As applications for conductive inks continue to emerge in Printed Electronics, so do the substrates that these inks are printed onto also expand. Many of these substrates such as PVDF, PVC and PC require to be processed at temperatures much lower than what a conventional Polymer Thick Film (PTF) ink can be processed. Heat Stabilized PET has traditionally been used because of its dimensional stability at the temperatures (120°C – 140°C) required to process conventional inks. Nagase ChemteX America, LLC. (NCU) has developed a silver (CI-1095) low-temperature, curing conductive ink for Printed Electronics applications. The silver ink can be processed at 80°C for <10 minutes and achieve resistivity suitable for most Printed Electronics applications. In Figure 1, below, is a chart comparing CI-1095 processed at 80°C compared to a conventional PTF ink, CI-1036. Figure 1 As can be seen in Figure 1 CI-1095 after 8 minutes at 80°C has resistivity of 0.020 ohm/sq/mil whereas the CI-1036 is 3.5x higher. This is excellent resistivity for processing at 80°C. While the CI-1095 does process at 80°C this does NOT have a negative impact on screen life. Figure 2 shows that the CI-1095 has comparable screen life compared to CI-1036. Figure 2 In testing screen life, NCU placed each material on the screen and made prints every 15 minutes for two hours. There was negligible change in dry film thickness (DFT) for the low temp ink, CI-1095, and the conventional cure ink, CI-1036. This would indicate that even with the capability to process at 80°C there is not an impact on the screen life. While the CI-1095 can be processed at 80°C, users shouldn’t assume that being able to process at lower temperatures should equate to faster processing at conventional temperatures such as 120 – 130°C. Figure 3 demonstrates that while CI-1095 could be processed at 120°C it does not process faster. It’s the unique chemistry of the CI-1095 that allows for it to be processed at low temperature. Figure 3 Adhesion is another critical factor to consider when working with substrates that must be processed at low temperatures. Table 1 shows cross-hatch adhesion testing. Table 1 *There are many different grades of the substrates noted. Each grade should be tested for compatibility. Because of being able to process conductive ink at a low temperature such as 80°C this allows the potential use of substrates that couldn’t be previously used in Printed Electronics applications. Potential markets include consumer electronics, medical, automotive as well as many others. For further information please contact Alan Brown at abrown@nagasechemtex.com or visit www.nagasechemtex.com. The Future of Electronics RESHAPED Join the flagship TechBlick event and the global industry in Berlin on 17-18 OCT 2023. Visit our booth.

