Speaker: Aaike van Vugt | Company: VSParticle | Date: 11-12 May 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

A research team led by Professor Lim Chwee Teck from the National University of Singapore’s (NUS) Department of Biomedical Engineering and Institute for Health Innovation & Technology (iHealthtech), in collaboration with clinical partners from Singapore General Hospital, has developed a smart wearable sensor that can conduct a real-time, point-of-care assessment of chronic wounds wirelessly via an app. A world’s first, the novel sensor technology can detect temperature, pH, bacteria type, and inflammatory factors specific to chronic wounds within 15 minutes, hence enabling fast and accurate wound assessment. The research was published in the journal Science Advances "A flexible multiplexed immunosensor for point-of-care in situ wound monitoring".
With a rapidly aging population, healthcare providers are seeing more patients suffering from non-healing wounds such as diabetic foot and chronic venous leg ulcers. It has been estimated that about two percent of the world’s population suffers from chronic wounds. The healing processes for these chronic wounds are often interrupted due to reasons such as infection and repeated trauma, leading to severe stress, pain, and discomfort to afflicted patients. For patients with diabetic foot ulcers, this can lead to more severe outcomes such as foot amputation. Timely care and proper treatment of chronic wounds are needed to speed up wound recovery. However, this requires multiple clinical visits for lengthy wound assessment and t...

Curved and flexible displays have risen in popularity in recent years and will continue to do so with high demand coming from several sectors.
This is most visible, of course, in smartphones and tablets, where there is a constant need for innovation in order to keep consumer interest. Further demand is also emerging at a rapid pace from the automotive and lighting sectors. Thus R&D into next-generation displays remains strong.
All of these applications require dedicated features for the control of light-guiding and outcoupling due to the curved geometry. However, most microtextures for beam shaping are designed for flat devices, and their appropriateness for curved geometries needs to be evaluated.
In this video tutorial, Dr. Urs Aeberhard demonstrates how to use the Optics module of Laoss to rapidly model a curved display backlight unit. Urs is using Fluxim’s 3D ray-tracing tool Laoss Optics to determine the impact of curved geometries on beam shaping. He is also demonstrating how to design suitable structures to control light outcoupling via microtextures in backlight units for LCD displays. More information: https://www.fluxim.com/news/22/10/curved-displays-mastering-light...

Speaker: Rudy Ghosh | Company: NovaCentrix | Date: 11-12 May 2021 | Full Presentation Bio As the Technical Program Lead at NovaCentrix, Rudy Ghosh helps translate technical innovations into customer ready products. He works closely with NovaCentrix’s customers, technology partners, and collaborators across the world to solve technical challenges and identify new avenues for the application of NovaCentrix’s industry leading technologies in PulseForge tools and Metalon inks for printed and flexible electronics. As a technical expert in the printed electronics industry, he is often an invited speaker for a variety of printed electronics conferences. Rudy also works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement. Before joining NovaCentrix, Rudy was a Post-Doc at the Microelectronics Research Center at the University of Texas at Austin, where he led the Center’s research into the synthesis of 2D materials. Rudy holds a PhD in Physics from the University of North Carolina at Chapel Hill and a MS in Physics from the Indian Institute of Technology, Bombay. Rudy has authored over 30 publications in a variety of technical journals. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platf...

Researchers at the Swiss Federal Laboratories for Materials Science and Technology (EMPA) have used 3D printing to create a sustainable new class of supercapacitors. The fully-3D printed battery, composed of a flexible cellulose and glycerol substrate, patterned with conductive carbon and graphite-laden ink, is able to withstand thousands of charging cycles while maintaining its capacity. Thanks to its biodegradable base, the novel cell can also be composted once finished with, potentially making it an ideal tool for tackling the world’s electronic waste issues. According to the EMPA scientists, the recent boom in electronic wearables, packaging, and Internet of Things (IoT) applications, has seen the global number of these devices rise to 27 billion. However, given their short life cycle, and the fact they tend to be powered by non-renewable lithium-ion or alkaline cells, many such products will eventually be landfilled, worsening the global ‘e-waste’ problem. The researchers’ findings are detailed in their paper titled "Fully 3D Printed and Disposable Paper Supercapacitors". In an effort to develop more eco-friendly energy storage devices, scientists have therefore begun to experiment with electrical double-layer capacitors, or ‘EDLCs.’ These high-capacity, fast-charging supercapacitors can at least partially be manufactured from biodegradable materials, potentially making them an ideal replacement for normal batteries, which often require specialized disposal services. Al...

