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National Research Council of Canada, Ottawa, Canada 3D electronics afford a means to miniaturize and enhance the performance and integration of electronic devices; however, adoption of 3D-printed electronics has been delayed by the lack of processes to effectively produce high-resolution metallic interconnects with good electrical performance on complex 3D shapes. While direct-write 3D printing has demonstrated the ability to generate conformal conductive interconnects, the technique is slow and yields low print resolution. The National Research Council of Canada (NRC) has developed a new fabrication approach based on tomographic volumetric additive manufacturing (VAM) that can produce electronics on complex 3D shapes with high manufacturing speed, high conductivity and 3D design freedom. Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend VAM is an emerging 3D printing technique developed in 2019 [1,2] and has since advanced as an additive manufacturing approach that can yield complex 3D objects with ultra-high speeds, with no support structures or layering artifacts. [3-7] The approach projects light patterns onto a rotating vial containing liquid photoresin. When the absorbed light dose reaches a critical threshold, the photoresin cures, resulting in solid polymer. The shape of the solid polymer follows the shape of the patterned light dose inside the printing volume, enabling printing of solid 3D objects. Unlike other 3D printing techniques that are based on layer-by-layer approaches, VAM can be used to 3D-print a polymer on top of an existing structure (Figure 1). The NRC is exploiting this particularly powerful feature of VAM to introduce conductive features to complex 3D shapes. In this approach, VAM is utilized to pattern a functional polymer onto the surface of a 3D object. The printed polymer is functional, allowing it to act as a template for electroless plating of a metal yielding an object with 3D conductive features. Figure 1. Light images of our test pattern are projected on a rotating square rod. Figure 2. a) The polymer patterned on the square rod acts as a template for copper plating. To realize 3D electronics with VAM, the NRC developed the projection algorithm to account for occlusion due to the opaque base object, the hardware to ensure alignment with projected light and the photoresins to serve as templating layers for copper plating (Figure 2). With this approach, we have demonstrated good print accuracy and resolution, as demonstrated in Figures 3a and b. Our test pattern illustrated the method can produce traces with widths of 70 µm, surface roughness of less than 0.10µm (RMS) with sheet resistances of below 100 mΩ/[]. To further demonstrate the strength of this approach, a multidirectional spiral RF antenna was designed and printed on a hemisphere using VAM. The spiral antenna (Figure 3c) was printed in less than a minute and was treated with copper electroless plating solutions, collectively resulting in a process that requires less than 10 minutes to complete.* The approach is particularly remarkable for its ability to print on any arbitrary object and material type and therefore can be a powerful tool for integrating antennas, metasurfaces or electromagnetic interference shielding onto the surfaces of objects. In summary, this new approach offers speed, resolution, cost efficiency and the ability to print in 3D in an unrestrained way, offering an alternative to extrusion or direct-write 3D printing, which generate conformal conductive interconnects that are slow, require complex 5-axis equipment and yield low print resolution. Figure 3. a) A test pattern of copper traces printed using the NRC’s VAM approach; b) the target line widths versus the measured line widths of copper traces; b) a spiral antenna printed on a hemisphere and c) S11 response from the spiral antenna. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now. References [1] D. Loterie, P. Delrot, C. Moser, Nature Communications 2020, 11, 852. [2] B. E. Kelly, I. Bhattacharya, H. Heidari, M. Shusteff, C. M. Spadaccini, H. K. Taylor, Science 2019, 363, 1075 [3] D. Webber, Y. Zhang, K. L. Sampson, M. Picard, T. Lacelle, C. Paquet, J. Boisvert, A. Orth, Optica, OPTICA 2024, 11, 665. [4] I. Bhattacharya, J. Toombs, H. Taylor, Additive Manufacturing 2021, 47, 102299. [5] A. Orth, K. L. Sampson, Y. Zhang, K. Ting, D. A. van Egmond, K. Laqua, T. Lacelle, D. Webber, D. Fatehi, J. Boisvert, C. Paquet, Additive Manufacturing 2022, 56, 102869. [6] A. Orth, D. Webber, Y. Zhang, K. L. Sampson, H. W. de Haan, T. Lacelle, R. Lam, D. Solis, S. Dayanandan, T. Waddell, T. Lewis, H. K. Taylor, J. Boisvert, C. Paquet, Nat Commun 2023, 14, 4412. [7] D. Webber, A. Orth, V. Vidyapin, Y. Zhang, M. Picard, D. Liu, K. L. Sampson, T. Lacelle, C. Paquet, J. Boisvert, Additive Manufacturing 2024, 94, 104480. *Design and measurement of the spiral antenna were performed by Prof. Amaya and Hojjat Jamshidi Zarmehri from the University of Carleton, Ottawa, Ontario, Canada

Author: Johanna Zikulnig, Silicon Austria Labs As the sensor market surges ahead, driven by megatrends like the Internet of Things (IoT), digital healthcare, and smart packaging, it's becoming increasingly urgent to consider not just how sensors are made, but also but also what happens to them at the end of their life cycle. At Silicon Austria Labs (SAL), we are investigating a critical yet often neglected aspect of this growth from manufacturing until the end-of-life (EoL) of printed and hybrid sensors. Our research focuses on sustainability-driven design to address environmental implications. Why Now? Three Key Drivers 1. Ubiquitous Sensing The global sensor market is expanding rapidly, with an estimated annual growth of ~9% [1]. From automotive to digital health and industrial automation, sensors are being embedded everywhere to enable real-time monitoring and smart control. Driven by the rise of IoT-enabled environments, this trend will only accelerate. 2. Emergence of Single-Use Applications Fields like point-of-care (PoC) diagnostics [2] and smart packaging [3] are seeing unprecedented growth. These applications often require low-cost, disposable sensors integrated directly into products or packaging. Printed electronics have emerged as a key enabling technology in this context, offering thin, flexible, and scalable solutions that meet performance and cost demands. While functionally effective, these single-use applications raise red flags for sustainability. 3. Electronic Waste is the Fastest-Growing Waste Stream Electronics already represent the fastest-growing waste stream globally [4], yet printed sensors embedded in non-traditional products like packaging or textiles rarely end up in conventional e-waste streams. Instead, they are discarded alongside household or municipal waste, leading to a silent loss of valuable materials and a missed opportunity for resource recovery. Do not miss the TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now.   What Happens When the Sensing Ends? Printed sensors are typically composed of hybrid material systems, combining elements such as polymer substrates, functional inks, and often a semiconductor chip for wireless communication or data processing. Figure 1 presents examples of in-mold-electronic and PoC devices. As these technologies are increasingly deployed in everyday applications from packaging to diagnostics the question arises: What happens at the end of their short life? Figure 1: Example of (a) in-mold-electronics and (b) PoC diagnostic device enabled by printed electronics technologies (KERMIT project: www.kermitsense.eu). Based on the European Union’s waste hierarchy [5], SAL has examined end-of-life (EoL) options for printed single-use sensors. Landfilling: While biodegradable components, such as certain substrate materials, can break down over time, they may emit methane (CH₄), nitrous oxide (N₂O), and CO₂, all of which contribute to climate change. However, non-degradable components such as metal electrodes and microchips are even more concerning, as they remain in the environment for generations. Incineration (with Energy Recovery): While a small amount of energy can be recovered from the combustion of carbon-based components, non-combustible materials like silver and copper are too small to be extracted from bottom ash. These valuable and strategic metals are lost to landfilling or downcycling into construction materials, undermining circularity and resource conservation. Recycling: In theory, recycling is the most desirable path, yet it is rarely feasible in practice. The mixture of materials, use of encapsulants, and embedded chips make it difficult to separate and recover components. Currently, no standardized recycling infrastructure exists for these small, integrated devices. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Bridging the Gap Between Innovation and Waste In a recent study published in Scientific Reports [6], we used life cycle assessment (LCA) to analyze the environmental hotspots associated with printed sensors. Contrary to expectations, we found that substrates, which are often the largest component by weight, contribute relatively little to overall environmental impact. Instead, it is the functional materials, such as nanoparticle-based inks or embedded semiconductor chips, that dominate environmental burdens. This challenges the intuitive assumption that "bulk equals burden" and emphasizes the need for system-level evaluation in sustainable design. Moreover, there is a blind spot that compounds the problem: printed sensors integrated into disposable products, such as packaging or textiles, do not typically enter the regulated e-waste stream. Instead, they are discarded as part of municipal waste, where they are neither recognized as electronics nor sorted for material recovery. This results in the loss of valuable functional materials – many of which are scarce, energy-intensive to produce, or considered strategic or critical by the EU [7] – and represents a missed opportunity to close resource loops. But this challenge also reveals a unique strength of printed electronics: Unlike conventional electronics, printed and hybrid electronics offer the possibility to work with novel or unconventional materials. This opens the door to reducing dependency on critical raw materials – a strategic global priority. Emerging sensor designs increasingly feature bio-based polymers, carbon-rich inks, and functional materials sourced from renewable streams. These innovations don’t just reduce environmental impact, but they diversify material sources, potentially shielding the industry from future supply shocks or geopolitical risks. Consequently, sustainability also presents a business opportunity: By designing systems around novel, secure, and recyclable material streams, companies can establish greater control over their supply chains and reduce exposure to material volatility. In the long term, such an approach could lead to industry-specific closed-loop ecosystems, where materials are deliberately selected not only for function but also for recoverability, safe degradation, or reintegration into new production cycles. To realize this vision, however, end-of-life considerations must be part of the innovation process from the start. Without that, the full potential of printed electronics as an enabler of a sustainable, resource-resilient future will remain unexploited. Rethinking Design: From Disposable to Responsible As printed single-use sensors continue to gain traction, the industry has the opportunity – and responsibility – to integrate environmental considerations from the outset. We need: • More transparency on materials and recyclability • Cross-sector collaboration to define end-of-life pathways • Continued development of eco-conscious sensor designs At Silicon Austria Labs, we see sustainability not as a barrier but as an opportunity. The future of electronics is not just smart. It must be sustainable. Let’s build that future together. For collaboration opportunities or further information, visit www.silicon-austria-labs.com or connect with us on LinkedIn (https://www.linkedin.com/company/silicon-austria-labs/).   About Silicon Austria Labs (SAL)  Silicon Austria Labs GmbH (SAL) was founded in 2018 as a top non-university research center in the field of Electronics and Software Based Systems. At its locations in Graz, Villach and Linz, research is conducted on key technologies in the fields of Microsystems, Sensor Systems, Power Electronics, Intelligent Wireless Systems and Embedded Systems. SAL brings together key players from industry and science and thus valuable expertise and know-how, and conducts cooperative, application-oriented research along the value chain. The aim is to accelerate the value creation process from idea to innovation – with excellent research and economic benefits. Owners are the Republic (50.1%), the Provinces of Styria and Carinthia (10% each), the Province of Upper Austria (4.95%) and the Association for the Electric and Electronics Industry (24.95%).    References: [1] Sensor Market Size, Share & Analysis | Growth Report [2032] [2] Point Of Care Diagnostics Market Size & Share Report, 2030 (grandviewresearch.com) [3] https://www.gminsights.com/industry-analysis/smart-packaging-market [4] Global E-Waste Monitor 2020 (UNITAR) [5] Waste Framework Directive - European Commission (europa.eu) [6] Zikulnig, J., Carrara, S., & Kosel, J. (2025). A life cycle assessment approach to minimize environmental impact for sustainable printed sensors. Scientific Reports, 15(1), 10866. [7] https://single-market-economy.ec.europa.eu/sectors/raw-materials/areas-specific-interest/critical-raw-materials/critical-raw-materials-act_en? We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now.

