At Fraunhofer EMFT, the latest advancements in digital lithography unlock new opportunities for high-throughput, sustainable electronics manufacturing. By combining a direct-write UV exposure system tailored for fully automated roll-to-roll (R2R) operation with a semi-additive processing approach, we enable the production of ultra-long, even theoretically endless, high-resolution metal patterns. A digitally controlled stitching technique ensures seamless alignment over extended foil lengths, expanding the capabilities of continuous electronics manufacturing.

This versatile platform supports a wide range of applications. Examples include tamper protection foils, flexible superconducting interconnects, and high-density flexible cables for medical catheters. Our technology further allows assembly and integration of packaged or bare die components via advanced bonding methods. We seamlessly combine printing, digital lithographic patterning , and precision integration techniques to deliver adaptable solutions tailored to specific functional and industrial demands.

Mass-produced components are either exact replicates, or contain a high percentage of replicate circuitry, making their manufacture well suited for “analog” print technologies. While screen printing dominates current printed electronics manufacturing, the use of roll-to-roll flexography can be advantaged for volume production of high-resolution designs. This talk will provide an overview of the benefits and challenges of “going roll-to-roll” and using flexo. Examples and data will be shared from lab-scale and production scale evaluations.

The exponential growth of computing, connectivity, and intelligent devices demands breakthroughs in how materials, electronics, and systems are built. Conventional semiconductor and microfabrication methods are increasingly constrained by limitations in scalability, flexibility, and sustainability.

Direct Atomic Layer Processing (DALP) offers a new approach: atomically precise, direct, and selective material processing on complex surfaces. Instead of incremental improvements to established methods, DALP represents a paradigm shift, from planar, rigid, and centralized chip-making toward flexible, on-demand, and design-driven fabrication.

This capability enables rapid material discovery and prototyping, accelerating the path from concept to functional device. It also opens new opportunities in advanced packaging, MEMS and sensors, and catalysis, where precision, adaptability, and material diversity are critical. DALP paves the way toward a future where innovation in materials and devices can happen faster, smarter, and with unprecedented freedom.

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In the era of digitalization and Industry 4.0, sensor technology is pivotal for real-time
monitoring and data collection, significantly impacting product life cycle management.
Traditional strain gages are produced via complex lithographic processes and require
manual bonding, leading to potential quality inconsistencies affecting data accuracy.
Direct application through digital printing offers a promising alternative, aiming to reduce
production costs while enhancing quality assurance.
Printed electronics require the ink to be sintered for conductivity, with most processes
striving for maximum conductivity. However, the printing process often results in
inconsistent local conductivity, impairing sensor performance. Laser technology provides
a solution by enabling precise control over the local sintering degree, thus optimizing
conductivity. Initially, low-power sintering is applied, followed by conductivity
measurement, potentially through contactless THz radiation. Local conductivity variations
due to printing inconsistencies are then addressed with a second sintering step to
standardize and improve sensor quality.
This study explores the impact of laser parameters on the local conductivity of thin silver
layers during both sintering steps, identifying defect sources and achieving resistance
fluctuations below 1 Ω. This method aims to fulfill stringent commercial strain gauge
sensor requirements.

Laser thermal processing is by far the most effective way to heat up NIR-absorbing materials.

The first step in sustainability is choosing green materials, followed by selecting energy-efficient technologies.

We offer enabling solutions in laser sintering, encapsulation or soldering through innovative partnerships with material suppliers, institutes, and system integrators.

Glass is becoming a popular material for electronics and semiconductor packaging. Using laser technologies we have created methods to do multilayer glass PCB with high interconnection density.

The miniaturization and complexity of modern microelectronics and advanced packaging present significant manufacturing challenges, often requiring the use of specialized low-viscosity inks and expensive plating processes. To address these limitations, we introduce Pattern Transfer Printing (PTP™), a novel laser-based, non-contact technology capable of microscale printing with high-viscosity pastes.
This technology enables the use of standard metal pastes, such as silver, copper, and solder, to produce high-resolution conductive patterns and electrodes. PTP™ has been successfully implemented in the photovoltaic (PV) industry for high-throughput, mass production, achieving fine-line fingers as narrow as 10 μm for both TOPCon and HJT cell technologies.
Furthermore, PTP™ serves as an effective alternative to costly plating methods in the semiconductor industry, capable of printing solder bumps down to 20 μm for advanced packaging applications. The unique capabilities of PTP™—combining high-resolution patterning, material versatility, and high aspect ratios—make it a key enabling technology for the next generation of semiconductor and microelectronic manufacturing.

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High-performance perovskite photovoltaic panels optimized for low-illuminance environments enable continuous power for IoT devices and consumer electronics without the need for disposable batteries. By tailoring the perovskite composition and device stack for spectral alignment with artificial light sources, combined with advanced encapsulation techniques, exceptional efficiency and operational stability are achieved under indoor conditions. The lab-to-fab transition is facilitated through scalable, industry-compatible printing and coating processes ensuring,, cost-effectiveness at scale. This integration of material innovation and manufacturing process control delivers compact, high-power indoor PV modules that advance sustainable, maintenance-free electronics and significantly reduce electronic waste in the rapidly growing energy harvesting market.

PINA Metal Oxide Nano Inks: Engineered Electron Transport Layer (ETL) and Hole Transport Layer (HTL) Solutions for High-Performance, Low-Temperature Perovskite and Organic Solar Cells.
Efficient and stable perovskite and organic solar cells rely heavily on the quality of their ETL and HTL—yet current organic and high-temperature metal oxide materials often suffer from poor stability, interfacial defects, high cost, and limited compatibility with flexible substrates. PINA Creation addresses these challenges with advanced ZnO and SnO₂ nano inks (ETL) and NiO nano ink (HTL) that enable high-quality thin-film fabrication below 120 °C in just a few minutes. These formulations are chemically engineered for optimal interfacial contact and energy alignment, offering superior compatibility with perovskite layers in both n-i-p and p-i-n architectures, resulting in enhanced performance, scalability, and long-term
durability.

TotalEnergies as one of the largest developers of renewable energies projects is actively assessing perovskite technologies. The presentation will look at the market introduction of perovskites from a developer's perspective, considering the costs and environmental impact as well as the importance of reliability. The barriers for market introduction and the requirements will be highlighted. For developers, getting access to field performance data and being able to test PV modules both in the field and in the lab is key for gaining trust in a novel technology.

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