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This issue of the TechBlick newsletter highlights battery technology, featuring insights from industry experts. Albert Schnieders from CNM Technologies discusses how Carbon Nanomembranes (CNMs) are enabling metal anode batteries by preventing dendrite growth and improving performance with standard separators. Dr. Christoffer Karlsson from rhd Instruments covers the improvements in solid-state battery materials testing through active pressure and temperature control. Rene Windiks from Materials Design explores atomic-scale modeling to optimize battery materials and enhance performance and safety. Marja Vilkman from VTT introduces the SOLiD EU project, focused on sustainable manufacturing and Roll-to-Roll (R2R) processes for solid-state batteries. Lastly, Shmuel De-Leon examines the growing sodium-ion battery market, its advantages and limitations, and the future of mass production. CNM Technologies | Enabling metal anode batteries by modifying the anode & separator interfaces with Carbon Nanomembranes rhd Instruments | Improving Solid State Battery Materials Testing through Active Pressure and Temperature Control Materials Design | Advancing Battery Materials Through Atomic Scale Modeling VTT | The development of R2R processes for manufacturing solid state batteries. The newly launched SOLID EU project Shmuel De-Leon | Sodium Ion (Na- Ion) Battery Market 2024. The Next Technology on Battery Mass Production Register by end of December and save 150 Euros!   Use discount code: Save150EurosSSB CNM Technologies  | Enabling metal anode batteries by modifying the anode & separator interfaces with Carbon Nanomembranes Albert Schnieders | 2023 To overcome the limitations of lithium-ion batteries, new battery technologies, such as lithium and beyond lithium metal, are being investigated. However, these solutions often suffer from dendrite growth or surface passivation at the metal anode site. Carbon nanomembranes (CNMs) are an electrically insulting 2D nanomaterial that has shown its ability to conduct lithium ions and promote homogeneous ion deposition when used in conjunction with conventional separators. These properties open the possibility of using CNMs as a promising material to enable metal anodes batteries, not only by modifying the interface of separators but also of metal anodes by acting as an artificial solid electrolyte interface to prevent dendrite growth. We will discuss in this presentation the technical and economic potential of these possibilities of CNMs in next-generation batteries. Explore the following in this session: The transition to metal anode batteries and the challenges of excessive dendrite growth. How Carbon Nanomembranes (CNMs) can prevent dendrite build-up in metal batteries. The high potential of CNMs when combined with standard separators in metal-based battery tests. Download the Full Slides Here rhd Instruments  | Improving Solid State Battery Materials Testing through Active Pressure and Temperature Control Dr Christoffer Karlsson | 2024 Key takeaways from this session include: Solid electrolyte conductivity - How to achieve reproducibility Pelletization (fabrication) pressure Measurement pressure & Measurement temperature Active materials - Three-electrode full cell testing – Example of NMC/graphite with Li reference electrode Download the Full Slides Here Materials Design  | Advancing Battery Materials Through Atomic Scale Modeling Rene Windiks | 2024 Topics covered in this session include : Industry Challenges: Rapid need for low cost, enduring concepts for high energy batteries while maintaining rigorous safety requirements R&D Strategies necessitate a comprehensive understanding and control of the material’s properties and behavior during battery operation The Value of Modeling: Multi-scale simulations insights and data where experiments are costly and time-consuming Collaborative Approach: Materials Design is developing a multi-scale modeling approach together with industrial and academic partners Case Studies: Prediction of thermophysical properties of polymer composites and time evolution of microstructure at metal electrode/solid electrolyte interface Download the Full Slides Here Join us on February 11-12, 2024, for the  Solid-State Battery Materials , a virtual event by TechBlick. Engage with industry leaders driving innovation in battery technology. Explore the agenda here.    Register by end of December and save 150 Euros!   Use discount code: Save150EurosSSB Register Now TechBlick.Com VTT  | The development of R2R processes for manufacturing solid state batteries. The newly launched SOLID EU project Marja Vilkman | 2023 In this session, you will learn about : Sustainable batteries The SOLiD project: Sustainable manufacturing and optimized materials and interfaces for lithium metal batteries with digital quality control R2R manufacturing of solid-state batteries - NMC811 cathode + interfaces - Polymer electrolyte - Li anode + interfaces - Quality control - Life cycle analysis and exploitation Download the Full Slides Here Shmuel De-Leon | Sodium Ion (Na- Ion) Battery Market 2024. The Next Technology on Battery Mass Production Shmuel De-Leon | 2024 This session is about - Sodium Ion Batteries are the next large production capacity technology for the rechargeable battery arena. Our presentation will review technology advantages/ limitations – and the motivation beyond bringing that technology to the market. Last year around 10 companies in China start production of different cell formats – Cylindrical, Prismatic and pouch. Will review some of the market players status and our prediction for the future Sodium Ion Battery Market. Download the Full Slides Here Join us for TechBlick’s Fourth Online Event: Explore the future of battery technology and discover the latest advancements in the battery industry, with key topics including: Solid state batteries Beyond Li batteries including sodium, metal-air, tin, aluminium, etc Next-generation anodes, cathode, and electrolyte materials Additive and/or dry manufacturing methods Register by end of December and save 150 Euros! Use discount code: Save150EurosSSB Book Now

Authors:  [1] Dr. Kedar Sathaye , Product Manager Light & Display at Konica Minolta Sensing Europe B.V. [2] Dr. Valentyn Volkov , co-founder of XPANCEO The market for image display devices is rapidly evolving, with innovations ranging from advanced screen technologies in smartphones and TVs to more sophisticated solutions like augmented reality (AR) glasses and virtual reality (VR) headsets, such as the Apple Vision Pro. The XR market alone is projected to reach an impressive $1,913.7 billion by 2032, with a growth rate of 39.2% from 2024 to 2032. There’s an increasing focus on making these devices more wearable and user-friendly. Achieving this goal, however, presents significant challenges due to the limitations of current technologies. Wearable devices, particularly in the AR and VR sectors, often face critical performance issues. For example, AR glasses and VR headsets frequently lack sufficient brightness, have limited battery life, and often end up being bulky due to the need for larger batteries. These issues can lead to overheating and reduced field of view, decreasing the practicality of these devices for long-term use. This is driving the industry to innovate and develop new devices that overcome these challenges. However, this rapid development invites another problem: the lack of comprehensive test solutions to ensure that these new devices meet the required standards for quality, safety, and performance. In response to this gap, Konica Minolta and XPANCEO have partnered to meet the growing demand for contemporary test solutions. AR Smart Contact Lenses