16 October 2023
On-Site Masterclasses & Company Tours
There will be three parallel tracks of industry-led masterclasses on 16 October 2023, the day before the conference. Each 45-min masterclass will cover a technology or application in detail, offering an insightful blend of practical, technological and application knowledge. These masterclasses will be delivered by industry experts & may involve live demonstrations.
The content below describes the outline of the classes. Please note that you will be able to move between tracks at the end of each class. The numbers in each class are limited to 50, and will be allocated on a first come, first served basis. PDFs of all masterclass presentations will be made available online to masterclass attendees.
Contact Chris@TechBlick.com if you have any queries.
Masterclasses | Track 1
Masterclasses | Track 2
Processing Functional Screen Printing Pastes
Berit Schuster & Philipp Hölzl
In this class you will get an insight into the world of functional screen printing pastes. You will learn about the structure and processing of the pastes before, during and after the application. Factors such as the correct storage conditions, the preparation of the pastes before the application process and the correct drying or curing methods play an important role. During the masterclass, you will also receive helpful tips on selecting the right products for your application. Finally, you will get an overview of possible applications with some practical examples
Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder
Interconnects are one of the most important technology elements in the entire flexible hybrid stretchable or soft electronics field. The requirements and limitations are fundamentally different to that of traditional SMTs and PCBs thus new solutions are required. Indeed, interconnect technologies can often hinder the performance of these systems.
In this class the participants will learn the following:
The existing and emerging requirement set from processing temperature, pitch, adhesion, flexibility and stretchability, reliability, method of application, etc
Overview of different types of conductive adhesives. Here you will learn the pros and cons of each solution, understanding how each solution can find use in a different application
Overview of existing and emerging low-temperature solder, understanding the processing requirements as well as the applicability of different solder solutions. The emphasis will be on emerging low temperature solders compatible with flexible low-temperature substrates
Discuss the key design considerations and challenges when implementing interconnect technologies in flexible and stretchable electronics, such as mechanical stability, electrical performance, and manufacturability.
Examine the current and emerging applications of flexible hybrid stretchable electronics and understand how advancements in interconnect technologies can propel their development and adoption across various industries.
Sustainable Electronics: Understanding and Analysing Sustainability Aspects of Printed Electronics
Transitioning from conventional Printed Circuit Boards (PCBs) to future electronic products based on Hybrid and Printed Electronics (HPE) provides immediate opportunities to achieve ecological benefits: use of recyclable thermoplastic polymers, reduced device thickness, lower weight and additive manufacturing instead of deductive manufacturing. You will learn about the environmental impact of Hybrid and Printed Electronics and what is needed to adapt this technology to circular economy. In both types of electronics, PCBs and HPE, the circuitry and surface mounted devices (SMDs) contain potentially critical, high impact metals, some of which, if not all, are embedded in plastics to protect them from external influences. Designs-for-recycling are relatively unexplored, leaving many critical metals trapped in their plastic casing. You will learn about example designs-for-recycling for HPE and their (potential) impact to the overall environmental footprint.
HMIs with Integrated Smart Functions
Kundisch GmbH & Co. KG
HMIs are traditionally just a keyboard and as such just a piece of wire with a metal spring to close an electrical contact. Over time such membrane keyboards very quickly evolved to have more functions than just switches. Integrated LEDs and illuminated emblems are state of the art. Integrating displays or microcontrollers is making HMIs smart. In this class we will see the technological possibilities and real-life examples of integrated smart functions in HMI systems. The examples show integrated displays, touch buttons including their electronics and novel printed sensors. Furthermore, the integration of transparent heaters, antennas or shielding will be outlined as this will be the next level of integration to a smart HMI.
R2R - UV Nanoimprint Lithography - Nano goes Macro for innovative use cases
Roll-to-Roll UV- Imprint Lithography (R2R UV-IL), a manufacturing technique for creating nanoscale patterns on flexible substrates. This method is an extension of traditional Imprint Lithography, but with a focus on high-speed, continuous, and large-scale production of nanostructures.
In this masterclass you will learn about:
Concept & basics: An understanding of the basic principles of UV-IL, a high-resolution, high throughput and low-cost method for patterning materials on the nanometer scale and the transfer of the process to R2R equipment.
The Roll-to-Roll process: a closer look as well as explanations on R2R UV-IL with insights into the process chain starting with the simulation of applicable designs up to the fabrication of prototypes.
Process flow: An overview of the different types of materials and flexible substrates used in R2R UV-IL, including polymers, metals, and other materials.
Detailed study of various R2R UV-IL methods, such as thermal, UV, and hybrid coatings and processing options, as well as advantages and disadvantages of each technique.
Markets & Use-Cases: A look at the various industries, market segments and new application possibilities that benefit from R2R UV-IL, such as biomimetics, optics, microfluidics, surface finishing and fraud protection based on actual use-cases. Finally, an examination of the current limitations and challenges faced in R2R UV-IL, as well as the potential for future advancements and innovations in the field will be shown.
