Thomas Kolbusch | Director Sales, Marketing, Technology, VP Smart packaging is becoming increasingly important in the context of steadily rising packaging waste. Plastic films and paper materials are used in a wide range of daily life products. The largest amount of this use is attributable to the packaging industry e.g., food and pharmaceutical packaging. Global production of packaging-related materials is continuously growing and as a result the industry and consumers are producing more packaging waste than ever before without considering the recyclability. The response from politicians, industry and society is to introduce new policies and stricter regulations, as well as new societal expectations to the industry. To handle the resulting ecological requirements, the industry faces new technological and logistical challenges. Beside the use of recyclable and biodegradable materials for products, the digitalization of production processes and the implementation of intelligent and smart products are essential for maintaining competitiveness. In this context, this presentation emphasizes the rising importance of printed electronics in terms of sustainable smart packaging and addresses how the aforementioned challenges can be overcome by implementing ecological solutions on an industrial scale. Work from various EU-funded projects dealing with the further development of sustainable and smart packaging as well as the introduction of industrial roll to roll process steps for the realization of the developed approaches will be presented.

Rolf Meyerhans ​ nsm, based in Zofingen, Switzerland is a company which specializes in the developing and manufacturing of high-precision printing and coating systems in the field of Printed Electronics. Rolf joint nsm in 2022. He has over 30 years worked in the development of mechanical components. He gained a long experience in mechanical design, dimensioning, process analysis and structural simulations. He is responsible for the technological strategy and the implementation of customer requirements together with a team of technology experts. Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Printed, R2R, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Klaus Mertens CEO Inkjet printed silver and copper can be considered “established” at least among printed electronics insiders – with their industry adoption starting to pick up speed. As a result, new variants of particle inks and innovations and curing have been emerging, which gives industrial producers a few curing options beyond brute heating. In contrast, the range of metals available for printing – esp. high precision inkjet printing, is still very limited. The talk will introduce two first-timers: printable platinum and printable palladium inks by OrelTech from Berlin. Just as all of their inks (including silver, silver transparent, gold, and more to come), they have a range of other advantages: 1) nanoparticle free, 2) low-temperature curing, and 3) high layer purity. Therefore, applications in the biosensor, medical and, more generally, printed flexible electronics market are in focus. Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Join us , 77 other exhibitors, 69 speakers, and over 600 participants together in Berlin to RESHAPE the Future of Electronics, making it Additive, Sustainable, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

The Role of the Contract Manufacturer in the Wearables Market. In the world of wearables, your idea may only go as far as the contract manufacturer you chose to partner with can take it. Taking a concept from the lab to commercialization frequently requires a number of adjustments. Working with a contract manufacturer who has the flexibility to make adjustments in order to bring your product to market may be the difference between commercial success and failure. A wearable sensor design, at its basic concept, consists of conductive inks printed on a substrate. In the manufacturing world, a basic concept can quickly turn into a complicated process. The contract manufacturer needs to marry all the aspects of a design together in order to create the perfect component. Conductive Inks Your wearable product will call for a conductive ink made of carbon or silver and possibly with a dielectric ink as an insulator. The first instinct with a wearable may be to go with inks that provide the most elasticity. This sounds like it would make sense especially if the wearable is intended to move with the person’s body. Even the most elastic of inks start to break down as they are stretched. There are many factors that go into selecting the correct inks. Partnering with a contract manufacturer with established ink vendor relationships, experience in the manufacturing of wearables, and enough experience to identify design change is important to the success