#PrintedElectronics #MultiMaterialPrinting #LaserPrinting #Disruption #AdditiveElectronics Author: Masoud Mahjouri-Samani | CEO and Founder NanoPrintek, info@nanoprintek.com In labs across the world - whether in industry, government, or academia - there’s a shared frustration: the path from concept to product is too slow, too expensive, and often restricted by the limitations of the tools themselves. For decades, R&D and Production labs have had to work around the constraints of ink-based printing systems - formulating complex inks, fighting clogs and contamination, dealing with post-processing steps, and adapting their ideas to match the tool rather than the other way around. At NanoPrintek , that paradigm is being reimagined. Figure 1. The paradigm is being reimagined. NanoPrintek’s ink-free multimaterial printing platform  doesn’t just eliminate inks - it eliminates the compromises that come with them. Instead of using liquid formulations with short shelf life and questionable reliability, NanoPrintek’s technology prints directly from solid pellets of the desired material — metal, ceramic, dielectric, or composite. Using a combination of laser-induced nanoparticle generation  and real-time laser sintering , the platform creates pure, high-performance printed features right where you want them - on many substrates. There’s no drying time, no curing stage, and no solvents to remove. What you get is a clean, fast, and incredibly versatile system that can take you from idea to functional device in a matter of hours. Figure 2. Examples of printing various materials directly from raw sources. A New Way to Print — Without Inks, Without Limits Imagine being able to print a complete multimaterial device structure from solid materials in one run  without ever touching a drop of ink . We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action That’s exactly what NanoPrintek’s printers offer. The technology works by ablating nanoparticles from a target pellet using a finely tuned laser, propelling them toward a substrate, and then sintering them instantly into a fully formed pattern. Everything happens in real time, without chemicals, binders, or additional processing. The result? A simplified, cost-effective, and sustainable process  that lets researchers print what they want, how they want it — whether on paper, glass, plastic, or even stretchable polymers. Figure 3. Printing on various substrates. Figure 4. From single materials to hybrid structures From Concept to Device - Without the Waste There’s also a sustainability story here that can’t be ignored. By removing inks from the equation, NanoPrintek eliminates the use of harmful solvents and binders. There’s no runoff, no chemical waste, and no energy-intensive curing steps. You use only what you need, when you need it —and the solid targets are shelf-stable, clean to handle, and easy to store. This makes the system not only better for the planet but also safer and more convenient for its users. Real Impact Across Key Sectors What makes this platform especially compelling is how broadly it applies. In the defense sector, the ability to print multimaterial circuits on-site - without fragile fluids or bulky equipment - opens doors for field-ready prototyping and battlefield repairs. In aerospace , the platform's compact footprint and low power needs make it a strong candidate for in-situ manufacturing aboard spacecraft or remote bases. In the energy  space, researchers are using NanoPrintek to explore next-gen batteries and supercapacitors with complex material architectures that would be impossible to formulate into inks. In biomedicine , the clean, solvent-free printing process is ideal for developing sensors on biocompatible or biodegradable substrates, from smart bandages to neural interfaces. Across all of these domains, the common thread is clear: less time preparing materials, less cost, and more time innovating with them . We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action The Future of Printed Electronics Is Ink-Free NanoPrintek’s ink-free multimaterial printing isn’t just a new technology — it’s a new way of thinking about additive manufacturing. It puts the focus back on speed, flexibility, and creative freedom , without the overhead of traditional processes. And for researchers and developers who are pushing the boundaries of what’s possible, it offers a clear path to get there — faster, cheaper, cleaner, and with more control than ever before. In a world that demands agility, sustainability, and precision, NanoPrintek is delivering the tools to keep you ahead of the curve . Want to learn more about how ink-free printing can transform your lab, research center, or advanced manufacturing team? Visit www.nanoprintek.com  or reach out to info@nanoprintek.com Proudly engineered and manufactured in the USA. We are Exhibiting in Boston and Berlin. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) is just less than a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations and material innovations as well as applications, manufacturing, and enabling technologies related to flexible hybrid electronics in wearable sensors and biosensors In this particular article, we focus on several applications beyond wearables/sensors as well as additional critical process innovations that advances the art of additive, hybrid and 3D electronics. Final Early Bird Discount Ends Soon! NASA Goddard Space Flight Center : NASA’s 3D Printed Electronics Lab enables custom antennas, sensors, and circuits to be printed directly onto spacecraft surfaces, enhancing performance and reducing SWaP. Printed solutions allow precise control over materials and geometry, improving reliability and accelerating mission design cycles. Raytheon | An RTX Business presents advances in Printed Hybrid Electronics (PHE) for next-gen RF systems. Using direct-write additive manufacturing, Raytheon develops printed interconnects and passive components to reduce SWaP, eliminate soldering, and enable conformal designs. Work at RURI focuses on board-level printing of coatings, resistors, capacitors, and inductors for reliable, compact, and structurally integrated electronics. Boeing Research & Technology - John D. Williams discusses advances and ongoing challenges in adopting additive electronics in aerospace systems. Final Early Bird Discount Ends Soon! Jones Healthcare Group presents intelligent packaging solutions designed to improve medication adherence through integrated printed electronics. Smart packaging enables real-time tracking, reminders, and data logging—enhancing patient outcomes and supporting connected healthcare systems IEE Sensing presents automotive use cases for printed electronics, from legacy safety systems to emerging needs in smart mobility, sensing, and infotainment. Hybrid electronics enable sensor fusion and edge computing for in-cabin monitoring and beyond. Dracula Technologies highlights scalable inkjet-printed organic photovoltaics for powering IoT devices via indoor light. Fully printed IOPV modules support autonomous, battery-free operation with shape customization. Final Early Bird Discount Ends Soon! Greensource Fabrication outlines U.S. PCB reshoring enabled by Zero Liquid Discharge (ZLD) systems and IC substrate capabilities via Semi-Additive Processes. A roadmap for sustainable and advanced domestic production will be presented. DEVCOM Army Research Lab presents a study on the durability of printed hybrid electronics under extreme mechanical shock. Using a “mill-and-fill” method with sintered silver traces on polymeric substrates, assemblies were subjected to up to 100,000 g impacts. Findings revealed low-cycle fatigue behavior, with cumulative shock leading to cracking, electrical degradation, and eventual component detachment. E Ink outlines advances in color-changing ePaper technology, enabling ultra-low power, full-color displays for outdoor signage and other sustainable applications. The new platform combines ACeP™ pigment mechanisms with microcapsule structures to deliver high-contrast, wide-temperature-range displays up to 75". The talk highlights real-world use cases and sustainability benefits of these dynamic surfaces. Final Early Bird Discount Ends Soon! TracXon introduces a patented, high-speed roll-to-roll process for printing vertical interconnects (VIAs), addressing a key bottleneck in printed electronics. This breakthrough enables double-sided, high-density circuitry without costly multi-layer isolation stacks. TracXon’s VIA filling system integrates with existing R2R and S2S lines, bringing printed electronics closer to PCB-level complexity. Essemtec presents precision jetting and mounting platforms for flexible substrates, addressing challenges like adhesive rheology and fine-pitch component placement in printed electronics. Notion Systems outlines industrial deployment of inkjet and EHD printing for miniaturized electronics. The session covers resolution, material compatibility, and real-world case studies, concluding with insights into ongoing R&D. Final Early Bird Discount Ends Soon! Altium discusses a cloud-based vision for agile electronics development, enabling real-time collaboration across engineering, procurement, and project teams. The platform integrates AI-assisted requirements, shared design environments, and supply chain visibility - streamlining the path from concept to manufacture and transforming hardware development into a truly agile process. Advanced Printed Electronics Solutions discusses strategies for scaling additive electronics through improved CAD/CAM tools and adaptive manufacturing. The talk addresses key barriers to broader adoption - design complexity, performance, and volume production - and highlights how emerging technologies enable both mass customization and scalable manufacturing. 3DFlexible presents a conformal circuit printing approach using AM-enhanced 5-axis CNC platforms. By integrating printing and post-processing tools with automated tool changing and multi-axis motion, the system enables precise, multi-layer deposition on complex surfaces. This cost-effective, reliable solution advances conformal electronics manufacturing on standard CNC hardware. Final Early Bird Discount Ends Soon! FineX – Panasonic showcases roll-to-roll fine mesh production for transparent conductive films used in EMI shielding, de-icing, photovoltaics, and displays. The solution addresses scalability and cost barriers of micron-scale “invisible” meshes. MicroContinuum, Inc presents a scalable roll-to-roll subtractive process for producing multilayer nano/micro-patterned films combining polymers, metals, and dielectrics. These flexible substrates enable advanced applications like OLED lighting, IR energy harvesting, and metamaterials. A key focus is improving OLED efficiency via nanoarray light extraction and transparent metal mesh electrodes. Carpe Diem Tech will also present the latest advances on nanoimprint lithography for flexible printed hybrid electronic and optical applications. Final Early Bird Discount Ends Soon!