Authors: Dr Adam Scotch and Jessica Albright Manually sampling for water monitoring is inefficient and inadequate Standard methods of detection for heavy metals and toxic inorganics involve manually sampling water followed by complex laboratory procedures and instrumentation with a slow turnaround time, all of which is subject to human error. A specialist might be needed for the sample collection, further adding to the expensive laboratory testing. Frequent calibration is required to ensure accuracy and reliability of measurements. Testing methods are not modular and follow a very specific procedure, which usually requires multiple systems to test for additional parameters, which can delay results up for up three days. Currently, there is not an in-line monitoring solution on the market able to detect on a part-per-billion range. The severe detriments of lead contamination The EPA has set the maximum contaminant level goal for lead in drinking water at zero because lead is a toxic metal that can be harmful to human health even at low levels. With nearly 412,000 deaths attributed to lead contamination annually in the United States, monitoring metal levels in water is a concern of life or death. There is no safe level of lead consumption for anyone. Lead is especially damaging for children and can damage developing brains leading to reduced intelligence quotient (IQ), attention span, impaired learning ability, and increased risk of behavioral problems. Prompt detection and remediation of any lead or other toxic contaminants in drinking water is imperative. https://www.techblick.com/electronicsreshapedJoin us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 -www.techblick.com/electronicsreshaped Rapid deployment of sensors integrated with network connectivity provide real-time actionable insight Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. After fabrication, the resulting array is comprised of solid-contact ion-selective electrodes (SC-ISEs) for detecting analytes Pb2+, NO3-, and H+, along with a reference electrode and conductive pathways for measuring temperature and ionic conductivity. Brewer Science’s innovative water sensors are made possible by combining printed electronics with next-generation materials. The result is a continuous real-time monitoring platform capable of multisensing arrays and associated multifaceted sensor solutions. This system is incredibly adaptive and can be integrated and customized for use in numerous industries and applications. Real-time actionable data is necessary to make preemptively make changes to ensure water quality is safe. Being able to make prompt and impactful decisions requires quantitative water quality measurement data presented in a dashboard that is easily communicated without specialized training, and enables a user to access the data remotely, in real time. This is achieved by using a hybrid integrated system consisting of printed electronic sensors interfaced with a software suite. The printed circuit board equipped with electrochemical methods, calibration solution, and sensor substrate connects to the software using either cloud-based through Wi-Fi network, Bluetooth, or USB. Calibration in water quality monitoring is crucial for ensuring accuracy and reliability of the measurements. However, it can be a time-consuming, labor-intensive process to manually compare readings obtained from measuring instruments to a known standard or reference value. Using a smart integrated system equipped with a chemical flow of calibration solution is an efficient and reliable method to ensure each measurement is accurately reported. Calibration solution is incorporated into the system along with code-driven automation that prompts the chemical flow cell to take accurate measurements with up-to-date calibration. The diagram illustrates a basic schematic, where the flow cell, pump, and valves are all housed with a sensor device that is approximately 4 inches in length. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 -www.techblick.com/electronicsreshaped Printed water sensors can be utilized in diverse monitoring environments The versatility of the technology enables a wide range of applications, spanning from residential “smart water” applications to municipal wastewater reservoirs. With the small profile the sensor is not limited to strictly laboratory use, a challenge current detection systems face. Source Water and Wastewater Residential Commercial Industrial Educational institutions Fresh Water Sources Lakes Rivers Streams Ponds Infrequent Wastewater Sources Farm run-off City storm drains Other sources of periodic water flow Essential criteria when selecting a water sensor With a wide range of applications in mind, Brewer Science offers a versatile solution specific to a customer-unique need. When selecting a water sensor, it’s important to consider the customer’s needs, intended application, and ensure the water sensor meets those anticipated needs. Some typical inquires to consider include, sensing range and sensitivity power needs exposure needs (in solution or not) lifespan query methodology (electrochemical methods) calibration needs determine who calibrates the device The graph illustrates measurement range and sensitivity of measuring lead, nitrate, and pH Arrays for on-demand water-quality monitoring For seamless implementation and successful integration, you need a provider that will not only create and calibrate the devices for you but assist in the entire process of ensuring the software meets the needs of your business and be accessible per your service requirements. Brewer Science has experience serving a diverse range of customers with unique business needs. This allows us to have a specialized approach to each customer’s requests and create a customized solution for your needs. A successful water sensor application is comprehensive, both in its implementation and analytics Brewer Science is committed to end-to-end solutions for our customers. We have been developing a sensing platform to interface with our sensors and deliver the measurements fully evaluated to our customers. The internet of thing (IOT) aspect of the water monitoring initiative includes: Measurement Data Transport Data Interpretation Presentation to the User Results Device Health Login Protected Information Brewer Science has developed a full-service water sensing platform that starts with measurement at the sensor with custom electronics. Our printed circuit boards and firmware will apply electrochemical methods to the sensors and gather the data. From there we will supply the customer with an appropriate data transport solution from LAN network connections to cellular networks. Once the data is transported to the cloud our machine learning will quickly transform the raw data stream into a meaningful data set with reportable metrics. The software team will then provide the customer with a portal to view their measurements, see device health, and secure it all behind username and password access. Brewer Science is focused on delivering critical, real-time information to our customers to achieve their goals, solve their problems, and improve their current systems. Brewer Science offers a full spectrum of services based on the customer’s need, ranging from materials development, electronics design, or a complete solution. You can learn more about Brewer Science printed electronics on our website. Or contact us if you’re interested in exploring arrays for on-demand water quality monitoring.

Integrating ultra-thin large area electrical radiant heaters into interior surface and furniture materials enables fast response warmth. Controlling heating like lighting delivers increased energy efficiency, comfort, and better health in built environments. This talk looks at how The Warming Surfaces Company is bringing its Halia™ warming technology to various surfaces to improve people’s lives while reducing material and energy requirements of heating. SAVE THE DATE

