Ultrafine line screen printing: emerging application and competing technologies TechBlick prepared this presentation for the Advanced Screen Printing Workshop organized by Asada Mesh (June 2022, Chicago). You can watch and read the full presentation here. You can also view the slides. The theme are Existing and emerging applications for ever finer Screen Printing linewidths (sub-15 micron meters): Photovoltaic metallization | MicroLED wrap-around edge electrodes | Fan-out structure for flexible hybrid electronics | Transparent HMIs |Transparent Touch Displays | Edge Electrodes | MLCC | LTCC Hybrid and direct (non-digital) printing technologies towards sub-micron linewidths: Hybrid screen printing (print + etch/ablate) | R2R flexo printing | R2R Gravure Offset Printing |S2S Offset Printing | S2S Reverse Offset Printing |R2R Reverse Offset Printing | R2R Imprinting + Filling | R2R Photolithgraphy You can download the slides at the bottom of this blog. Simply scroll down mmWave 5G RFFE based on LTCC and printed Ag metallization LTCC with printed Ag metallization is an excellent choice for heterogeneous integration of electronics, especially for high-frequency (mmWave and 5G) and harsh environmental conditions. Indeed, it shows our printed electronics can play a role in the 5G/6G communications infrastructure. In this study, DuPont demonstrates an Antenna-in-Package (AiP) which integrates a beam steerable antenna array in a Radio Frequency Front-End module (RFFE) operating at 28 GHz and incorporating an Anokiwave IC with a 2 x 4 patch antenna array. The ceramic dielectric (so-called GreenTape) shows excellent dielectric properties through 100 GHz while maintaining Dk of 7.1 and Df of <0.0010. It also shows stable properties throughout the extreme temperature range (-50°C to 150°C). In this study, screen printed sintered Ag metallization was used for ground planes, via fills, signal lines and solderable pads. The data in this study shows the viability of LTCC for mmWave and 5G applications. It is an exciting solution with low moisture update, good temperature stability, etc. As the density of parts in LTCC based heterogeneous systems rises, screen printing will also need to go to finer lines to support this densification, but that is a story for another day Digital printing of screen printable pastes for rapid prototyping??! Screen printing requires tooling which limits prototyping and rapid product iteration. Digital printing uses nanoinks which have a more limited menu of material options and are more expensive, and in any case are not always the ultimate material selected in final volume production. This leaves a gap in the market for digital printing of off-the-shelf screen printable materials and pastes. Voltera is developing a prototyping benchtop machine aimed at solving this problem. This product will be launched at the TechBlick show in Eindhoven (12-13 OCT 2022). It allows users to rapidly digitally print using different screen pastes. The digital printing processes largely self caliberates, allowing uses to experiment with different materials and formulations without needing to go through the full learning curve/print optimizaiton process each time. The benchtype size also allows one to keep this in the lab, enabling rapid prototyping. The digital direct wire printing head allows printing on different substrate materials as well as over flat and 2.5D/3D shapes. Applications demonstrated here: (1) soft insole pressure sensor on TPU | (2) wearable heater integrated into clothing (denim) | (3) thermally formed mug heater. Digital Laser Processing of 3D Electronics Combining digital printing (inkjet, aerosol, etc) with site-specific digital rapid laser-based sintering has many advantages. In the talk below, you will see various examples from Fraunhofer ILT in Aachen, Germany. Multi-layer piezoelectric actuators: The structure is multi-layer [(PZT (140nm)-->LNO (30nm)--> PZT (140nm)-->LNO (30nm)--> PZT (140nm)-->LNO (30nm)]. Therefore, it is essential to have rapid sintering otherwise TACT time will be too long. Here, Fraunhofer ILT suggests that laser sintering (inkjet layer 1 --> laser sinter --> repeat) can be an excellent solution. Strain sensors on and within 3D-printed bionic component: here, the insulating layer is first dispensed. The strain sensor materials are then digitally (inkjet) printed onto the surface of the 3D part and then digitally laser-sintered. The ability to digital print and sinter means that only the required parts will be metallized and subjected to heat treatment. As such, it saves time, prints on non-flat shapes, and maintains integrity of the 3d printed mechanical parts. In another variation of the same device, they can stop the 3D printing process to digitally print (aerosol this time) and digital laser sinter the electronic components before resuming the 3D printing process. This way, the electronic functionality will become embedded in the structure itself. 3D Pad Printing on 3D Surfaces: 5G antenna for smart phones Metallising 3D structure has many applications. The common technology approaches to LDS (laser direct structuring) or digital aerosol printing. The fomer is a multistage process with a relatively large machinery footprint, but offers high adhesion and bulk-level conductivity with ease of soldering. The latter is a two-step digital process with small compact machine. However, it offers ink-level conductivity, which can be low especially on low-T substrate. Henkel has recently demonstrated pad printing - an old technique- for 3D electronics. This technology enables printing of inks onto 2.5 and 3D plastic structure, thus offering an alternative to LDS and aerosol. It is a simpler process than the other two. The process will not create fine structure but can print thicker (thus more conducting) lines using high viscosity pastes. It is also a robust and relatively low-tech process compared to LDS and aerosol. As shown therein, in this process, a conformal silicone pad first pickes up the ink from a metallic plate. The ink formulation must ensure good adhesion to the silicone pad. The pad then stampls the 3D surface. Since the pad is conformal, it follows the shape of the target substrate, achieving non-flat or 3D coating. Applicaiton examples demonstrated herein are developed with Henkel's Chinese partners: printed 5G antenna on the outside polycarbonate frame of a mobile phone, achieving 10mOhm/sqr/mill printed conductor on the inner side of the plastic to connect with mainboard

This presentation was developed for the Advanced Screen Printing Workshop organized by Asada Mesh. The theme was fineline printing. In this presentation, we discuss the following: Existing and future applications for ever finer Screen Printing Linewidths (sub-15micron meters). Photovoltaic metallization MicroLED wrap-around edge electrodes Fan-out structure for flexible hybrid electronics Transparent HMIs Transparent Touch Displays Edge Electodes MLLC LTCC Hybrid and direct (non-digital) printing technologies towards sub-micron linewidths Hybrid screen printing (print + etch/ablate) R2R flexoprinting R2R Gravure Offset PRinting S2S Offset Printing S2S Reverse Offset Printing R2R Reverse Offset Printing R2R Imprinting + Filling R2R Photolithgraph You can download the slides at the end. Please scroll down This is an automatic transcription of the full presentation. It has not been proof read so there may be errors. This is here to help in case you prefer to read Hello, everyone. My name is Kasha. I am the CEO of TechBlick. We are really the home of the global community for additive electronics, for printed flexible hybrid electronics, 3D electronics. And we provide our community members a year round programme of curated onsite and online conferences and masterclasses market studies and beyond. The presentation itself has two parts. So the first part. The presentation will be looking at applications which will benefit or which will require ever finer screen printed line width. And then the second part of the presentation will be looking at non digital printing techniques, hybrid and directly or fully additively printed techniques which allow one to take the linewidth from, let's say, 30 or 40 micrometers down to a few micrometers and then eventually to sub micrometer range. Photovoltaics So first, as I mentioned, we are going to look at applications which require or which will benefit from ever finer screen printed line widths and the first. Important application is, of course, silicon photovoltaics is, you know, one of the biggest applications for conductive inks and for screen printing in electronics is metallization of silicon PV wafers. And if you look at this chart here, if you look at the orange lines, what you find is that is the line width of the printed metal mesh as the printed metallization. You can see the current state of production today is something around 34 to 36 micrometers today and it is coming down very, very fast. So it is expected that within a few years we'll be reaching 20 micrometer line widths and maybe even lower. What is also interesting about this application is that screen printing is actually a very, very productive process. So here you can see the wafer per hour rate for the back end processes, which also include the metallization step screen printing. The wafer size is something around 180 to 182 millimeters. And you can see that today we are something around 7000 wafers per hour. And this is projected to rise to something around, let's say, 10,000 wafers per hour by the end of the year. So you already have screen printing in this very productive high volume production setting, producing, you know, 30 to 35 micrometer linewidths and evolving the process down to 20 micrometer line width. And here on the left, you can see an example of what I think is a very good representation of the state of the art. And here you can see a screen printed sort of finger on a perc solar cell. This was made by Fraunhofer ISE. And you can see very nice, with 19 micrometers and a very nice aspect ratio of about 18-19micrometers. And so yeah, I mean that, that already tells you that there is an application in high volume production which has narrow language in the line which will go down to 20 micrometers and beyond. But I want to say that solar metallization is really relatively an easy application, and that is because the pitches are very wide and at the same time broken lines, interrupted lines, can to some extent be tolerated. So there is some tolerance of defects. MicroLEDs Another application which I think would benefit as an example for ever finer screen printing metallization lines is the Micro-led display application, so microLEDs are a very hot display topic. And one