Speaker: Gilad Fisher | Company: Addionics | Date: 9-10 Feb 2022 | Full Presentation As climate change concerns continue to drive interest in clean energy and our daily lives become increasingly digitized and dependent on electronics, electrification has become a widespread trend across almost every industry. The problem is that battery innovation hasn’t kept pace with the electric revolution. Charging time, available capacity, lifetime degradation, and costs are key performance areas that are lacking in batteries today. While most efforts to enhance battery performance to date have been focused on battery chemistry, this has only led to incremental changes over the past 30 years. The key to the next step-change in battery performances lies within its structure. This is what Addionics is doing - changing battery architecture to allow the next step-change in battery performance, to any battery chemistry, existing or emerging. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National ...

Additive manufacturing (AM) offers tremendous possibilities for the fabrication of next-generation microelectronic devices, including lower cost and simplicity. Yet, there are several challenges to the widespread use of AM techniques for microfabrication. The miniaturization trend requires printing ultra-thin and highly conductive interconnects on complex 3D topographies and heterogeneous substrates. XTPL’s Printing Technology tackles these challenges. We demonstrate Ultra-Precise Deposition (UPD), a versatile approach to printing micrometric conductive and non-conductive structures on various rigid and flexible substrates (see: Łysień et al. High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates. Sci Rep 12, 9327 (2022). https://doi.org/10.1038/s41598-022-13352-5). UPD allows maskless deposition of highly-concentrated silver, copper, and gold pastes, up to 85 wt. % of solid content. The printed feature size can be as small as 1 µm, and the maximum electrical conductivity obtained in this range is around 45% of the bulk material. The UPD process is based on a direct extrusion of ink using pressure. Simultaneous optimisation of the ink, printing nozzle and process parameters allows for extrusion of high viscosity inks using nozzles with a diameter as small as 1 µm. Thanks to these features, UPD allows to achieve results beyond the reach of other AM techniques: 1) printing on 3D topographies for advanced packaging; 2) printin...

How lasers help in MicroLED display production? One of the biggest manufacturing challenges in uLED display production is the transfer step given the speed and yield requirements. As shown in the slides below by Oliver Haupt from Coherent Inc., lasers can play an important role in this step, both when all three colors (R G B) microLEDs and also when only blue microLEDs need to be transferred. To learn more join TechBlick's first ever specialist event on microLEDs on 30 NOV - 1 Dec where Oliver will present this technology www.TechBlick.com/microLEDs
The process flow for both cases is shown below. In case of RGB MicroLEDs, first a temporary carrier is attached to the sapphire substrate on which GaN uLEDs are grown. Laser Lift Off (LLO) is deployed to de-bond the sapphire substrate, releasing the carrier wafer with the detached GaN microLEDs. Next, controlled UV spots are used to release the individual microLEDs onto the final substrate holding the TFT active backplane layers. These process can be repeated three times, each time for a different uLED color. In all steps, of course, excellent and optimized control of the laser profile/parameters in harmony with the right adhesive material properties are required.
In the case of blue-only microLEDs, the final backplane substrate is brought into contact with the GaN sapphire substrate. The GaN uLEDs transfer to the final substrate via the LLO process. Three color capability is then achieved by color conversation, e.g., QDs or s...

Integrated electronic circuits into standard textiles using mass production techniques? Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones. This well established technology can enable the integration of complex circuit patterns using functional / conductive fabrics with standard textiles using mass production techniques. In this short talk, Sophia Krinner @Karl Mayer showcases the following technology demonstrators:
1- textile as remote control for commanding a mini robot
2- working mobile phone charger pad based on textiles
3- smart shirt for measuring heart rate, temperature and humidity...