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Author: e2ip Technologies | Contact us [https://e2ip.com/contact/] Flexible and thermoformable printed electronics have become increasingly popular in recent years as they offer a cost-effective and versatile alternative to traditional electronics. The ability to print electronic devices onto a variety of substrates, including plastics, textiles, and even paper, has opened new avenues for innovation in Smart Structural SurfacesTM. In this article, we will discuss the applications and challenges of three types of flexible and thermoformable printed electronics that require fine line printing capabilities: Capacitive Touch Switches, Transparent Printed Heaters, and Metasurfaces. Capacitive touch switches, such as CapFlex®, use capacitive sensing to turn any surface into a touch-controlled electronic smart surface. These switches are typically made of a thin, flexible printed circuit layer sandwiched between a backing layer and a top overlay. The compact design eliminates the need for additional mechanical parts, and the surface becomes the screen. With CapFlex®, designers can create customized touch controls on a variety of surfaces, including plastics, glass, and even curved or irregularly shaped surfaces. Transparent printed heaters use fine line printing process to generate heat, making them more energy efficient by improving the heat diffusion. The design pattern allows the technology to adjust the desired temperature and transparency according to the electrical requirements and the applications. The materials used in this process are all qualified for both indoor and outdoor applications, making them suitable for a wide range of applications including new possibilities for Smart Structural SurfacesTM. Fine Line printing process is applicable in a lot of different industries and applications. Advanced Screen Printing requires a lot of adjustments to obtain the desired results. Regarding screen printing, two main criteria must be considered: The robustness of the screen: The size of your pattern will dictate the size of your screen. Fine line meshes are expensive and, for some of them, fragile due to the wire diameter required to achieve resolution as small as 20um. Define the exact requirements and work with your supplier to select the best match for your application. The ink: most inks used in PE right now are made of flakes and solvents. The critical point is the size of the particles when it comes to fine line. Nanoparticles or particle free inks with low solvent evaporation or UV curable inks should prioritized. To overcome these challenges, engineers must continue to develop new materials and design for manufacturing that address these issues. Advances in materials science, ink formulations, and printing technologies can help to improve the robustness of flexible and Thermoformable printed electronics, making them more durable and long-lasting. Additionally, advances in automation can help to reduce the time and cost associated with mass production, making large-format screens more accessible to a wider range of industries. In conclusion, flexible and thermoformable printed electronics offer a wide range of applications and benefits over traditional electronics. They enable almost any surface to become a touch-controlled electronic smart surface, offer improved safety and energy efficiency, and can help to enhance the propagation of wireless signals. Despite the challenges associated with the adoption of this technology, continued innovation and development can help to overcome these issues, making flexible and thermoformable printed electronics a more viable option for a wide range of industries.

Ryojiro Tominaga Company: Fuji Corporation In recent years, 3D printer technology that can manufacture bare PCBs using digital printing technology for both conductors and insulators has been developed. However, it is essential to optimize the SMT process in accordance with the transformation of the bare PCBs manufacturing process for the practical application of this technology. Fuji will introduce a novel machine that combines the additive manufacturing process of bare PCBs and low-temperature SMT technology optimized for this purpose SAVE THE DATE

Andree Maindok Speaker: Celanese Silver sintering pastes and films are widely used for attaching SiC dies to their substrates in modern power electronics. They offer mechanical stability to well above the use temperatures (>200C), high thermal conductivity, and do not form brittle inter-metallics. They provide a strong, high reliability bond, especially when sintered with pressure assistance. However, they are not always easy to work with. Developing a product that will sinter at modest temperatures and with modest levels of pressure often results in an unstable formulation that requires cold storage and transport. These products then require conditioning to bring them up to working temperatures before they can be used. If the product cannot be dried before die placement, die size will be limited, or reliability will suffer due to trapped organics left after the sintering process. We have developed several novel paste formulations for sintered silver die, heat sink and top of die attach. They are shelf stable for months at room temperature, offer long open working times with little or no viscosity drift. They can be metal mask stencil printed syringe dispensed, or jetted, and are dried before placement (even when dispensed), allowing large area dies and substrates to be bonded without loss of reliability or thermal performance. We also have new developments in high reliability performance for large area heat sink attachment at reduced temperature and pressure. This allows attachment of encapsulated die/substrate structures onto heat sinks without damage to the organic encapsulant. Extensive reliability test data for these novel formulations will be shared that I SAVE THE DATE

OLED is widely known as the highest quality display on the market, used in flagship products such as high-end TVs and smartphones. Many of the early promises of OLEDs have been realized and commercialized, including their ultra-thinness and potential for flexibility. However, today's flexible OLEDs are still fabricated in much the same way as rigid OLEDs on glass. And most of the innovation in the field is still aimed at high-end consumer products. At Sinovia, we are using roll-to-roll flexographic printing to fabricate bottom-emitting OLEDs suitable for use in segmented, indicator, and passive matrix displays at price points that can compete with incumbent LCDs and LED assemblies. This is enabled by our proprietary materials technology and our in-house process, along with some key supplier partnerships. In this talk, I will cover our core technology, our development status, applications of our displays, and our future plans as we move toward mass production. SAVE THE DATE