of the key uniques of this display technology is that you can create bezel free displays. So when you have bezel free displays, it means that you can form a larger display by putting together many kind of smaller tiles and building up the big display. So here you can see an example of one such display tile. So we have glass and on this you deposit the TFT, the thin film electronics on the glass. You might deposit the the bonds, the micro bonds or something, and then you transfer the micro LEDs on the top. the driverwould be on the bottom. So first you can imagine that the two surfaces on the top have to be metallized (see the lines on the top surface). You have to realize the lines on the bottom surface, connecting them to the pins on the driver. And then you have to somehow connect the front to the back. And one way, of course, would be to drill via into the glass, fill the through glass vias. But this is really not elegant. And as far as I know, nobody uses this process. So a more interesting approach would be to create this so-called wraparound edge electrodes. So you would have these electrodes going around the edge connecting the front to the back. So this example, I believe, is from Applied Materials, and this one is from Corning. Here is an example again by Applied Materials showing you the kind of process so that the front metallization would be printed on a chamfered glass. Then the bottom metallization would be screen printed on the chamfered glass, and then the glass would be rotated to print the edge electrode and then cure. So first you need very good alignment. You need very, very highly conductive inks and you need to control your printing process so that you don't end up with peaks around at the chamfered edge of the glass. Here's an example where the chamfered edge, the example on the on the bottom left, you need to have a topography of a printed line which is relatively smooth, with no major peaks around the edges. And then the thickness would be for a given connectivity level of inks something around 3 to 6 micrometers after drying. So here you can see an example of fine line printed, a screen printing also around the edges and the line width of the spacing is 40 to 60 micrometers in this case. So already this is by some standards very, very fine line screen printing. But perhaps this is the technology of yesterday? And the reason I mentioned this is because micro led dies are shrinking in size. So the early generations were actually mini LEDs with the dies being something around 125 by 225 micrometer size. And now we are going down, and this chart is put together by, Yole and you can see that we'll be going into a territory where the dies are something around maybe ten micrometers by ten micrometers. And as we approach that range, the bond sizes are going to get smaller and also the metallization lines are going to get ever, ever narrower, which means that the screen printing, if screen printing is to stay competitive in this technology, it also has to produce ever finer lines. And so here's an example again by Applied Materials. I think you can't see it in the recording because my video is here, but this is a 15 micrometer printed screen printed line. So it shows you that you can print that level. And I'm sure all of you in this expert audience know this, that one can print 15 micrometers, but this application is not like a PV application. It is very challenging. It cannot tolerate broken interrupted lines because that would imply a dead microleds and therefore a dead pixel. And in the worst case, you might be able to tolerate some defects on 10% of the tiles, but on 90% of the tiles, all the metallization, have to be defect free. So not only one needs to deposit very, very fine lines with good control of topography, high conductivity, good wraparound coverage. But also one needs to do so without too many broken lines. So this is a challenge for the industry and I think this workshop would help the industry achieve these targets. I should say here that the competition actually here is actually one of the competitions here is PVD and Samsung uses a PVD process developed by a Korean company in which in the PVD chamber they stack all the glasses together and then they rotate them and they get PVD to deposit also around the edges. So PVD is always, always the competition in these cases. But if screen printing could produce fine lines, 15 micrometers or less without defects, maybe this could be with very little defects. Screen printing would remain competitive in this application. Flexible Hybrid Electronics (fan-out) So another application that I wanted to highlight, and I think it's an interesting one, is around flexible hybrid electronics. So flexible hybrid electronics is about combining the performance of rigid ICs, rigid silicon ICs with the low cost production and the flexibility of printed flexible electronics on low temperature substrates like PET. And I think many of the technology hurdles which have held back this technology are being cleared away now. So people are developing ways to use standard solders or developing materials with solder like properties, i.e. self alignment on heat or on other low temperature substrates. People are finding ways to thin ICs and make them flexible. People are finding ways to do pick and placing of these very thin ICs, sometimes even in a roll to roll set up. So many of the technology hurdles are being cleared. And the reason I have it here in this screen printing workshop is because I think screen printing could also play a role here, at least fine line screen printing could play a role. So look at this example here. This is, I think a demonstrator by Nexflex, you have the IC here, you have the wiring lines printed. Let's say the wiring lines can typically be screen printed. The pitches are wide. The linewidth is well within what screen printing can do. Then one needs to go from the wiring to the ICs. So in the pictures, the pins of the ICs are much narrower than the wiring. So one needs to have this so-called fan-out structure connecting the pins with the bumps and connecting the pins to the actual wiring. And here's an example of a fan-out structure. So right now, screen printing cannot do the wiring and the final structure just based on the screen printing process. So different processes have to be combined. But what I think if fine line screen printing would be further advanced, then this would be possible to screen print the fan-out as well as the wiring and the requirements for the line width of the fan out is something around 30 microns or less with a pitch of around 60 microns or less. So this particular image is from Netflix and some of these images I took from a presentation by Komori in Japan and adapted them just for reference. Transparent HMIs So I wanted to also say a few words about this very interesting application for Transparent Touch or HMIs. I mean, here the competition is maybe trying to replace PEDOT transparent dot layer, which is also printed in very high volumes. But in this case, in the case of these metal mesh structures, one maybe does not need a protective layer. Simplifying the structure and making it also thinner. This example is by sSun Chemical as other mesh type, CFR and others. So this is a well known example in this audience that actually I think Erika will have presented on this. . So I won't I won't discuss this particular application. But just to say the linewidths, I think, are around 30 or 35 micrometers, so you can see the meshes, but it is probably okay for these switch or HMI applications, but. Say that, you know, the requirements for a transparent touch display are very different from the requirements for a transparent switch. Transparent Touch Displays So when we talk about a transparent display like on your phone or on your tablet, then the line width needs to be a lot narrower. So here you can see an example of the kind of the different ranges to micrometer range for me, so sorry. So maybe let me explain this again. So here you can see the ranges. If your linewdith is wider than 4 to 5 micrometers, it is possible to see the structure even though it is transparent. If the line width is around 2 to 4 or five micrometers, then it is very difficult to see. But if one looks very, very carefully, one can sense. I can recognize that something is there and if it's below two micrometers, probably it's totally invisible. And I just want to show you in this table what companies are doing, what kind of line widths they are printing for the metal meshes, which act as a transparent conductive field for display industry. So these are different companies. These are different processes. I won't go into the processes in this presentation, but just look at this column here showing the line width. So one can clearly see that the line widths are generally sub four micrometers and that shows you the requirement for this industry. So I just have this slide here to kind of make a contrast between transparent touch displays and transparent touch switches. Edge Electrodes Now another interesting application. I think if if screen printing could print ever finer lines, then screen printing would stay would have stayed relevant in this application and would be very competitive process that is for printing the edge electrodes in a transparent touch display. So here you can see an example of a kind of an edge electrode series. The requirements because the bezels have been getting narrower and narrower, the line width to spacing requirements have also shrunk over time. So I have here two examples of companies offering a full, transparent film structure, including the transparent layer and the edge electrodes. And here you can see the line with over the spacing in micrometers of just the edge electrode just to give you a sense of what kind of requirements people have. So if screen printing is to stay relevant, it needs to target sub 15 or so, maybe at least sub 20 micrometer micrometer range And here is a kind of an evolution chart. Very rough, very, very, very approximate chart showing line with over the spacing requirements. Standard screen printing maybe takes you down to 40, 50, 40 micrometers then fine down screen printing. So screen printing technologies which are being developed now and together with the ones that are the subject of this workshop, maybe take you down to 20-15 micrometers, then people start to use hybrid processes. So I'll give you an example later on screen printing plus laser plus photolithography. And then there are other non-screen printing techniques which are put here in green. So all the blue ones are either direct or hybrid screen printing and the other ones are non screen printing processes. So