Speaker: John Yundt Company: SunRay Scientific In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues. SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were...

Authors: Lena Reinke lena.reinke@panacol.de | Tobias Kaposi: tobias.kaposi@panacol.de Paradigm shifts and disruptive technologies typically combine with, and often rely on generational changes. Such a shift can be seen in today’s photovoltaics development, where organic photovoltaics (OPV) is creating radically new applications in consumer electronics. They include indoor light harvesting to extend battery life of wearables, and outdoor energy generation with performance previously unimaginable from conventional photovoltaics. The same is true for flexible electronics. Manufacturers are redefining the boundaries of volumetric form factor, functionality, and design flexibility in consumer and automotive electronics. A critical contributor to these technology advancements has come from the advancement of bonding technologies. Adhesives now go beyond the basic benefits of sound structural bonding and provide additional functionality to the assembly. This has become the industry standard. Working in conjunction with our highly valued partners and customers, Panacol has successfully developed a range of multi-functional adhesive selections for applications in OPV and flexible electronics. For OPV applications, these adhesives provide higher resistance to environmental stresses. Adhesives for barrier foil lamination optimize the critical interplay between the pretreatment, foil, stack, and adhesive. New conductive adhesives efficiently adhere and protect electrical connectio...

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Zackary Davis Danish Technological Institute The demand for flexible, stretchable and sustainable electronic solutions is growing rapidly due to the growth in eHealth, automotive, smart buildings and other similar application areas. At the core is printed electronics, which uses printing technologies such as screen, flexographic and inkjet printing, together with functional materials and inks to fabricate electronics directly onto plastic foils, paper or textiles. To de-risk European industry to adept these novel materials and technologies, Danish Technological Institute (DTI), has established a One-Stop-Shop, which facilitates European industry with consultancy, development and pilot production. DTI can take novel ideas and perform proof of concept projects, develop these into full prototypes and in many cases, upscale prototypes to a pilot scale. Furthermore, DTI can provide support throughout the entire value chain, from materials to final products. In this presentation, you will witness DTI's work on novel material formulations, particularly focusing on bio-based and sustainable printable materials, including copper-based and transparent silver nanowire inks. DTI will showcase various fully functional demonstrators and prototypes they have developed, ranging from wearable EMG sleeves and heated undergarments to crystal lighting and embedded sensors in drones. DTI Printed Electronics is also heading a vast network through the formation of the open innovation test bed, Sust...

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer. SAVE THE DATE...

Author: Jesus Zozaya | CEO of Voltera | jesus@voltera.io Goal : Design and print a high-performance ultra-high frequency (UHF) RFID tag using precision dispensing of nano copper ink on a paper substrate. Promising Technology : Radio Frequency Identification (known as RFID) is a technology that leverages wireless communication over radio waves to communicate with and locate objects. RFID tags are small label-like objects that are placed on an item which can be tracked and communicated with using an RFID reader — a handheld device that scans RFID-equipped items. UHF RFID tags are passive, meaning they don’t require a battery or power source. UHF RFID has many applications, being well-suited to use cases where non-contact data transfer and item localization can prove beneficial. For example, tracking inventory in a warehouse or manufacturing plant, acting as a high-speed point-of-sale scanner in consumer stores, enabling non-contact cashless payments, and even tracking donated blood bags in healthcare settings. While it seems like RFID tags are just fancy barcodes, they provide many benefits compared to traditional optical barcodes. RFID tags do not require a line-of-sight and are therefore resistant to bad lighting conditions and other environmental factors. You can quickly scan a room full of thousands of RFID tags without having to identify each individual tag (tags can even be scanned if they’re behind a wall!). RFID tags also integrate a user-writable memory space, enabli...

Speaker: Andrzej Pepłowski CEZAMAT, Warsaw University of Technology After years of extensive research and development in biomedical wearables, focusing on chemical and physical measurements, we have gained significant expertise in their manufacturing. Our extensive knowledge of ink dynamics, colloid mechanics, and material characterization enables us to understand the underlying phenomena in technological processes. Starting from material composition and preparation to printing and device operation, we effectively translate our expertise into scientific advancements. Through quantitative and reproducible methods, we establish the foundation for groundbreaking innovations in printed electronic SAVE THE DATE...

Martin Hedges NeoTech AMT GmbH This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given. SAVE THE DATE...