XPANCEO is a deep-tech company pioneering smart contact lenses, a new frontier in wearable technology that it envisions as the next generation of computing. These lenses aim to solve the problems of current wearable technology by integrating various traditional device functions into a single interface that is weightless and as natural to the wearer as their own vision. Beyond applications such as health monitoring and enhanced vision, a key focus for XPANCEO is image projection. The company has already succeeded in developing a smart contact lens with a display that significantly outperforms standard solutions. By reducing the resolution in the peripheral vision area—where the eye does not require high resolution—the load on the video controller is minimized, allowing for much smaller packaging. Additionally, the brightness loss from the display to the eye is reduced threefold, and the total power consumption is expected to be only 1-3 µW, which is 100-300 times less than comparable AR glasses. However, this technological advancement raises new questions about testing and quality assurance, as there are currently no ready-to-go solutions on the market. Image projected by XPANCEO lens Image Quality Testing To help manufacturers like XPANCEO ensure quality of the display, Radiant’s AR/VR Lens paired with a ProMetric® Imaging Photometer or Colorimeter provides unique optics engineered for measuring near eye displays (NEDs), such as those integrated into virtual, mixed, and augmented reality headsets. The innovative new geometry of the lens design simulates the size, position, and binocular field of view of the human eye. Unlike traditional lenses where the aperture is located inside the lens, the aperture of the AR/VR Lens is located on the front of the lens to enable the connected imaging system to replicate the location of the human eye in an AR/VR device headset and capture the entire FOV available to the user. Radiant developed an AR/VR Lens to address the unique challenges of qualifying integrated NEDs under the same conditions as they are visualized by human users. The AR/VR Lens is designed to be paired with high-resolution imaging photometers and colorimeters, 16-megapixel and higher resolutions. By capturing displays at this detail, the measurement system can evaluate the entire display FOV at once with the precision to capture any defects that might be noticeable to the human eye. The Radiant AR/VR Display Test Solution includes (left to right): AR/VR Lens, ProMetric® Imaging Colorimeter or Photometer, and TrueTest™ Software with optional TT-ARVR™ module. Radiant’s AR/VR display test solution is specially designed for in-headset display measurement. What separates the AR/VR Lens from other optical components is the lens’s ability to replicate the FOV and entrance pupil of human vision. The AR/VR Lens product specifications include: Aperture (entrance pupil) located at the front of the lens. 3.6 mm aperture size. The average pupil will contract to 1.5 mm in diameter in bright light and dilate to 8 mm in diameter in darkness. Radiant uses 3.6 mm for two reasons: 1) it is in the mid-range of pupil dilation; 2) the 3.6 mm aperture allows a high MTF for the lens. Wide FOV to 120° (±60°) horizontal. Importance of Calibration Each Radiant AR/VR camera/lens system is factory calibrated to ensure the most accurate images for absolute light and color analysis. Calibration processes include factory distortion calibration to remove lensing effects of the wide-FOV lens, ensuring accurate spatial analysis of the display by the camera software. When measuring displays using a wide-FOV lens, the image captured by the lens may appear distorted as shown in figure below. Top, an image captured by an uncalibrated wide-FOV system; bottom, image captured by a system with distortion calibration applied. Because the AR/VR solution uses a fisheye lens, an uncalibrated image exhibits barrel distortion. Radiant’s camera/lens solution is calibrated to process out distortion effects before applying display tests. This ensures accuracy of spatial measurements to detect defects where they occur on the display. Software Solution Radiant TrueTest™ Automated Visual Inspection Software applies analyses to all images captured by Radiant’s AR/VR measurement solution. This platform includes a suite of display tests with standard tests for luminance, chromaticity, contrast, uniformity, and defects like dead pixels and lines. In addition, unique tests for AR/VR projections are available in the pre-configured TT-ARVR™ software module. Some examples of TT-ARVR software analyses are shown in Figures 14-16 below. These analyses are performed on the AR/VR display to test the manufacturing specifications of the AR/VR device. These specifications can also be published for consumer use (for instance, on an AR/VR headset specification sheet) to help them evaluate the device and compare with competitive products. Uniformity analysis as shown in figure below determines areas of low or high luminance across the display, which may indicate a defect in the display. This analysis can also be used to characterize the uniformity against design specifications. Uniformity analysis (shown in false color) characterizes display quality. A checkerboard contrast analysis as shown in figure below is performed by projecting a checkerboard pattern on the display within the AR/VR headset. Once the pattern is imaged by the AR/VR test system, the checkerboard contrast test evaluates luminance levels in the image to determine the display system’s ability to project distinct light and dark values - a performance parameter that can be indicated on a specification sheet. Checkerboard contrast analysis evaluates the contrast ratio of the display. Customized Testing Radiant Vision Systems, a Konica Minolta Company that focuses on solutions that can be used across various applications, has partnered with XPANCEO to develop a custom testing system that measures critical parameters for these emerging devices: Field of View: The XR smart contact lens is designed to allow users to see images from any angle, requiring precise measurements to ensure the gradual improvement of this parameter. Brightness of Virtual Images: While traditional light bulbs can be easily quantified, virtual images provide a subjective experience that necessitates an objective testing system. This is particularly important given strict medical guidelines on image brightness to prevent damage to the human eye. Contrast: This measures how clearly an image stands out from the background and is crucial for comfortable and safe viewing. It should remain stable regardless of the brightness of the environment. Adaptation to Weather Conditions: The brightness of virtual images needs to adjust to different weather conditions, similar to how phone screens adapt, without causing excessive brightness that could blind the user if they look directly at the sun. The gradient of Intensity Across the Field: For optical reasons, virtual images have varying brightness, especially at the edges. Accurate measurement of this parameter is essential for correcting the image when it’s recorded for projection. Line Sharpness: This parameter ensures that fine lines and details in the image are clear and easy for the user to see. The testing system assembled in XPANCEO lab These advancements in testing are not only applicable to smart contact lenses but could revolutionize quality assurance in a variety of fields. Though the fully realized smart lens is still in the research and development stage, the technology behind it holds promise for broader applications in the industry, offering a significant opportunity for further development and standardization in wearable tech testing.