Author: Rudy Ghosh, Vice President - Business and Applications Development, NovaCentrix #PrintedElectronics #AdditiveElectronics #GoldInks #CondutiveInks #Innovation #HighAspectRatio The performance demands of next-generation electronic systems—especially in biomedical devices, sensors, and RF platforms—are outpacing what traditional fabrication methods can deliver. Increasingly, designers require conductive materials that can support not only fine-line patterning but also vertically structured, high-aspect-ratio features on unconventional substrates. At NovaCentrix, we’ve developed advanced gold inks optimized for exactly these challenges, engineered for compatibility with high-resolution deposition systems like inkjet and aerosol jet printers. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend Material Design for 3D and High-Fidelity Printing NovaCentrix’s Metalon® gold inks are designed to meet the precision demands of modern additive electronics—particularly in biomedical engineering—where fine features, complex 3D geometries, and biocompatibility are all critical requirements. Two of our flagship inks, JG-125 and JG-024UA, exemplify this focus on performance and process adaptability. JG-125 is a water-based gold nanoparticle ink optimized for inkjet printing, offering excellent stability, adhesion, and print fidelity on flexible and rigid substrates. It is well-suited for applications requiring fine-line patterning and high electrical conductivity, and can be processed with conventional thermal curing or advanced photonic techniques. JG-024UA, on the other hand, is tailored for aerosol jet printing using ultrasonic atomization. With its higher solids content and carefully tuned rheology, this formulation supports the stable, high-resolution deposition needed for 3D microstructures, such as vertically printed micropillars and high-density interconnects. In addition to their print fidelity and process compatibility, both JG-125 and JG-024UA deliver excellent electrical performance. When thermally cured, these inks achieve volume resistivities as low as 1.3 × 10⁻⁵ Ω-cm—less than 6X that of bulk gold. These inks can also be photonically-cured offering flexibility for temperature-sensitive substrates. This level of conductivity is critical for fine-feature and high-aspect-ratio designs where signal integrity, miniaturization, and reliability go hand in hand. Together, these inks form a versatile platform for printed electronics—enabling both 2D and 3D additive manufacturing across biomedical, RF, and sensor applications, where precision, reliability, and biocompatibility are essential. In addition to our ink formulations, we also offer stable gold nanoparticle dispersions in water, available in concentrations ranging from 1% to 50% by weight. These are suitable for a variety of research applications beyond printed electronics. Aerosol-Based Printing in Focus: Enabling High-Aspect-Ratio Microstructures Figure 1: High resolution printing of JG-027UA-10% using IDS NanoJet Aerosol printing. Figure 2: Printed 3D interconnects using Optomec's Aerosol Jet printing technology with JG-024. Aerosol jet printing (AJP) has emerged as a go-to technique for fine-line, high-aspect-ratio printing, especially when working with free-form or temperature-sensitive substrates. Our collaborations have allowed us to fine-tune ink formulations for our partners at IDS (JG-027UA-10%) and Optomec (JG-024UA), yielding compelling results in both resolution and z-axis structuring. One of the most compelling demonstrations of this capability comes from KU Leuven, where researchers used a NovaCentrix-developed gold ink in a comprehensive design of experiments (DOE) study to fabricate arrays of 3D micropillars using ultrasonic-mode AJP on glass and flexible TPU films. Using a 45 wt% AuNP-based ink (diluted 2:1 with MilliQ water for 3D builds), the team was able to: Print micropillar arrays as small as 50 µm in diameter Achieve heights up to 436 µm with an aspect ratio of 9.3 Maintain shape fidelity using layer-by-layer builds in <10 minutes per structure Validate high electrical conductivity Demonstrate excellent biocompatibility with human fibroblast cell cultures The optimized print condition delivered the best shape fidelity and vertical resolution with minimal overspray. Sintering at 200°C post-printing ensured dense and continuous conductive networks. Figure 3: Layer by layer printing of micropillars with print resolution down to 40 microns and pillar height ~ 500 microns. Pictures courtesy of Dr. Miriam Seiti, Prof. Eleonora Ferraris, Advanced Manufacturing Laboratory at KU Leuven. Proof-of-Concept: 3D Flexible Microelectrode Arrays Taking this a step further, the team printed fully gold-based 3D MEA chips directly onto flexible TPU substrates. These devices, inspired by commercial 60MEA architectures, featured vertically printed micropillars on electrode pads with resolution down to 40 µm and a total device size under 12 mm. Notably, the devices retained their integrity and performance even under bending—highlighting the mechanical resilience of both the ink and the printing process. This kind of structure—difficult or impossible to manufacture with conventional lithographic techniques—demonstrates the unique opportunity that additive manufacturing, combined with precision-engineered inks, brings to advanced electronics. Figure 4: Flexible 3D printed microelectrode array (MEA) chip on Thermoplastic Polyurethanes (TPU) foil. Pictures courtesy of Dr. Miriam Seiti, Prof. Eleonora Ferraris, Advanced Manufacturing Laboratory at KU Leuven. Broader Applications and Industry Validation In addition to the KU Leuven work, NovaCentrix gold inks have been featured in several other high-impact 2024 studies, supporting applications such as: Flexible ceramic rectennas for wireless power (University of Washington) Organic electrochemical transistors (American University of Beirut and The University of Hong Kong) Thermoelectric generators (INRS-Canada) Biosensors for healthcare diagnostics (Old Dominion University) Each of these examples underscores the versatility of our ink platform: printable on flexible substrates, compatible with sintering or photonic curing, and fine-tuned for mechanical, electrical, and biological integration. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend Looking Ahead The convergence of materials science and additive manufacturing is reshaping the future of electronics. By collaborating with researchers, equipment manufacturers, and device designers, NovaCentrix is helping to close the gap between materials capability and system-level need. Our commitment is simple: to provide high-performance, application-driven ink solutions that unlock design freedom, miniaturization, and functional complexity—without compromising manufacturability or reliability. If you have any specific conductive ink questions that need a customized materials solution we would love to chat. Please reach out at rudy.ghosh@novacentrix.com We are Exhibiting in Boston. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston Contact us for your special discount coupon to attend

From AI-powered AR smartglasses to defect-free red micro-LEDs: Innovations shaping the future of electronics This edition dives into work by LetinAR, Arkema, ADDEV Materials, Micropen Technologies, and Verticle. You’ll learn how LetinAR’s plastic reflective waveguides are bringing high-performance AI into everyday smartglasses, how Arkema’s printable piezoelectric polymers are enabling smarter human-machine interfaces, and how ADDEV’s ultra-thin heating film is already being used by battery manufacturers for safety testing. We also explore Micropen’s unique 5-axis printing system for space-grade materials and Verticle’s solution to a long-standing bottleneck in red micro-LEDs: defect-free mesa etching. LetinAR | Advancements in plastic reflective waveguides for enhanced AI integration in AR smartglasses Arkema | Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions ADDEV Materials | Flexible Printed Substrate as a Smart Heating Solution for Industrial applications Exxelia Micropen | Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing Verticle | Defect-free AlGaInP micro-LEDs by wet chemical etching The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 FINAL Early Bird rates expire on May 30, 2025 . 💥  Register Now! LetinAR | Advancements in plastic reflective waveguides for enhanced AI integration in AR smartglasses Jiwon Rho Plastic reflective waveguides have significantly contributed to reducing manufacturing costs and minimizing the form factor of augmented reality (AR) smartglasses while delivering high-quality visuals through OLED microdisplays. This presentation will introduce LetinAR’s latest developments in optimizing AR systems for seamless integration with artificial intelligence (AI). The focus is on enhancing visual performance and power efficiency to enable all-day use of intelligent, context-aware AI experiences. Novel design methodologies for plastic reflective waveguides are introduced, which improve optical efficiency and display quality. Strategies for incorporating AI processing capabilities into AR smartglasses without compromising compactness or battery life are also discussed. Experimental results demonstrate substantial improvements in visual clarity and energy consumption, highlighting the potential for practical, AI-driven AR applications in everyday use. What you will learn in this presentation: How plastic injection molding-based optics can significantly reduce manufacturing costs, making smartglasses more accessible to a broader market. Why reflective optics offer superior image quality a key factor for enhancing user experience in real-world applications. A clear breakdown of the four main categories of smartglasses: VST Headsets, OST Headsets, AR Glasses, and AI Glasses. An inside look at LetinAR’s latest advancements in optical performance and how they are shaping the future of smart eyewear. Download the full presentation here Arkema  | Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions Mickael Pruvost Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products. Download the full presentation here The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website  here. Final Attendee Early Bird Registration is now open! Register today and take advantage of our FINAL Early Bird rates  before they expire on May 30, 2025 . 