TechBlick’s The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is just three weeks away! This year’s agenda once again covers the state-of-the-art across the full innovation spectrum of additive, sustainable, printed, hybrid, R2R, 3D and wearable electronics. In this article, we introduce the conference agenda, summarising the innovations that will be showcased as part of the conference program. The list below does not correspond to actual agenda timings. Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor | Masterclasses Fuji Corporation Inkjet-printed silver nano-inks on UV-curable substrates for multilayer circuits with embedded components. GE Aerospace Additive RF sensors and packaging for aerospace applications rated up to 1000 °C. Lockheed Martin Case study on flexible hybrid electronics adoption, incl. copper additive manufacturing and flexible RF circuits. Valeo Printed and in-mold electronics integration into vehicles, addressing automotive specs and quality demands. Akoneer Laser-processed multilayer glass PCBs for semi-additive semiconductor packaging, demonstrating high-density interconnections on glass substrates. AMAREA Technology Multi-material 3D printing of ceramic components with integrated electronics. CEA-Leti Additive PCB fabrication replacing subtractive methods to enable sustainable electronics. NanoPrintek Inkless nanoparticle-based dry printing without sintering via...

Authors: Andrew Stemmerman, John Yundt, Kathy Ritter | SunRay Scientific Inc., Eatontown, NJ USA | andrew@sunrayscientific.com johny@sunrayscientific.com, kathy@sunrayscientific.com SunRay Scientific of Wall Township, NJ, USA has developed a versatile interconnection technology for flexible and stretchable electronics on Thermoplastic Polyurethane (TPU) substrates for wearables. This article will outline the developments of this suite of conductive and dielectric stretchable inks with strong adhesion to mechanically flexible substrates, paired with a high-performance magnetically aligned Anisotropic Conductive Epoxy (ACE). The ACE interconnect material, with ferromagnetic conductive particles aligned along the z-axis, forms vertical conductive pathways to connect multiple component styles to the stretchable circuits on flexible TPU. The ACE additionally provides the strong mechanical bond for the components, with the entire assembly capable of surviving wearables’ wash cycles. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Introduction Thermoplastic urethane (TPU) substrates, with flexibility, wear resistance and skin-compatibility, are ideal for wearable electronics applications. Wearables require stretchable circuitry with high density for integration and miniaturization. Printable materials enable low-cost electronic circuit fabrication processes. SunRay Sc...

The show will take place next week on 24 & 25 Sept 2025 at the High Tech Campus, Eindhoven, Netherlands. Explore the program here The exhibition spots are all sold out and the registrations have long exceeded the 2024 levels. We hope you will join us and we look forward to seeing you all there. In this article, we introduce the talks that are to be given onsite at the show. Google – Bernard Kress discusses the evolution of light engine technologies for smart eyewear, highlighting design tradeoffs and innovations needed to enable all-day wearable AR glasses. Avegant – Edward Tang contrasts LCoS and MicroLED display engines for AR glasses, examining their respective strengths and tradeoffs as the industry moves toward mainstream adoption. VueReal – Reza Chaji outlines the manufacturing benchmarks microLEDs must achieve—from yield and cost to scalability—to enable transition from niche deployments to broad consumer and industrial adoption. ITEC – Joep Stokkermans introduces XG-Alpha, a flexible lab tool for microLED development that combines laser-based droplet dispensing and die transfer with in-line metrology, dynamic gap control, and optical inspection—aiming for high-yield, cost-effective assembly and paving the way toward next-gen industrial platforms. Aledia – Xavier Hugon presents nanoLED arrays grown on silicon, where GaN nanorods form photonic-crystal structures with intrinsic directive emission and tunable RGB capability, enabling >6000 ppi ultra-compact microdisplays ...

Connecting flexible circuits to traditional printed circuit boards (PCBs) is commonly called flexible-to-rigid interconnections. They enable flexible sensors, displays, wearables, and other flexible electronics to communicate with microcontrollers, power management systems, and external devices. MATERIALS USED NovaCentrix HPS-U11 silver nanoparticle ink ACI FS0142 flexible silver ink ACI SS1109 stretchable silver ink ACI SC1502 stretchable carbon ink ACI FC3203 flexible carbon ink VFP ECV003 UV-curable dielectric ink T4 Solder paste SUBSTRATES USED Polyethylene terephthalate (PET) Thermoplastic polyurethane (TPU) Polyimide (Kapton) 3" × 4" FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Würth Elektronik 687140149022 FFC connector TE Connectivity AMP Connectors 487923-1 contact crimp pin connector Amphenol ICC (FCI) 66226-004LF 4 position FFC connector header CW Industries CWR-142-10-0203 IDC connector 3M electrically conductive adhesive transfer tape 9703 TLKKUE B0B1B33TZJ 10 mm snap connectors Guangshunle B0CXLL458K 15 mm snap connectors Arduino Micro controller We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Project overview Purpose The goal of this project was to validate five different ways of making reliable, accessible interconnections between flexible and rigid circuits — a common use case for a lot of our customers and essential...