As presented at the recent TechBlick’s Future of Electronics RESHAPED USA event held in Boston, our project,  Multilayer Flexible Displays Using Electroluminescent Ink , validated the use of the Voltera NOVA  material dispensing system to print a multilayer electroluminescent display on PET and paper using various Saralon inks. In this article, we explain how this project was achieved, covering the inks and substrates used, the steps we followed, as well as challenges and tips on printing flexible multilayer projects using the direct-ink-write technology.  Contact: sales@voltera.io  or +1 888-381-3332 ext: 1 Summary of Materials and Tools MATERIALS USED Saralon Saral Silver 700 Silver-Based Conductive Ink Saralon Saral Dielectric 600 Dielectric Ink Saralon Saral BluePhosphorl 800 Electroluminescent Ink Saralon Saral Conducting Polymer 700 Polymer Electrochromic Ink SUBSTRATES USED Polyethylene terephthalate (PET) Cardstock paper TOOLS AND ACCESSORIES Nordson EFD 7018424 dispensing tip Nordson EFD 7018333 dispensing tip Nordson EFD 7018482 chamfered tip Adafruit 12V EL wire/tape inverter Project Overview Purpose The purpose of this project was to demonstrate the multilayer capability of Voltera NOVA . We printed a blue light-emitting pattern - the Voltera logo - on two substrates: paper and PET separately, using electroluminescent ink. Design layout Electroluminescence operates by exciting a phosphor material with an electric field. An inverter is needed to convert the direct current from the power source into alternating current. Based on this mechanism, our design positioned a phosphor layer between two conductive layers, incorporating a dielectric ink layer to insulate the phosphor. The printing sequence was as follows: Layer 1: Base conductive layer  Layer 2: Dielectric layer  Layer 3: Phosphor layer Layer 4: Top conductive layer Desired outcome Once connected to an alternating current (140 V, 1.862 kHz), the phosphor layer should emit blue light, illuminating the Voltera logo with an even glow across both prints. Functionality We determined the Voltera logo would be suitable for this project. It is feasible to incorporate designs into larger electronic applications, including billboards, branded merchandise, and control panels. Printing the electroluminescent Voltera logo Base conductive layer (1) This layer consists of a Voltera logo pattern (55.5 mm L × 19.75 mm W) and positive and negative traces that connect to power and ground terminals. Print settings on NOVA software (1) Result on paper (left) and on PET (right) (1) Dielectric layer (2) This layer features a dielectric Voltera logo pattern which measures 23 mm L × 15 mm W and two dielectric pads. These extra pads help ensure the top conductive layer is appropriately insulated. Print settings on NOVA software ( 2) Result on paper (left) and on PET (right) (2) Phosphor layer (3) This layer contains a Voltera logo pattern, slightly smaller than the dielectric layer (by 0.5 mm each way), printed with blue light-emitting ink. Print settings on NOVA software (3) Result on paper (left) and on PET (right) (3) Top conductive layer (4) Lastly, this layer includes a conductive overlay with an opening at the bottom left to prevent short-circuiting. It measures 29.5 mm L × 21.5 mm W and connects to the ground terminal. Print settings on NOVA software Result on paper (left) and on PET (right) (4) Challenges and advice for printing multilayer electroluminescent displays Trapped air Air bubbles can form in inks that have been left unused for an extended period. These bubbles caused the dielectric layer to break when we cured it in the oven. Mixing the ink with a dual asymmetric centrifugal mixer before printing will eliminate air bubbles. Additionally, it is recommended to allow the dielectric layer to dry naturally at room temperature instead of curing it in an oven. Uneven glow During our experiments, some prints exhibited dark areas, leading to an uneven glow. This issue can arise from several factors: The top conductive layer being too thick The phosphor layer being too thin or getting scratched off during dispensing of the ink for the top conductive layer Irregularities in print height Adding fiducials to each layer helps improve alignment and print quality. In terms of print settings, if the layer is too thick, increasing the print speed, reducing the height (we reduced it to approximately 40 µm), and using a smaller nozzle can be helpful. If the layer is too thin, try to reduce the print speed. Furthermore, in multilayer projects, changes in height can happen drastically when printing over existing traces. Setting a low probe pitch will make the height map more accurate, ensuring the height transition at the edges of features is accurate and reducing the risk of traces being printed off-course. Conclusion The paper substrate provided consistent results throughout our experimentation, due to its absorbent nature. Each layer was smoother on paper than on PET, highlighting the potential of using paper as a substrate in EL display applications.   On the other hand, PET, being flexible and chemically resistant, offers the advantage of suitability for more demanding use cases. As demonstrated by this project, with careful attention and fine-tuning of the print settings, the results of EL display on PET are equally impressive. Electroluminescent logo final print EL displays are also intriguing when printed on glass and other non-conductive substrates. As we continue to explore the possibilities of electroluminescent displays, we invite you to view the other application projects  we’ve completed using NOVA and V-One.  In the meantime, if you’d like to discuss your designs or our NOVA materials dispensing system, please contact us at sales@voltera.io .  We are Exhibiting in Berlin. Visit ou r  booth at the TechBlick event on 23-24 October 2024 in Berlin.

In this issue, we dive into technologies shaping the future of printed electronics and additive electronics, smart buildings, and additive manufacturing. From optimizing tool chains for 3D printed electro-mechanical structures to exploring low-volume manufacturing techniques for printed circuit boards (PCBs), this edition showcases advancements and practical applications. Featured companies include Siemens, Murata Manufacturing, Henkel, and BotFactory, each presenting innovations that are redefining industries. Learn how additive manufacturing and advanced materials are driving efficiency and sustainability in electronics production and smart infrastructure. Siemens | Optimizing the tool chain from Design through manufacturing for Printed Electronics Printed Electronics Ltd | Scaling up From Idea to Product With The PEL Open-Access Printable Electronics Production Facility Henkel - Laiier | Connecting surfaces of the smart building to the cloud with sensors enabled through PE Murata Manufacturing | Highly Conductive MXene for Electronics BotFactory | Exploring AM-PCBs for Low-Volume Manufacturing The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com Siemens | Optimizing the tool chain from Design through manufacturing for Printed Electronics David Wiens | 2023 In this session, you will explore the following: How printing and additive techniques enable innovative electronic architectures, including flexible, conformal, structural, and 3D designs. A comparison of two design approaches: planar structures versus non-planar structures, along with the challenges each presents. The tool chain required for 3D printed electro-mechanical structures, focusing on the key areas of development and optimization. Download the Full Slides Here Printed Electronics Ltd | Scaling up From Idea to Product With The PEL Open-Access Printable Electronics Production Facility Neil Chilton ​ | 2024 For university spin-outs and startup companies, especially in the growing medical sector, it can be challenging to find a responsive production partner to scale up your idea from bench-scale to the small/mid volume production needed to gain investment and customers. PEL is an established manufacturing company with over 18 years’ experience in printable electronics. Here in the UK, we have an extremely well-equipped production facility that gives access to a multitude of printing methods including: high resolution screen printing, inkjet deposition, aerosol jet and viscous jet piezo jet deposition. Whilst some customers prefer to outsource their production entirely to us, we also engage with users who are keen to become manufacturers in the longer term – where they can be trained on the systems we sell and “try before they buy”. In this presentation we explain the capabilities and the training and support packages that PEL can offer. Key takeaways from this session include: Additive manufacturing of electronics – areas of expertise at PEL. Screen printing excellence – featuring high-performance print platforms, including Micro-tec in the EU. PEL's screen print offerings – covering printers, screens, inks, typical layers, and turnaround times. Functional inkjet printing – a detailed example of our inkjet capabilities. Aerosol jetting