🔗 Register Now! TechBlick.Com ADDEV Materials  | Flexible Printed Substrate as a Smart Heating Solution for Industrial applications Aziz Rezig This talk will explore: An introduction to NEOHEATER, a flexible and ultra-thin (≈125 µm) smart heating film designed via screen-printing, optimized for high-temperature industrial applications. Real-world use cases across sectors such as space, aerospace, automotive, and broader industrial applications. Insights into how NEOHEATER is used to simulate thermal runaway in battery modules, including: Design specifics: 56 x 35 mm heater with adhesive backing Capability to reach 250°C for 5 minutes at 30W, enabling controlled testing environments Key advantages of the technology: slim profile, ease of integration, strong adhesion, and rapid heat-up time. Performance in cold environments, with examples targeting a 70°C temperature differential (from -7°C to 67°C using 60W input). Ongoing development of flexible temperature sensors for real-time power regulation and control of NEOHEATER systems. A detailed business case: Heated armrest solution featuring: Integration of thermal sensors, Bluetooth connectivity, and API-driven temperature control Precision temperature tracking with ±1°C sensitivity Applications in automotive, healthcare, and industrial environments Download the full presentation here Exxelia Micropen  | Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing Roberta Greco Novel dielectric materials that are polymer-nanocomposite based are now available for use in additive manufacturing products. Lightweight and thermoformable, the Wave-Pro material is the next generation dielectric material for a variety of different antenna and space applications. Using the Micropen to direct write patterns on thermoformed shapes has opened the door to a wide range of technology options where bare alumina was unable to compete. The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra- precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible, irregular, and highly three-dimensional shapes. This talk will provide an overview of the Micropen additive dispense integration of the new Wave-Pro material set and custom CMI formulated ink system. Download the full presentation here Verticle  | Defect-free AlGaInP micro-LEDs by wet chemical etching Mike Yoo Micro-LED is known as the best display technology for the next generation displays, however real commercialization has been repeatedly delayed due to lack of advanced process technologies. Besides the mass transfer, RGB integration and enhancing efficiency of the small LED die appears more critical to be resolved. The biggest hurdle for RGB integration is making small red LED die having comparable efficiency to the blue and green. AlGaInP native red, quantum dot, and InGaN reds have been widely attempted. While AlGaInP red appears to be a strong contender, however, fatal disadvantage is an outrageously low efficiency due to sidewall defects formed by mesa dry etching, thus, defect-free mesa etching technology has been highly sought. Recently, we have achieved a crucial breakthrough in developing mesa etching of the AlGaInP native red micro-LED by “defect-free” wet chemical etching. In the past most of the efforts have been focused on the post dry etching recovery, However, they are helpful for partial recovery only. More importantly, they are not effective for the small die because sidewall defect penetration depth is close to or excess of the micro-LED die. According to our cathodoluminescence results, the sidewall defect penetration depth of the dry etched micro-LED is more than 7 m, while it is less than 0.2 m for the wet etched micro-LED. Thus, effective mesa area of the dry etched red micro-LED is only 28% of the wet etched, which implies that almost no or negligible number of defects exist in the wet etched red micro-LED. Further, our wet etching is capable to etch thicker than 6 m AlGaInP epi layers with etch rate similar to dry etching. In particular, it is one-step etching for any combination of binary, trinary, and quaternary compound semiconductor alloys without need for multiple photo-lithography processes. The chip sidewall is highly vertical and anisotropic; thus, no undercuts are observed after mesa etching. Both defect-free etching and promising etch profile results indicate that our wet etching technology is ready to apply for mass production process for mesa etching of the phosphide-base native red micro-LEDs. Download the full presentation here The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration:   🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥  Register Now! TechBlick.com

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) - co located with the Wearables RESHAPED conference - is nearly a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program  here.   In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations ( here)  and material innovations ( here ) which will showcased In this particular article, we focus on the following Wearable devices and continuous healthcare/vital signs monitoring Flexible Hybrid Electronics (FHE) in biosensors, wound care, and neural simulation Wearable sensor manufacturing Electronic textile development and manufacturing Pioneering R&D in wearable sensors and FHE Enabling materials (inks, substrates, adhesives) and technologies for wearable sensors, biosensors and e-textiles Wearable Healthcare Monitoring Patches and Biosensors GE Healthcare is invited to explore wearable physiological and molecular monitoring patches designed for both medical and defense applications, single-use Vital Signs Monitoring (VSM) patch continuously tracks ECG, respiration, pulse oximetry, skin temperature, and motion for up to three days, and complementary ISF-based patch using microneedles and screen-printed sensors to detect biomarkers like lactate and cortisol, enabling real-time biochemical monitoring from interstitial fluid [exact abstract to be confirmed] Epicore Biosystems presents the Connected Hydration system, a wearable platform for real-time monitoring of sweat rate, sodium loss, fluid intake, and skin temperature. Combining electrofluidic sensors, haptic feedback, and mobile app integration, the system supports personalized hydration strategies and workplace safety during heat stress. Field studies confirm improved outcomes for individuals and organizations. Spark Biomedical is invited to showcase a wearable flexible neurostimulation device developed to address women's health conditions through non-invasive, drug-free therapy. The system delivers targeted electrical stimulation via a soft, adaptable circuit, enabling continuous, comfortable wear. This bioelectronic approach reflects Spark Biomedical’s mission to advance personalized, accessible healthcare solutions through wearable neurotechnology [exact abstract to be confirmed] GlucoModicum introduces Talisman, a needle-free continuous glucose monitor (CGM) using magnetohydrodynamic (MHD) technology. The wearable system includes a reusable device, replaceable sensors, and app connectivity. Clinical trials show a MARD of 13%, with no adverse skin effects — positioning Talisman as a safe, accurate, and accessible CGM for global diabetes care. GrapheneDX presents a low-cost, disposable diagnostic platform using graphene field-effect transistors (GFETs) for multiplexed detection of proteins, small molecules, and nucleic acids. Built on scalable silicon wafer technology, the instrument-free platform delivers fast, accurate results and enables accessible, decentralized healthcare diagnostics worldwide. IdentifySensors is invited to present their digital diagnostic platform leveraging printed graphene ink biosensors for rapid, multiplexed detection of infections. The system integrates solid-state graphene semiconductors into a Bluetooth-connected device that analyzes saliva samples without reagents or amplification. This technology delivers PCR-level accuracy within minutes, offering decentralized, point-of-care diagnostics [exact abstract to be confirmed] Innovosens is invited to introduce their non-invasive, multiparametric wearable sweat sensor for continuous tracking of glucose and lactate. Designed for personalized health, training, and wellness monitoring, this wearable sensor enables real-time metabolic insights through a skin-interfaced patch—unlocking new possibilities for non-invasive, data-driven care and performance optimization [exact abstract to be confirmed] Electronic Textiles Human Systems Integration, Inc. details TacMON, a compression eGarment platform using soft electronics embedded directly into stretchable textiles for physiological monitoring in high-performance environments. Tested in U.S. Air Force cockpits, TacMON delivers reliable ECG and respiratory signals under motion and stress, offering enhanced comfort, durability, and long-term usability. NextFlex presents collaborative work with AFFOA and Drexel University on integrating additively manufactured hybrid electronics into functional fabrics for soldier-worn systems. The team embedded sensors, communication nodes, and computing into garments like shirts and helmets, enabling situational and physiological monitoring. The platform also shows promise for civilian uses in safety and performance tracking. Nautilus Defense showcases a method for directly attaching chiplets to embroidered conductive yarn networks at 180 µm pitch, enabling scalable, flexible textile-integrated systems. This approach preserves fabric softness while embedding dense electronics, merging textile and semiconductor manufacturing for high-throughput, comfortable, wearable sensor platforms. Fraunhofer IZM will present on stretchable electronics with a specific focus on smart patches for wound monitoring Manufacturing Wearables Linxens discusses the development of advanced electronic skin patches and wearable sensors for medical applications. Leveraging printed electronics, novel materials, and scalable processes, Linxens is enabling continuous health monitoring through miniaturized, cost-effective devices. The talk explores how integrated technologies are shaping the future of proactive, personalized healthcare. VTT offers a practical guide to scaling up wearable medical devices using pilot line services like MedPhab. He explains how partnerships with RTOs help assess technology readiness, identify risks, and bridge gaps through structured design reviews. Conductive Technologies will share their experience as a key contract manufacturer on how to commercially succeed in mass producing - via printing - wearable sensors. Pioneering Applied Research Holst Centre presents hybrid printed electronics as a key enabler for smart wound care, enabling flexible, sensor-integrated dressings that track healing markers like temperature, oxygen, and pH. The talk highlights progress in eco-friendly materials, clinical testing, and the challenges of multimodal sensor integration. Scalable manufacturing and cross-sector collaboration are vital to bring these next-generation medical devices to market. Massachusetts General Hospital/Mass General Research Institute is invited to present the Ink-Net, a 256-channel dense EEG system using high-resistance polymer thick film (PTF) technology for improved safety and MRI compatibility. Compared to copper-wired nets, the Ink-Net shows minimal heating at 7T and reduced MRI signal artifacts at 3T, enabling high-quality, simultaneous dEEG and MRI recordings. Georgia Institute of Technology reports advances in soft, wearable bioelectronics for real-time health monitoring, diagnostics, and human-machine interfaces. His team develops hybrid-material systems such as AR-integrated brain sensors, energy harvesters, and drug response monitors. The talk highlights in vitro/in vivo results and emphasizes translation from research to commercialization and education in sustainable biomedical innovation. ÉTS Montréal will also present on A.I.