Author: Cesar Omar Ramirez Quiroz | corq@gm.dk A functional material may perform well in the laboratory but producing it continuously and consistently is a very different challenge. This is a common issue in printed electronics, batteries, fuel cells, solar technologies, and other functional thin-film applications. As a process moves from laboratory trials to pilot production and industrial manufacturing, more variables come into play. Scale-up is not simply about increasing speed or using a wider web. The material, substrate, equipment, and individual production stages all need to work together. What changes during scale-up? Laboratory development often involves short samples, small quantities of material, and relatively slow processing speeds. Parameters can be adjusted between trials, and each production step can be examined separately. In roll-to-roll manufacturing, the substrate moves continuously through several stages. Coating, drying, curing, web handling, registration, inspection, and converting become part of the same process. Increasing the line speed, for example, reduces the time available for drying or curing. Moving to a wider web can increase output, but it may also make coating uniformity and tension control more difficult. A successful laboratory result is therefore only the starting point. The next task is to find a stable process window that can maintain the required quality throughout a complete production run. We are exhibiting at The Future of Electroni...

Author: Thibaut Soulestin, PhD; Technology Manager Printed Electronics; Henkel Adhesive Technologies; thibaut.soulestin@henkel.com Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in adhesives, sealants, and functional coatings, Henkel has developed a broad portfolio of LOCTITE® conductive inks and coatings. The LOCTITE® Printed Electronics portfolio includes more than 100 material solutions. Henkel silver inks are recognized for their reliability, printability, and ease of processing. This article examines silver-plated copper (SPC) inks as a lower cost and more price-stable alternative to conventional silver inks. It explains importance of raw material selection and formulation behind reliable electrical conductivity; and presents processing, aging, and compatibility data for LOCTITE® ECI 4010. We are exhibiting at The Future of Electronics RESHAPED in Berlin on 21-22 October 2026 Please register to meet us in person and see our technology in action. Economical Context Silver price fluctuations directly affect the cost of conventional silver-based electrically conductive inks. Over the past 20 years, silver has shown large and rapid price variations, as shown in Figure 1. A first peak occurred in 2011-2012, close to 50 USD/tOz. Earlier this year, silver reached record prices above 100 USD/tOz. Prices have since decreased, but have not returned below 30 USD/tOz. Silver demand remains supported b...

Flexible & Printed Electronics: Commercialising 2D Materials for Industries Applications Event, taking place on Tuesday 3rd November 2026 at the Graphene Engineering Innovation Centre (GEIC), University of Manchester. This full-day event will bring together industry leaders, manufacturers, innovators, and researchers to explore how graphene and other advanced 2D materials are enabling the next generation of flexible and printed electronic technologies. Attendees will gain practical insights into real-world applications, manufacturing challenges, commercial opportunities, and routes to adoption. The programme includes: Expert presentations on the latest developments in flexible and printed electronics Industry case studies and commercialisation insights Networking with technology leaders and potential collaborators Tours of the world-leading GEIC facilities Opportunities to explore future partnerships and innovation projects Whether you are involved in product development, manufacturing, innovation strategy, business development, or technology scouting, this event offers a valuable opportunity to understand how advanced materials can create competitive advantage within your organisation. Date: Tuesday, 3 November 2026 Time: 09:00 - 17:00 Location: Graphene Engineering Innovation Centre (GEIC), University of Manchester, Manchester M1 3B To register, please visit: https://www.eventbrite.com/e/flexible-printed-electronics-commercialising-2d-materials-for-industries-tickets-1996...

Author: Erika Rebrosova, Ph.D is Global Technology Manager for Electronic Materials at Sun Chemical Screen printing is the dominant process for printed electronics manufacturing. Screen printing is capable of multilayer patterning of materials with different functionalities. These include conductive, resistive and insulating layers. This method of printing is used to manufacture various electronic components and circuits. For example, printed touch switches for control panels, displays, lighting, flexible heaters, printed antennae and medical electrodes. Additionally, various sensors are used in environmental monitoring, wellness and healthcare monitoring and even medical diagnostics. As printed electronics continue to expand into healthcare, automotive, industrial and consumer applications, material performance has become increasingly important. Sun Chemical works with manufacturers to develop functional ink solutions that help enable reliable and scalable printed electronic devices. We are exhibiting at The Future of Electronics RESHAPED in Berlin on 21-22 October 2026 Please register to meet us in person and see our technology in action. Electronic Manufacturing Printing Traditional high-speed printing methods – such as flexography and gravure – are rarely used in electronics manufacturing. These methods are typically used for low power interconnects and sensors in niche and specialty applications. They include electronic medical adherence packaging, smart adult incon...