of bio-compatible carbon electrodes – collaboration with a UK university for disease-sensing applications. Download the Full Slides Here Henkel - Laiier | Connecting surfaces of the smart building to the cloud with sensors enabled through PE Matt Johnson - Laiier | Aad van der Spuij - Henkel | 2022 Step into smart buildings of the future and you might not see a difference. Combining the scalability of coatings and building materials contemporary sensing techniques opens-up an incredible range of possibilities for predictive, preventative, and responsive maintenance. For Henkel, a global leader in specialized and cross-functional ink formulations for printed electronics, and Laiier a smart surface technology provider, the next decade will see the rise of smart buildings that integrate new capabilities into the built environment. Whether it’s office facilities that warn of leaking pipes, walls that heat our rooms, or floors that tell us when an elderly relative has suffered a fall, many of the core technologies are already here. Today, the challenge besides the technology innovation is more about building networks and creating markets. The presentation will cover the unique ecosystem required to bring this vision to life that includes the whole value chain from construction, materials, manufacturing industry to IoT integrators. The session will take the attendees through technical explanations and customer use cases demonstrating clear ROIs and customer insights. In this session, you will learn about: Retrofit Smart Skin: IoT monitoring through smart stickers and tape Unique Selling Propositions: Leveraging printed electronics for installation, coverage, and resolution Surface to Cloud™: Delivering real-time insights and alerts Launch Use Cases: Measuring leaks and levels with "smart tape" Reshaping Partnerships: Accelerating the path to implementation Download the Full Slides Here Join us on February 11-12, 2024, for the  Solid-State Battery Materials , a virtual event by TechBlick. Engage with industry leaders driving innovation in battery technology. Explore the agenda here.    Early Bird Offer: Register by December 24 and save 150 Euros with the discount code: Save150EurosSSB Register Now https://www.techblick.com/events-agenda Murata Manufacturing | Highly Conductive MXene for Electronics Shun Sakaida | 2022 In this session, explore the potential of MXene (Ti3C2Tx) in electronics applications, with a focus on its high conductivity and environmental stability. Learn about the synthesis procedure for MXene and its ability to enhance components such as capacitors, EMI/ESD components, and SAW components. The session also covers: Schematic Representation: Host–guest interaction for improved environmental stability Humidity Test: Assessing the material's resistance to moisture Anti-Swelling: Strategies to prevent material degradation and maintain performance Download the Full Slides Here BotFactory | Exploring AM-PCBs for Low-Volume Manufacturing Carlos Ospina | 2024 In this session, discover how Additive Manufacturing (AM) is transforming the production of Printed Circuit Boards (PCBs), enabling faster, more sustainable solutions for low-volume manufacturing. Learn about: Reducing Lead Time: How AM reduces the production time of a 4-layer PCB from 10 days to just 4 hours. Challenges of Traditional PCB Manufacturing: The inefficiencies of mass production for small runs. Additive Manufacturing Technologies Matrix: Pros, cons, and how AM fits into low-volume PCB manufacturing. Substrate-Based vs. Substrate-Less: An overview of these different approaches in AM-PCB production. BotFactory’s Experience: Insights into the company's journey with AM-PCBs and the innovations they have implemented. Download the Full Slides Here

In this edition, we explore exciting breakthroughs shaping the future of electronics. Fernando Zicarelli (E2IP Technologies) dives into the design and challenges of screen-printed heaters, comparing resistive and wire heaters while spotlighting transparent heater advancements. Ram Prasad Gandhiraman (Space Foundry) shares insights into plasma jet printing and its applications in aerospace, tackling issues like adhesion and material performance. Shavi Spinzi (Nano Dimension) showcases the move from 2D to 3D Additively Manufactured Electronics (AME), unlocking new possibilities for compact, high-performing devices. Finally, Marco Galiazzo (Applied Materials) highlights how advanced screen-printing is revolutionizing medical sensor production, offering a cost-effective way to create wearable health-monitoring devices. E2IP Technologies | Screen-printing Heating Devices: Limits and Challenges Space Foundry | Precision digital plasma deposition: deposit multilayer structure without curing Nano Dimension | Roadmap for 3D AME Designs Applied Materials | Advanced Screen-Printing: Manufacture a Medical Sensor by Screen-Printing The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com E2IP Technologies | Screen-printing Heating Devices: Limits and Challenges Fernando Zicarelli​ | 2024 This presentation will review the most common screen-printed heaters in Printed Electronics; Printed Resistive heaters and Printed Wire heaters. An explanation will follow on how each type of heater is designed, and a comparison between a Printed Resistive heater (PTC) and a Printed Wire heater will be shared. There will be a review of the technology limits and challenges.Finally, a quick review of the latest technological advancements in Transparent heaters. What You’ll Learn in This Session: Why Printed Wire Heaters? Printed wire heaters are incredibly versatile. They can be customized to fit specific shapes and sizes, making them perfect for unique applications. These heaters are often designed with simple yet effective patterns, like serpentines or coils, for even heat distribution. Printed Resistive Heaters vs. Printed Wire Heaters: Explore the differences between these two heating technologies, including how they perform and where they’re best used. What’s Holding Printed Heaters Back? Learn about the key challenges, such as material limitations and design complexities, that researchers and engineers are working to overcome. Download the Full Slides Here Space Foundry | Precision digital plasma deposition: deposit multilayer structure without curing Ram Prasad Gandhiraman | 2023 In This Session, You’ll Explore: Conformal Electronics for Aerospace & Defense: Electromagnetic invisibility for aircraft structures and drones, plus challenges like curing, adhesion, and thickness control. Plasma Jet Printing Technology: How aerosolized ink is used for precise, high-resolution printing. Direct-Write Technology Pain Points: Addressing issues like adhesion, manufacturing complexity, and ink performance. Plasma Deposition & Electrochemistry: Applications of plasma technology in advanced electronics manufacturing. Download the Full Slides Here Nano Dimension  | Roadmap for 3D AME Designs Shavi Spinzi | 2022 This presentation will describe the industry drivers for increased electronic devices and circuits performance and packing density and how multi-level and multi-material Additively Manufactured Electronic (AME) technology enables corresponding innovative designs and fabrication from DC to mmWave applications. The presentation will focus on AME devices including design, materials, fabrication, and testing. This technology provides for electronic circuits not only in 2D but also in 3D where connections can be made without vias, but direct wiring between the electronic elements. The wires can be shielded and unshielded. Furthermore, the fabrication technology allows for traces with different thicknesses at the same level. Yielding fully functional boards with smaller size and lower weight, as compared to equivalent PCB fabricated ones. The presentation will include also devices with chip first embedded active ICs. Components such as capacitors, coils, band pass filters, and multilevel Fresnel lenses exhibit superior RF performance as compered Surface Mount Technology (SMT) of components. In This Session, You’ll Explore: AME Fabrication Technology (Nano Dimension implementation) The road from 2D to 3D designs – design examples How to design 3D electronics? Download the Full Slides Here Applied Materials  | Advanced Screen-Printing: Manufacture a Medical Sensor by Screen-Printing Marco Galiazzo | 2022 Developments in electronics and sensors have demonstrated the ability to manufacture wearable devices to remotely monitor human health in real-time at reasonable cost. A wide variety of smart sensors are now available, both on rigid and flexibRecentle substrates, to monitor the health and well-being of patients suffering from chronic illnesses. We’ve used our advanced screen-printing capabilities to manufacture medical devices: in particular, we studied and developed the realization of medical sensors entirely by screen printing. Thanks also to the constant improvements of the screen-printing ecosystem (paste, screen, equipment), enabling high processing yields and throughput, manufacturing of such devices by screen printing technology was proven to be a cost-efficient solution, compared to conventional microfabrication techniques, for mass manufacturing of healthcare devices. What This Session Covers: Technical Case Study: Medical Sensors: An in-depth look at remote health monitoring technologies and their applications. An overview of the methodologies and materials used in innovative electronic applications. Silver Traces:Techniques for fine-line printing and the results achieved in precision manufacturing. Carbon Print:Insights into achieving optimal thickness by fine-tuning process parameters. Feasibility Analysis with Applied Tempo™ Presto™ Platforms:Exploring the potential and practicality of using advanced platforms for cutting-edge electronics production. Download the Full Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com