-enhanced wearable flexible hybrid electronic sensing platforms for health applications Enabling Technologies - Inks, Substrates, Adhesives, and Communication Protocols NGK Insulators introduces ultra-thin, semi-solid-state Li-ion batteries designed for medical and healthcare wearables. Featuring crystal-oriented ceramic electrodes and minimal liquid electrolyte, the batteries offer enhanced safety, fast charging, and long cycle life. The talk details how this advanced battery platform supports the growing demands of next-generation wearable devices. AmbAI explores how Ambient IoT is bridging AI with the physical world through advances in standards and sensing technologies. As a founding member of the Ambient IoT Alliance, AmbAI highlights real-world use cases where ubiquitous, low-power sensing enables smarter operations, customer experiences, and business models—extending AI beyond digital interfaces into everyday environments. Nagase ChemteX unveils next-generation stretchable conductive inks designed for wearable electronics that endure repeated bending, stretching, and washing. The talk explores challenges in achieving adhesion, conductivity retention, and durability, and highlights material innovations shaping the future of flexible, high-performance printed devices. Policrom Screens Spa introduces ELECROM STRETCH, a TPU-based substrate and encapsulation system that overcomes traditional printing and processing challenges for wearable circuits. Designed to maintain elasticity, dimensional accuracy, and conductivity through multi-layer builds, the system enables reliable integration of stretchable electronics—such as pressure sensors in gloves—into textiles. ACI Materials presents advanced printable conductors that enable fully additive manufacturing of durable flexible hybrid electronics (FHE), wearables, and e-textiles. The talk highlights high-resolution, solderable inks that support denser circuit designs and improved reliability under harsh conditions. Cost-effective material sets for stretchable and formable e-textiles, including direct transfer methods, are also discussed. Sun Chemical discusses the evolving requirements for inks used in electrochemical biosensors across medical, wearable, environmental, and cosmetic applications. The talk explores key material properties, performance evaluation methods, and the challenges in formulating inks that meet sensitivity, stability, and biocompatibility demands in next-generation sensor systems. Creative Materials Inc offers comparative study on skin-interface materials for ECG monitoring, evaluating Elefix paste, dry electrodes, and OmniWAVE against traditional hydrogels. Results suggest improved signal clarity, stability, and patient comfort with these alternatives, particularly for long-term use. The talk explores each material’s performance and potential to enhance ECG reliability and user experience.

Author: Dr. Erika Rebrosova, Electronic Materials Technology Manager at Sun Chemical Corp Biosensor Applications Biosensor applications are a growth application area, where material technologies, bioengineering and sensor design are continuously and rapidly evolving. Among the various types of biosensors, electrochemical (EC) biosensors are relevant for the printing industry as some of the components of EC biosensors are already being manufactured by printing technologies. The end applications for electrochemical (EC) biosensors are shown in Figure 1. In medical diagnostics and health monitoring , printed EC biosensors are used to monitor glucose levels in diabetic patients, detect pathogens, and identify biomarkers for diseases such as cancer and cardiovascular conditions. They enable immediate analysis of biological samples, such as blood or saliva, allowing for quick decision-making and timely medical interventions. In the pharmaceutical industry , they are employed for drug development and monitoring therapeutic drug levels in patients. In environmental monitoring, these biosensors help detect pollutants, heavy metals, and pesticides in water and soil, ensuring environmental safety and compliance with regulations. The food and agriculture industry benefits from screen-printed biosensors by using them to detect contaminants, pathogens, and allergens, thereby ensuring food safety and quality. Portability and ease of use make them ideal for on-field testing, providing quick and reliable results without the need for complex and large laboratory equipment. Figure 1. Example end-applications of electrochemical biosensors Printing in Manufacturing of Biosensors Among printing processes, screen printing is the dominant process in electronics manufacturing, including manufacturing of electrodes for biosensors, where it has been used for many years. Biosensors with screen-printed electrodes (SPEs) have a wide range of applications due to their versatility and cost-effectiveness. Screen printing is ideally suited for mass production, which is essential for meeting the high demand for medical and environmental biosensors. Screen printing has proven its value due to easy scalability during the recent pandemic and the ensuing increase in demand for biosensors for rapid Covid-19 testing. Screen printing is an additive printing process offering high precision, accuracy and consistency; all of which are important for reliability of an analytical device. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend SPEs are most often used in the electrochemical (EC) type of biosensors, where high sensitivity and selectivity is needed for accurate detection of various analytes even at low concentrations. There are special considerations for designing and processing materials for EC sensing. The electrode surface is the place of interaction between an analyte and sensor cell. Materials for sensing electrodes are required to induce an electrical response due to chemical and biological reactions on the electrode surface. Therefore, the surface quality, functionality and high consistency of printed electrodes is of critical importance. The electrical response can be, for example, in the form of voltage potential difference, electrical current levels, or conductivity/impedance changes. EC performance requirements also need to coincide with the process requirements for screen printing, like having suitable rheology, curing dynamics, processing stability, reliability, and biocompatibility. The single-use blood-glucose test strip is the best-known example of an electrochemical biosensor device. While the “finger-prick” technology may appear out-of-fashion compared to the newer devices such as insulin pumps or continuous glucose monitors (CGMs), the test strips are often used alongside higher-tech monitors and are therefore still an essential part of diabetes management. SPEs are used for both single-use glucose test strips and CGM sensors. Screen-printed EC biosensors are revolutionizing the point-of-care (POC) industry by offering accessible, cost-effective, and efficient healthcare solutions. This technology not only reduces the dependency on centralized laboratories but also enhances and accelerates patient care by delivering results in real time. They are designed to be portable and user-friendly, making them ideal for use in clinics, homes, and even remote locations. Additionally, using EC biosensor devices for biomedical analysis is considered less invasive and less stressful for the patient/user. In addition, recent advances in screen printing technologies, for example high-resolution capable emulsions, high open area stainless steel meshes and fine-line printable functional inks, enable miniaturisation of sensor electrodes for more advanced sensor designs. Smaller footprint and thinner sensors are ideal for integration into wearable devices. Higher electrode density is needed for multiplex biomarker detection on a single transducer for POC biosensor applications. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend SunSens Materials Solutions from Sun Chemical Sun Chemical is a leading manufacturer of inks, coatings, and pigments, supplying a diverse range of products to numerous industries. In electronics applications, Sun Chemical’s materials are used, for example, in the manufacturing of printed circuit boards, advanced solar cells, flexible switches and displays for human-machine interface, and a variety of printed biosensors used for medical diagnostics, health monitoring, environmental monitoring, and food safety. The SunSens product range, designed for EC biosensor applications, includes a wide range of conductive inks for screen-printed electrodes (SPEs) , such as working, counter and reference electrodes. Other materials on offer are dielectric or insulator pastes , which are used in the EC sensor construction to precisely define sensing areas and insulate and protect the sensor’s circuitry. When selecting materials for SPE-based electrochemical sensors, it is important to find the best balance between optimum sensitivity, signal response, processability, reliability and cost. The key functional materials for EC biosensors are conductive pastes for working electrodes, as this is the primary detection surface. Figure 2 shows a variety of SPE designs printed with SunSens pastes. Figure 2. Screen-Printed Electrodes SunSens carbon conductive pastes and mediated carbon pastes are suitable for working electrodes used in multiple electrochemical techniques and detection methods. The pastes based on precious metals, such as gold and platinum, are used for immuno-electrochemical assays or applications where high conductivity, inertness and oxidation resistance are important. For reference electrodes, Silver/Silver Chloride (Ag/AgCl) pastes with different ratios of Ag-to-AgCl are available to accommodate the requirements of various EC sensors designs and detection methods. More information about the SunSens products can be found at https://www.sunchemical.com/product/sunsens_sensors/ Sun Chemical’s SunSens team, with their extensive expertise and experience in biosensor materials design and applications, works continuously on new materials and electrochemical characterization methods to address the needs and new requirements of this exciting field. Along with the medical quality (ISO13485) certified manufacturing facilities, Sun Chemical is more than materials supplier, it is a partner for your next biosensor development project. We are Exhibiting in Boston and Berlin. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) is less than 6 weeks away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches.  This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program  here.   In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations that will be showcased (see  here). In this particular article, we focus on some of the material innovations that will be showcased in the program from around the world, featuring copper inks and molecular ink systems, liquid metal materials and applications, sustainable PCBs, printable EAPs, high temperature inks, printable nickel and more. In subsequent articles, we cover further material, process and application innovations that will be showcased in the program. Copper Innovations Copper has long been considered an attractive alternative to silver in conductive inks due to its inherent cost advantages as well as its compatibility with IPC standards for reliable solder joints. However, it has not been an easy path developing a copper ink/paste that prints well, dries/cures within normal conditions and is stable and oxidation free.  At the Future of Electronics RESHAPED in Boston (11&12 June 2025)   we will highlight a novel of innovations advancing copper ink/paste technology Priways (Japan) : Minari-san will report on a novel approach to forming air stable and highly conducting copper-nickel complex inks. Here, Cu-Ni inks can form uniform Cu@Ni core-shell nanostructures by a self-assembling process, resulting in the nickel coating on the surface. Thus, the addition of nickel overcomes the weakness of conventional copper inks, achieving high oxidation resistance and high electrical conductivity. The formed Cu-Ni wiring shows high conductivity of 10 μΩ cm and the high oxidation resistance can be maintained at 180°C. This is a novel and promising approach to achieving air stable copper inks. University of Maryland (USA): Most nanomaterial based copper inks are highly susceptible to oxidation. Here, Prof. Ren reports on their work developing a printable copper precursor-based ink based on molecular decomposition. This approach not only results in high performance copper materials, but also gives rise to printed structures that can remain stable for long periods even under extreme conditions such as 1000C. This demonstrates a promising approach to the development of printable stable copper inks. Copprint (Israel): This team has long developed a screen printable copper ink system that can meet many commercial requirements such as low-temperature and rapid sintering, stability and even solderability, making it a viable commercial choice in printed electronics and even additive PCB production. Here Dr Grouchko  will offer a masterclass where you can learn about practical techniques and tips for applying and adopting copper inks, even in existing lines. You will learn important insights about scale up of copper ink production. Finally, you will learn about a large array of applications in which copper inks deliver value together with supporting data. These applications range from wafer-based PV to RFID to aluminium based LED boards and beyond. Liquid Metals Liquid metals are an emerging class of materials in flexible, stretchable and soft electronics with unique properties, including extremely high stretchability, self healing, etc. At the   Future of Electronics RESHAPED in Boston (11&12 June 2025)  we will highlight the following advances. Satosen (Japan):  The increasing demand for flexible and wearable devices necessitates the development of circuit boards capable of withstanding significant mechanical deformation. Traditional PCBs struggle to maintain conductivity and structural integrity under strain, limiting their applicability in dynamic environments. Here, Satosen reports on a unique approach to deploying liquid metals to form stretchable PCBs. Here, the liquid metal traces are encapsulated within a flexible substrate.  This approach offers significant advantages in terms of durability, stretchability and conformability compared to conventional rigid or flexible PCBs. The inherent fluidity of the conductive traces allows for dynamic reconfiguration of the circuit pathways, enabling new possibilities for adaptive electronics. In general, this approach can truly change the design and fabrication of wearable electronics, biomedical devices, and soft robotics. North Carolina State University (USA): Dr. Dickey is a pioneer in the field and will present a new useful property of gallium-based liquid metals: ability to print conductive thin oxides! In general, an oxide layer rapidly forms on gallium based liquid metals, giving them the ability to be shaped. Dr. Dickey will report on a method to separate the oxide, offering a way to directly deposit 2D-like oxides at ambient conditions without vacuum processing. These oxides are surprisingly also conductive. This is an innovative material development,  important for electronics, sensors, optics, and touch screens. Worcester Polytechnic Institute (USA) : Multimodal Glove and Sleeve Human Machine Interfaces can have many use cases including multimodal sensing of human intent and motion; AR/VR/XR immersion; human-robot teleoperation and collaboration (i.e. human-machine integration); control of exoskeletons; and human performance/health monitoring. However, such systems require very stretchable electronics. Here, Dr. Rao reports on how they integrate printed liquid metal conductors into stretchable fabric garments to achieve this. Furthermore he reports on the progress towards printing of fine-line and fine-pitch stretchable circuits, as well as attachment and encapsulation of surface-mount integrated circuits and passive components onto these circuits. This talk demonstrates how the printed liquid metal technology is advancing and opening new applications. Other Exciting Innovations Sustainable PCB substrates | Massachusetts Institute of Technology (USA): e-waste presents a significant environmental challenge due to the non-degradable nature and limited recyclability of conventional polyimide (PI)-based substrates. In Boston, Dr Wallin from MIT will report the design and synthesis of a family of photopatternable, degradable polyimide network substrates that maintains high mechanical and electronic performance for reprocessible flex electronic circuitry. These materials exhibito desirable thermal and mechanical properties as well as stable dielectric value suitable for flexible electronics. Furthermore, the material can be used to form multilayered circuits surviving the solder reflow process. These materials are an important step in improving the sustainability of the PCB and flexible hybrid electronics industry.  Printable black phosphorus inks for optoelectronic devices | Irisi Light Technologies (USA):  Black phosphorus (BP) has emerged as a promising two-dimensional material due to its unique properties, including a tunable bandgap, high carrier mobility, and strong light-matter interaction. The development of scalable synthesis routes has enabled the production of black phosphorus inks in large quantities, making them suitable for industrial applications. This talk reports on synthesis, characterization, and device applications for BP photonic devices. Furthermore, it reports how BP photonic inks were utilized in the fabrication of optoelectronic devices using aerosol jet printing. Example devices include pn diodes and photodetectors. This opens up avenues for the realization of flexible and wearable electronics, as well as the development of low-cost sensors for environmental monitoring and healthcare applications. Printable Nickle Structures| New Mexico State University (USA):  Dr Mahajan will report on a method for creating aligned nickel (Ni) nanoparticles with unique and customizable structures on various substrates for electronic and magnetic applications. The ink can be printed in ambient conditions, and upon heating in the presence of a magnetic field, it forms aligned elemental Ni nanostructures over large areas. The use of templates or subsequent purification is not required. This technique is very flexible and allows the preparation of unique patterns to produce structures with enhanced anisotropic electrical, magnetic, and thermal properties. Resistive Inks for High-Temperature Applications| Vibrantz Technologies (USA):  Aerospace and defense industry requires thick film solutions for specialty low-thermal expansion substrates that can withstand high operating temperatures. Such thick film pastes are not easy to formulate and are not readily available. Vibrantz Technologies reports a package consisting of RuO2-based resistive inks and optional underglaze dielectric/sealing overglaze targeting the firing temperature of 1020°C. The materials show excellent high temperature stability and can tolerate rapid thermal cycling. The inks can be deposited by screen printing or spraying and are fully compatible with Ceramic Matrix Composite (CMC), Silicon Carbide, and Fused Quartz substrates. This opens up new applications for printed electronics in demanding high-temperature fields Printable Electroactive polymers | Arkema (France):  These printable EAPs enable easy integration into smart systems such as pressure sensors in insoles and mattresses, sports equipment sensors, steerable medical guidewires, structural health monitoring in hydrogen tanks, and haptic gloves. Here, Arkema reports on 2 classes of EPAs: (1) Piezotech FC (P(VDF-TrFE)) for piezoelectric, pyroelectric, and ferroelectric applications like sensors, energy harvesting, and speakers, and (2) Piezotech RT (P(VDF-TrFE-CTFE/CFE)) for high-k, electrostrictive, and electrocaloric uses in actuators and OTFTs. Furthermore, you can learn about specific real applications including printed pressure sensors integrated into mattresses, insoles, and sports equipment such as gold clubs or tennis rackets, a guide wire for endovascular navigation, acoustic monitoring sensor for H2 tank structural health monitoring, haptic glove and many more... Join us at the  Future of Electronics RESHAPED USA (Boston, 11  12 June 2025) - where the global additive, printed, hybrid, wearable, and 3D electronics connects. This is the only event in North America dedicated to this industry, bringing together the entire ecosystem.