... MicroLEDs, QDs & the Energy Gap |QD-LED & Cd-Free QDs Welcome to this week's edition of our newsletter. First a couple of housekeeping notes: We have begun to cover select display and QD technologies in this newsletter. There are two reasons (1) additive electronics is used in this areas since, for example, QDs are areasolutions processed or microLEDs can be transfer printed, and (2) we are hosting a unique world-class event on microLEDs and QDs on 30 NOV-2 Dec - see schedules here www.TechBlick.com/microLEDs please note that there is strong demand for our onsite event in Eindhoven - the Future of Electronics RESHAPED. The masterclass and tours are almost sold out. Please reserve your spot now if you wish to join us https://www.techblick.com/electronicsreshaped Topics for this edition: Copper Nanoparticle Scale-up | Warp Knitting of E-Textiles | Functional Crystals in Structural Electronics | MicroLEDs and the Energy Gap | Advances in QD-LED and Cd-Free QDs | Stable QDs for microLEDs Will copper nanoparticle inks finally come of age to disrupt the dominance of silver in the conductive paste business? Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink cost differences. To overcome this issue, Zachary James Davis et al at Teknologisk Institut have scaled up copper nanoparticle pro...

“Silicon” Displays with an incredible 3600ppifull color using microLED and QD technology? Sharp (HIRANO Yasuakie et al) will join us from Japan to explain this technology at the upcoming TechBlick event on microLEDs and quantum dots (www.TechBlick.com.microLEDs).
As shown in the slide below, first blue-only uLEDs are formed on a sapphire substrate. Here, one LED array contains 352 x 198 micro LED dies of 24 um x 8 um in size. In parallel, an LSI chip containing the driving circuitry is formed on a silicon wafer. Here, the cathode (N-type electrode) and anode (P-type electrode) are fabricated for each micro LED die to apply driving voltage independently to each die. The Au bump electrodes are fabricated in accordance with the pitch of the LED dies. The two substrates are flip-chip bonded using Au-Au bonding. Here one can already see the parallel to the silicon and optoelectronic industry (vs. the traditional thin film display industry!). Next, the sapphire layer is removed via laser lift off. Finally, Cd-free quantum dots (green and red) are deposited atop the microLED dies to enable R G color conversion. This way one achieves RGB colors
The device architecture is shown in slide 2- here one can see the location of GaN uLED dies, Au bumps, as well as light shielding walls and quantum dots (QDs). This way, a full color 1,053 ppi display is formed.
However, given the small size of the emissive area of uLEDs, the brightness is low. An innovative solution here is to switch from...

Contact: Rick Ramos,
Marketing & Inside Sales Engineer – Eastprint Inc.
Email: rramos@eastprint.com
Website: https://www.eastprint.com/index.html
Introduction:
As wearable electronic devices continue to be more and more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available. Mass producing wearable biosensors: To cost effectively mass produce wearable biosensors, vertical integration and assembly operations is key. Having the ability to print conductive inks on flexible substrates and fully perform converting operations (such as lamination of medical grade hydrocolloids, adhesives, non-woven and foam layers, hydrogel dispensing and or placement and final packaging) in SMT components and any connections on the non-patient side of the patch (ensures patient comfort). Have been successful in .010” diameter via hole print filling in order to have continuity between skin contact and a assumed communication device. Technologies Used to Manufacture Biosensors
Process for manufacturing biosensors employ screen printing, laser cutting, lamination, and adhesives. Screen printing of various conductive inks, such as but not limited to silver, silver/silver-chloride, carbon, zinc, gold, dielectric, etc. In addition, Surface-Mount Technology (SMT) is used if components are required. There are ...

Rafael Michalczuk howcases fantastic and beautiful demonstrators combining all these technologies. Here, in collaboration with PolyIC and Kurz, they showcase beautiful interactive smart surfaces with integrated functional crystals for automotive.
The embedded (hidden) electronics technology is from Kurz (based on PolyIC technology) based on its R2R metal mesh technology (10um linewidth and 100um spacing with ultrathin (100 nm) layers of printed Ag nanoparticles) together with their so-called Functional Foil Bonding, which enables these metal mesh films to be integrated on the back of shaped plastic parts together with decoration layers. This creates part with electronics seamlessly integrated within the curved or 3D shaped part
SWAROVSKI I provides the beautiful functional crystals which enhance the aesthetics but also allow for continued touch and optical interaction with the underlying electronics. #functionalcrystas #automotiveinteriors #structuralelectronics #inmoldelectronics #HMI #humanmachineinterface...