of your product. Conductive Technologies and 77 other exhibitors will be in Berlin on 17-18 OCT 2023, helping to RESHAPE electronics. Explore the programme now https://www.techblick.com/electronicsreshaped Substrates The substrate, or the base material that the sensor is printed on, is a key component to the design of a wearable device. Chosen based on flexibility, durability, or other physical characteristics, the substrate in the planned design may not be compatible with the manufacturing process. So, what do you do now? Your contract manufacturer should have experience with a number of substrates and be able to recommend other materials. Carriers Projects may require, either by design or as a design change during manufacturing, to have the conductive printing applied to an image carrier and then transferred to a substrate. You may find that the substrate used in prototyping doesn’t work in the actual manufacturing process. Issues can arise tied to the thickness of the substrate or the ability of the substrate to tolerate the temperature required for the drying process. The design of the housing for the printed sensor may not be flat and a carrier with an adhesive would be required in order to print the sensor and then attach it to the housing. More than Printers When considering contract manufacturers for your product, it is important to identify all of the capabilities that one vendor can provide. While it’s not always possible, it is preferable to have one vendor complete as much of the manufacturing and assembly process as possible. The contract manufacturer you pick should have both clean rooms and environmentally controlled rooms available. Environmental contamination from either debris or temperature and/or humidity can damage or degrade printed electronics if they are not stored or handled properly during the manufacturing, assembly, packaging, or shipping processes. Lastly, but likely the most important is that your contract manufacturer be compliant with FDA 21 CFR Part 820 and certification to ISO 13485 ensures their ability to assist your company’s medical device project along the path to FDA clearance. Conclusion The adage, “You don’t know what you don’t know” holds true when taking a wearable design from prototype to full-scale commercialization this is all the more reason to pick the contract manufacturer who knows what you don’t. Conductive Technologies and 77 other exhibitors will be in Berlin on 17-18 OCT 2023, helping to RESHAPE electronics. Explore the programme now https://www.techblick.com/electronicsreshaped

Arthur Hendsbee | Technology Director Organic photovoltaic technologies are a 3rd generation solar technology which has been steadily improving in the past decade due to rapid evolutions in materials design, device stacks and processing strategies. Due to their high efficiency, non-toxic nature and low-cost-high-volume manufacturing potential, several market-ready applications are now emerging for this technology. For instance, photovoltaic modules for indoor energy harvesting, for integration into buildings such as greenhouses, office buildings or even vehicles. In this presentation Brilliant Matters will outline some of the current challenges in the field of high performance and scalable OPVs from a materials chemistry perspective and will discuss novel materials systems for efficient and scalable OPV devices Join us and the global community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics, making it Additive, Sustainable, Wearable, and 3D. Explore the programme here https://www.techblick.com/electronicsreshaped

TechBlick is excited to announce that the exhibition at their Future of Electronics RESHAPED event has grown by 50% over this event in 2022 and is sold out with 4 months to go. This year’s show takes place on 17 & 18 October at The Estrel in Berlin and looks to reshape the future of electronics. 78 leading global organisations will be exhibiting and attendees will experience the latest technologies and products - see https://www.techblick.com/electronicsreshaped This premier conference and exhibition looks to re-shape the future of electronics focusing on the key topics of printed, flexible, sustainable, additive, hybrid, wearable, textile, 3D, structural and in-mold electronics. This unmissable event will attract a global audience from innovators and material suppliers to equipment makers, manufacturers and a large number of end users. The world-class agenda too has been announced and confirmed speakers include: META, Volvo, Signify, GE Healthcare, Williot, Panasonic, Airbus, BEKO, Space Foundry, LIFE Group, Cicor, Raynergy Tek and many more. In total over 60 speakers will present over the 2 days and an agenda can be seen below. Agenda 1 - 17 October Keynote Presentations 09.05AM • TechBlick • Welcome & Introduction 09.10AM • Meta • Additive Manufacturing for Future High Volume Manufacturing of Electronic Devices 09.30AM • Volvo Cars • Evolution of lighting in automotive interiors: how will the future look* 09.50AM • Signify • Additive manufacturing & lighting: status, future and challenges* 10:10AM • InkSpace Imaging • Flexible printed arrays and their use in wearable medical devices and MRI imaging* 10.40AM • Beko • Can additive electronics help in the white goods industry* 10.40AM • Exhibition Networking Event Track 1 11.30AM • Wiliot • Ambient IoT – Scaling from billions to trillions, saving supply chains and the planet 11.50AM • Smooth & Sharp • Functional Layer – A Comparison with same Printed Circuit Pattern on Different Polyester Film before and after 3D Thermoforming 12.10PM • SODAQ • Sustainable Transportation Solutions: Exploring the Benefits of Smart Labels and Low Power Technologies 12.30PM • TracXon • Opening up new business models in Printed Electronics by leveraging advancements in roll-to-roll manufacturing 12.50PM • SMART Industry Consortium/Purdue University • Smart devices for digital agriculture, food, healthcare and infrastructure 1.10PM • Lunch & Exhibition 2.50PM • FUJI Corporation • Innovation in electronics by integration of additive manufacturing and SMT 3.10PM • NanoPrintek • A Dry Multimaterial Printing Technology 3.30PM • Space Foundary • Precision digital plasma deposition: deposit multilayer structure without curing * 3.50PM • Syenta • Electrochemical Printing of Multi-Material Electronics * Track 2 11.30AM • GE Healthcare • Skin electrode adhesive performance testing 11.50AM • Epicore Biosystems • Wearable Devices for Sweat and Hydration Monitoring 12.10PM • Quad Industries • Printed Electronics – a true booster for innovation in Wearables 12.30PM • Neurosoft Bioelectronics SA • Soft Implantable Electrodes to Interface with the Brain a Gateway to BCI 12.50PM • Information Mediary • Real World Smart Packaging For Pharmaceuticals* 1.10PM • Lunch & Exhibition 2.50PM • Soplast • Towards manufacturing of 3D automotive parts with integrated electronics using stretchable liquid metals* 3.10PM • PolyIC/Kurz • Smart HMI Surfaces With Inmolded Touch Sensors & Decoration* 3.30PM • BeLink Solutions • The exciting journey from electronics manufacturing to printed electronics manufacturing 3.50PM • Panacol • The way to smarter light-curable barrier sealants for flexible OPV R2R production 4.10PM • Exhibition Networking Event Closing Presentations 4.45PM • Voltera• A Tool for Every Additive Electronics Project 5.05PM • Panasonic Industry • Ultra-Pliable Circuit Board Technology 5:35 PM • Exhibition Networking Event Agenda - 18 October Track 1 09.00AM • TBC • TBC* 09.20AM • VTT • Towards roll-to-roll manufacturing of green wearable electronics 09.40AM • TNO at Holst • Laser-Assisted High-throughput microLED Integration 10.00AM • Danish Technological Institute • Sustainable materials and processes for printed electronics 10.20AM • Yamagata University • Flexible Printed Carbon-based Sensors and Their Applications 10.40AM • Exhibition Networking Event 11.30AM • Coatema • Upscaling OPV into production tech 11.50AM • The Warming Surfaces Company • Digitalizing heating for a sustainable future 12.10PM • Sinovia Technologies • Flexographically Printed OLED Indicator and Passive Matrix Displays 12.30PM • Inuru • Manufacturing thin printed OLED lighting: scale up and real applications* 12.50PM • SamwonAct • Metal Pattern Transferring Printing Technology 1.10PM • Lunch & Exhibition 2.50PM • Metafas • The mass production of a smart textile sock that measures stress behaviour 3.10PM • Loomia Technologies • Automotive Interior Lighting and Heating: Powered by Electronic Textiles 3.30PM • LifeSense Group • Wearable sensors and e-textiles to empower peoples health* 3.50PM • Mycronic AB • Sustainable, digital production of wearable soft-stretchable electronic devices 4.10PM • Exhibition Networking Event Track 2 09.00AM • INKATRONIC • TBC* 09.20AM • Heraeus • Review of industrial applications of printed electronics 09.40AM • NScript • 3D Printed Electronics is Powerful when combined with CHIPS 10.00AM • XTPL • Solution for printed micro-electronics. Next generation of resolution in additive technology 10.20AM • IoTech Group • Digital, Laser-Based, Multi-Materials, Non-Contact Printing of Low and High Viscousity Materials* 10.40AM • Exhibition Networking Event 11.30AM • ElectronInks • Metal Complex Inks for Semiconductor Packaging* 11.50AM • IDS • Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging 12.10PM • Printed Electronics Ltd • Superinkjet: going beyond limits of inkjet* 12.30PM • Neotech AMT • Advances in 3D Printed Electronics 12.50PM • Brewer Science • Printed Water Sensors: From Design to Commercialization* 1.10PM • Lunch & Exhibition 2.50PM • Exeger • Mass Screen Printed DSSC