In this edition we get into microLED, printed electronics, and flexible tech in this edition, featuring expert insights on electroluminescence (EL) vs. photoluminescence (PL) for accurate microLED testing, scalable RGB microLED assembly with high yield, and silver nanowire (AgNW) materials enabling transparent heaters and smart surfaces for automotive applications. Learn how printed piezoelectric sensors are revolutionizing structural health monitoring in aerospace composites, and discover a bioelectronic breakthrough with gold ink ECG electrodes printed on flexible TPU. Ideal for professionals in display technology, automotive, aerospace, and wearable electronics, this newsletter highlights scalable manufacturing solutions using advanced materials, screen and aerosol jet printing, and sensor integration. InZiv  | Unleashing microLED’s Future: The Power of Electroluminescence Testing Fraunhofer IZM  | An R&D study on feasibility of Massive parallel assembly for contacting Micro-LEDs DuPont   | Transparent heater, Smart surface and In-Mold Electronics Fraunhofer IFAM  | Printed sensors for structural health monitoring of composite components Voltera  | Printing ECG Electrodes with Gold Ink on TPU The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 Early bird rates expire on 25 April 2025! 💥 Limited-time offer: Get an extra $200 discount with this special coupon! Get your coupon here InZiv | Unleashing microLED’s Future: The Power of Electroluminescence Testing Noam Shapiro Despite their promise, microLED displays have yet to achieve mass commercialization, with yield improvement being a critical hurdle. Effective testing is essential to overcoming this challenge. This talk will explore the two major functional testing methodologies—photoluminescence (PL) and electroluminescence (EL)—and demonstrate why EL is the superior approach for accurate defect detection and performance assessment. We will discuss the key advantages of EL testing and examine what the industry needs in order to adopt this methodology at scale, ultimately driving microLED technology toward widespread adoption. Key Takeaways: The Yield Challenge: Reliable testing and inspection are essential to improving microLED yields Early-stage inspection = reduced costs and faster time-to-market PL vs. EL: Why electroluminescence offers deeper insights into device functionality InZiv’s research: Understanding the limitations of PL and how EL overcomes them Download the full presentation here Fraunhofer IZM | An R&D study on feasibility of Massive parallel assembly for contacting Micro-LEDs Charles-Alix Manier The present work describes a method for the RGB handling and the electrical bonding of Micro-LED arranged onto a host substrate emulating a display. The assembly technology will be presented which relies on a three-step sequential soldering for RGB-connecting of several thousands of small-sized (ca. 20x20 µm) LED mechanical chips mimicking "RGB" source LEDs to a large substrate in a 150x150 matrix array, leading to a 99.5% success rate at R&D scale. Key Takeaways from the Presentation: Goal and Motivation Lower power losses Longer lifetime, higher brightness, thermal stability, and robustness in extreme conditions RGB monolithic integration remains complex Base Principle and Specificities Core principle of the assembly process Unique features of the approach Description of the test vehicle Material Preparation Micro-LEDs (Mechanical Silicon) Donor & Conveyor systems Host substrate ("display") Sequential Assembly of Micro-LEDs Selective picking process Assembly methodology Assembly Results Post-assembly inspection Electrical testing Download the full presentation here DuPont | Transparent heater, Smart surface and In-Mold Electronics Xiaofeng Chen DuPont’s silver nanowire-based Activegrid® inks and films deliver excellent optical clarity, conductivity, and flexibility, making them ideal for a wide range of automotive applications. These include transparent heaters, smart surfaces, LiDAR systems, in- mold electronics (IME), transparent EMI shielding, and infrared (IR) reflection. Activegrid® inks can be applied onto diverse substrates such as polycarbonate (PC), polyethylene terephthalate (PET), cyclic olefin polymer (COP), polyimide (PI), glass, and more, possibly at low process temperature (less than 60 °C). These inks are compatible with various solution coating techniques, including spray, dip, flow coating, and roll-to-roll slot-die processes, allowing application to both flat and curved surfaces with ease. In addition, DuPont offers Activegrid® films as a pre-coated film product on various substrates with Activegrid® inks, which can be laminated or molded onto target surfaces to meet specific design needs. By leveraging DuPont’s silver nanowire technology, we enable cutting-edge innovation, driving the development of next-generation automotives. Key Topics Covered: 1. A Materials Platform for Next-Gen Electronics & Automotives Core material: Silver Nanowire (AgNW) Product offerings: Printable inks, 3D inks, AgNW adhesives & composites, transparent conductive films Target sectors: Touch sensors, interconnects, life sciences 2. Flexible Manufacturing Capabilities Downstream process adaptability Pilot coating widths up to 600 mm, mass production up to 1250 mm 3. Automotive Innovation Use Cases Transparent heaters for ADAS, exterior & interior applications UltraNW™ Technology – the industry’s highest performing transparent heater LiDAR/Camera heaters – high transmission in visible and near-infrared Electrified fabrics – for heated armrests, seat leather, and seatbelts Download the full presentation here The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website  here. Early Bird Registration is now open! Register today and take advantage of our exclusive Early Bird rates  before they expire on April 25, 2025 . Special Limited-Time Offer: Get an additional $200 off  your registration with our special coupon! 🔗 Get your coupon here TechBlick.Com Fraunhofer IFAM | Printed sensors for structural health monitoring of composite components Ingo Wirth In aviation industry, there exists an increasing demand for structural health monitoring (SHM) of carbon fiber reinforced composite materials (CFRP), which are needed for aerospace structures because of their unique stiffness to weight ratio. The challenge in such a context is to integrate smart systems in composites for lightweight constructions using different sensors without mechanically changing the structural behavior of the host structures (low weight addition and as small as possible stiffness modification). Innovative printing technologies allow the integration of printed sensors in composite parts and components by satisfying these criteria. For this purpose, manufacturing and integration process of sensors in composite parts using printing technologies was investigated. Piezoelectric sensors as well as temperature sensors were deposited directly on composite aeronautics parts representative of the aeronautic industry using screen printing and Aerosol Jet printing technologies. As an architecture network, printed individual sensors can be connected to an overall system. The great advantage of printing technologies is the possibility to deposit customized sensor structures directly on planar and non-planar surfaces. The usage of printing technologies results in a great accuracy, reliability, and cost reduction also in a later production process. The development of electrical conductive composites allows the deposition of conductive paths between the sensor structures on the part and finally a connection to the power supply unit. This allows for the realization of a complete sensor structure with low added weight and low intrusivity with respect to the host structure. The sensor technology platform itself offers a broad range of variations of piezoelectric sensor candidate architectures into manufacturing process. The printed sensor network consists of several connected piezoelectric sensors, which build a dynamical load and displacement sensitive element. To detect, localize, classify and quantify damage to CFRP parts, composite aeronautic structural elements may be monitored using data from such printed sensors. This innovative sensor technology can thus be used for SHM by providing a complete and continuous observation of the whole system in the aircraft, but also in any other application area having similar requirements. Printed piezoelectric sensors can be used to detect and monitor structural deformation, damage, or fatigue in aircrafts, helping to ensure the safety and reliability of the aircraft. Furthermore, it can be used to monitor the vibration of aircraft engines, providing early warning of potential issues and helping to prevent costly engine failures. Printed temperature sensors are able to monitor temperature changes even in inaccessible places in engines. Overall, the use of printed piezoelectric sensors in aeronautics can help to improve the safety, efficiency, and performance of aircrafts. Download the full presentation here Swing by our booth to learn more! Voltera | Printing ECG Electrodes with Gold Ink on TPU Katarina Ilić What you will learn 1. The Problem with Traditional ECG Electrodes Skin irritation from gel adhesives Biocompatibility concerns for sensitive users 2. The Bioelectronic Solution – A Modular System ECG electrodes printed directly onto flexible TPU for skin contact A control unit featuring a heart rate monitor and controller A protective enclosure safeguarding the electronics from impact 3. Design & Fabrication Electrode design, layer stack-up, and post-processing Printing the control unit and integrating components 4. Technical Challenges & Learnings Download the full presentation here Visit us at our booth to learn more and say hello! The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration:   🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 Early bird rates expire on 25 April 2025! 💥 Limited-time offer: Get an extra $200 discount with this special coupon!  Get your coupon here TechBlick.com