We introduce a groundbreaking advancement in Magnetic Resonance Imaging (MRI) coil technology that addresses key challenges in medical imaging. Leveraging screen-printing techniques, our approach results into flexible, lightweight MRI coil arrays with enhanced coil performance and better patient experience. We report on the design and characterization of a 12-channel RF receiver coil array, including signal-to-noise ratio (SNR) studies performed in phantoms, volunteers, and patients. Phantom tests involving the pediatric printed coil indicated noise covariance matrices on par with those of the commercial coil, with a minor SNR reduction for the printed coil. Our work included a comprehensive study that assess the performance and acceptance of a pediatric-sized screen-printed flexible MRI coil array, contrasting it with conventional coil technology. Study participants, ranging from 2 days to 12 years in age, underwent MRI scans using the pediatric printed array. The results were benchmarked against historical control subjects who were scanned using a commercial 32-channel cardiac array at 3 Tesla. A survey of caregivers and clinicians demonstrated strong acceptance of the printed coil, garnering an average score of 4.1 out of 5, indicating a preference for the printed coil. The diagnostic quality of images produced using the printed coil was highly rated, achieving a quality score of 4.5. SAVE THE DATE

Speaker: Neil Chilton Company: Printed Electronics Ltd PEL is both an experienced manufacturer and specialist machine supplier for printable electronics. At TechBlick we present together with our key partner SIJ. In this presentation we will explain where we have used our knowledge to determine the optimal print methods for applications ranging from large area to ultra-fine-line printing. We will focus on new developments in SIJ including the high productivity multi-nozzle systems. SAVE THE DATE