Photovoltaics: Powering IoT Applications* 3.10PM • Solliance • TBC* 3.30PM • Imprint Energy • Ultrasafe Printed Batteries for Smart Electronics 3.50PM • Ensurge • Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries 4.10PM • Exhibition Networking Event Track 3 09.00AM • TBC • TBC* 09.20AM • Toppan • Highly bendable oxide TFT withstanding over one million bending cycles* 09.40AM • Raynergy Tek • Progress of Organic Semiconductor based NIR-SWIR Image Sensor* 10.00AM • SmartKem • Next Generation MicroLED Displays 10.20AM • Brilliant Matters • Materials Developments for Stable, Scalable and Efficient Organic Solar cells 10.40AM • Exhibition Networking Event 11.30AM • CEZAMAT, Warsaw University of Tech • From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables 11.50AM • SunRay Scientific • Multilayer Silicon RF System-in-Package Technique Using Magnetically Aligned ACEs* 12.10PM • X-trodes • Printed Electrode Arrays: Unleashing the Power of Skin Electrophysiology* 12.30PM • Rochester Institute of Technology • Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets* 12.50PM • Celanese • Silver Sintering Pastes - Improved Bond Performance and Simplified Handling 1.10PM • Lunch & Exhibition 2.50PM • CONTAG AG • A versatile toolbox for innovative mechatronic systems in industrial applications 3.10PM • Cicor Group • Printed sensors using aerosol jet technology 3.30PM • MINT Soldering Solutions • An innovative method to achieve IPC compliant Inter-Metallic Compounds when soldering on printed electronics 3.50PM • Trackwise Designs • Length-unlimited multilayer flexible printed circuits 4.10PM • Exhibition Networking Event Closing Presentations 4.55PM • Airbus • The Printed Future At Airbus On Monday, 16 October, TechBlick are hosting 12 expert-led masterclasses, in three parallel tracks, covering themes such as: 3D Printed Electronics Printed Batteries Ink Formulation Electrohydrodynamic Printing Printing HMIs Sustainable Electronics R2R Nanoimprint Lithography Wearable Sensors InMold Electronics R2R Printing Interconnect Technologies for FHE In the afternoon there will be four company tours to some of the leading organisations located in Berlin, a centre of excellence for these technologies. For further information and to discover more about the current earlybird attendee passes, please contact Chris Clare at Chris@TechBlick.com

Author: Sandra Lepak-Kuc, PhD Eng. linkedin.com/in/sandra-lepak-kuc-5a333b75 Print innovative, print smart, print sustainable, print green; Print Intelligence Why? In recent years, sustainable printed electronics have gained tremendous interest in both science and industry. Novel electronics focus on enhancing environmental friendliness while maintaining functionality. Researchers are exploring materials and manufacturing techniques that enable the production of biodegradable or recyclable electronic components, reducing electronic waste and its impact on the environment. Where particularly? Some of the most dominant subjects involved in this trend are those related to materials and methods in biomedical applications. Rapid advances in medical technology have historically contributed to significant improvements in patient healthcare. The challenge is to develop modern or improved methods of preventive care. It will also allow to reduce the cost of instrumentation, as well as its deterioration and maintenance expenses. Very often, disposable products are desired in biomedical applications. Their main advantages are that they do not require disinfection and reduce the risk of spreading pathogens[1]. The COVID pandemic has further escalated the emphasis on single-use products, both due to the increased awareness of pathogen risk and simultaneously by spreading and improving telemedicine, which has become a permanent part of private and public healthcare[2,3]. Why there? In addition to several advantages of disposable appliance components, their disadvantages are increasingly being highlighted. The environmental aspect is recognized as one of the biggest. In the case of ECG electrodes, for example, the solutions currently proposed on the medical market, both traditional and modern disposable ones, are based on substrates made of materials such as PET or PE and sensors or conductive pathways made of Ag/AgCl. These materials are not environmentally friendly. They are not biodegradable, and their combustion produces harmful gases[4]. In the stream of pro-environmental actions mentioned above, an attempt to replace precisely these materials with environmentally friendly, biodegradable, and biocompatible ones would seem the right course[5,6]. What do we need? Challenges are not only directed toward obtaining an electrically conductive layer from recyclable materials. Many more factors are required. It is essential to ensure printability, preferably by methods allowing