basically I guess the message here is that if screen printing could do very fine lines, then it would be able to participate in this market. Also printing the electrodes for transparent touch display. Other Applications (MLLC, LTCC, etc) So. We want to focus on alternative technologies. So so far in the application area, we talked about photovoltaic metallization and how the line width will go to 20 micrometers or below with very, very high wafer per hour throughputs. We looked at the microgrid application and how the requirements there are moving towards 15 micrometer line width and below, but with very exacting sort of defect and yield requirements. We looked at flexible hybrid electronics and how it might benefit from printing the wiring or screen printing the wiring and also screen printing the fan out. We then said a few words about transparent light switches, transparent type screens, edge electrodes. And before going to the alternative technologies, I just want to mention maybe a couple of applications which I omitted in my presentation but are very important. One of them is MLC, where nickel powders are screen printed. Maybe some do gravure printing, maybe 30% or so do gravure printing for the mobile application, but the majority are still screen printed and will remain so. And the reason I mentioned this is because the thickness of the lines is going down and down. And I think now it's between 1 to 2 micrometers, the thickness of the final line and the other application is LTCC. LTCC is, I think, a very competitive technology for 5G. And when you think about 5G and LTSC as a substrate technology and if you think about heterogeneous integration of different ices in an LTC kind of a system, then one needs to have very, very fine line printing techniques with very good edge definition to support 5G lines and also very, very narrow, narrow printed lines. I think they are also the requirements would be very soon about 15, 15 micrometers. Technologies Towards sub-Micron Printing So in the next few slides, what I want to do is I want to tell you about technologies which allow you to go to find very fine lines, sub micrometer or micrometer range. So we'll look at screen printing plus photolithography. We look at role of flexible printing, we look at gravure offset printing, sheet to sheet offset, reverse offset and so on. And basically you will see how we go towards ten micrometers and then we go to sub ten and sub five and sub three and then in some cases sub one micrometer. Hybrid Screen Printing So just two quick, quick, quick slide on this one. So this is a hybrid screen printing process. The idea is that the ink itself in this case contains a photosensitive material. So you don't need a photoresist. So as you can see here, you can screen, print it and then expose it to UV light directly with the photoresist and then etch. And then this will allow you to get very, very fine lines. So in this case, this material is Toray. the references are behind my behind my image. So this is my Japanese company. And these examples, this example here is linewidth over a spacing of about about ten, ten by ten micrometers. This is for curing for 140 degrees Celsius. So compatible with PET substrates. But I think what is important here is that the conductivity of the line is not very high because you also are loading other additives into the formulation. If you want a higher temperature version that is compatible with PI or glass, then you can adjust the process and go to even finer lines. 2.45 micrometers or eight eight micrometers. So that was a hybrid screen printing process, a screen print plus etch. R2R Flexo Printing In this case, I want to talk about a direct, flexible printing process. Of course, flexible prints, thin lines, just just how it is. And this case is developed by Kodak, who has a very good laser process for creating the plates with flat top dots. And they created a metal mesh here. This is a semi additive process where they flexo print a catalyst layer and then they use plating to thicken the layer and achieve bulk like conductivity. And if you look at these metal meshes here, the only reason I have it here is that the linewidth can be around eight eight micrometers. So it shows you that with this technique one can go down to sub10 micrometers. R2R Gravure Offset Here is an example of road roll gravure offset printing being developed for a number of years in Japan. And I don't want to go into the details of the actual technology, but you can see a kind of the narrow web tools which are being developed now. The web speed is relatively, relatively low, but here I think they print with submicron particles. So let's say a nanoparticle ink is used to print these metal mesh lines and you can see that the lines are five micrometers. S2S Offset Printing Another example which I liked again by a Japanese company. This time you can see the name here. And the reason I like this here is that this is a sheet to sheet offset printing process. And you can see they can print these very, very complex patterns with just 1.5 micrometer linewidth. And here, too, they're using silver nanoparticles. You can see it's a very thin line, maybe 250 nanometer just thickness cured at low temperature. So you can cure the ink at 120 to 400 degrees Celsius. But the reason I basically have it here is that this shows you that with direct printing sheet sheet on various substrates, as long as it is sheet to sheet, one can achieve 1.5 or three three micrometers. S2S Reverse Offset Process Then if you want to go below that level and achieve kind of one micrometers, then I think an interesting sort of process is the reverse is the reverse offset process. Here you can see an example by. This was, I think, published recently and showcased at our conference just in March at the TechBlick show. And you can see a kind of a desktop reverse offset printing machine. Reverse offset printing technique is very unique because you usually have a PDMS roller mold, you totally ink it, so it's totally covered with ink. Then the ink semi absorbs into the PDMS, which means that you're not dealing with a complete liquid, but because it is in a semi dried state, then you can control the wetting a little bit better and then it is brought into contact with the relief plate. Some of the patterns are removed, removed, and then the roller mold is brought into contact with the final substrate and then the ink is transferred. So you can see that in this case, they have developed a process. They have developed a process which allows them to create metal meshes with just, just one micrometer line. So I think it is a very interesting process. I mean, reverse offset is good for these kind of line widths. I would imagine that the printed lines are generally very thin. So let's say from 20 to maybe 1000 nanometers, the printed resolutions could be about 0.5 or a little less to a few micrometers. And the printing speeds could be would be, well, less than 50 millimeters per second or so, just to give you some parameters about the capabilities of this process generally so. R2R Reverse Offset Printing? Here's another, I think, interesting technology. This one is, again, by a Japanese company. Unfortunately, the source is again falling behind my picture. So this is by Asahi Kasei in Japan. So you can see they're printing very fine lines. And I didn't have a video here, but these are continuous lines with very well defined edges and just 300 micrometers wide. One of the innovations here is that they have these roller molds, which they call a seamless roller mold, and it is patterned not using just laser, but with electron beam lithography. And you can see the kind of the features they can define on this roller mold, around one micrometer wide and five micrometer pitches. And this is a very, very smooth, smooth surface. And here you can see a couple of examples of actual kind of roller roller molds. This is, I think, 250 millimeters in width and about a hundred millimetres in diameter. So what is the actual printing process here? Undisclosed. But my guess is that this is also a form of reverse offset printing process. So the previous example that I showed you was the relief plate was flat. In this case, the relief plate is actually a roll, so it's a fully roll to roll process. And here you can see an application in this demonstrator. They are printing aligned with a three micrometers. So not at the leading edge of the of the capability, but it is a transparent kind of an antenna application for transparent RF ID for for putting it on products without without taking up real estate. So the RFID would be there without occupying any real estate on the packaging. R2R Nanoimprinting So I guess we are now almost approaching the end. There are only two slides left, I believe. So. I just wanted to say that there is a whole array of technologies which are hybrid and roll to roll, and they go to very, very, very fine lines. So this example is by Panasonic. Panasonic is not the only company developing this technology and is in fact, not the first. But I think it is kind of a state of the art. From what I can gather, because the way the process works is that you have a substrate, you coat it with a resin, and then you roll to roll emboss a pattern into the resin. Actually, they do it on both sides, so it's a double sided embossing process. Then they simply fill in the grooves with silver nanoparticles. So here you can see they can achieve a two micrometer line with with a good aspect ratio. And very, very good sort of sheet resistance of two ohms per square. What is really interesting about this process, I think, is that the conductive line ends up being embedded into the substrate. And what that means is that to increase the conductivity of the line, you don't actually have to print a thicker and therefore a wider line. So this is a classical example, but you could just make the grooves a little deeper. R2R Photolithography And I want to say just a few words about the competition, which is photolithography. And here's an example of a roll to roll photolithography. This is developed, I believe, by Dai Nippon Printing. The target market is transparent displays, and you can see the kind of the line with that they've achieved. So the first generation of their products had four micrometers line with the second had two micrometers, and now they've announced on kind of smaller sizes, one micrometer line width. So here's an example and I think they can do this to serve the market of sub 40 inch displays. Just, just gives you some information about the state of the art using alternative techs. So with that, we come to the end of the end of the presentation. Again, thank you for your attention.

