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TechBlick Blog

26 January 2022

Networking Break, Meet The Speakers

Company: Networking Break | Date: 9-10 Feb 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/...

TechBlick Blog

24 January 2022

Fabrication of flexible electronics improved using gold and water-vapor plasma

Researchers at the RIKEN Center for Emergent Matter Science (CEMS) and the RIKEN Cluster for Pioneering Research (CPR) in Japan have developed a technique to improve the flexibility of ultra-thin electronics, such as those used in bendable devices or clothing. Published in Science Advances, the study details the use of water vapor plasma to directly bond gold electrodes fixed onto separate ultra-thin polymer films, without needing adhesives or high temperatures. As electronic devices get smaller and smaller, and the desire to have bendable, wearable, and on-skin electronics increases, conventional methods of constructing these devices have become impractical. One of the biggest problems is how to connect and integrate multiple devices or pieces of a device that each resides on separate ultra-thin polymer films. Conventional methods that use layers of adhesive to stick electrodes together reduce flexibility and require temperature and pressure that are damaging to super-thin electronics. Conventional methods of direct metal-to-metal bonding are available but require perfectly smooth and clean surfaces that are not typical in these types of electronics. A team of researchers led by Takao Someya at RIKEN CEMS/CPR has developed a new method to secure these connections that do not use adhesive, high temperature, or high pressure, and does not require totally smooth or clean surfaces. In fact, the process takes less than a minute at room temperature, followed by about a 12-hou...

TechBlick Blog

21 January 2022

The first OLED fashion application

Inuru announced the first use of its OLED solutions in a Hoodie made for LOOK LABS, a digital luxury brand based in Düsseldorf. Comfy420 Metalight™ Hoodie (NFT+Physical) LOOK LAB has recently launched a game called 420. As usual, gamers are able to buy in-game items to improve their gaming experience. with special utility and purpose in the game. Those items are very limited and give an advantage to whoever owns them. The light effect comes from Inuru's free-form OLED. These are powered with integrated thin-film batteries that can be recharged wirelessly. The hole technology is integrated into a thin and light-weight film, that is so robust that it can be washed as any other fashion product. Inuru OLED solutions are washable and easy to integrate in fashion With the launch of the Hoodie Inuru announces another milestone in its company history. After having products in packaging before, the Inuru Laboratories in Berlin Adlershof has developed electronics solutions that can be easily integrated into fashion. "Our latest solution can be applied easily on any type of fashion product with standard manufacturing processes and is, of course, washable," says Matti Prasdorf lead product engineer behind the fashion application at the Inuru Laboratories in Berlin-Adlershof. The processes have been tested within multiple projects with major fashion and apparel brands. Inuru solutions have been successfully integrated at the typical fashion production sites across the globe without any fu...

TechBlick Blog

19 January 2022

Precision flexible heater meeting the individual needs

VTT has developed a thin, flexible, and plastic-free heater to help in lowering the energy consumption at homes and offices and also to achieve individual comfort temperatures. When attached to seats, walls, or floors, heaters can in the future identify their users and immediately generate heat to the individual temperature preferences of the occupants. Hot Delivery Company piloting the use of heaters in food delivery bags.
The use of insulation materials and reduction of room temperatures are means to lower the energy consumption of buildings to prevent climate change. A one-degree decrease in room temperature leads to roughly 5% savings in heating costs. However, the comfort of residents suffers if the temperature of homes is decreased by several degrees. Comfortable temperatures can be achieved locally very quickly and with lower total energy consumption, if the heating can turn on and off rapidly as needed on the surfaces around the inhabitants, for example on the floor surface, on a seat cushion, or on the wallpaper of an adjacent wall.
Comfort and warmth at home
Surfaces can be heated with the thin, bendable, and flexible heater developed by VTT, which is produced by printing the heating electronic components with a roll-to-roll method. A 50 micrometers or 0.05 millimeters thick metal mesh can be cut to form and installed on, for example, fabric, paper, or floor laminate without an additional support layer. This has a very limited impact on the properties of ...