Hee Hyun Lee, Ph.D. Lead Scientist at Celanese Micromax™ Electronic Inks and Pastes The global printed electronics market is huge and estimated to reach USD 23 billion in revenue by 2026, growing at a CAGR of 18.3% from 2023 to 2028 [1]. Increased demand for printed electronic products in automotive and the growth of consumer electronics are two key fueling factors to drive the market growth. The two critical segments require various reliable printed electronic products for applications from low temperature to high temperature. The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties such as conductivity, dielectric strength, and electrical resistance. Celanese Micromax™ Electronic Inks and Pastes is a global supplier of thick film pastes/inks and recently launched HT (High Temperature) ink series - HT602/603 resistors, HT702 dielectric and HT802 conductive inks for high-temperature and high-power applications. HT series inks can be printed additively by using screen printing or nozzle dispensing process on various flexible/rigid substrates including Kapton® FPC, Kapton® RS, FR-4, Aluminum, Alumina, and glass. The operation temperature of conventional PTF (Polymer Thick Film) ink is typically limited up to 200°C due to the thermal degradation issue of polymeric resin in ink formulations. In the printed electronic industry, high-temperature and high-power applications often require operation temperatures above 200°C. HT series inks were developed by using novel polyimide resin whose thermal resistant temperature is up to 300°C. Polyimide resin is flexible thermoplastic allowing much more flexibility compared to rigid thermoset Epoxy resins that have been used for the majority of high-temperature applications. Another key benefit of our polyimide resin is its chemical resistance. The unique combination of high-temperature resistance, flexibility and chemical resistance of HT series inks is expected to provide solutions for new high-temperature applications in the printed electronics industry which couldn’t be achievable by conventional PTF inks. This article will discuss key technical features of HT inks and their potential applications. HT602/603 resistors Printable resistor ink can be used to deposit passive resistive components directly on a substrate. Applications include heated floors, pressure sensors and variable potentiometers. HT602 and HT603 were formulated by adding different types of Carbon black powders in a polyimide medium for high-temperature or high-power applications. The average Rs (Resistivity) is 25 Ω/□/mil for HT602 and 300 Ω/□/mil for HT603, respectively. Two HT resistors may be blended to meet specific Rs targets. If a higher Rs value is required than Rs of HT603, HT702 dielectric can be blended with HT603. Figure 1 shows (a) plot of Rs vs. blend ratio of HT603 and HT602, and (b) Rs vs. blend ratio of HT603 and HT702. Figure 1. (a) Plot of Rs vs. blend ratio between HT602 and HT603; (b) Plot of Rs vs. blend ratio between HT603 and HT702. For reliable device operation, the resistance variation of the printed resistor should be minimal with temperatures. TCR (Temperature Coefficient of Resistance) of two HT resistors were measured at four different temperatures as shown in Figure 2. TCR data of HT602, 603 showed much lower values vs. conventional resistor inks (7082M, 7102) formulated with non-polyimide resin demonstrating more stable resistance values of HT resistors with temperatures. Figure 2. TCR comparison between HT602/603 containing polyimide and 7102/7082M containing non-polyimide resin. STOL (Short time overload) test was also performed to check how high power HT602 and HT603 could endure without resistance change. Chip resistor’s standard criterion is less than +/- 1% of R change up to 2.5 times of desired operating voltage. Different size of HT resistor pattern was screen printed over Ag electrode as shown in Figure 3 and 0.5mm x 0.5mm printed resistor was used to monitor resistance deviation during STOL test. Test condition is 5sec dwelling time with step increase of voltage. Both HT602 and HT603 showed excellent stable resistance up to 200W/cm2 power density (Figure 4). Figure 3. HT603 printed over Ag electrode on Alumina substrate for STOL test. Figure 4. STOL test to check Resistance change with step-changing voltage (power density). HT702 dielectric To prevent mechanical damage or chemical oxidation of electronic circuits on Flex or Rigid PCB (printed circuit board), the protective layer is applied on top of the metalized circuit. A Conventional protective layer in the PCB industry is applied by photoimagible soldermask (typically epoxy material) on the rigid substrate or high-pressure assisted thermal lamination of Coverlay (polyimide with acrylic adhesive) on flex circuit. Both photoimaging of solder mask and coverlay lamination not only require multiple process steps but also generate waste of materials. The incumbent protective layers also have deficiencies on the material side; the thermoset epoxy solder mask is typically not flexible and coverlay contains acrylic adhesive which is not thermal resistant above 200°C. HT702 formulated with thermoplastic polyimide resin is more flexible than thermoset epoxy solder mask and has much higher thermal resistance than acrylic adhesive used in coverlay. The unique combination of flexibility and thermal resistance of HT702 is expected to create new applications in PCB industry where incumbent protective materials have a deficiency. In addition, direct printable HT702 dielectric ink can lower the overall cost of ownership by decreasing process steps and material waste. Good dielectric strength (BDV > 0.5kV), excellent chemical resistance and excellent adhesion on various substrates are additional benefits of HT702. To achieve good dielectric strength and uniform coverage without pinhole defects, 2~3 printing and drying cycles are recommended. HT802 conductor HT802 is highly conducive and thermal-resistant ink formulated with silver powders and polyimide resin. High thermal/chemical resistant polyimide resin enables HT802 to be applicable to high-temperature applications such as electrodes for heaters or platable conductors where the plating process involves a caustic acid/base bath process. For example, figure 5(a) shows the HT802 electrode printed on 16in. x 16in. Kapton® RS flexible heater. Uniform heating performance was achieved up to 240°C (Figure 5(b)). Figure 5. (a) HT802 printed on Kapton® RS film as an electrode for flexible heater fabrication. (b) Uniform heating up to 240°C was demonstrated. Table 1 shows the performance of HT802 with different cure conditions. Resistivity decreased with higher cure temperatures while maintaining excellent adhesion on Kapton® film. Interestingly, crease resistance also became better (lower % increase of electrical resistance) when HT802 was cured at higher temperatures. Table 1. Resistivity, adhesion, and crease resistance of HT802 with cure condition. HT802 was screen printed on Kapton® film. Summary Micromax™ Electronic Inks and Pastes launched a new HT product line using noble Polyimide resin chemistry for high-temperature printed electronics applications. The unique combination of high thermal/chemical resistance, flexibility, and additive printability of HT inks is expected to provide solutions for various high-temperature applications on both flexible and rigid substrates. Visit our website: https://www.celanese.com/products/micromax to find a technical datasheet of HT products [2]. References [1] Printed Electronics Market Revenue Trends and Growth Drivers | MarketsandMarkets [2] Micromax™ Electronic Inks and Pastes (celanese.com)

Speaker: Arne Casteleyn company: Quad Industries In this presentation, we will discuss the use of printed electronics in the development of customised electrode patches and smart textiles. Quad Industries has leveraged this technology to create innovative wearable sports, healthcare and comfort products that offer several advantages over traditional approaches. Through the use of practical use cases, we will showcase the benefits of printed electronics, including enhanced comfort, flexibility, and functionality. Our presentation will demonstrate how this technology is revolutionizing the field of wearable devices, and we will provide insights into the potential for further innovation in this exciting area. SAVE THE DATE