This is an auto-generated transcript. It has not been proof read by a person threfore they may be errors This is your Thibaut. It's a pleasure for me to talk about the new range of product that we have developed by printing silver ink. So Henkel is well known for the sale of conductive inks, especially for screen printing. But we have a nice project in China where one of our customers ask for printable inks for antennas, and basically we develop those inks, especially to meet the customer demand, but also because it really answers to product requirements, especially it combines two trends. The main trend that we see is the trend of connectivity. We have all heard for many years about Internet of Things, you know, is the 5G. We are even talking about the Internet of everything in that the objects we have to communicate together. We have also to communicate to people, but also to cloud in order to process the data, in order to enable seamless communications between everyone and everything you need high quality antennas and they. Other trend that we will see also is the one of 3D electronics, because we want to have smaller and smaller objects with even higher integral functionality also always customized. So basically you want to turn some maybe thermoplastic enclosure into smarter ones. And the best way to to make it is maybe to incoperate components on plastic surfaces or to bring or so connectivity. So we have developed by printing for those who are not familiar with pad printing. Here is a small animation tool to explain. Basically, you will have a silicone band that is going to take up an ink from a metallic plate. So you need to have the ink that has good adhesion and free transfer to the silicone pad. And then the pad is going to stamp the ink onto the 3D curves of face. And because it's fully conformable, you have a nice surface coating. If you want to increase, for example, the thickness, you can make multiple stamping. It's a nice alternative to two worlds. And especially this is it has been used for smartphone applications. So for these smartphone applications, we have developed two things. The first one is printed on the outer side of the smartphone frame in polycarbonate is called Loctite Acid. 1203 That is very good conductivity t below ten milliohms per square at 25 micron thickness and brings the antenna functionality. We also have developed another contact link that is printed on the inner side of the of the plastic frame with very good abrasion resistance. It is Loctite 1204 in order to have the contact with the main board, a main board of the smartphone, and in order, of course, to contact the outside of the antenna and the inner side contact pad we also have developed a ink not not for printing, but for dispensing to fill small holes in the plastic frame. So basically the combination of our inks and the printing technology brings many benefits to the customer applications. The inks offers a high performance, so very good conductivity, but also the low temperature curing that you need to avoid. The challenge of the smartphone frame can be cured to also have a very good reliability. And same because we are going to use inks and an additive technology, a printing one. You're going to, of course, to reduce the waste, for example, of copper plating that you will have from the LEDs process. But similarly, the inks are very good reliability, performance towards abrasion, humidity, damp heat and everything. But printing is also a well-known technique used for decades. For graphic printing, it can be easily scaled up. You just have to multiply the number of machines and also highly versatile because we have to change the cliché plate, the metallic plate, as you've seen two slides before to change the design. So also highly easy to customize. So this project has only been possible because we have the work of Chinese team at work in close collaboration with the customer, but also with part printing machine manufacturers to learn also on our side about printing. It's a nice solution as an alternative to like the direct structuring, LDS or also other types of antenna. But we are not we do not only have but printing inks for the 3D electronics or printing, and we also have a product portfolio. So if you want to learn more about it, you can either contact me directly, you have my email address, or we also have our virtual booth in room four and we will be happy to meet you there.

This is an auto-generated transcript, It has not been proof read by a person threfore they may be errors Okay. Perfect. Thank you so much for the introduction. Thanks, everybody, for sticking around towards the end. I'm very excited to talk to you today about rapid prototyping for soft and stretchable electronics. So a little bit about me. I'm a product manager at Volterra. I have a background in nanotechnology, joined Volterra in 2014, have been a materials scientist, a product engineer, electromechanical design engineer, and now I'm leading our entry into next generation electronics at Volterra. If you haven't heard of Volterra in 2015, we created a circuit board printer that would help electronics engineers speed up their development time. We were inspired by how 3D printing could use, could bring ideation to concept for mechanical design. And we really wanted to do the same thing for electronics focusing on the PCB manufacturing process. However, shortly after we launched the product over the next couple of years, we spoke to our users and found that they were really surprising us with what they were doing. So these weren't the electronics engineers or some of them weren't the electronics engineers and product developers that we'd initially imagined using this. These were researchers and scientists at world leading institutions who are really pushing the boundaries of what was possible with electronics. And from that, we learned a lot about what could be possible when you go beyond the green floorboard and conductive materials that we were working with before and into this whole new space that many of you call flexible hybrid electronics. Now, the V1 had never been designed for this particular application set, so when we went back to a lot of these users and we asked them, what is it that you really need to help get you from where you are to where you want to go? In your research, we identified quite a few common themes. So the first, of course, the reason why they started using our technology in the first place was that we use direct write digital printing so you can load up a file, create a design, and then in a matter of minutes have a printed conductive pattern or other otherwise functional pattern in a matter, a matter of minutes. The next thing they were asking for was the ability to work with a variety of screen printable inks. Digital printing has for a long time been the realm of inkjet materials, but screen printable inks gave you so many options in terms of material categories and fillers and functionality. And finally, the benchtop form factor that would allow you to keep this in your lab, not have to book a ton of time for you to be able to get something done very quickly, potentially go through five iterations in the span of a day, rather than having to wait weeks or even months to get your first design tested. Now, over the past couple of years, we took this feedback and I'm excited to say that sometime this year in Q4, this year, we will be announcing our new product specifically for Flexible Hybrid Stretchable Electronics. So this will be coming in Q4. If you want to see us in person with our new product, you'll be able to see us actually at the next live tech event in Eindhoven and I look forward to seeing you there. However, let's give you a quick inside look at what this product will allow you to do. So this will allow you to create flexible electronics at your workbench. So if you want to create a flexible prototype of flexible circuit on set with silver inks, you can do that in a matter of minutes. It will also allow you to create stretchable and soft devices, which is something that I know a lot of you are very interested in and we're very excited to demonstrate. Also, you'll be able to do this just as quickly as you could have done with rigid or traditional electronics. And finally, people ask for materials freedom, and that's what we're going to be delivering. So if you want to be printing with silver inks, carbon inks, copper inks, this is really a tool that allows you to load up nearly any screen printable ink, calibrate it, and then you'll be able to print that in a matter of minutes. So I believe I'm going to try and rush through this, guys. Let me know if I'm running late. But let's let's go through the applications here. So to help you explore the possibilities of what's possible with desktop electronics prototyping, let's look at three case studies that we've prepared, actually, our interns prepared over the past couple of months. So we're going to start with soft insole pressure sensor. So some custom electrodes that allow you to sense how how someone's gait may be modified. We're going to look at a wearable pocket heater afterwards. It's integrated into fabrics and finally a thermal formed electric mug heater. So going from dynamic to static stretch to show you kind of what you can do there. So if we're doing the soft insole pressure sensor, you're just printing and curing on stretchable substrates, which I mean, at this point it seems fairly simple to us, but it's something that really lets you get to that point without having to do any kind of tooling. So for this example, we just use the thermoplastic polyurethane substrate and the stretchable conductive ink that we sourced from an ink manufacturer. You can let it. You can ask us. We'll let you know which one. We took a flexible carbon sheet to cover that conductor, and then we iterated on a couple of electrode patterns to get to a five zone sensing electrode. And as you increase the pressure. It decreases the resistance. You got a foot shaped FSR and you're good to go. For our next case study, we've got a wearable heater. We took that same concept of printing on Stretchable Electronics and we integrate it into clothing. So after printing and curing, then you can heat laminate that device to denim. In this case, we use denim, you can use synthetic fabrics as well. We made it a battery powered device and because we were in Canada, it was winter. We wanted to consistently heat the 45 degrees Celsius which we were able to do. It keeps your hands nice and toasty. And this was this was a really fun project for one of our interns to work on. Finally, we've got this thermal formed mug heater, which is a single stretch application rather than a dynamic stretch application, but really helps you get those lightweight 3D electronics. So in this case, we started with a 3D printed mold that we put together on our form printer. We used an inexpensive desktop thermoforming called a maku, and then we took an in mold conductive ink and printed on polycarbonate thermo formed it with 50% strain in the maximum strain regions. And after this connected to some to some power and you've got yourself a thermal formed mug heater. So this thing definitely will keep your drinks warm throughout the day. You'll be able to keep your coffee hot in the morning. And if you're a real slow drinker, you can get that at lunch as well. So that kind of wraps up our case studies portion. Hopefully I'm within the 5 minutes. If I'm not, I'm sorry, but if you want to see us in person, we will be at 10:00 live on the 12th and 13th of October later this year with the product. We'll have everything there. You can come, you can see it, touch it and you can talk to us about it. If you can't wait, you want to get in on that early access program? Jan Ganesh He's actually also in this event you can talk to him any time he'll fill you in on the program and if you have questions you can of course talk to me. My email is right at the beginning there, but also I'd encourage you to reach out to Jan. He's an expert in this area and he'll be able to hold your hands through the whole process and show you what we can really do with our next generation product. So thank you very much for sticking around. This is a lot of fun and hopefully you guys will have me back. Thank you very much for the very nice presentation. And yeah, thank you for listening. We can't wait to see the product.

