Speaker: Malte von Krshiwoblozki | Company: Fraunhofer IZM | Date: 24-Jun-22 | Full Presentation Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics. Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and d...

Speaker: David Dewey | Company: Fujikura Kasei | Date: 24-Jun-22 | Full Presentation As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Aart-Jan Hoeven | Company: DoMicro | Date: 24-Jun-22 | Full Presentation DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less. Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Shahzad Khan | Company: Keiron Printing Technologies | Date: 24-Jun-22 | Full Presentation Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Mahmoud Tavakoli | Company: University of Coimbra | Date: 24-Jun-22 | Full Presentation Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsres...

Speaker: Armin Wedel | Company: Fraunhofer IAP | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Thomas Kolbusch | Company: Coatema | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Using a Single Platform Speaker: Ahmed Busnaina | Company: Nano-Ops | Date: 24-Jun-22 | Full Presentation Imagine if you can input your design and materials on one end and have your chips come out the other end using one machine? And do this on the same day as you finish the design? What if this machine could be installed in your, lab, or another secure location? We present a new purely additive manufacturing technique for nano and microscale integrated electronics systems manufacturing. This fully automated foundry-in-a-box tool takes less than 10 square meters of space and can be installed and used anywhere to ensure a secure operation independent of any semiconductor fab. The electronic development cycle would be in days instead of six to nine months, with prototyping taking a day or less. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoparticles at room temperature and atmospheric pressure. This technology can be used to make transistors, diodes, or logic gates using a purely additive (directed assembly enabled) process utilizing semiconductors, metals, and dielectric nanoparticles suspended in a liquid. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. The technique has been used to make transistors, inverters, diodes, logic gates, displays, all carbon ele...