Fraunhofer IAP | Quantum Dot Color Conversion in MicroLED – A Material Perspective - Quantum Dot (QD) materials for color conversion in MicroLED displays. Key topics include high quantum efficiency QDs, tailored ink formulations, and EHD-Jet printing techniques for high-resolution applications. The session explores QD stability, ligand optimization, and methods to close the green and red gap in MicroLED displays. Saralon GmbH | Conducting Copper Ink for Printed Electronics: An Application-Based Journey - Saral Copper Ink as an alternative to costly silver-based inks for printed electronics. The session covers copper ink’s stable conductivity, processability via conventional screen printing, and its application in low-cost, high-demand sectors. It highlights challenges and benefits for future electronics manufacturing. INTLVAC THIN FILM | ICARUS: Indium Solder Bump Deposition System- Focusing on improving indium solder bump deposition, addressing pattern hole closure, dendritic growth prevention, and enhancing bump quality. Insights on system stability and reliability for semiconductor assembly and MEMS packaging will also be discussed. Flexoo | Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services- Exploring mass-customization in high-end sensing solutions. Topics include the production of BaMoS and MiniMoS sensors, battery behavior analysis at the cell level, advanced wiring solutions, and the role of digitalized processes in manufacturing efficiency. E-Lyte Innovations GmbH | Enhancing Battery Safety in Sodium-Ion Batteries - Addressing the performance challenges of Sodium-Ion Batteries (SIBs), focusing on electrolyte optimization to prevent degradation and sodium plating. The session talks about additive development, test plans for improving efficiency and safety, and a comprehensive review of existing patents and research on SIB technologies. The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 Early bird rates expire on 25 April 2025! 💥 Limited-time offer: Get an extra $200 discount with this special coupon! Get your coupon here Fraunhofer IAP | QD color conversion in MicroLED – a material perspective Manuel Gensler Quantum Dot (QD) materials are emerging as promising candidates for color conversion in MicroLED displays, offering significant advantages over traditional RGB emitting backplanes. The Fraunhofer IAP has developed exceptionally stable QDs with enhanced properties, including high quantum efficiencies under blue illuminance and improved solubility for ink formulation. These advancements are crucial for the practical application of QDs in display technology. Furthermore, the talk will showcase the application of EHD-Jet printing techniques to achieve high-resolution printing of 10 µm and less, even on multi-nozzle systems. This demonstration paves the way for future up-scaling to industrial processes, potentially revolutionizing the manufacturing of MicroLED displays. What You Will Learn from This Presentation: The Green and Red Gap for LEDs in the MicroLED Size (1 – 30 μm) Quantum Dot Color Conversion: The Currently 3 Promising Candidates Printable Quantum Dots for Color Conversion – Tailored Materials and Printing Processes (Ink-Jet, EHD-Jet) Quantum Dot Stability – Optimizing the Ligands Quantum Yield and Stability – Giant-Shell Approach Ink Formulation and Printing – Ink-Jet and EHD-Jet Techniques Devices Increasing the Blue Absorbance & Optimized Encapsulation Download the full presentation here Saralon GmbH | Conducting Copper Ink for Printed Electronics : An Application-Based Journey Steve Paschky Silver based conductive ink is the backbone of the Printed Electronics. However, volatile silver prices necessitate the development of conductive inks with lower cost underlying Materials. Such an alternative must provide comparable conductivity while ensuring stable conductivity levels over time, and easy processability using conventional printing technologies (i.e.screen printing). Introducing a novel low-cost Saral Copper Ink, this presentation guides you through the high-demand application areas, discusses the benefits and addresses how to overcome challenges. Join us in Boston and stop by our booth to learn more! Download the full presentation here INTLVAC THIN FILM | ICARUS: Indium Solder Bump Deposition System Dino Deligiannis Insights you will gain from this session How we minimized pattern hole closure How we improved bump quality by preventing dendritic growth Prevention of spits System stability and reliability Indium bumps we produce Download the full presentation here The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website  here. Early Bird Registration is now open! Register today and take advantage of our exclusive Early Bird rates  before they expire on April 25, 2025 . Special Limited-Time Offer: Get an additional $200 off  your registration with our special coupon! 🔗 Get your coupon here TechBlick.Com Flexoo | Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services Thomas Rohland Key points covered in this presentation Mass-Customization: The Mass-Production of High-End Sensing Solutions — What is Required for Mass-Customization? Outstanding Sensors: From BaMoS to MiniMoS Gain an understanding of battery behavior at the cell level Learn how to monitor pressure distribution within your system/device Versatile Wiring Solutions Explore how wiring lines are gradually shifted within one repetition of the printing cylinder, leading to a shift in the bus connector in the transverse direction with each revolution Technically Advanced Solutions & Gathered Knowledge Discover the benefits of digitalized processes that enable fast processing of customer requests Understand the subject matter and the challenges it presents Download the full presentation here E-Lyte Innovations GmbH | Enhancing battery safety in Sodium-Ion Batteries Jonathan Bäthge The electrolyte plays a crucial role in improving key performance indicators (KPIs) such as efficiency, cost, safety and lifespan of a Sodium-Ion Battery (SIB). By adjusting the electrolyte to prevent active material degradation and sodium plating on the anode, which represent currently occurring problems while cycling SIBs at high cut-off voltages, an enhancement in performance of SIBs can be achieved. Patent and literature analyses were conducted to identify relevant existing electrolyte components, providing a foundation for further electrolyte development and research on new additives. Therefore, new electrolyte additives were investigated to improve the safety and lifespan of SIBs. Key Takeaways from the Presentation Sodium-Ion Batteries (SIBs): Overview of current operational challenges from literature. Patent Analysis: Multi-source approach for patent data collection combined with a Python-based methodology for data processing. Test Plan: Absolute and relative discharge capacity measurements. Post-mortem analysis of battery performance. Archimedes measurements for material evaluation.   Download the full presentation here The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration:   🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 Early bird rates expire on 25 April 2025! 💥 Limited-time offer: Get an extra $200 discount with this special coupon!  Get your coupon here TechBlick.com

Author: Voltera Due to their thin profile and lightweight design, flexible membrane keyboards are useful in a variety of industries, such as portable electronics, toys, games, home appliances, medical equipment, automotive, and aerospace. This project is an example of using Voltera’s NOVA materials dispensing system to print a functional flexible membrane keyboard.   YouTube video:  Printing a flexible membrane keyboard with silver ink   Contact: sales@voltera.io  or +1 888-381-3332 ext: 1   Summary of Materials and Tools MATERIALS USED ACI SS1109 Stretchable Silver Ink ACI SI3104 Stretchable Printed Insulator T4 Solder Paste Sn42Bi57.6Ag0.4   SUBSTRATES USED Polyethylene terephthalate (PET) FR1 (to secure the controller)   TOOLS AND ACCESSORIES Nordson EFD 7018333 dispensing tip Nordson EFD 7018424 dispensing tip Arduino Micro, A000053 Tactile metal switches Keyboard cover skin Headers Diodes   We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Project Overview Purpose The purpose of this project is to demonstrate how NOVA prints multilayer electrical circuits on a highly flexible substrate (PET), and dispenses ink with high precision on sections that are as small as 250 µm W × 40 µm H. Figure 1: Three-layered print with crossovers Design layout We divided the layout into three layers: Base conductive layer (ACI SS1109 stretchable silver ink) Dielectric layer (ACI SI3104 stretchable printed insulator) Top conductive layer (ACI SS1109 stretchable silver ink) Desired outcome Based on a matrix style keyboard design, we limited the number of pins used to only seven on the controller (Arduino Micro, A000053). Once connected to a power source, pressing any key on the keyboard will trigger the controller to register the key. Functionality We determined a 10-numbered keypad design would be suitable for this project. However, other flexible membrane keyboard designs have the potential for further customization, such as specific graphics, colors, or lighting, which could be beneficial for specialized equipment, including customized control panels, wearable devices, and foldable electronics. Printing and curing the flexible substrate Base conductive layer This layer consists of a 4’’ × 3’’ matrix grid for 10 numbered keys, excluding the 10 dielectric pads (see dielectric layer). Figure 2: Base conductive layer schematic Figure 3: Base conductive layer being printed by NOVA Figure 4: NOVA print settings, base conductive layer Dielectric layer This layer consists of 10 dielectric pads. To ensure full coverage of the dielectric ink, we did two passes for this layer, each cured after dispensing. Figure 5: Dielectric layer schematic We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston   Figure 6: Dielectric layer print result Figure 7: NOVA print settings, dielectric layer Top conductive layer This layer consists of 10 fine crossover lines that connect the red signal paths and complete the circuitry. Figure 8: Top conductive layer schematic Figure 9: Top conductive layer print result with crossovers Figure 10: NOVA print settings, top conductive layer Challenges and advice for printing multilayer Broken layers Because inks from different manufacturers have different properties – they may contain solvents that dissolve existing traces for example – printing and curing each new layer risks breaking the layer previously completed. It is, therefore, crucial that you choose compatible materials based on the degree of flexibility required. For this project, we selected compatible inks from ACI Materials, but for projects that involve using multiple inks from different manufacturers, it is recommended that you check the materials’ technical data sheets. Electrical shorts Due to the matrix design of the keyboard, the signal lines have a number of crossovers, which could cause electrical shorts if not insulated properly. Printing a second pass of the dielectric layer achieves an appropriately thick insulating layer and supports further printing on top. Connection issues Because the crossover sections are intricate (250 µm W × 40 µm H), if the nozzle scratches the ink while printing, the electrical paths may not function as planned. Separating the crossover sections into their own layer (the top conductive layer) allows each crossover pad to be probed accurately and have specialized settings, yielding a higher success rate. In addition, because changes in height can happen drastically when printing over existing traces, setting a low probe pitch will make the height map more accurate. An accurate height map means the height transition at the edges of features is accurate and the risk of traces being printed off-course is low. Post-printing: A fully flexible electronic device Figure 11: Flexible keyboard assembly To ensure the Arduino Micro was securely in place, we used a FR1 board, cut it to 30 mm × 60 mm, and placed it beneath the flexible substrate (PET sheet). Next we drilled through holes on the board and the flexible substrate with the Voltera V-One PCB printer. We then dispensed solder paste, placed the diodes on the flexible substrate, and riveted it together with the FR1 board, before placing the metal switches on the rectangle-shaped contacts. To secure the metal switches, we covered them with Kapton tape. Next, we secured the controller to the flexible substrate and connected it to a power source. We also gave the keyboard a finishing touch by placing it inside a 3D-printed enclosure with graphical silicone keys. Figure 12: Final assembly in 3D-printed case Conclusion This project highlights the innovative potential of printing on flexible substrates. It also points to the critical role of fine-tuning print settings to achieve success in multilayer projects. As achieved by this project, using compatible materials helps ensure optimal performance, and is key to unlocking the full potential of flexible electronics. As we continue to explore the boundaries of what’s possible with flexible substrates, we invite you to view the other application projects we’ve completed. We are Exhibiting in Boston and in Berlin. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston 22-23 October 2025 in Berlin