TechBlick Blog

25 January 2022

Toray Develops Semiconductor Circuits on Film by all Printing Process

Toray Industries, Inc., announced that it has created a printing technology to form semiconductors circuits on flexible films that employ high-performance semi-conductive carbon nanotube composites. The company also announced that it has fabricated radio-frequency identifiers (RFIDs) and sensors on general-purpose films and has demonstrated its wireless operations. One prospective application of Toray’s technology is UHF RFID, which could enhance retailing and logistics efficiency by automating cash registers and reduce inventory control labor. Diverse other applications could encompass such security fields as counterfeiting prevention and sensors at medical and eldercare sites. Toray will collaborate with external partners to develop systems and applications to swiftly commercialize its semiconductor circuits. Efforts to develop new materials and coating techniques to form semiconductor circuits on films have progressed, especially for organic semiconductors. It has been challenging, however, to improve mobility. This indicator of semiconductor performance has languished at just 20 cm2/Vs. Toray overcame this challenge in 2020 by attaining a world record mobility of 182 cm2/Vs for printing with its proprietary semi-conductive carbon nanotube composite technology. The company also created p-type (positively charged) and n-type (negatively charged) semiconductors needed to form low-power complementary metal-oxide-semiconductor (CMOS) circuits. It additionally fabricated RF...

TechBlick Blog

24 January 2022

Semiconductor and Printed Electronics Industries: Overview of emerging applications

Speaker: Sean Chang | Company: Texas Instruments | Date: 11-12 May 2021 | Full Presentation Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

20 January 2022

Heraeus releases Microbond® SMT650 solder paste with a tin-silver-copper alloy

Microbond® SMT650 high-reliability solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. Combining the new F650 flux system with the Innolot® alloy delivers superior reliability—particularly in miniaturized systems in the automotive industry. Electrochemical migration is a form of corrosion that negatively affects the reliability and service life of electronic components. It is caused by moisture—either during the circuit board manufacturing process or due to external factors. Miniaturization and the resulting minuscule distances between conductor paths lead to greater electric field intensity, which in turn increases the risk of electrochemical migration. One example is the control units in vehicles: Fluctuations in temperature can lead to condensation, and this can result in moisture reaching the circuit board. When combined with flux residue, this moisture can lead to negative interactions such as the formation of dendrites and eventually lead to short circuits. Microbond® SMT650 solder paste achieves a consistently high surface resistance that prevents electrochemical migration. In addition, the specially developed F650 flux system can be combined with different alloys. The combination of the F650 flux system with Innolot® alloy delivers superior reliability— especially in miniaturized systems in the automotive industry. Its material composition provides a consistently high surface resistance that prevents elec...

TechBlick Blog

19 January 2022

Electroninks Expands Line of Particle-Free Conductive Inks With New Gold and Platinum Formulations

Electroninks, the leader in particle-free conductive metal inks and advanced materials, today announced the addition of gold (Au) and platinum (Pt) particle-free conductive inks to its catalog of products. The addition of gold and platinum inks gives makers of consumer electronics, medical devices, sensors, and semiconductors the ability to make lighter, less expensive, and more environmentally friendly products. ​​The demand for powerful microelectronics packed into consumer and industrial products of different shapes and sizes has never been greater. From foldable displays in new 5G phones to medical sensors in athletic wear to new materials and architecture in semiconductor packaging, powerful tiny circuitry is making it possible, and Electroninks’ broader line of conductive inks is enabling greater innovation in this field. Electroninks has already established a superior particle-free ink in the market with its conductive silver ink. The new gold and platinum metal inks consist of metal-organic precursors that decompose cleanly at lower temperatures than nanoparticle inks and can be UV-cured. The inks are unique to the market, providing deep savings on material use (and waste) and costs for customers by enabling similar electrical and reliability properties of vacuum or plated films of gold and platinum. Opening additional doors in product manufacturing, the new inks are catalytically active (may serve as a seed layer) and have a high corrosion resistance — ideal for pr...

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