23 May 2024
Innovation: A Contract Manufacturer's Perspective
#InMoldElectronics #WearableElectronics #TextileElectronics #StretchableElectronics #MedicalElectronics Innovation and collaboration are the driving forces behind taking a novel idea from concept to commercialization. Innovation requires change and improvement, in raw materials, and in the manufacturing process, which leads to new and improved products that are shaping the future of the medical and industrial markets. Within the innovation process, contract manufacturers play a pivotal role, serving as the driving force behind the realization of novel ideas. As a contract manufacturer, Innovation is at the root of CTI’s success. Here, we will discuss the intricacies of innovation from our unique perspective as a contract manufacturer to the medical and industrial markets. Author: Alicen Pittenger | Director of Sales apittenger@conductivetech.com Collaborating on Innovative Novel Ideas: Contract manufacturers are positioned at the center of the innovation process, bridging the gap between ideation and commercialization. We can translate concepts designed at the bench into mass-produced commercial goods. As the glucose testing market migrated from traditional glucose testing, with strips and meters, companies looked to us, once a leading manufacturer of glucose strips, for the development, and production, of components for continuous glucose monitoring devices. Identifying and Integrating New Materials: Innovation is a constantly evolving process, as a contract manuf...
14 May 2024
Pilot Factory for roll-to-roll processing of next-generation smart wearable patches | VTT
Wearable sensor patches offer novel opportunities for many healthcare and wellness applications. For optimal comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed electronics and hybrid electronics enable the use of almost any substrate and packaging materials, making it the perfect technology for next-generation wearables. Author: Antti Kemppainen , VTT, Antti.Kemppainen@vtt.fi Pilot Factory The production of printed and hybrid electronics requires several manufacturing processes and tools which might not be available by commercial manufacturing partners. VTT’s Printocent Pilot Factory bridges the gap towards full upscaled manufacturing by extremely versatile infra, including for example following capabilities: Roll-to-roll printed electronics lines with: Interchangeable printing methods, high curing capacity and automated layer-to-layer registration. Printing and coating processes are available for thin films (<100 nm) up to thick films (tens of micrometers). Highly experienced team and facilities for ink tailoring, process development and quality control. Component assembly in a roll-to-roll format using: High throughput pick and place line for low-temperature soldering or adhesive bonding. Flip-chip high-precision and bare-die assembly line Extensive converting and post-processing capabilities including: A Versatile lamination and cutting converting line equipped with a cutting laser, robot arms, soldering and ultrasonic welding...
10 April 2024
Paste Noise Absorber Technology for High Frequency Devices (110-170 GHz) and Packages
UJIWARA REI | Panasonic Electronic Materials Business Division | fujiwara.rei@jp.panasonic.com High-frequency devices, such as those used in beyond 5G and 6G technologies, require precise and reliable signal transmission for optimal performance. High-frequency signals are more susceptible to noise interference, which can degrade the quality and integrity of the transmitted data. Noise mitigation is crucial to ensure that the intended signal is accurately received and interpreted.
Traditionally, noise-absorbing materials have been used as an effective method of making noise. Noise absorbing materials are generally sheet or sponge type. However, these types are difficult to apply beyond5G/6G devices which become smaller and more complicated. We are speaking in Boston on 12-13 June 2024 at The Future of Electronics RESHAPED USA
Register now and come to hear our talk To solve this problem, we propose a noise-absorbing paste. Dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G, and contributing to improved quality and performance. Features: Dispensable Good conformability High frequencies over 100GHz Figure 1 Paste Noise Absorber Table 1 Properties Figure 2 Absorption vs frequency
Case 1: For solving cavity resonance. Figure 3 MMIC on antenna module. The radiation noise of MMIC resonating in the cavity affects the antenna characteristics. (Figure.3) Noise absorbing paste can be installed on small sp...
4 April 2024
Flexible Microelectronic Devices produced with Sputtered Coatings and Laser Patterning
Authors: Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLC ljosephson@intellivation.com | Intellivation The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications. Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. Sputtered layers were deposited using Intellivation’ s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create...
23 May 2024
Stretchable Inks: All essentials for producing stretchable Printed Electronics
Steve Paschky | Managing Director Sales & Marketing at SARALON GmbH Among the emerging areas for Printed Electronics (PE), wearables and automotive industries are rapidly adopting this technology on a commercial scale. These sectors are heavily investing in PE due to its several advantages mainly: PE supports invisible electronics PE eliminates the complexities of bulky electronics integrations PE allows direct printing on lightweight substrates, leading to substantial weight reduction #InMoldElectronics #WearableElectronics #TextileElectronics #StretchableElectronics #MedicalElectronics Stretchable electronics: A significant driver of Printed Electronics industry The transformative impact of PE is not only due to enabling experimentation with various ink materials and functionalities, but also encouraging the use of div erse substrate materials. More specifically in the wearables and automotive sectors, electronics printing on stretchable substrates is highly desirable: Stretchable electronics easily flex to fit complex car interior geometries. They offer excellent conformity to the human body ideal for health monitoring wearables and medical patches Fully integrated PE on textiles offer comfort and movement flexibility in smart garments They adopt easily to 3D shapes or thermoformed in the IME process perfect for automotive electronics To support these needs, Saralon GmbH has developed all the essentials for producing stretchable Printed Electronics. Stretchable Saral Ink...