By Pierre Laboisse, President & CEO of Aledia For more than a decade, microLED technology has captured the imagination of display engineers, semiconductor innovators, and industry analysts. The promise has always been clear: unmatched brightness, durability, and energy efficiency. The challenge has been turning that promise into a mass-market reality, a process that has proven to be complex and slow. Now, in 2025, the pieces are finally coming together. From materials breakthroughs to smarter manufacturing methods, microLED is at a critical inflection point. At Aledia, we have always believed that solving physics was only part of the equation. True success also depends on solving economics, process scalability, and systems integration. This year, momentum is building across all these areas. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 At the Core: Materials and Emission Mechanics At Aledia, we are pioneering a fundamentally different approach to microLEDs. Unlike traditional planar technologies, our 3D microLED architecture, built from silicon nanowires, enables far greater light extraction, power efficiency, and manufacturability using existing 200 mm IC manufacturing lines. Our innovations in GaN-on-silicon nanowire growth allow full-color emission from a single material system. This directly addresses the long-standing RGB alignment challenge in lining up red, green, and blue sub-pixels at microscopic sca...

Low Resistance Carbon Inks, Print Production, Perovskite Cells & Applications. Why carbon inks matter for the future of perovskite solar. GraphEnergyTech Ltd will be presenting at TechBlick Perovskite Connect 2025 in Berlin. Authors: Thomas Baumeler, Chris Jones, chris.jones@graphenergytech.com, GraphEnergyTech Ltd Scaling perovskite solar & the challenge of moving from a reliance on silver The solar industry accounted for approximately 19% of global silver demand in 2024 according to The Silver Institute, with projections suggesting that by 2050 this figure could be at 113% of current production. Silver has cost pressures, price volatility & environmental problems; as well as degradation issues that reduce stability & device lifetime. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend The case for carbon & graphene Our work focuses on replacing silver with carbon/graphene-based inks. A simple goal of high conductivity, low cost & environmental responsibility. GraphEnergyTech’s printable carbon electrodes are already delivering lower resistance than traditional carbon inks, with up to 87% cost reduction compared with silver and a 97% lower carbon footprint. By tuning our formulations, we are achieving repeatable sheet resistance values below 0.1 Ω/□ at low application weights. These translate into test cells reaching over 21% power conversion efficiency with engine...

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 95 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of R2R and reel-to-reel manufacturing of electronics and photovoltaics. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. Explore the Full Agenda and Register before 10 October 2025 for the best rates Wiliot – Eylon Gersten presents scaling ambient IoT with battery-free Bluetooth tags. Produced via reel-to-reel manufacturing, these ultra-low-cost inlays integrate printed sensors for temperature, humidity, light, and proximity. The talk highlights Wiliot’s novel communication method and the role of printed electronics in enabling sustainable, large-scale deployment of bil...

Author: Tobias Steinel, Steinel@instrumentsystems.com, Instrument Systems GmbH, Munich, Germany Background MicroLED (µLED) displays promise high contrast, fast response, wide color gamut, and long lifetime. However, production faces critical challenges: Massive parallelization of testing: Millions of tiny µLEDs must be characterized quickly. Metrology limitations: Narrow emission bandwidth and strong wavelength variability (≈5 nm) demand both speed and spectral accuracy. Hardware requirements: In order to rapidly test and measure millions of µm sized µLEDs high resolution optics and cameras as well as precise detection algorithms are needed to avoid image artefacts due to low oversampling ratios (Rs). Fig. 1: Detail of a highly resolved image of a microLED microdisplay, white test pattern Traditional LIV measurements with integrating sphere methods are too slow (hours per wafer). To address this, the authors developed a spectrally enhanced imaging light measurement device (ILMD) – the LumiTop system – which combines a high-resolution camera with a traceable spectroradiometer. Fig. 2: Comparison of LIV and imaging photoluminescence measurement setup Methodology Color Calibration: Live calibration is performed for every image, using the spectroradiometer to adapt to spectral variations from manufacturing tolerances or drive conditions. [1,2] Experimental Setup: [3] Photoluminescence (wafer test): µLED 6”wafer with 17M µLEDs; 165 stitched images captured ≈100,000 µLEDs per fram...