large-scale printing. Ensuring recyclability of both the print and the substrate. Ensuring proper adhesion of the print to the substrate. Ensuring functionality under complex conditions - as in the above-given example of ECG, the need to work in contact with the human body, sometimes under various external conditions - temperature, exposure to UV light, or humidity (sweat). Moreover, in the case of electronics dedicated to medical applications, it is also necessary to meet the relevant specific standards. HOW? Alternative materials are being explored that, in between being suitable for printing techniques and having their functionalities, are being made sustainable and less harmful to the environment. This includes using biodegradable substrates, such as cellulose-based materials, instead of traditional non-biodegradable substrates, such as plastic. However, it is a key issue to produce sustainable printing pastes alongside substrates. These are being challenged with increasing demands, the fulfillment of which is often a complex matter, requiring unconventional approaches and innovative ideas. In our research, we go beyond the usual patterns and use materials not previously associated with electronics. These are often unsuccessful attempts, often time-consuming, necessitating unusual methodological solutions. Nevertheless, we have successfully printed graphene pastes based on sodium alginate and glycerine on paper. Subjecting them to cytotoxicity tests showed a total lack of toxic effect of the obtained structures on living cells. Pastes based on glycerine and various reagents such as gelatine, modified starch or xanthan gum. A huge difficulty we encountered was that such materials often did not allow us to achieve the right rheology for screen printing and thus the relevant printability in this method. Fig. 1. Digital microscope photographs of prints on paper (b-f) photos of conductive paths in selected positions as marked in (a); Fig. 2. Metabolic activity of L929 cells treated with sodium alginate, glycerol and graphene layer extract on a paper substrate compared to a negative control (paper). XY plot (GraphPad Prism 9.5.0) The goal? Our research aims to develop a range of available solutions that will make the greatest possible contribution to protecting the environment and saving the climate. Ultimately, we aim to obtain electrodes (e.g., for ECG) and other electronic structures that are environmentally friendly, recyclable, or even compostable. Ones that could be rinsed under the tap or thrown into the fireplace and burned. The road may be long and complicated, but it is an effort worth taking. [1] C. Bloe, Br J Nurs 30 (2021) 628–633. [2] G.B. Colbert, A.V. Venegas-Vera, E.V. Lerma, Rev Cardiovasc Med 21 (2020) 583–587. [3] J. Portnoy, M. Waller, T. Elliott, J Allergy Clin Immunol Pract 8 (2020) 1489–1491. [4] K. Sovová, M. Ferus, I. Matulková, P. Španěl, K. Dryahina, O. Dvořák, S. Civiš, Molecular Physics 106 (2008) 1205–1214. [5] Z. Fang, H. Zhang, S. Qiu, Y. Kuang, J. Zhou, Y. Lan, C. Sun, G. Li, S. Gong, Z. Ma, Advanced Materials Technologies 6 (2021) 2000928. [6] C. Zhang, R. Cha, P. Zhang, H. Luo, X. Jiang, Chemical Engineering Journal 430 (2022) 132562. We are Speaking & Exhibiting at "The Future of Electronics RESHAPED" event in Berlin on 17-18 OCTOBER 2023.

Daniel Slep, CEO Dielectric materials play a critical role in modern electronics as they serve as insulators that prevent electrical charges from flowing between conductive parts. In recent years, significant advances have been made in the development of dielectric materials, driven by the demand for improved performance and efficiency in electronic devices. Novel methods have been developed for processing and integrating dielectric materials into electronic devices, including inkjet printing, plasma-enhanced chemical vapor deposition, and self-assembly techniques. These advances have enabled the fabrication of electronic devices with improved performance, reduced size, and lower power consumption. ChemCubed has adopted inkjet printing since it’s a promising technique for the fabrication of electronic devices due to its precision, versatility, and low cost. Together with our commercialized silver ink, we are able to print circuit boards with complex structures for electronic devices such as capacitors, sensors, and antennas, which have potential applications in diverse fields such as healthcare, energy, and communication. However, one disadvantage of inkjet printed polymer dielectric materials is its high coefficient of thermal expansion (CTE). By incorporating carbon nanotubes into the dielectric materials with a patent pending printing technique, we have dramatically decreased the CTEs of the dielectric materials we are using, as well as increased their mechanical properties and thermal stabilities.