Screen Printed Batteries
Stuttgart Media University
Every IOT device, sensor, display etc. etc. needs a power supply. If it is not connected by cable to a power supply, a battery or supercap is needed, preferably integrated into the device, and depending on the form factor, in the best case freely designable and most desirably flexible. Printed batteries and the corresponding supercaps offer this functionality. They differ significantly from standardised and rigid housings as known from AA, AAA or button cells. This course introduces the basic designs of printed batteries and their components. Components such as substrates, current collectors, electrodes, separators, electrolytes and sealants, sealing techniques are discussed in detail with their properties, requirements and challenges. Different electrochemical systems, non-rechargeable and rechargeable, are also discussed. Performance values are also shown.
3D Printed Electronics
Neotech AMT GmbH
3D Printed Electronics (3D PE) is the Additive Manufacturing of electronics and complete mechatronics systems using digital driven printing and assembly technologies.
In this class, you will learn about all aspects of (3D PE):
1. What is 3D Printed Electronics / What are its uses and benefits? 2. 3D Printed Electronics Processes, Systems & Strategies
3. Current Markets & Applications
4. Active Research & Future Perspective
Electrohydrodynamic Printing and how to Scale it towards Economics
In this class you will obtain fundamental knowledge of how the use of electrohydrodynamic ejection can overcome fundamental barriers of conventional inkjet printing. You will also lean why this promising process has not yet made a broader entry into the market of printed electronics and how we attempt to change this. Finally, we will screen through some applications that will potentially be transformed by this novel additive manufacturing technology.
Masterclasses | Track 3
Navigating the Market Landscape: Qualifying Ideas and Overcoming Barriers in Printed Electronics
The technology of printed electronics has the capacity to boost efficiency, and create fresh opportunities for innovation in many markets such as automotive and medical. This session will prioritize the exploration of goto-market experiences over the technology itself, offering valuable insights into the obstacles and challenges that may arise when introducing a new technology.
Attendees can expect to gain a deeper understanding of the hurdles and barriers that come with introducing printed electronics to the automotive market through discussions on industry standards, customer-specific norms, quality management, product requirements, regulatory compliance, and potential contractual or safety issues.
This session will also offer a sneak preview of potential go-to-market scenarios in the medical industry, showcasing how printed electronics can be utilized and which entry barriers might apply.
Wearable Sensors for Healthcare Applications
TNO at Holst
With rising prevalence of chronic diseases, healthcare organizations are dealing with resourcing issues, enormous pressure on personnel, long patient waiting lists, and missed health screening appointments, further pressurized by the consequences of the recent coronavirus pandemic.
This more than ever highlights a need in a sustainable healthcare from economic, social, and environmental perspective.
Wearable skin sensors or ‘the smart skin’ offer new ways for remote monitoring to support the accessibility to and sustainability of healthcare systems along the entire care cycle: from healthy lifestyle to screening, diagnosis and post treatment surveillance.
Recent advances in technology printed electronics, in miniaturization of sensors and in photonics, have significantly contributed to the wearable technology. All of these sensors can be integrated into stretchable, flexible and breathable wearables which can be worn during weeks.
In this Masterclass you will learn about the Vital Signs wearable patch – an open platform for measurements of biophysical read-outs as well as about its potential applications for remote monitoring for well-being and heath. What is more, we will share how next generation wearable technology platform can address healthcare needs. We will also address challenges on the road ahead concerning manufacturing, durability of wear and signal reliability.
3D Structural In-Mold Electronics: New Design Freedom and New Design Rules
In-Mold Electronics (IME) is a proven technology for bringing functionality into mechanical structures, making formerly dead spaces alive and functional. Basic IME in its simplest form - flat or mildly curved surfaces augmented with printed wiring - offers straightforward solutions for eg. for touch sensing, antennas, and heating elements.
More complex functionality requires basic IME to be augmented with existing components, such as LEDs and control systems in case of complex lighting. Design wise, IME with thermoplastic electronics substrates and plastic wirings offers a platform for thermoplastic electronics: A contemporary cost-effective solution for mass produced 3D electronics and true smart surfaces.
Integration of electronic functionalities, mechanical support, and decorative materials into a single monolithic structure instead of multiple distinct parts leads directly to drastic reduction of materials and logistics needed. Further, the additive process of printing electronics directly onto thin substrate diminishes the environmental load implied in using traditional PCBs and wet etching methods.
In the masterclass, we discuss the overall 3D structural IME solution with real-life applications and demonstrators concerning the main manufacturing and design aspects. Special emphasis is given to the changes in design rules going from traditional PCB electronics with separate mechanical parts to formable structural electronics.
Technologies for High-Resolution R2R Manufacturing
The use of printing techniques to manufacture flexible electronics is now commonplace for a range of products – from consumer electronics to medical tests to automotive components. Product requirements drive choices in manufacturing techniques. This talk will review features that can be delivered by different print methos for comparison against a diverse set of end-use requirements.
There are multiple, readily available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). There is a further distinction between print technologies for the range of inks that can be printed, as well as the volume of ink that can be deposited in a single-pass.
We will review a high-level comparison between print technologies – mapping the technical capabilities of each to the features required for end products. Advantages of these additive R2R technologies will be covered - looking beyond the “obvious” potential materials savings over subtractive technologies for potential benefits to both the manufacturer and the end-product stakeholders.