We would like to start our regular newsletters bringing you snippets of cutting edge knowledge and insights from our events across the world. In this newsletter we share short selected videos showcasing key innovations in additive and printed electronics. If you wish to learn more join us at the Future of Electronics RESHAPED conference and tradeshow in Berlin on October 20–22, 2026, where the entire industry meets to learn and do business. NoiseFigure Research | Dr. Manish Ojha | Can we bridge the gap between high-resolution sub-10 micron printing and industrial-scale manufacturing throughput for flexible packages? Iris Light Technologies Inc. | Pradeep Subedi | Can 2D Black Phosphorus Eliminate the Gluing Costs of Silicon Photonics? Lockheed Martin | Paul Gaylo | How do you build high-frequency RF antennas that survive high temperatures without cracking the ceramic substrate? iGii (Integrated Graphene) | Michelle Ntola | Can we integrate 3D nanocarbons directly onto silicon and metal foils without binders? Tapecon | Brad Hull | The Evolution of Smart Labels: From Identification to Intelligent Interaction. ChemCubed | Daniel Slep | How do molecular precursor inks achieve near-bulk conductivity without particle fillers? Sefar | Mark Pintar | How does mesh geometry determine whether your conductive paste prints like a "skyscraper" or a flat "factory"? Tatsuta | Robert Wilson | Can we bypass the high cost of silver in conductive inks without suffering from copper's extreme oxid...

Author: Marcel Grooten <m.grooten@domicro.nl> Introduction Additive Manufacturing Electronics (AME) and Flexible Hybrid Electronics (FHE) are transforming how electronic devices are designed and produced. Instead of relying on traditional PCB manufacturing processes such as copper etching and multiple lamination steps, electronic circuits can be built layer-by-layer. Using the innovative inkjet printing system ElectroJet™ by ChemCubed (Figure 1), multiple conventional production steps are replaced by depositing only the required material. This turn-key inkjet printing platform enables rapid prototyping, complex geometries, customization, and multi-material printing while protecting your IP (Figure 2). Figure 1: Block diagram of the setup of the printhead of ElectroJet™ printers (left) and the ElectroJet™ UV3D-3200 printer system (right). We are exhibiting at The Future of Electronics RESHAPED in Berlin on 21-22 October 2026 Please register to meet us in person and see our technology in action. Figure 2: Demonstrators manufactured by ElectroJet™ printing equipment Incorporating Carbon nanotubes (CNT) in Dielectric materials A critical component in printed electronics is the dielectric material. However, improving the mechanical and thermal performance of printed dielectrics without compromising their electrical insulation remains a major challenge. To address this, a novel method for incorporating carbon nanotubes (CNTs) into a UV-curable dielectric material was developed ...

Introduction Recent industrial and academic research has produced many optoelectronic materials with improved properties. Perovskite, quantum dot, and 2D materials have enhanced the range of existing organic and inorganic materials suitable for light-emitting diode (LED) or photodetector (PD) applications. Researchers with access to conventional laboratory equipment can produce working demonstrations of individual diodes to characterise properties related to electro-optical performance and therefore select suitable applications where the new materials could be employed. Moving beyond this toward productization for practical applications brings with it a number of challenges, since the use case for the consumer world requires a much more polished demonstration, closer to existing industry standards and quality. The decision by funders to invest further financing into R&D for novel materials is often influenced by a functional prototype incorporating those materials in a display or imaging device. The increase in complexity required to go from single pixels to high-yield arrays with 100,000s of pixels extends far beyond the capability of the equipment sets available to the team that made the material innovation. Figure. (Left) Perovskite Crystal Structure. (Right) Quantum Dot Emission Transforming lab results into impressive product-ready prototypes LED or PD arrays are typically made with pixel counts beyond what may be achieved using simple direct drive connections, such as ...

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. The event is co-located with Electronic Textiles RESHAPED, Sustainable Electronics RESHAPED, and Perovskite Connect. In this article, we highlight various innovative talks around the theme of material, ink and paste innovations — the formulations that sit at the heart of every printed device. From silver-coated copper and room-temperature copper processing to biosensor inks, graphene formulations, and the substrates and adhesives that everything is printed on. In future articles, we will cover digital deposition, manufacturing and hybrid integration, and printed applications. Explore the full agenda now and register to join the event — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Conductive Inks & Pastes: The Silver Question and the Copper Answer With silver prices and price volatility at record highs, the search for cost-effective, high-performance conductor materials has never been more urgent. Ames Goldsmith (USA) – Daniel Lacorte presents advances in silver-coated copper materials for high-performance printed electronics. As geopolitical uncertainty drives silver prices to new heights, core-shell si...