This is an auto-generated transcript to help the video. It has not been proof read by a person threfore they may be errors So, yeah, thank you very much. And for the opportunity to give a talk here and show the introduction of what we are doing in the field of roll to roll UV nano printing, lithography. So Joanneum Rresearch located in Austria we have one vision with this process from nano goes macro. So I don't know if all of you are familiar with UV nano imprint. And so we have the ability to produce very small structures on large scale, so on large and mechanically flexible substrates. And the first step we have to apply a coating resin. Then the next step is the molding. So the giving, the coating, the structures and the subsequent curing via UV and then the molding. And finally you have the structure. So it seems to be quite a simple process for a highly complex and very small structures. And what we have established over the last decade that Joanneum Research is so called patterning pilot line where we start with the material. So we develop our own material, which is a anneal cure. It's like polyurethane or acrylics, which we can adjust to the specific needs a little bit later on. Then we have the simulation and the design by software tools to identify the optimal structure. Then we make the mastering. So with, for example, mala, so maskless laser lithography and the upscaling from the master by step and repeat to really have a full shim equipped with those structures. And we can do polymer shims on our own at Joanneum, we have partners in house due to the fact that we don't do this metallization by ourselves. And finally you have the production. And so this little cure resin is a registered trademark of Joanneum and on the video below, you'll see that we can really tune it and tune it in the field of surface energy, refractive index elasticity. They are currently 70% biobased already. And I'm going to restart this video as you see with a needle, for example, you have a with a standard resin, you have really scratches and all this. And by adjusting our material, it perfectly fits the desired need. And so the pilot line on the right hand side, we have this mask, this laser or solar graphic for origination. Then we can make the tooling and mastering by this step and repeat. So to scale the small design up for the whole scheme and the replication. And finally of course the printing like 2 to 2.5 D for microfluidics micro optical structures or bionic structures like rabbits, moth, eye or lotus, which is shown here. Some applications, bionic films, for example, is drag reduction where we mimic the sharkskin. So to reduce drag, if you glue this foil on airplanes like at Red Bull areas is equipped with those foils, it can result in fuel reduction, drag reduction, for example, planes or ships, then three from micro optical films for also medical diagnostics, but also for lighting industry. Microfluidic films are very interesting. Now, in the field of lab on foil and lab on chip systems, we can enhance the surface for the corrective films, but also create plasmonic films or like metal mesh, highly transparent conductive films. And here are some examples and enlargement of the picture shown before. This is realized by pilot line or open innovation testbed projects which we currently participate or coordinate like fabulous matlab and flex function to sustain. And so in the picture right below, for example, this is additional a new picture. It's holographic structure on land, recycled pet with some biodegradable resin for security features, like for banknotes, for labels or also for for tickets. And if you're interested in those projects, you can apply for micro crowns. But we can discuss this later on. And last but not least, another result from next gen microfluidics like this is a microfluidic channel shown in the left video with pillar arrays where the liquid perfectly distributes so for lab foil and lab on chip systems. And for example, if you need some other structures when you don't have these capillary effects so triangles with channels in between and you'll see when you drop some fluid you have a perfectly smooth distribution of the liquid. And so here the material, the design and the production of course are very, very important. And I think that we at joannuem research have the whole along the whole value chain, profound knowledge, which we like to offer interested companies. And so, yeah. Thank you for your interest. And I'm done.

Speaker: Girish Wable | Company: Jabil| Date: 10-11 March 2021 | Full Presentation Bio With a Bachelor of Science in Mechanical Engineering and a Master of Science in Industrial Engineering, Girish Wable is a technology, operations, sourcing and business solutions strategist for Jabil. With more than 25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation, Girish leads up strategic business and technical initiatives for Jabil. Girish, who started as an intern with Jabil, has authored several engineering publications, received multiple patents and enjoys engaging with ecosystem partners and research institutions to further the technology. Girish regularly contributes to engineering articles, reviews technical proposals, serves as advisory board, write blogs for Jabil.com and has been a keynote speaker at multiple conferences. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Brian J. Laughlin, Ph.D. Lead Scientist, Brian.j.laughlin@dupont.com Visit our web portal: https://www.dupont.com/brands/microcircuit-and-component-materials.html While the infrastructure, devices, and applications of 5G telecommunications are evolving, the need for circuits which operate at the higher frequency millimeter wave (mmWave) bands is clear. High-frequency circuit operation presents many challenges, including the need to create efficient RF signal processing and wireless transmission which can generally be achieved via increased integration that allows shorter communication paths. Also, advanced materials that enable both heterogenous integration of disparate active devices (e.g., Si, GaAs, GaN, and SiC) and passive devices (e.g., SMD, antennae, filters, etc.) while providing stable operation and low losses in a variety of environments are critical performance considerations. DuPont™ GreenTape™ Low-Temperature Co-fired Ceramic (LTCC) tape and silver (Ag) metallization delivers excellent high-frequency performance in designs optimized for high reliability and long life—even in the most challenging environments. Figure 1: GreenTape™ dielectric constant (Dk) and dielectric loss (Df) measured by a Fabry Perot from 20 to 100 GHz. As part of an initiative to demonstrate the high performance of GreenTape™ and create a reference design that goes beyond a basic material datasheet, DuPont Microcircuit and Component Materials (MCM) partnered with Dr. Chun-An “Ivan” Lu at the Material and Chemical Research Laboratories (MCL) of the Industrial Technology Research Institute (ITRI) in Taiwan. This joint effort resulted in creating a wireless communication system featuring an Antenna-in-Package (AiP) which integrates a beam steerable antenna array in a Radio Frequency Front-End module (RFFE) operating at 28 GHz. The basis of this demonstration is GreenTape™ ceramic dielectric which has excellent dielectric properties through 100 GHz while maintaining Dk of 7.1 and Df of <0.0010 (see Figure 1). Additionally, GreenTape™ ceramic’s dielectric properties are stable throughout the extreme temperature range (-50°C to 150°C) a deployed radio head may be exposed to (see Figure 2). Using a full suite of high conductivity Ag metallization pastes for ground planes, via fills, signal lines, and solderable pads, a multilayer module can be made using standard LTCC processing† that is co-fired and then can be further processed to surface mount passives, connectors, and active semiconductors. Figure 2: GreenTape™ dielectric properties measured at 28 GHz in-situ from -50°C to 150°C An RFFE AiP module was designed to incorporate Anokiwave phasor integrated circuit (IC) chipsets and utilize a 2 x 4 patch antenna array. (Figure 3 shows images of the top and bottom of the LTCC module, an illustration of the fully assembled module, and a schematic of the system architecture.) The module design and prototyping started with the radiating antenna patches, followed by the feedline network and power divider, and, finally, the integration and operation with the phasor IC with all the required passives and connectors. Figure 3: (top) Images of the LTCC module with the antenna side on the left and the SMD/Connector/IC pad on the right. (middle) Illustration of the multilayer module fully assembled. (bottom) A schematic representation of the AiP RFFE module and system architecture. The fabricated LTCC device shows excellent agreement between the simulations of the design using the material properties measured previously and the measured performance as shown by the return loss of the antenna elements (Figure 4). The module was evaluated by over-the-air measurements at 28 GHz where the Effective Isotropic Radiated Power (EIRP) of greater than 18 dBm was observed while steering the radiated beam by the array and the phasor ICs over ±35°. Less than 1 part per million error vector magnitude (~0.7 ppm EVM) was observed in a 64-quadrature amplitude modulation (64 QAM) scheme. These results were achieved due to the excellent high-frequency properties of GreenTape™ LTCC material and the highly integrated design of the system. Figure 4: (top right) Simulated verses measured data for the antenna elements showing excellent agreement. (top left) Antenna array performance over ±35° of beam steering. (bottom) Photograph of the transmitter component and the EVM data showing <1ppm of error. The AiP demonstration successfully shows how DuPont™ GreenTape™ LTCC can be used to create devices for 5G telecommunications operating in the mmWave regime. After building a software system and components to simulate the signal processing functions, 4K resolution video was transmitted reliably over 10 meters. Our reference design is analogous to several use cases in the real-world 5G buildout from customer premise equipment (CPE) including: · small cells installed indoors · connected factories · municipal- or provider-owned small cells for coverage in densely populated areas like smart cities or arenas and performance centers · mmWave base station radio heads In small and macro cells deployed outdoors, LTCC has unique advantages over organic laminate material platforms due to a significantly greater thermal conductivity of the dielectric which helps with thermal management in milliwatt to >1W operation power. Plus, LTCC is established as a highly reliable material with >200 MPa flexural strength. Unlike other materials, it is hermetic, and therefore impervious to moisture that can degrade performance. The thermal expansion of LTCC is also a close match to critical ICs that are active components in the modules. These data and the reference design are provided to encourage hardware designers to consider how LTCC properties and high-frequency performance can enable devices that provide greater access to 5G mmWave bands. The DuPont team welcomes inquiries from industry players who want to collaborate on antenna applications for GreenTape™. For more information and to view a short video of this demonstration please visit: https://www.youtube.com/watch?v=gJcwya3HLzs