Developing inkjet printing processes for printed electronics manufacturing is very tricky. It is certainly much tricker than non-functional inkjet printing since often single pass print is used with little chance to correct missed drops and application-level tolerance of defects is significantly lower. First, one needs to develop an ink that at least on paper satisfies the requirements in terms of particle size, viscosity, etc. This itself is an art as most materials and inks are not designed for inkjet. Next, one must select the right print head. This is easier said than done. This is because there are many print heads and each, all other things being equal, exhibit their own print characteristics including terms of print velocity, satellite formation, longevity of the print head, consistency, etc. It is hard to know a priori which will work and which not. Thus testing is required. Next one must optimize the waveform. This is relatively straightforward and somewhat often a standarized and mundate task in ink systems used outside printed electronics. However, it is a time-consuming fine-tuning process in printed electronics. It is also essential. Once these are all optimized one can go to pilot production, but still on small scale machine. Finally, if an application is successful or larger volumes are planned, one must transition to a larger-scale production-level machine. Here, the parameters are not exactly one-to-one transferable from lab to production level machines, and further control, measurement, and optimization of the ink-printhead-substrate interplay is required. ImageXpert has developed an all-in-one platform that can accompany developers through all stages from ink formulation to print head selection to waveform optimization to quality control and pilot production and finally to optimization for and in mass production. Kyle Pucci, Director of Applications Engineering expertly explains these challenges and how the ImageXpert solutions can help accelerte the process, getting better results with much less effort, time and money! Enjoy the watch ImageXpert will be exhibiting in Berlin on 17-18 OCT 2023. Join ImageXpert, 77 other exhibitors and over 600 industry participants to RESHAPE the Future of Electronics, making it additive, hybrid, sustainable, 3D and wearable. Explore the programme here

Elephantech is developing mass production of multi-layer flexible and rigid PCBs [FPCBs and RPCBs] using inkjet printing. This is an important industry development which enables more sustainable electronic production Slide [1] compares the convention process vs the inkjet printed process, showing how the number of production steps and the amount of material consumed can be reduced since ink-printing enables additive (vs subtractive) manufacture. Note in slide [1] how Elephantech is also developing technology to enable double-sided FPCBs with drilled vias[more on this later] Slide [2] shows how Elephantech is a vertically integrated operation now, covering material development [copper nanoparticles] to ink formulation to inkjet printer development to production of FPCBs in house. The ultimate goal is to be an equipment supplier. However, they will do manufacturing to gain production experience to perfect the process and machinery in the years to come Slide [2] also demonstrated the sustainability of the process, showing that the additive inkjet based process reduces copper and water consumption vs. the traditional etched process by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. These are very important achievements, in particular considering how all major electronics OEMs are now pushing for greener value chains [10% of the CO2 footprint of Apple comes from PCB production!] Slide [3] shows an inkjet printer under development. This is not the final design and many design questions remain open such as number of print heads or the exact choice of piezo-actuated printer suppliers. Slide [4] shows the current achievements. Incredibly, they can directly achieve inkjet printed linewidth-to-spacing [L/S] ratio of 100/100um without the need for any laser ablation or laser finetuning. This is an important achievement which is the result of high optimization between inkjet head, control system, and ink and substrate development. In this process, first a copper nanoparticle ink [50-100 nm particles] is inkjet printed. The Cu nanoparticle solution is specially formulated with surface functionalization [my guess is the substrate PI is also somehow pre-treated] to promote strong adhesion to the surface. The inkjet printed Cu layers are then photosintered using a Xenon or similar lamp. The idea of the activation here is not to achieve high conductivity but to achieve a solid network of deposited copper nanoparticles with strong substrate adhesion which acts as a seed layer. In fact, conductivity is not measured. This is because the formulation of these Cu nanoinks must fulfill different criteria as those aimed at printed electronics. In the recent past, Ag seed layers were used. This important transition is motivated by cost savings. The seed layer is then thickened using electroless plating. Plated copper gives bulk level conductivity and solderability, making it [unlike circuits with printed paste] a drop-in replacement performance-wise As shown in slide [4], a 12um thick copper plated can be achieved. This is a significant advancement vs. the previous achievement of 3um. Importantly, the adhesion remains strong even with a thick plated layer Slide [5] shows how double sided FPCBs can be achieved. Here, a via is drilled into the PI substrate and is then metallized with inkjet printing before being plated. Slide [6] shows the future roadmap. Firstly, the deposited layer will be thickened to 30um to support more PCB options. This needs much better adhesion and must have more optimized interplay between functionalized Cu nanoparticles, substrate surface, and electroless plating process. Next, they will transition from flexible to rigid PCBs and add more layers to the capabilities. These developments will take time and are an engineering challenge, but in the end this is a more sustainable production process yielding high performance PCBs compared to etched PCB production. As such, in the long term, it will have its role in the industry without doubt. Indeed, as shown in slide [7] it is already on the market.