Pyramidal µLEDs, Indium Bump Deposition, InGaN-Based Red Micro-LEDs, Laser and LIFT, VCs In this newsletter, you’ll learn about advancements in microLED technology, deeptech investment, laser-driven manufacturing, and cutting-edge microelectronics. You will also have the opportunity to download the full presentation slides. Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission Intlvac Thin Film | Indium Bump Deposition System Kaust | Challenges in InGaN-Based Red Micro-LEDs Technology Coherent  | MicroLED Display Volume Manufacturing Enabled By Laser Technology Imec.xpand | Opportunities and Challenges of Investing in Deeptech Startups The MicroLED Connect conference and exhibition will take place next year at the High Tech Campus in Eindhoven on 24 & 25 Sept 2025. You can learn more here   This year this show will be co-located with our inaugura l AR/VR Connect t echnology, covering all the key innovations in AR/VR display technology, from light engines to waveguides to optics.    EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission Lisa Rullik | 2024 Our novel bottom-up concept based on InGaN/GaN uLEDs offers solutions to several challenges that the uLED development is facing right now, namely miniaturization of the die without efficiency droop, sufficient small pitch to reach FHD resolution, and focused light emission to reach sufficient incoupling efficiency into waveguide optics. By using selective area growth, the dies can be placed deterministically onto the lithographically patterned SiN-masked GaN templates and die sizes down to 300nm have been achieved. As no etching of the die itself is needed the efficiency of the InGaN quantum wells, which are the active emitters, stay intact. The geometic structure of the uLED, a hexagonal pyramid, facilitates the focused emission and a sub-lambertian emission was obtained. In this presentation you will learn about the following: Polar Light Technologies’ GaN/InGaN bottom-up approach without etching damage Achieving RGB in the same material system Focused light emission and sub-lambertian performance Insights from the first hybridization prototypes Download the Full Slides Here Intlvac Thin Film  | Indium Bump Deposition System Michael Chesaux | 2024 Producing indium bumps for interconnect is a technology that has had to adapt to an ever increasing demand for smaller bump size and high bump density while having to process larger and larger substrate sizes. This presentation discusses how indium bump fill and uniformity was optimized for substrates up to 200mm wafers. We demonstrate strategies to both prevent dendritic growth, to produce reliable bumps, and to eliminate indium spits, which can be a source of defects, without having to sacrifice tack time and reliability. In this presentation you will learn about the following: How we minimized pattern hole closure How we improved bump quality by preventing dendritic growth Prevention of spits System stability and reliability Indium bumps we produce Download the Full Slides Here Kaust | Challenges in InGaN-Based Red Micro-LEDs Technology Daisuke Iida | 2024 Micro-LEDs are promising for next-generation displays such as AR/VR. InGaN material can generate emissions in red, green, and blue. In the same material system, the LED devices can be stacked continuously, making it possible to fabricate monolithic RGB micro-LEDs on the same wafer. The low efficiency of red LEDs is the bottleneck for RGB micro-LED development. In this presentation, we will discuss the growth technology for InGaN-based red LEDs and the realization of monolithic RGB micro-LEDs. In this presentation you will learn about the following: Red LED growth technologies Micro-LED fabrication technologies Monolithic RGB micro-LEDs LED Fabrication Technologies Download the Full Presentation Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com Coherent  | MicroLED Display Volume Manufacturing Enabled By Laser Technology Oliver Haupt | 2024 Laser technologies are essential for display fabrication today. Several laser processes and laser types are required for state-of-the-art display manufacturing. With the move from OLED to microLED displays some processes remain and several new manufacturing processes are required. The success of microLED displays is mainly driven by costs and availability of volume manufacturing equipment. Thus, microLEDs must become very small and need to be processed with highest throughput and yield. Lasers have proven their capability already in many applications but also in display fabrication. In this presentation, we will provide an overview of the microLED display process chain and highlight the individual laser processes. In this presentation, you’ll learn about Laser-driven mass transfer techniques like LIFT The key steps in microLED manufacturing and how lasers drive innovation. The critical role of laser mass transfer for microLED miniaturization. Advanced laser applications like LTPS backplane annealing and beam delivery systems. Download the Full Presentation Slides Here Imec.xpand  | Opportunities and Challenges of Investing in Deeptech Startups Cryil Vancura  | 2024 Many aspects of today’s modern society are enabled by advances in semiconductor technologies. Most of those innovations have been driven by the incumbent corporates in the industry but some of them have come from ambitious startups globally. Despite the size of the market and the potential for key innovation, startups active in semiconductor technologies have often struggled to raise sufficient capital in the past decade, even in times when other sectors of the venture capital market have been very active. Since one to two years, though, we start to see a change in sentiment of venture capital investors towards semiconductor technology startups. This is driven by external market factors, such as the onset of artificial intelligence technology, driving global increase of data center traffic and compute performance, as well as geopolitical considerations and dependencies.imec.xpand is one of the world’s largest independent venture capital funds dedicated to early-stage semiconductor innovation. Since 2018 we have been investing in ambitious startups where the knowledge, expertise and infrastructure of imec, the world-renowned semiconductor and nanotechnology R&D center, can play a determining role in their growth. imec.xpand has an outspoken international mindset towards building disruptive global companies and strongly believes that sufficient funding from the start is key to future success. Our position gives us a unique view on the startup landscape in the sector, which we will share with the audience. In this presentation, you’ll learn: How imec's world-class infrastructure, brilliant minds, and global network enable disruptive ventures. What venture capitalists look for, including team evaluation and market potential. The importance of understanding the value chain, business models, and positioning in the market. Strategies for building a competitive edge, from patents to speed and comprehensive approaches combining these elements. Download the Full Presentation Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com

