Syenta - an exciting start-up in Australia - is developing an electrochemical multi-material printing platform [digital printing machine + associated materials], addressing several critical shortcomings of traditional printing with particle-based ink/paste systems: bulk-like properties, wide material choice, no post treatment, and excellent z-direction [height] control. Syenta will be exhibiting in Berlin on 17-18 OCT 2023 - join us and the global industry to RESHAPE Electronics, making it Additive, Sustainable, Flexible, 3D and Wearable - learn more https://www.techblick.com/electronicsreshaped An example of their current printer [currently single nozzle with a 40x40 cm2 print area] is shown in slide [1]. The process is based on LEM or Local Electrochemical Modelling. Here, a local plating or electrodeposition takes place when an external controlled electrical potential is applied via the print head to a precursor solution. By control of the applied voltage as well as distances one can control many parameters including print speed, height, and linewidth. As you can in slide [2], this technique can be applied to a wide range of materials, covering conductive metals like copper as well as high viscosity polymers like epoxies and semiconducting materials like MoO3. In this way, it overcomes one of the limitations of particle-based ink systems which is the range of available materials. In slide [3] you can see the achieved conductivity. Given that it is a localized plating pr...

Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D . Explore the programme now https://www.techblick.com/electronicsreshaped...

Are you interested in screen printing of electronics and functional materials? Then the below panel is a must-watch for you, bringing you over 100 years of experience in the field covering all aspects from mesh to screen to screen printing machinary to screen printing of utlrafine lines. This panel took place in May 2023 but we are now making it available to you to watch on-demand In the video below The panelists each give a short presentation [7min] introducing the state-of-the-art in the field followed by a lively and detailed discussion covering all the pressing questions in the industry.
Ron Hayden from RH Solutions LLC with a focus on Screen Printing and Auxiliary Equipmen
David Eisenbeiss from Kissel + Wolf Group with a focus on emulsion Technology, including the latest Laser Imaging developments
Fernando Zicarelli from Fernando's Consulting (formerly at Asada Mesh and now at e2ip) with a focus on Mesh Technology and Tooling Erika Rebrosova from Sun Chemical with a focus on functional ink technology Julie Ferrigno from e2ip focusing on on applications for fineline screen printing...

Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D . Explore the programme now https://www.techblick.com/electronicsreshaped...

Elephantech is developing mass production of multi-layer flexible and rigid PCBs [FPCBs and RPCBs] using inkjet printing. This is an important industry development which enables more sustainable electronic production Slide [1] compares the convention process vs the inkjet printed process, showing how the number of production steps and the amount of material consumed can be reduced since ink-printing enables additive (vs subtractive) manufacture. Note in slide [1] how Elephantech is also developing technology to enable double-sided FPCBs with drilled vias[more on this later] Slide [2] shows how Elephantech is a vertically integrated operation now, covering material development [copper nanoparticles] to ink formulation to inkjet printer development to production of FPCBs in house. The ultimate goal is to be an equipment supplier. However, they will do manufacturing to gain production experience to perfect the process and machinery in the years to come Slide [2] also demonstrated the sustainability of the process, showing that the additive inkjet based process reduces copper and water consumption vs. the traditional etched process by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. These are very important achievements, in particular considering how all major electronics OEMs are now pushing for greener value chains [10% of the CO2 footprint of Apple comes from PCB production!] Slide [3] shows an inkjet printer under development. This is not the final desig...

Janos Veres Director & VP of Engineering
NextFlex, together with its extended ecosystem network, has been exploring the potential for novel electronics packaging and integration on a system level. This includes electronics integration in wearables, textiles, medical, and high-density integration of RF circuitry, all the way to integration of antennas on the skins of aerial vehicles. Such high-level integration is enabled by the combination of thinned bare die, additive manufacturing, printing, robotics, laser imaging, novel materials and plastics technologies. NextFlex established a unique Technology Hub with a diverse set of tools and know-how to support the needs of government and industry partners. This presentation will discuss system-level integration and packaging implementations with examples of wearables, safety devices and industrial monitoring, as well as very large scale integration on airframes. The talk will address design methodology and the manufacturing process flow used on the devices including additive printing, assembly, test, and final encapsulation. Hybrid electronics is an exciting trajectory for future electronics, enabling new shapes and form factors....

Liquid metals are extremely versatile. They are composed of GaIn liquid [Ga and In have melting temperatures of 30C and 157C]. The material has no vapor pressure and has viscosity like water, but with metallic properties.
Dr. Michael Dickey from North Carolina State University recently presented interesting results at TechBlick, showing self-healing structures, conductive fibers, stretchable barriers, and filled microfluidic channels using liquid metals. These liquid metals almost instantaneously form a thin [few nm thick] non-conducting GaOx passivating layer which stabilises the structure. The oxide layer can easily be broken [with mechanical force] to form a conductive pattern.

As can be seen in slide [2], these materials can be applied to fibers in two ways: filling the fibers/tube or adding the particles to the outer surface of the fiber/thread. In the first approach, a material can be formed with the elasticity of rubber and the conductivity of metal. As shown in slide [3], the conductance changes with strain [up to 500% demonstrated]. Note that the conductivity of the liquid metal itself does not alter with strain, but the cross-section of rubber fiber changes, thus changing overall conductance.

As shown in slide [4], to apply these materials to the outer surface, a droplet suspension of liquid metal nanoparticles [100 nm to a few micrometer in diameter] needs to be formed through, for example, sonication. The droplets become stabilized thanks to the presenc...

Menno Bos | Sales Manager International...