circuits and fine pitch interconnects, Holst Centre has recently demonstrated selective and high-throughput laser die transfer of 40 μm microcomponents and high-throughput printing of 30 μm dots of conductive adhesive. In this talk, we will explain how Holst Centre’s technologies are promising key enablers for microLED displays.

Lotte Willems
Bio

The development of microLED displays has driven the need for high throughput and cost effective technologies for microLED mass transfer and integration, as conventional assembly technologies fail to provide the required accuracy and throughput. Building upon an extensive track record in the development of laser-assisted technologies for high resolution printing of multilayer circuits and fine pitch interconnects, Holst Centre has recently demonstrated selective and high-throughput laser die transfer of 40 μm microcomponents and high-throughput printing of 30 μm dots of conductive adhesive. In this talk, we will explain how Holst Centre’s technologies are promising key enablers for microLED displays.