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Ryojiro Tominaga Company: Fuji Corporation In recent years, 3D printer technology that can manufacture bare PCBs using digital printing technology for both conductors and insulators has been developed. However, it is essential to optimize the SMT process in accordance with the transformation of the bare PCBs manufacturing process for the practical application of this technology. Fuji will introduce a novel machine that combines the additive manufacturing process of bare PCBs and low-temperature SMT technology optimized for this purpose SAVE THE DATE...

OLED is widely known as the highest quality display on the market, used in flagship products such as high-end TVs and smartphones. Many of the early promises of OLEDs have been realized and commercialized, including their ultra-thinness and potential for flexibility. However, today's flexible OLEDs are still fabricated in much the same way as rigid OLEDs on glass. And most of the innovation in the field is still aimed at high-end consumer products. At Sinovia, we are using roll-to-roll flexographic printing to fabricate bottom-emitting OLEDs suitable for use in segmented, indicator, and passive matrix displays at price points that can compete with incumbent LCDs and LED assemblies. This is enabled by our proprietary materials technology and our in-house process, along with some key supplier partnerships. In this talk, I will cover our core technology, our development status, applications of our displays, and our future plans as we move toward mass production. SAVE THE DATE...

Speaker: Neil Chilton Company: Printed Electronics Ltd PEL is both an experienced manufacturer and specialist machine supplier for printable electronics. At TechBlick we present together with our key partner SIJ. In this presentation we will explain where we have used our knowledge to determine the optimal print methods for applications ranging from large area to ultra-fine-line printing. We will focus on new developments in SIJ including the high productivity multi-nozzle systems. SAVE THE DATE...

Author: e2ip Technologies | Contact us [https://e2ip.com/contact/] Flexible and thermoformable printed electronics have become increasingly popular in recent years as they offer a cost-effective and versatile alternative to traditional electronics. The ability to print electronic devices onto a variety of substrates, including plastics, textiles, and even paper, has opened new avenues for innovation in Smart Structural SurfacesTM. In this article, we will discuss the applications and challenges of three types of flexible and thermoformable printed electronics that require fine line printing capabilities: Capacitive Touch Switches, Transparent Printed Heaters, and Metasurfaces. Capacitive touch switches, such as CapFlex®, use capacitive sensing to turn any surface into a touch-controlled electronic smart surface. These switches are typically made of a thin, flexible printed circuit layer sandwiched between a backing layer and a top overlay. The compact design eliminates the need for additional mechanical parts, and the surface becomes the screen. With CapFlex®, designers can create customized touch controls on a variety of surfaces, including plastics, glass, and even curved or irregularly shaped surfaces. Transparent printed heaters use fine line printing process to generate heat, making them more energy efficient by improving the heat diffusion. The design pattern allows the technology to adjust the desired temperature a...

Andree Maindok Speaker: Celanese Silver sintering pastes and films are widely used for attaching SiC dies to their substrates in modern power electronics. They offer mechanical stability to well above the use temperatures (>200C), high thermal conductivity, and do not form brittle inter-metallics. They provide a strong, high reliability bond, especially when sintered with pressure assistance. However, they are not always easy to work with. Developing a product that will sinter at modest temperatures and with modest levels of pressure often results in an unstable formulation that requires cold storage and transport. These products then require conditioning to bring them up to working temperatures before they can be used. If the product cannot be dried before die placement, die size will be limited, or reliability will suffer due to trapped organics left after the sintering process. We have developed several novel paste formulations for sintered silver die, heat sink and top of die attach. They are shelf stable for months at room temperature, offer long open working times with little or no viscosity drift. They can be metal mask stencil printed syringe dispensed, or jetted, and are dried before placement (even when dispensed), allowing large area dies and substrates to be bonded without loss of reliability or thermal performance. We also have new developments in high reliability performance for large area heat sink attachment at reduced temperature and pressure. This allows att...

We introduce a groundbreaking advancement in Magnetic Resonance Imaging (MRI) coil technology that addresses key challenges in medical imaging. Leveraging screen-printing techniques, our approach results into flexible, lightweight MRI coil arrays with enhanced coil performance and better patient experience. We report on the design and characterization of a 12-channel RF receiver coil array, including signal-to-noise ratio (SNR) studies performed in phantoms, volunteers, and patients. Phantom tests involving the pediatric printed coil indicated noise covariance matrices on par with those of the commercial coil, with a minor SNR reduction for the printed coil. Our work included a comprehensive study that assess the performance and acceptance of a pediatric-sized screen-printed flexible MRI coil array, contrasting it with conventional coil technology. Study participants, ranging from 2 days to 12 years in age, underwent MRI scans using the pediatric printed array. The results were benchmarked against historical control subjects who were scanned using a commercial 32-channel cardiac array at 3 Tesla. A survey of caregivers and clinicians demonstrated strong acceptance of the printed coil, garnering an average score of 4.1 out of 5, indicating a preference for the printed coil. The diagnostic quality of images produced using the printed coil was highly rated, achieving a quality score of 4.5. SAVE THE DATE...

Hee Hyun Lee, Ph.D. Lead Scientist at Celanese Micromax™ Electronic Inks and Pastes The global printed electronics market is huge and estimated to reach USD 23 billion in revenue by 2026, growing at a CAGR of 18.3% from 2023 to 2028 [1]. Increased demand for printed electronic products in automotive and the growth of consumer electronics are two key fueling factors to drive the market growth. The two critical segments require various reliable printed electronic products for applications from low temperature to high temperature. The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties such as conductivity, dielectric strength, and electrical resistance. Celanese Micromax™ Electronic Inks and Pastes is a global supplier of thick film pastes/inks and recently launched HT (High Temperature) ink series - HT602/603 resistors, HT702 dielectric and HT802 conductive inks for high-temperature and high-power applications. HT series inks can be printed additively by using screen printing or nozzle dispensing process on various flexible/rigid substrates including Kapton® FPC, Kapton® RS, FR-4, Aluminum, Alumina, and glass. The operation temperature of conventional PTF (Polymer Thick Film) ink is typically limited up to 200°C due to the thermal degradation issue of polymeric resin in ink formulations. In the printed electronic industry, high-temperature and high-power applications often require operation temperatures abo...