Yuan Gu and Ayan Maity - Senior Scientists, Electroninks As the world of electronics continues to change shape – literally, and products become wearable, flexible, foldable, and capable of processing data at the same time, the demand for the tiny circuitry that makes this all possible has hit a tipping point, creating a need for innovative solutions. Advancements in additive manufacturing are dictating the shape, size and even purpose of new products yet to be created by consumer and industrial companies. Electroninks' particle-free inks - along with the next generation of NanoJet provided by the Integrated Deposition Solution (IDS) system - allows for the fabrication of sensors and circuits. The combination of Electroninks’ particle-free inks and IDS NanoJet provides a higher mass output, better printing quality, and lower cost to fabricate electronics compared with other traditional digital printing technologies. Particle-free Cu, Ni, Ag, Au and Pt conductive inks from Electroninks, Inc. (based in Austin, TX) are metallo-organic-based inks that provide superior performance and reliability compared to nanoparticle-based inks. Particle-free inks consisting of metal-organic precursors typically have better performance because they reduce metal films more cleanly, often at lower temperature. Final films do not contain organic components and tend to survive stress/adhesion tests which increase their reliability to moisture sensitivity level (MSL) and aerospace standards. Particle-free inks consisting of metal-organic precursors decompose more cleanly and often at lower temperature. Particle-free inks also have better stability during the printing compared with nano-particle based inks, thus the printing uniformity and longevity is better. The shelf life of metallo-organic based inks is usually longer than the nanoparticle based inks. Table 1: Comparison of NPs based Ag, Au and Pt inks with Electroninks particle-free Ag, Au and Pt inks The inks can be deposited using aerosol jet printing which is a non-contact deposition method. The schematic of this printing process involves jetting out an ink stream produced by ultrasonic or pneumatic atomization. Electroninks’ Ag, Au and Pt inks are specifically designed for ultrasonic atomization, so they attain higher printing resolution than the more conventional pneumatic atomization process. This new advanced process of printing circuits, sensors, or interconnects with an aerosol jet printer (OPTOMEC system or IDS NanoJet system) using Electroninks’ particle-free Ag, Au or Pt ink is highly flexible, high conductivity and reliability. This system also gives customers complete control and tremendous latitude in customizing their application and choosing substrates. IDS has developed the next generation aerosol jetting print head technology. This jetting process, trademarked NanoJet, relies on both hydrodynamic and aerodynamic focusing. It enables a collimated and focused broad aerosol droplet size distribution resulting in printed lines with exceptional printed edge quality. In comparison, traditional alternative approaches have historically resulted in overspray at the printed line edges. Electroninks’ particle-free Au ink has 4-10 wt.% solid fraction with a mass output that is competitive with NP-based inks. The particle-free ink is concentrated in the atomization as the high vapor pressure solvents are removed during the atomization. This ensures an appropriate mass output. Due to this novel ink formulation design, Electroninks’ particle-free Au ink can be printed at room temperature with a high mass output, which is critical when printing on conformal surfaces. The printed structure is thermal cured at 300 °C for 1 hour to achieve the best electrical conductivity. Figure 2: Au ink printing on glass (a) before thermal curing; (b) after curing at 300C for 1h Overspray and satellite spots are inevitable in aerosol jet printing. The overspray and satellite spots are caused by less weight droplets with insufficient inertia to be focused by the central sheath gas and deposited along the edge of designed lines. In contrast, particle-free Au ink has excellent atomization. It exhibits limited overspray and satellite spots in fine features printed by the IDS system, resulting in approximately 60μm linewidth. This improved line edge definition and overall line quality makes Electroninks’ particle-free Au ink suitable for dense interconnects printing in compact electronics. Electroninks’ particle-free silver ink has 14% silver loading and the same ink formulation mechanism as Electroninks’ gold ink to ensure a high mass output. Most of the existing alternative silver inks require printing at an elevated temperature to prevent spreading. This limits printing on conformal surfaces or printing on 3D substrates. One of the unique attributes of Electroninks’ silver ink is it can be used to print on high aspect ratio structures without heated plates. The printed features have minimized overspray and satellite spot and line width is measured at 15μm with approximate 2μm thickness. Electroninks Ag and Au inks can be processed at room temperature, making them ideal for printing on complex surfaces. Its Ag ink provides 5-7 μΩ-cm resistivity while Au can provide 6 μΩ-cm resistivity; this low resistivity requires fewer printing passes and saves time compared with alternative inks. Pilot testing has shown the IDS’s next generation aerosol jetting technology - which uses Electroninks particle-free inks - can print feature size ranging from 20μm wide by 2μm tall to 20μm tall on even conformal surfaces with improved edge quality, less satellite spots and minimal overspray.

This is an auto-generated transcript to help the video. It has not been proof read by a person threfore they may be error Okay. Excellent. Thank you, everyone. Good to be here. Thanks for an opportunity to speak here. My topic is critical to performance metrics of functional materials for IMC, so I'm going to try to cover some of the highlights and key points in this 5 minutes that I have here. For those that are not familiar with Sun Chemical, we are the largest ink coating and pigment supplier. I work personally in the division for Advanced Materials. We offer materials for electronics. You can see different applications here on this slide, but I will be really focusing on our suntronic materials for printed electronics and more specifically on in mold electronics. So we the topic is the requirements or requirements metrics, performance metrics for IAM. So as you can imagine, inmold electronics includes multiple process steps and it comes from printing label printing which is typically screen printing. Then it goes to say SMT assembly, it goes to 3D forming injection molding. So it's a quite, quite interesting process. But then it's not only the materials need to meet, not only performance related to process such as print ability process, stability, stability on, on, on press drying and things like that, but also 3D forming, which is really, you know, you're stretching a conductor. You you're making the cross section smaller, you're thinning the conductor, you're narrowing the conductor. So we really need to make sure that there is no cracking, no outgassing, no shorting between thinning down the dielectric, between crossovers and things like that. And of course, injection molding process involves high temperature and high pressure. So the inks need to withstand the pressure and temperature of the molten resin coming into the tool in terms of application related requirements. You know, materials need to meet the same things that traditional printed electronics requirements, printed electronic materials need to do it right. So electrical resistance, good insulation, low variance in in performance sheet during printing, you know, all of that low defects and of course, end use reliability. So when it comes to automotive applications, you can imagine a full list of reliability testing that these parts need to go to. Now in terms of some chemicals. So we are as I said, we are the largest ink coating and pigment manufacturer and we offer basically from graphic inks all the way through functional inks, solutions for most electronics. So in terms of decoration and also some auxiliary products such as adhesion promoters, barrier layers, you know, things like that that are needed for the individual layers of the IMY or decorated IMY applicators or labels. We offer our sun tech mold in christenings. We have the DMS, which is the solvent based graphic series. We have DMT. This is a two pack Salomon based graphic inks, and then the DMS series, which is the UV curable enamel decoration. Now we have range of colors, as you can imagine. You can also see on the pictures and custom matches as well. And we now also offer a non conductive decorative dense black, which is extremely important for the capacitors, which is or any circuitry that that needs to be on the label, especially on the same label. Then the electronics from the functional inks we offer conductive inks, silver conductive inks. They are used for interconnects, electrodes, antenna, heating elements, carbon conductive inks, either interconnects or resistors. Our carbon can be also flammable. They also serve carbon serves as a protective layer for connector pads. The dielectric inks certainly serve as crossover insulation, protective over codes and specification for details that are coming out of the plastic parts. Now, we do have again full range of products for either single or multilayer circuits for either one film or a two film molding process. We have we have had our solvent based range for a while and now we are actually introducing some new technologies from some chemical. We have a UV based functional inks, mainly silver. And I'll have a little bit on those in next slides. So here, one of the key metrics certainly for conductivity is or conductivity and form ability. So we have a range of silvers that have different level of conductivity and form ability and therefore they will be applicable to different end uses such as high conductivity is required for interconnects, antennas, heaters, whereas the lower conductivity or less than 30 less than 25 mill ohm square mil and forming is required for things like capacitive switches and interconnects, lower power application. A snapshot of some of the forming tools here, and I know I'm in my 5 minutes here, but I'll I'll cover it in maybe 30 seconds here. We have a very high formability for my new the newest UV curable . We have fine line principle. They're highly flammable as well. So as you can imagine, the finer lines you print the you can do either higher density interconnects or transparent electrodes, heaters, transparent heaters, transparent antenna. You can combine fine line mesh with and with another transparent conductor like the P dot or cents coatings for highly conductive transparent features. So you can see example of some of the things that we printed that are suitable for. I'm down to around the 20-25 micron level. And last but not least, our high reliability dielectric. You can see our newest generation is highly stable in the 10 to 12 or resistance in the crossover. So you can imagine very fairly thin layer of crossover between the between the layers of the servers with 20 volt bias eight in 2080 585 environmental chambers. So highly stable, highly reliable dielectric as well. So that's it from my side. Some examples of the projects, my contacts. So please let me know if you have any questions or you want to discuss further.