In this newsletter, explore the advancements in solar technology, featuring InterPhases Solar's pioneering in-line roll-to-roll processes for flexible, thin-film devices, Crystalsol OÜ's innovations in CZTS photovoltaic technology, Taiwan Perovskite Solar's approach to large-scale perovskite production, Pixel Voltaic's laser-assisted glass encapsulation for perovskite photovoltaics, and University of Colorado Boulder's strategies to tackle degradation in perovskite solar panels. InterPhases Solar | Versatile in-line roll-to-roll process for flexible, thin film devices Crystalsol OÜ | Printed CZTS photovoltaic technology Taiwan Perovskite Solar | Large-scale perovskite production: materials, processes, and challenges Pixel Voltaic | Laser-assisted glass encapsulation for perovskite photovoltaics University of Colorado Boulder | Understanding & preventing degradation in perovskite solar panels The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com InterPhases Solar  | Versatile in-line roll-to-roll process for flexible, thin film devices Shalini Menezes | 2024 Fabricating devices with non-vacuum roll-to-roll processes that intrinsically host nano-scale pn junctions offer an attractive platform to create low-cost, flexible, lightweight opto-electronic devices. Incumbent 3G nano technologies still face significant challenges in-terms of stability, toxicity, up-scaling and reproducibility to reach the status of the established technology. Here we present an alternate path that integrates new device structure, process and manufacturing. It features a compact, practical, atmospheric process to manufacture high quality, ordered 3D nanocrystalline pn homojunction (NHJ) device structures. Exemplified here by two Cu-In-Se (CISe) compounds, the method entails single-step electrodeposition of interconnected network of p-CISe and n-CISe nanocrystals to create a depleted NHJ thin film. Extraordinary attributes the CISe NHJs include non-linear emissions, large carrier mobility, low trap-state-density, long carrier lifetime and likely up-conversion. The NHJ film can be inserted between two electrodes to produce an isotropic device, wherein current can flow in either direction to convert light into electricity or applied voltage into light. Although originally conceived for CISe solar cells, this radical concept could create NHJs with most II-VI or III-V semiconductors for wide spectrum of applications, e.g., PV panels, LEDs, photodetectors, photoelectrodes, laser diodes, displays, MEMS and optical fibers. Importantly, the NHJ structure can be continuously roll-to-roll processed in ambient atmosphere from aqueous solution. Overall, this approach offers a promising low-cost processing platform to create high performance, stable and scalable devices. The NHJs could essentially perform like 2D planar pn junctions or artificially ordered 3D nano-structures, but without their high cost and fabrication complexities. In this presentation you will learn about the following: 2D & 3D Opto-Electronic Devices: Exploring the challenges of achieving 2D performance in 3D manufacturing processes. CISe: Cu-In-Se approach demonstrated SSE: Single-step electrodeposition NHJ: Nanocrystalline pn homojunctions with unusual nano & quantum attributes R2R: Roll-to-roll manufacturing Download the Full Slides Here Crystalsol OÜ  | Printed CZTS photovoltaic technology Dieter Meissner | 2024 In this session, you will explore the following topics: Why printing, but not OPV (Organic Photovoltaics) CZTS/Kesterite: Powder production, powder composition, and stability of Kesterites with different chalcogenide ratios Powder (monograin) printing technology, powder synthesis (high T.), and module printing (low T.) in a continuous roll-to-roll process Crystalsol monograin cell and module printing Efficiency and stability potential Cost considerations Sustainability Download the Full Slides Here Taiwan Perovskite Solar  | Large-scale perovskite production: materials, processes, and challenges Chih-Hsuan Chao  | 2024 In the field of solar energy, it has become a common belief that perovskite solar cells are advancing at an unprecedented pace. While the historical trajectory may seem astonishing, we can gain insight by examining the development path of the solar cell industry, which has progressed from silicon and CIGS (copper indium gallium selenide) to organic solar cells. Perovskite solar cells represent the culmination of decades of knowledge and research. A perovskite solar cell is composed of multiple layers. Each layer is carefully deposited on a substrate, which imposes certain limitations on the choice of materials and manufacturing processes for the top layer. To overcome these limitations, various process technologies such as slot-die coating, blade-coating, and spray deposition have been developed and refined for large-scale production. Additionally, a wide range of materials has been extensively studied. In the presentation, we will delve into the critical considerations for selecting materials and processes when fabricating perovskite solar cells. Furthermore, we will highlight the challenges and obstacles associated with these technologies. This session will cover the following topics: Structure of PSC: Conventional & Inverted Material selection and process considerations Techniques for creating thin film layers Classification of coating methods and choosing the right solution Encapsulation processes Download the Full Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com Pixel Voltaic  | Laser-assisted glass encapsulation for perovskite photovoltaics Tiago Lagarteira | 2024 This session will delve into: Power Conversion Efficiency (PCE) of 3rd Generation PVs The necessity of glass encapsulation for PSCs Glass frit encapsulation process for PSCs Innovative solutions in glass frit encapsulation Download the Full Slides Here University of Colorado Boulder | Understanding & preventing degradation in perovskite solar panels Mike McGehee | 2024 Metal halide perovskites are ionic conductors and can undergo oxidation and reduction. Perovskite solar cells often contain metal electrodes that can be oxidized. Redox reactions occur quite rapidly when the cells are operated in reverse bias, which can happen when a shaded cell is forced to match the current of illuminated cells that are connected in series. Shunting typically occurs in reverse bias when silver electrodes are used, but not when transparent conducting oxides or carbon are used. Oxidation of iodide can result in loss of iodine from the perovskite layer, which can also reduce power conversion efficiency. The talk will describe the electrochemical degradation and how feasible it is to protect different types of modules with bypass diodes. This session will explore: The future of module manufacturing with perovskite solar cells, including the potential dominance of classic thin-film processes unless perovskite-Si tandems are adopted. The challenges of laser scribing, such as stability issues and thermal damage during the ablation process. Why perovskite-Si monolithic tandems eliminate the need to cut through the ITO electrode. How current can pass in reverse bias, either through uniform tunneling or metal shunts. The lack of demonstrated perovskite cells that remain stable under reverse bias for extended durations. Download the Full Slides Here Join us on February 11-12, 2024, for the  Solid-State Battery Materials , a virtual event by TechBlick. Engage with industry leaders driving innovation in battery technology. Explore the agenda here.    Register Now TechBlick.Com

In this newsletter, you’ll explore cutting-edge innovations in additive electronics manufacturing, bioprinting, and printed electronics. Gain insights from industry leaders and download the full presentation slides to dive deeper into these transformative technologies. ImageXpert | Inkjet & Dispensing for Printed Electronics: R&D to prototype and Pilot Production University of Montreal | Drop-on-demand laser-assisted bioprinting of cells & hydrogels Fraunhofer IAP | Inkjet printable stretchable electrodes for organic electronic applications NRCC | Material & Process development for additive manufacturing TNO at Holst | 3D Additive Lithography for Electronics The Future of Electronics RESHAPED Boston  is the flagship TechBlick event. This event will take place at the UMass Boston, USA on the 11-12 June 2025. Visit the event website  here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com ImageXpert | Inkjet & Dispensing for Printed Electronics: R&D to prototype and Pilot Production Paul Best  | 2023 In this presentation, ImageXpert will discuss new technologies in inkjet for evaluating and optimizing processes in R&D and production. These tools allow you to build a better understanding of your inkjet process, improve the performance, and accelerate the rate of development. We will explore the latest analysis tools, from new dropwatching technologies to smarter prototyping printers. In this presentation you will learn about the following: A Process for Optimization in Jetting/Dispensing Performance: Volume, Velocity, Trajectory, Satellite, Wetting, Print Quality Measurement: Feature Size, Dot Positioning, Edge Quality, Uniformity, Drop Impact Testing Inkjet Performance, Sustainability – Drop Analysis. Measuring Nozzles Across the Head, Testing Inkjet Performance JetXpert Print Station Optimizing Inkjet Performance:Pulse Width, Damping Pulse Spacing, Voltage Download the Full Slides Here University of Montreal | Drop-on-demand laser-assisted bioprinting of cells & hydrogels Christos Boutopoulos  | 2023 Learn about: Cell bioprinting technologies: Viscosity range, resolution, speed, and cell viability Laser-Induced Side Transfer (LIST) for precise bioprinting Liquid ejection dynamics in LIST: Optimal printing conditions and maximum speed Microvasculature bioprinting and the role of pro-angiogenic factors in tubulogenesis Download the Full Slides Here Fraunhofer IAP | Inkjet printable stretchable electrodes for organic electronic applications Manuel Gensler  | 2023 In this presentation you will learn about the following: The fundamentals of stretchability in PEDOT:PSS materials Ink development for heart-rate sensor applications in collaboration with Umana Medical Dielectric Elastomer Actuator with inkjet printed electrodes Download the Full Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com NRCC | Material & Process development for additive manufacturing Chantal Paquet  | 2023 In this presentation you will learn about the following: Molecular inks (M-INKs) -Metal salts (e.g. copper formate, silver carboxyates) formulated into inks that decompose to form a metal film 2D printing: Boron nitride nanotube (BNNTs) coatings on PET to improve performance of printed conductors 2.5D printing: In-mold electronics with molecular inks 3D printing: Silver neodecanoate in photoresins for 3D printing of conducting structures Download the Full Slides Here TNO at Holst | 3D Additive Lithography for Electronics Jeroen Sol | 2023 In this presentation you will gain insights on the following: Lead Extractor Use Case: Enabling localized ultrasound imaging for safer heart pacemaker lead replacement procedures. Innovative Design: A 6 mm diameter ring-shaped device with 10 chips, integrated seamlessly using 3D-ALE, eliminating the challenges of traditional assembly. 