World-class Agenda | Latest Technology Updates | Exclusive Networking Sessions Topics Covered | Perovskites | Organics | CIGS | Tandem | R2R | Inkjet | Printed | Thin Film Deposition Scale-Up | Stability | Thin Film Barriers | Material Innovations | Substrates. 1-2 December 2021 | 1pm - 9pm CET Add to your Calendar iCalendar (majority of email clients) Google Calendar | Microsoft Outlook Calendar | Office 365 Calendar | Yahoo Calendar TechBlick's sixth Live event on 1 -2 December 2021 will cover The Future of Photovoltaics and as always we have a superb speaker line-up, interactive exhibitor booths for you to visit and exclusive networking sessions. TechBlick is a year round event series with over 350+ Analyst picked live online presentations on emerging technologies. With a single Annual Pass you have year long access to our platform where you can join live conferences as well as watch over 250 (and growing) on-demand presentations and participate in Masterclasses by leading industry exerts. You can also network with fellow attendees as well as learn from, and meet our exhibitors. TechBlick will once again be hosting the popular networking sessions in our exclusive lounge. This will be your chance to mix with attendees and meet speakers just as you would at a physical event. If you are not familiar with the lounge, you can try it out here. Why don't you grab a drink and join us for this sociable occasion. Leading Global Speakers Include: Annual Pass With an Annual Pass you c...

A research team in the Department of Electrical and Electronic Information Engineering at the Toyohashi University of Technology has developed a MicroLED neural probe for neuroscience. This MicroLED tool can optogenetically control and observe neural activity in the brain. The work "Development of a neural probe integrated with high-efficiency MicroLEDs for in vivo application" was published in the Japanese Journal of Applied Physics. An LED probe with 16 MicroLEDs was fabricated in one shank and it was reported to effectively activate neural activity in the depth direction in the cerebral cortex in vivo. This design allowed for the realization of complex neural activity manipulation; however, electrophysiological experiments require the use of neural recording electrodes to capture the manipulated neural activity. Because the LED probe and neural recording electrode probe are different, it is necessary to precisely control the position of each probe and insert both devices for observation. Thus, the development of an integrated MicroLED and neural recording electrode probe is essential. New optogenetic technology that enables the manipulation and recording of single neurons in the deep regions has been realized; however, there are a few reports of such integrated probes. Furthermore, among those that have been reported, they are not suitable for neuroscience research because the light output of MicroLEDs is as low as several μW because of their small size. Although an incre...

Heterogeneous Integration, AI Chips, 5G Packaging, Chiplets, High Density Fan-Out Packages, Scaling, Future of Semiconductors 3D and Conformal Printed Electronics have many existing and emerging applications in Electronic Packaging. In the talk you will learn about the different techniques that one can deploy in 3D and conformal printed electronics. Furthermore, you will learn about different applications ranging from antenna printing to medical devices to conformal as well as area-selective package-level EMI shielding to wire-bond replacement especially for ultra-high frequency packages to heat management in stacked die packages or high-power semiconductor packaging to prototyping of redistribution layers. Finally, you will also hear about emerging digital ultraprecise printing. Here, we exclude exciting approaches as wafer printing. To learn about wafer printing visit the Nano-ops talk at the Techblick platform or read a future newsletter. 3D & Conformal Printed Electronics in Electronic Packaging World-Class Symposium on Electronic Packaging TechBlick is delighted to bring you a world-class symposium covering cutting-edge innovations in electronic packaging. This symposium was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. The symposium can now be accessed with a TechBlick Annual Pass granting you access to all online Techblick events for 12 months, access to TechBlick ever expanding portfolio of industry-led maste...