This is an auto-generated transcript to help the video. It has not been proof read by a person threfore they may be error All right, perfect. The stage is yours. Thank you. So had everyone as already told. My name is Jonas Martin from Fraunhofer Ilt in Germany. And I'm going to present you some of the work related to printed electronics now. So as a first small hint, what are we doing? Who are we? I'm coming from the group fields of film, film processing, a form of ilt, and we're covering in detail five different topics, all about things and processing. So the first one is about cleaning, painting, pretreatment of layers or substrates. The second one is about corrosion, corrosion resistance and anti stick layers. The third one is about energy and mobility means a particular battery technology and hydrogen technology. And the two topics I'm going to detail today are printed electronics and embedded sensors and microelectronics in particular, also by printing technology. So our approach to what's printed electronics, we are using laser radiation sources for the additive production of electronic layers. Depending on this, we typically have about four process steps, not too different from those you already know from printed electronics. So firstly, we usually do a surface pre-treatment mainly via laser radiation, but we do also use sometimes more conventional techniques like plasma treatment and so on. Secondly, we do the position of the layers, mainly with lasers, also by industrial technologies, mainly like inkjet printing, also jet printing, screen printing and so on. And then we add the point where our main expertise comes in, which is the thermal treatment of the layers, meaning on one hand, laser base drying, getting all the organic components out of the layer. And on the other hand, laser based functionalization meaning in particular the sintering and the melting of the particulate layers. If you need multi material or multi layers, we can do this, of course, in the loop and the benefits we try to create are massive, as you see. But I think in this context the main is the main benefits come from a resource efficient, flexible, low cost application of of sensors and layers onto 3D components and the application of our technology only on a selective area of the substrate. So first example I want to show you about how about the technology is from the field of microelectronics. Here we are printing actors or micro actors onto silicon wafers, which then can be used to produce micro speakers, hearing aids and so on. So therefore, we use inkjet printing to deposit multiple layers of lithium nickel oxide and lead tonight onto platinum silicon or two platinum coated silicon wafers. And the printheads are laser crystallized by using laser radiation. So as you can see this here, so that we can get multiple layers with this, we get multiple, very homogeneous layers of those two components which we can cure using laser radiation in shorter times, which in comparison, which one would need if he's using an oven or an eight and those layers later get an etched and contacted to produce these loudspeakers I was telling you about a second application comes from aerospace and this is about the integration of functions into fiber reinforced plastics by the combination of printing and laser technology. And in particular, we are here about here we are here talking about the integration of function into semi-finished products, which means we have some kind of textile which we are printing on and which is then fabric worked on by vacuum infusion, for example, to produce different features into the final component like deformation sensors, integrated LEDs or humidity sensors, which we demonstrated together with our colleagues from Fraunhofer, F.M. and Wing Leading Edge to show these integrated functions. Next application is about the combination of 3D printing with printed electronics. So what we are trying here to do is printing of strain gauges onto 3D printed components. We do this by the position of insulation layers by dispensing process. After that, we use each technology to print strain gauges onto the component and then using laser sintering to have the possibility to only sintered strain gauge without touching from a heat point of view, the component itself and equipped with a wireless transmission board, we are able to do wireless integrated structural health monitoring onto components, which is almost all printed except for the for the transmission board right now. We also did some function tests with similar structure where we can see that as the wireless transmission as well as the signal generation by the strain gauge is working quite well to get signal and to measure the strain. But it's not only about on the component, but also going into into a component. So what we did here is having a laser powered fusion process, metal 3D printing process, which we stopped at one point and then went on with integrating sensors. Again, here we are talking about string gauges into this component by printing and laser sintering, this time with aerosol object printing technology. And then after wiring and encapsulation of the sensors, we finished the 3D printing process, we reworked the component and then had a finally working milling hat with integrated sensors, which you can use for machining your metals while measuring all the mechanical properties inside your head. So with this, I'm going to end my presentation. Thanks a lot for your attention. If you have any questions, I would happily answer them. Just contact me with the contact data you see there. And thank you.

This is an auto-generated transcript to help the video. It has not been proof read by a person threfore they may be error Thank you. Well, good morning, everybody. I represent metamaterials and we're developing discrete platform specific proprietary technologies for large area lithography, similar to the previous speaker in a sense. But I guess where we differentiate is that to a certain extent we have a roll to rolll manufacturing of these films. So the large area allowing the manufacture of these nanostructures to be carried out in a very cost effective manner. So each platform that we have employs massively parallel patterning scheme designed to be scalable in these large areas of either rigid substrate materials or rolls of flexible film. And in certain cases we use phase shift masks approach to actually pattern them. And in others we use a new type of class cast plasmonic printing, all allowing for the creation of structures with feature sizes down to about 50 nanometers. Metamaterials are complex structures, as we just learned and patterned into conventional materials such as metals or plastics, in ways that perform special functions, such as transparently blocking a specific level of light, for instance, in one of our products for anti reflective glasses to prevent people from laser strikes, etc., or performing multiple optical functions in, say, a lens which we're also working on. So what I'd like to do today is just zero in or just one of our platforms, nano web in the time available and seven several revolutionary printed electronic applications that Nano enables. So another way is a metal mesh and it's configured as a transparent nanostructured conformal y mesh with a 500 nanometer line width with very superior electrical and optical properties, and it can even be laminated onto glass curved surfaces . And I'll come on to explain how we've applied it to ophthalmic lenses for a number of exciting applications. ITO has high electrical conductivity granted and has good optical transparency, and it's chemically stable, but it suffers from very high cost and limited supply of indium. It's fragile in many cases inflexible and is costly to deposit, especially as you get down less than 24 square, which a lot of our customers want. For some of the automotive applications that come on to nano work, however, has all the electrical performance benefits of ITO. And as you can see here, nanotechnology clearly demonstrates its superior transparency and sheet resistance performance, which in many cases can't be attained by ITO. It supports precision, high resolution and high yield patterning. And this is because we're patterning literally at the lithographic level at source. And so we're able to pattern in certain types of features and new types of applications. For example, in a show recently, a couple of weeks ago, we demonstrated a 5G antenna that can receive high bandwidth, totally transparent into the optical lens. So by patterning it at the same time that we're making the nano web into the application structure, we in fact get all that for free. There's no need, unlike ITO, to go back and do that in this application. Nano web, as I mentioned, enables the smart glasses for 5G and 6G antennas. We can also commit to putting in eye tracking and anti fogging filters, all to be integrated in goal here for customers in all day wearable glasses. And these are ophthalmic glasses and you'll notice that the 5G patterned antenna in the black frame glasses here is totally invisible. You literally go right up to it, move around, and you cannot see it in there because of the resolution of the patterning. So the costing of these electronic devices in curved lenses also requires precision alignment. And as we fabricate and cast these lenses, we're able to actually align these functional films very accurately, either for display applications or antenna applications like the one demonstrated. Here. We've laminated our nano web to be an EMI shield in the door of a microwave oven. And we're actually sampling these now as demonstrations to a number of manufacturers. We can scale this using our roll to roll process into full size ovens. And we even address the smart oven application space where you not only have a microwave built in, but you also have a convection oven and a steam oven at the same time. And it's only with this highly transparent nano web as an alternative to the traditional microwave perforated match that you have at home, that you're able to do that because clearly when you're using conventional convection oven, you want to be able to see how the cooking is proceeding and to time it in that respect. So Nano is a key enabler to create total transparency in this consumer category. Here now the Webbs attached to a building where it can enhance 5G and six G signals at a high bandwidth. And it's a totally passive solution where the functional film reflectivity is equal that to a solid metal sheet. And finally in ADAS and autonomous vehicles which depend on cameras and sensors to see the surroundings, we can use nano web as an active heater in that respect to heat and dimmest and default, etc. So that really gives an overview of one of our category products. And I encourage you to entertain any questions or comments with regard to either this or some of our other products. Metamaterials Thank you so much. Thank you so. Speaker 200:06:27Much, Jonathan, for the excellent presentation. So I want to say that Metamaterial is our gold sponsor actually, so thank you very much. And they do have a booth. So if you want to meet Jonathan and some of his colleagues, maybe please visit hall six. So go back to the floorplan and click on their logo at hall six and then you will find the booth.