4D Printing Benefits: Accelerated design iterations and faster time-to-market through this cutting-edge technique. Download the Full Slides Here Join us on December 11, 2024, for the FREE-TO-ATTTEND  Printed Electronics &   Display Innovation Day , a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.    TechBlick.Com

Author: Jesus Zozaya , CEO at Voltera | sales@voltera.io   As presented at the TechBlick Berlin event in October, our project, a multilayer magnesium zinc battery, validated the compatibility of Saralon’s battery inks printed on a PET substrate. Watch our Video: Printing a Flexible Magnesium Zinc Battery with Voltera NOVA MATERIALS USED Saral Silver 600A Battery Ink Saral Carbon 700A Carbon Based Conductive Ink Saral Zinc 700 Battery Ink Saral MnO2 800 Battery Ink Saral BatBarrier 600 Battery Ink Saral HotMeltGlue 800 Battery Ink Saral BatElectrolyte 700 Battery Ink SUBSTRATES USED Polyethylene terephthalate (PET) TOOLS AND ACCESSORIES Voltera NOVA materials dispensing system Nordson EFD 7018302 dispensing tip (330 µm ID) Nordson EFD 7018107 dispensing tip (840 µm ID) Nordson EFD 7018260 dispensing tip (410 µm ID) Nordson EFD 7018333 dispensing tip (250 µm ID) Heat press machine Dual asymmetric centrifugal mixer Project Overview Purpose The purpose of this project is to demonstrate how we fabricated a functional multilayer printed battery on a flexible PET substrate, validating the compatibility of PET with a variety of conductive and insulating inks. Image: Printed flexible battery-powering lights in a breadboard Design layout Typically, a printed battery consists of five layers: Current collector layer for the anode Anode layer Separator layer with electrolyte Current collector layer for the cathode Cathode layer Image: Schematic for typical printed batteries We segmented the battery into halves, each comprising four units, connected in series. As a result, our final print consisted of seven layers. Image: Design layout The printing sequence was as follows: Silver conductive layer Carbon current collector layer Zinc anode layer Manganese dioxide cathode layer Separator layer Hot melt glue layer Zinc chloride electrolyte layer Desired outcome Once the halves are laminated together, the cells align perfectly and do not exhibit any leakage. When connecting its two probes to the battery terminals, the multimeter shows a stable reading of about 2.4 V. Functionality The device incorporating the Saral inks was able to operate at a voltage of 2.4 V, which can make the battery quite versatile. With a voltage of 2.4 V, a printed battery can power a range of devices from low-power electronics such as LEDs, to more demanding applications such as handheld GPS devices, depending on its capacity. The dimensions for the battery are 90 mm L × 85 mm W × 0.75 mm H, with an initial capacity of about 1 mAh. Larger energy capacity and different voltages are achievable by varying the size and thickness of the layers, choosing different materials for electrochemical reactions, or adding more cells in series. We are speaking at the Free-To-Attend Online Printed Electronics Innovation Day Printing the magnesium zinc battery Silver conductive layer This layer consists of a silver conductive circuit connecting the positive and negative terminals. The Saral Silver 600A Battery Ink used for this layer provides a moderate electrical conductivity (< 20 mΩ/sq at 25 μm), ensuring reliable current flow between the electrodes. NOVA settings, silver conductive layer Image: Silver conductive layer design Image: Silver conductive layer print result Carbon current collector layer This layer consists of carbon features that collect current from both the anode and cathode, covering all eight cells (the basic units that generate electrical energy through electrochemical reactions) across the halves. The Saral Carbon 700A Carbon Based Conductive Ink provides excellent adhesion on PET, with a moderate resistance of 30 Ω/sq at 25 μm, ensuring efficient collection of current. NOVA settings, carbon current collector layer Image: Carbon current collector layer design Zinc anode layer This layer includes four cells that serve as the anode of the battery. The Saral Zinc 700 Battery Ink provides a sufficiently thick layer by one print, ensuring that the anode maintains a high conductivity and stability throughout its lifecycle. The high zinc content promotes efficient electron flow, which is critical for maintaining the battery's overall energy output and longevity. NOVA settings, zinc anode layer Image: Zinc anode layer design Image: Zinc anode layer print result Manganese dioxide cathode layer This layer includes four units that serve as the cathode of the battery. Similar to the The Saral Zinc 700 Battery Ink, the Saral MnO2 800 Battery Ink provides a sufficiently thick layer by one print, ensuring that the cathode maintains a high conductivity and stability throughout its lifecycle. NOVA settings, manganese dioxide cathode layer Image: Manganese dioxide cathode layer design Image: Manganese dioxide cathode layer print result Separator layer This layer consists of eight units printed with a water-based ink to create separation between the anode and the cathode layers. Once dried, it becomes porous to allow ion travel. NOVA settings, separator layer Image: Separator layer design Image: Separator layer print result Hot melt glue layer Excluding the terminals, anodes, and cathodes, this layer covers the whole surface of the final print and facilitates lamination. NOVA settings, hot melt glue layer Image: Hot melt glue layer design Image: Hot melt glue layer print result Zinc chloride electrolyte layer This layer consists of eight units of electrolytes, each slightly smaller than the anode/cathode units. They provide electrolytes that facilitate the movement of ions between the anode and cathode. NOVA settings, zinc chloride electrolyte layer Image: Zinc chloride electrolyte layer design Image: Zinc chloride electrolyte layer print result Laminating the halves of the printed battery together Once the last layer was printed and dried, we cut out part of the PET substrate to leave the terminals exposed. We then folded the print from the middle, carefully aligning the fiducial marks. Next, we inserted the PET into the laminator at 120°C, with the terminals going in last. This was to prevent leakage of the electrolyte to neighboring units and causing short circuits in the battery. When subjected to heat, the hot melt glue layer becomes sticky and holds the halves together. Image: Printed flexible battery folded and laminated Challenges and advice for printing batteries on flexible substrates Nozzle compatibility Nozzle clogging was an issue while working on the separator layer, which was printed with an ink that tends to dry quickly and is prone to forming agglomerates if left unused for an extended period.   In addition, due to the thin, water-like consistency of the water-based BatBarrier 600 Battery Ink, we had to refine print settings to adjust for over-dispensing in order to achieve the intended thin, uniform traces.   We mixed the ink using a dual asymmetric centrifugal mixer before printing. This process, which lasted for 10 minutes at a speed of 2,000–2,500 rpm, proved effective in breaking up the agglomerates and alleviating clogging. Additionally, removing excess water from the ink (we removed 1.8 mL) helped resolve issues with over-dispensing. Layer leakage Because the electrolyte layer was printed with a water-based zinc chloride ink, it posed some challenges during lamination. To avoid leakage, we noted that sufficient time was required for the electrolyte layer to absorb into the separator layer before laminating the halves together.   