Speaker: Gaetan Guillemot Company: BeLink Solutions Unless you're a printed electronics expert, you probably have no idea what's going on in the making of new innovations in printed electronics, let alone what it takes to bring technology to mass production. As the automotive, industrial, home automation, medical, aerospace and defense market segments increasingly rely on recent advances in printed electronics, it is more important than ever to establish robust manufacturing processes that provide reliability and quality to this next-generation electronics with the integration of all types of electronic components. This presentation will allow you to understand how BeLink Solutions overcame these challenges from POC to mass production. SAVE THE DATE...

Our research group at Yamagata University in Japan is actively developing flexible and printed organic electronics, covering all related technologies from materials and devices to fabrication processes and applications. Our focus is on wireless applications for healthcare, robotics, and logistics. We have recently developed highly sensitive and reliable pressure, strain, and humidity sensors using composite materials of carbon and polymeric materials with simple printing methods. The pressure sensor exhibited a high resistivity change with a sensitivity of 0.014kPa-1 when pressure was applied. The stretchable strain sensors demonstrated high sensitivity with a gauge factor of approximately 14 and could stretch up to 100% with small hysteresis. The developed humidity sensors exhibited a high resistive response of 120% over the relative humidity (RH) range of 30% to 90% through an absorption and desorption mechanism, with fast response and recovery times. We have used these sensors to demonstrate human pulse wave and respiration detection, as well as tactile sensing for robot grippers. In addition, we have established flexible hybrid electronics (FHE) with screen printing methods and combined these sensors with the FHE technology to realize more practical applications for the Internet of Things (IoT) society. SAVE THE DATE...

By Thomas Kolbusch, Director of Sales, Marketing, and Technology, VP 1. Abstract The Roll-to-Roll (R2R) processing methodology, pivotal in the fabrication of printed electronics, particularly 3rd Gen photovoltaics (OPVs), offers significant advantages. Yet, inherent technical challenges pose constraints in achieving optimal device performance. This article delves into the mechanics, advantages, and impediments associated with the R2R method as applied to OPVs. 2. R2R Process: Operational Mechanics and Implications 2.1. Mechanism At its core, R2R involves unreeling a flexible substrate from a source, subjecting it to various fabrication processes, and subsequently reeling the treated substrate. These processes can encompass material deposition, lithographic patterning, and post-fabrication treatments. 2.2. Benefits High Throughput: Continuous production translates to faster manufacturing cycles. Economic Viability: Economies of scale achieved reduce per-unit costs. Versatility: It enables the creation of lightweight, flexible electronic devices. 3. Inherent Technical Challenges in R2R Processing for OPVs 3.1. Ensuring Quality Homogeneity Attaining uniformity in deposition across vast substrate lengths poses a formidable challenge. Factors like deposition rate, substrate tension, and ambient temperature can influence the end product's quality. 3.2. Addressing Material Limitations For OPVs, the choice of materials is critical. Many organic materials used in these cells are sensi...

Carolyn Ellinger , Chris O’Connor , Chris Liston , Emily Rej, Tom LeBlanc Eastman Kodak Company Kodak has a long history of manufacturing quality film products – starting with silver halide imaging films for consumers, including the iconic KODACHROME. Kodak is continuing to build on that history, manufacturing a variety of industrial film products for strategic business partners in many industries – from automotive to battery to healthcare. Built on expertise in coating, printing, and image quality, printed electronics products and contract manufacturing services offer customers modern functionality rooted in decades of manufacturing excellence. Flexible heaters were first developed in the late 1800s, around the same time as Kodak was starting to manufacture film products While these first flexible heaters were textile based, they operate on the same resistive heating principles as today’s flexible film heaters. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped . Contact us for your discounted passes With new technologies come new challenges and limitations, and “hidden” heaters are being deployed to improve the functionality of a broad range of electronic systems. Temperature-limited electronic devices, such as LCDs, require heating to be able to operate in cold environments. Outdoor sensors require that ice and snow be removed from their front surface to ensure their ope...

Speaker: Ashok Sridhar Company: TracXon Printed Electronics is experiencing a strong growth phase of late. To sustain this growth and to turn the hype into actual products in the market, it is necessary to come up with new business models that provide demonstrable value to companies that want to adopt Printed Electronics in their products. Such added value should go above and beyond product-related benefits such as flexibility, stretchability, conformity, etc. At TracXon, a Netherlands-based foundry for Printed Electronics, we offer unique business models that can aid broader penetration of Printed Electronics products, by lowering the barrier to entry for OEMs and Tier-1s across domains such as automotive, healthcare, IoT, consumer electronics, etc. SAVE THE DATE...

Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant property which make it compatible with high volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products and currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with surface mount assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of conventional FPCs. In this presentation, we will introduce our novel ultra-pliable circuit board material development. SAVE THE DATE...

Roartis, a Belgian, privately owned company, develops and manufactures adhesives, coatings, resins and sintering materials for electronic applications. Since 2008, their focus has been on high reliability markets and applications, in the field of medical, semiconductor, automotive, defense, aerospace, heady-industries, etc. Based on a business model of customized solutions, technical support and excellence in quality, the company has been steadily growing over the past years with its broad portfolio of over 400 commercial products for various electronic applications. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped The portfolio includes electrically conductive adhesives, micro-encapsulants, high power sintering pastes, thermally conductive materials, UV-curable adhesives, etc. Roartis’ portfolio is marketed under the brands IQ-BOND®, IQ-CAST® and IQ-SINTER® . Recently, a new line of functional inks has been introduced, targeting applications for printing circuitry on flexible substrates including PET, PEN, PC, PVC, TPU, etc. The new range of products, branded IQ-INQ® will be launched during the upcoming Techblick event in Berlin, Germany and covers apart from Ag-based inks also other metal options, as well as dielectric materials. Where over the past years, many suppliers have emerged for traditional 2D compatible conductive inks compatible with screen, inkjet, gravure or slot...

In this illuminating presentation, Michael Petersen will walk us through the transformative path of medication adherence advanced by smart packaging technology. Focusing on remarkable innovations like Information Mediary Corp's Med-ic smart blisters and CertiScan solutions, Petersen will provide a comprehensive insight into how these pioneering tools have decoded complex adherence puzzles and driven industry momentum, albeit slowly. By tracing the arc from traditional to smart adherence packaging, Petersen aims to showcase the remarkable potential of digitization in healthcare while acknowledging the challenges and the gradual pace of progress. Attendees will come away with a deeper understanding of the power of smart adherence packaging to reduce clinical uncertainties and improve patient outcomes, despite persistent industry inertia. This discourse forms an integral part of the larger dialogue about the transformation of healthcare through technology at the TechBlick event in Berlin SAVE THE DATE...