Andrew Stemmerman & John Yundt SunRay Scientific Inc. Eatontown, NJ USA andrew@sunrayscientific.com johny@sunrayscientific.com SunRay Scientific of Eatontown, NJ, USA has developed a new and innovative approach to electronic component assembly. This article will outline the developments of this technology and show examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Introduction Flip-chip die and die-to-die bonding, from dense to fine pitch, typically require solder balls and underfills. Underfill and/or edge encapsulant is often utilized to provide additional mechanical strength and stress reduction. The result is a complex assembly process flow. Localized placement of Anisotropic Conductive Adhesive (ACA) or Anisotropic Conductive Film (ACF) for specific components typically involves the fine-pitchuse of thermocompression bonding, an additional process step that could also be damaging to thin silicon. Another drawback for traditional interconnect materials is relatively slow processes, limiting the utility of such technologies. Development towards a wafer scale compatible packaging method will be shared, using a pressure-less and low-temperature magnetically aligned Anisotropic Conductive Epoxy (ACE). Figure 1. Flip Chip assembly comparisons: traditional solder balls & underfill attachment (Left); Die attach with z-ax...

Steliyan Vasilev Company: 3E Smart Solutions Embroidery is a textile manufacturing technique that has its roots in historic hand-stitched garment design. However, with the invention of computers, this textile manufacturing technique has seen a resurgence due to its high levels of material optimization. Embroidery allows the textile engineer to place single fibers, yarns, fiber bundles, or even wires with high precision in a variable, predesigned geometry. Because of this high precision, embroidery is highly applicable for integrating functionality into textiles through textile sensors, actuators, or electrodes. Three types of embroidery technologies are commonly used and defined in the literature. These include chain and moss stitch embroidery, standard embroidery as well as tailored fiber, wire, or tube placement. Each of these methods can be utilized in varying ways for the mass production of smart textiles. The embroidery technology offers enormous possibilities for the automatic integration of conductive fibers and electronic components into textiles to create e-textiles. E-textiles are in development for decades but only a few products could make it to the market. The main reason for this lack of products on the market is the high production costs. Manual production steps increase the production costs and lead to high product costs. Furthermore, reproducibility cannot be guaranteed or manually created products. The high level of automation of the embroidery process final...

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions. SAVE THE DATE...

IoTech is introducing a new and patented digital additive manufacturing technology: the Continuous Laser-Assisted Deposition or CLAD. CLAD is a breakthrough multi-material production process for electronics, from semiconductor packaging to flexible electronics. CLAD enables the fast, precise, high-resolution, and high-volume deposition of most industrial materials, no reformulation required. Manufacturers can - use their standard industrial materials, - control the deposition of every single drop, - print at up to 30µm resolution and, - reach unmatched production yields. The system is fast, contactless, high-resolution and micron-accurate. It enhances manufacturing flexibility for advanced electronic designs. CLAD enables more compact, powerful product functionalities in a wide range of applications. It is compatible with most conductive and dielectric fluids, even of high viscosity. CLAD is also ESG-compliant and labour-efficient. It provides an alternative to highly polluting subtractive technologies, enabling the re-shoring of production processes to OECD countries SAVE THE DATE...

Recent advances in Additive Manufacturing (or 2D and 3D Print) have poised many of these technologies to displace or augment traditional electronics manufacturing methods, yet significant further advances are still needed in order to obtain broad adoption for high-volume manufacturing of electronics devices. After presenting a view of how additive manufacturing methods could be leveraged for wearable AR/VR devices as well as highlighting the benefits of additive methods, I will dig into key areas where significant developments are still needed, including: component-level and device reliability; design tools; close-loop in-situ process monitoring; integrated manufacturing workflows; productivity and yield; and material properties. I will then conclude with a few application examples, highlighting unique solutions promised by additive methods as well as gaps which remain. SAVE THE DATE...

Company: Syenta Speaker: Jekaterina Viktorova SAVE THE DATE...

The convergence of lab-based discoveries and industry-need created reimagined products based on stretchable and/or flexible substrates.Soft electronics made of silicone were translated into a printed technology to create smart bedding products to monitor aged-care residents and improve quality of care. Working closely with manufacturers, the evolution of the technology from stretchable electrodes to a sensor array across a mattress, will be covered. This approach represented a new take on production of electronic textiles.Combining flexible substrates with surface mount components, composite structures have created a category of modular sensing skin patches. Based on clinical need, different sensor combinations have been utilised for aged-care health monitoring, with potential use cases targeted to dementia care and post-operative management. SAVE THE DATE...

Name:Łukasz Kosior Company: XTPL XTPL provides additive manufacturing technology and conductive materials at the micron scale to address complex issues in the advanced electronics industry. The company has developed its own solutions that allow for extremely accurate printing of functional features at the micron level with high resolution. This capability extends to both planar and non-planar complex substrates, including the ability to print continuous and highly conductive interconnections oversteps. In our presentation, we will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Additionally, we will present our plans to introduce Ultra-Precise Deposition technology to the industry. SAVE THE DATE...