As the design varies, the volume of inks dispensed is different. It is therefore difficult to pinpoint an exact time required for the electrolyte layer to absorb. Some visual signs that indicate full absorption include:   ●      A noticeable lowering of the level of the electrolyte layer ●      Drying and uniformity of the print surface ●      A change in the color of the electrolyte layer to a dull white hue   It is also important to note that achieving a higher short circuit current usually involves increasing the thickness and size of the electrolyte layer. Consequently, more time should be allowed for the layer to dry and settle properly.   Conclusion The thickness of the final print (excluding the PET substrate) is 500 µm, which highlights the potential of printed batteries to be ultra thin and flexible. More importantly, this flexibility renders printed batteries highly customizable — they can store energy in various shapes and sizes to suit product design, instead of the other way around.   In this project, we experimented with zinc and magnesium dioxide inks as the anode and cathode, but a wide variety of materials can be used for printed batteries, including lithium cobalt oxide, carbon nanotubes, and vanadium oxide, to name a few. As we continue to explore the possibilities of printed batteries, we invite you to view the other application projects we’ve completed.   As we continue to explore the possibilities of printed batteries, we invite you to view the other projects  we’ve completed.   If you’d like to discuss your designs or our NOVA materials dispensing system, please book a meeting with our applications team  or contact us at sales@voltera.io . We are exhibiting! Visit our booth at two flagship TechBlick's events (1) in Boston on 11-12 June 2025  and (2) in Berlin on 22-23 October 2025 . Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

Author: Steve Paschky ( steve.paschky@saralon.com ) I recently read an insightful article on Nature about the challenges facing the scale-up of the Printed Electronics industry [1]. The article effectively highlights how disruptive technologies, like those in our industry, are reshaping the electronics landscape. While we often associate this sector with innovation, not every innovation is truly disruptive. Disruptive innovations fundamentally change industries, even society and lifestyle. PE innovations don’t just add value; they also revolutionize how electronics are produced, replacing traditional methods. As a materials supplier for PE industry, Saralon GmbH has started with engaging into emerging markets that didn’t exist before. Some of our best-selling Saral Inks© with high demands from these markets include SaralBattery Inks and Stretchable Saral Inks © among many others. However, as disruptive innovations evolve and mature, the key challenge becomes aligning them with mainstream markets. This is where the concept of product-market fit becomes critical. Saral Copper 200 is our latest generation of copper conductive ink designed with product-market fit in mind. While it has the potential to be used in conventional PCB manufacturing (thanks to its solderability), the primary market we are focusing on is smart labelling, smart packaging, and antenna technology at the core—specifically RFID and NFC tags and inlays. Before diving into the details of Saral Copper 200, I’d like to briefly elaborate on why copper ink and how it addresses the gaps in current solutions in the mainstream antenna market. 1. Huge market potential The smart labeling market is rapidly growing. In 2023, the global market for NFC and UHF tags was valued at 7 billion euros, and it’s projected to grow at a compound annual growth rate of 15%. Despite this growth, most RFID antennas are still made through unsustainable, subtractive etching process. IDTechEx says that only around 1.5% of antennas are produced by additive manufacturing processes. This highlights a significant opportunity for innovation in the Printed Electronics industry. 2. Additive printing vs. conventional subtractive electronics manufacturing Etching, the dominant antenna production method, is unsustainable. It wastes materials and relies on corrosive chemicals. Additionally, this process can only produce high-volume standardized antennas. Printed Electronics offer a sustainable, additive manufacturing alternative that allow for the production of customized antenna tags and inlays. However, current printed electronics solutions rely on silver conductive inks, that brings up the challenge of cost. 3. Copper microparticle conductive ink to deal with the cost issue While antennas including RFID inlays, NFC tags, etc. play a central role in smart labelling and retailing applications, cost has remained to be the key challenge for vast commercialization of Printed Electronics antennas. Up until today, printed antennas have primarily used costly silver-based materials making them less viable for large-scale adoption. Due to the rising and volatile silver prices, Printed Electronics community recognizes the pressing need to develop conductive inks made of lower cost underlying materials. In addition to being more affordable, such an alternative must provide comparable conductivity while ensuring ambient stability over time, and easy processability using conventional printing technologies (i.e. screen printing). Saral Copper 200 is a thermal curable copper microparticle based electrically conducting ink, suitable for paper and different plastic substrates. The ink is simply screen printable and thermally curable. Processed due to the instructions, a sheet resistance of 17 mΩ /sq/25 μm is easily accessible for printed and dried Saral Copper 200 with excellent ambient stability over time. In short, main advantages of Saral Copper 200 include: Dramatically lower cost Simply screen printable and hot air curable Low sheet resistance and excellent ambient stability Significantly lower carbon footprint compared to silver Saral Copper 200 is the revolutionary solution for the Printed Electronics industry to overcome cost challenges, particularly in the high-volume markets of smart labelling and RFID antennas which are currently dominated by conventional electronics that depend on unsustainable etching methods. Saral Copper 200 allows for the additive manufacturing of smart labels directly near the end-use markets. This will significantly reduce both costs and emissions associated with long-distance transportation. The demand for RFID tags and smart labeling is strong, the enthusiasm is present, and the opportunity is within reach. We’ve developed Saral Copper 200 with a product-market fit mindset to empower Printed Electronics industry in terms of cost effectiveness, performance, sustainability, and easy processability. I am Speaking Printed Electronics Innovation Day - 11 December 2024 This is a free-to-attend online conference and exhibition organized by TechBlick. It is co-located with TechBlick Display Innovation Day (online). We invite you to attend and listen to our talk. [1]   https://doi.org/10.1038/s44287-024-00096-9

by  Austin Buchholtz  | Nov 12, 2024   INTELLIVATION LLC is thrilled to announce the addition of Dr. Robert Malay to our team as the new Application Lab Director. The Application Lab includes two R2R Vacuum Coating systems and our Laser system for patterning and annealing thin film coatings. Dr. Malay brings extensive expertise in deposition on flexible substrates, physical vapor deposition (PVD), characterization, and experience with application and industrial integration for end users. This strategic addition will bolster our technology development and customer support efforts. In his new role, Dr. Malay will oversee all Application Lab activities including deposition of single and multilayer coatings on flexible substrates, materials characterization, and precision patterning and annealing of deposited films.  He will also assist the product development department with testing of new systems for commercial use.  His broad experience will be instrumental in enhancing existing and new products to assure that Intellivation continues to provide industry-leading hardware and software in our systems.   "We are excited to welcome Dr. Robert Malay to Intellivation LLC," said Mike Simmons, President & CEO. "His vast experience and dedication to advancing technology make him a perfect fit for our team. We look forward to the innovative solutions and support he will bring to our customers and growing capabilities in our Application Lab.”   Dr. Malay will also play an important role in representing Intellivation at industry-leading organizations such as Association of Roll-to-Roll Converters (ARC), the Society of Vacuum Coaters (SVC) and International Converting Exhibition (ICE), furthering our commitment to supporting our industrial partners and staying at the forefront of technological advancements. Dr. Malay received his PhD from Binghamton University, where his research focused on R2R electronic device fabrication, projection lithography and characterization on flexible glass.    Please join us in welcoming Dr. Rob Malay to Intellivation LLC. We are confident that his contributions will drive our ongoing success and innovation.   Contact Information: Intellivation LLC 560 W 66th Street Loveland CO 80538 info@intellivation.com www.intellivation.com Follow us on LinkedIn