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CondAlign AS
CondAlign AS

Silver

CondAlign AS

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About

Novel ACF for room temperature, low-pressure component bonding in flexible, hybrid and printed electronics.
CondAlign brings a range of innovative, adhesive anisotropic conductive films (ACFs) to the market, enabling a novel way of...

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This page was last updated:

2 July 2024

Documents & Links
Event Presentations

Morten Lindberget

Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

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Boston 2024

Morten Lindberget

Room temperature bonding in printed and flexible electronics – realizing novel solutions with a focus on cost and sustainability

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Innovations Festival 2023

Morten Lindberget

Adhesive ACF for efficient room temperature bonding in FHE

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PE Festival 2022

PÃ¥l Morten Lindberget

Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

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PE May 2021

Masterclasses
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