Digital fineline printing is one of the most important developments in additive electronics. Inkjet itself has come very far with excellent progress even towards R2R industrialization. However, inkjet has two limitations as a technology: (1) limited resolution, (2) limited ink viscosity range, and (3) limited throughput per print head. Here, we highly several digital and hybrid technologies that can overcome these limits. XTPL- microdispensing with innovative non-Newtonian highly-loaded NP pastes The first is the microdispensing technology developed by XTPL with nozzle diameters in the range of 0.5-12um. It demonstrates a unique combination of ultrafine line (few micron) 'digital' printing on flat and non-flat surfaces AND highly conducting (40% Ag bulk?) highly viscous nanoparticle (Ag, Cu, Au) pastes. Thus, this technology advances the art not just by extenting the resolution of digital printing beyond what inkjet achieves but also by enabling far more conductive and highly loaded conductive pastes. The innovation here is not just the microdispensing machine, but also the unique non-Newotonian highly-loaded nanoparticle pastes. The AgNP pastes have high loading (>85 wt% in some cases), small particles (45nm), and are in ethylene glycol solvents. The pastes require relatively high sintering temperatures (250-300C) but offer high conductivity, e.g., 4.2 uOhm.cm for the ink with 80wt% loading. In the first slide below you can learn about the microdispensing machine itself. It currently has a substrate size of around 50 mm x 50mm. The max print speed is around 10mm/s. The XY motor and Z motor controllers have accuracies of 2um and 0.5um, respectively. In the next slide, we can see the types of structures that can be printed. In the benchmarking chart, it is demonstrated that they can achieve 2um linewidths with >40% bulk Ag conductivity, which outperforms other reports in the literature. In the right, one can see the types of structures being printed, showing that the printed structure demonstrate high aspect ratios. Given the highly loaded nature of the pastes as well as the narrow nozzle, fear of constant clogging exists. In the next slide, it is shown that the non-Newtonian pastes can be printed through a 2.5um nozzle for long periods of periods, demonstrating the stability of the process. In the final slide, we showcase the structures which can be printed. Electrohydrodynamic Printing: Breaking the Limits of Inkjet EHD is one of the most exicintg developments in the additive electronics field. It offers several key advantages over traditional inkjet: (1) it can achieve lower resolutions beyond current capabilities of inkjet, (2) can handle a wider range of ink viscosities, and (3) can cover non-flat topographies. EHD can print drops with <500nm diameters. It can reach 1-10um resolution, which standard inkjet would struggle to achieve. Furthermore, it can handle pastes with viscousities of some 1000 Cp. Given that the principle is based upon particles being pulled out by electrostatic force, whereas being pushed out by mechnical force as is the case with inkjet, the trajectory of the particles can be controlled, enabling one to print on 3D or non-flat topographies. These are all important technological steps forward. In the second slide, you can see examples of printing lines, droplets, and other patterns, demonstrated by Enjet. In the case of lines, one can see L/S ranging from 2/2um to 80/80um, demonstrating both the versality and also ultrafine line printing capabilities of this technology. In the inset, digital printing over a non-flat surface is shown, demonstraing good step coverage. A challenge for this technology is that it is slow. Most systems are R&D systems with a single head. However, companies are now developping industrial-scale mult-head printing. The embedded video shows a multi-nozzle array printing of 0.5-1um Ag NP lines by Scrona. This is a fantastic result because it shows a pathway towards industrial scale printing at ultra fine lines, beyond what inkjet achieves. Final slides show some applications. The application space is in fact broad and expanding. The EHD can be used to digital print micropads for placement of ever shrinking microLEDs (is the die attach a particle free Ag ink??); it can be used to print quantum dots (QDs) onto ever shrinking microLED dies, enabling color conversation; it can be used to repair printed metallizations and wrap-around edge electrodes for microLEDs or repair TFTs post production; it can be used in semiconductor packaging to digital print inteconnects or shielding; etc etc Join the TechBlick Innovation Festival (24 June- free | online) here to learn more. At this festival, Fraunhofer IAP will present the latest on EHD of QDs for display applications and DoMicro will present its perspectives on EHD printing, perhaps for die-first integration. LIFT Processs: digitization of screen and stencil printing LIFT or laser induced forward transfer is a process enabling digital non-contact deposition of highly viscous conductive pastes and even adhesives and solder. This is in contract to inkjet which digital prints low viscousity inks. The principle of operation is demonstrated in the first slide. A transparent film is coated uniformly with a thin layer of paste. When laser pulses hit a spot on the film, if the paste is correctly formulated, it will detach and land on the substrate. As such, this technique opens the way to print without mask or nozzles patterns of various viscous materials on any substrates. The second slide shows the various materials that could be printed. The table is from IO Tech, suggesting that a wide range of off-the-shelf materials can be LIFT printed. It is of course not as straighforward as this since many parameters need to optimized, e.g., laser fluence, pulse rate, distance of film to substrate, print speed, coated film thickness, shear thinning properties of the paste, target substrate, etc, etc I include some printed patterns from literature. These are printed straightlines using PV metallization pastes, showing that narrow linewidths as well as very high aspect ratios can be achieved. In one example, a linewidth of 65um is achieved. Note that this is wider than the state of production in screen printing of PV pastes (34um) In subsequent slides, you can see various demonstrations. In these examples, solder paste is LIFT printed, adhesives are deposited, or packaging interconnects are fomed (in this example a linewidth of 20um is claimed, although we have not seen verification yet). Finally, you can see that also Ag and Cu nanoparticle inks can be formulated to be compatible with LIFT. In general, these examples demonstrate the LIFT can go where inkjet can not. In general, LIFT is an intersting technology. The production is not yet fully commercialized despite the principle of LIFT being well established for some years. The latest efforts are aimed at creating industrial-scale R2R machine able to print multi-materials. It will be an interesting space watch, especially if it indeed succeeds in printing fine linwidths using viscous pastes digitally (without mask or nozzle) but at high speeds. Join the TechBlick Innovations Festival (24 June 2022 | FREE | Online) to hear from Keiron Printing Technologies, a start-up in Eindhoven developing and commercialising a novel LIFT machine. R2R: Jet selective metallization for industrial level production JetMetal Technologies has developed a novel process which is able to spray jet metallize surfaces with select area control. In this technique, two water-based components are sprayed onto a surface and via a redox process under atmospheric temperature and pressure conditions a thin layer of pure metal (in this case mainly Ag) is formed. The thickness can range from 10nm to 5um but is most typically a few hundred nanometers. This process is thus a bridge between high-throughput painting process and thin and controlled plating deposition. The formed lines are close to pure Ag, and thus offer high conductivity. Indeed, JetMetal Technologies suggests that they can reach 85-90% of bulk Ag conductivity on a smooth PET substrate when the sprayed coating is 500nm thick. Both the thinness and high conductivity are clearly differentiated from traditional particle-based pastes and inks because such traditional inks are typically 20-30% bulk Ag conductivity when applied on low-T PET substrates. Furthermore, with the exception of inkjet or particle-free inks, the printed thickness levels are typically in the few micrometer ranges. Like printed inks and pastes, the jet metallization will also need to prove adhesion to different substrates. A challenge for any spraying or jetting process is the ability to achieve selective area metallization. JetMetal has developed a hybrid process in which a dielectric ink is first printed (Screen, inkjet, gravure, etc) to act as a mask. The jet metallization then applies the Ag, metallising the exposed parts and (this is crucial) removing the masking ink at the same time. Therefore, no lift-off or similar process will be required. We would imagine that the process needs to be carefully controlled so that the right metallization thickness is achieved and the masking ink is fully dissolved at the right time so no residual ink is sprayed. As shown in the slides below, JetMetal has a S2S screen printing machine in-house (400x400mm with >50um resolution) as well as a R2R pilot jet metallization line (400m width, <3m/min web speed). Multiple applications are showcased in the slides. RF Antenna: a thin and highly smooth (Sa<20nm) layer is deposited achieving 90% bulk Ag conductivity with >50um resolution. The properties are shown in the slide PI based heater with with 50nm homogeneous Ag layer A metal mesh with 150nm linewidth and >90% aperture acting as a semi transparent thin film heater a thermoformed 3D circuit with <1000% elongation. This is interesting because in their case they elongate the masking ink first and then metallize the 3D shape using the jetting process. Thus, the elongation of particle-filled conductive inks will not be the limiting factor