11 April 2024
Celanese Micromax™ Presents: "Electronic Inks & Pastes Seminar"
Free seminar An Introduction to Printed Electronics & Thick Film Technology May 22nd & 23rd, 2024 With Dinner on Wednesday, May 22nd Join us to hear leading industry experts provide a comprehensive overview of Printed Electronics/Thick Film materials and processing during this TWO DAYS / TWO TRACKS IN PERSON seminar. The seminar is designed for professionals and engineers who are new to Printed Electronics & Thick Film Technology or would like to learn more about its art and science. The program also comprises talks from external speakers as well as a tour of our European Technology Center (ETC) for Engineering Polymers. In addition, we will display and discuss Printed Electronics/Thick Film applications. The event runs from 8:30 am to approximately 5 pm each day. Lunch, coffee and light snacks will be provided during the seminar. Please refer to the attached preliminary agenda Seminar Location Celanese Performance Solutions Switzerland Sàrl Route du Nant-d’Avril 146 1217 Meyrin, Switzerland
Click HERE to register for the Seminar
Recommended Hotel Mercure Geneva Airport (10 min walk to the Seminar location) 3B Rue de la Bergère, 1217 Meyrin, Geneva A contingent number of rooms are pre-reserved to ensure availability. Please book prior 15th April 2024 by sending an email to: mercure-geneva-airport@accor.com and refer to: “Celanese Group as of May 2024” Additional Hotels (not pre-reserved) Hotel NH Geneva Airport, Av. De Mategnin 21, 1217 Meyrin, Geneva Hotel NH Genev...
8 April 2024
Bridging the Divide: Transitioning from Lab-scale to Industrial-scale Equipment in Printed Electronics Development
Authors: Daan de Kubber , Jurgen Westerhoff , Ben Robesin SPGPrints b.v., Raamstraat 1-3, 5831 AT, Boxmeer, the Netherlands Printed electronics have gained significant attention for their potential to revolutionize various industries through cost-effective and scalable manufacturing processes. However, a critical challenge within this domain lies in the transition from lab-scale and pilot equipment to industrial-scale production. We want to shed light on the implications of this transition, emphasizing its impact on cost reduction, repeatability, and time to market. The initial stages of printed electronics development predominantly occur on lab and pilot equipment, where researchers and innovators prototype new applications. As these applications progress towards commercialization, the shift to industrial-scale equipment becomes inevitable. Rotary screen printing emerges as a prominent technique, providing high-throughput capabilities essential for large-scale production. We are Speaking at the Free-To-Attend On-Line Innovations Festival on 25 April 2024.
Register to hear our talk, and meet us during the virtual networking. We have looked critically at this transition. Investments in Industrial-scale equipment, though substantial, ultimately leads to significant cost reductions in large-scale production. This is essential if manufacturers want to achieve sustainable, cost-effective printed electronics. Moreover, the transition to industrial-scale equipment like Rotary Scr...
4 April 2024
Extending the pot life of silicones to several months: LEDs, 3D printing and beyond
How to extend the pot life of silicone to several months without changing its material properties? Ulrich Trog [ Ulrich.Trog@joanneum.at | JOANNEUM RESEARCH] explains in this article how this is possible JOANNEUM RESEARCH offers the formulation of the appropriate compound based on feasibility studies of the silicones used by its customers. Licences for the Supresil™ technology are available. Platinum (Pt)-cured silicones are gaining in popularity, emphasising addition curing over traditional peroxide methods. This process ensures purity and efficacy, resulting in products with increased strength and superior aesthetics. The rise of Pt-curing marks a significant shift in silicone manufacturing techniques, promising unmatched quality and durability in a variety of applications. When crosslinking is initiated, the curing process starts almost immediately and the resulting silicone typically has a pot life limited to a maximum of a few hours at room temperature. This places significant practical and technological limitations on its use: short processing time manufacturing waste difficult reproducibility inflexible manufacturing process Our patented formulation greatly increases pot life via reversible inhibition of the crosslinking via hydrosilylation . After deposition, the inhibitors evaporate easily. Normal crosslinking occurs at mild temperatures, even below 80 °C, leading to a fast and complete curing. Join the Future of Electronics RESHAPED event in Boston on 12 & 13 Ju...