The discussion will extend to ways to achieve the best performance from various print systems. Working examples will be primarily taken from Kodak’s high-resolution flexographic functional printing system, however broader insights will be shared. We will explore how best to take full advantage of “addressable resolution” and print speed in print systems, with attention to various process elements that must be considered and controlled.
Company Tours & Masterclasses
These four tours are open to attendees on the morning masterclasses. You need to register for the tour of your choice and numbers on the tours are limited as indicated below. Please email your choice of tour to Chris@TechBlick.com
The tours will leave at 1.30pm and attendees should meet at the registration desk. Transportation will be provided and the tours are expected to return to the Estrel by 6.00pm.
Conformal & Stretchable Electronics and E-Textiles
This tour is limited to 30 people, and places will be allocated on a first come, first served basis. Fraunhofer IZM is a 45 minute drive from Estrel Congress Center, transportation will be provided.
As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging. The focus lies mainly on material, process and substrate development, characterization and simulation, advanced system engineering, assembly and interconnection technologies and environmental engineering. Fraunhofer IZM is employing about 438 employees and graduate students with its main branch in Berlin. Together with its partner institute at the TU Berlin it is running a ~1000m2 clean room of with full thin film and packaging capabilities from 4” to 12” wafers.
Fraunhofer IZM and specifically the department “System Integration and Interconnection Technologies” with the group “System on Flex” is specialized in the integration of electronics in and on flexible and stretchable substrates – including textiles. The focus will be on optimized integration technologies for garments. Fraunhofer IZM has a unique prototyping infrastructure for electronic textiles and has been developing successfully technologies for the reliable integration of electronics into textiles.
Participants will be guided through our textile labs (textile technologies and textile specific interconnection technologies), our substrate line and our mechanical testing lab.
PVComB + Helmholz Zentrum
This tour is limited to 40 people, and places will be allocated on a first come, first served basis. Helmholtz Innovation Lab is a 20 minute drive from Estrel Congress Center, transportation will be provided.
The Helmholtz Innovation Lab HySPRINT offers a unique infrastructure for fabrication, development, and characterization of metal halide perovskite materials and solar cell devices in the high-tech campus Berlin Adlershof. This infrastructure is used to develop world leading perovskite single junctions, mini modules and perovskite/silicon tandem solar cells. It includes several wet chemical and vacuum based deposition methods integrated into inert condition operating glove-boxes. The tour will be guided through these laboratories and specific fabrication methods will be presented together with highlighting how these solar cells are characterized in terms of performance
IRIS Adlershof + Synchrotron Lightsource BESSY II
Material development for inkjet printing
This tour is limited to 40 people, and places will be allocated on a first come, first served basis. IRIS Adlershof is a 15 minute drive from Estrel Congress Center, transportation will be provided
Research at the Integrative Research Institute for the Sciences (IRIS) Adlershof of Humboldt-Universität zu Berlin explores novel hybrid materials and functional systems with so far inaccessible optical, electronic, mechanical and chemical properties. This research is connected to fundamental studies of structure and dynamics of matter on extreme length and time scales and in complex systems.
IRIS Adlershof is located in a newly constructed, state-of-the-art research building in the immediate vicinity of Humboldt-Universität zu Berlin’s Departments of Physics and Chemistry and of numerous other innovative institutes and companies. You will visit the building and its lab facilities and gain insight into ongoing research and development of hybrid systems for electronics, optoelectronics and photonics.
BESSY II, the synchrotron radiation facility in Berlin, Germany, offers a broad variety of research options for the international scientific community free of charge. From photovoltaics, chemical energy conversion, batteries to quantum materials, information technology materials, biology, cultural heritage and medical research we provide infrastructure for your scientific projects.
Although BESSY II is dedicated to soft X-ray regime, experiments using infrared radiation on the low energy side and tender or even hard X-rays on the other are feasible.
The instrument portfolio allows a multitude of methods like photoemission, photoabsorption, scattering and diffraction methods, microscopies or imaging.
BESSY II is a key enabler for developing solutions to the grand global challenges societies are facing, namely the progressing climate crisis, and the urgent need for sustainable, carbon-neutral energy. However, global problems have to be addressed globally; with international knowledge exchange, “brain-circulation”, and cooperation we can contribute to tackling global problems.
During the tour, you will get an overview over the scientific possibilities at BESSY II, learn about some science highlights, and become familiar with the world of large scale research infrastructures and their contribution to science diplomacy.
To attend this tour you will need to supply your name, organisation and also date of birth. This is required for radiation protection. In general visitors have to be 18 years old or older. Pregnant women are not allowed to go into the experimental hall (radiation protection).
Digital Printing of high viscosity pastes
This tour is limited to 20 people, and places will be allocated on a first come, first served basis. Quantica is a 25 minute drive from Estrel Congress Center, transportation will be provided.
Quantica is a manufacturing company that specializes in the design and development of advanced additive technology. Its flagship technology, the NovoJet printhead, enables users to jet new materials with high-viscosity fluids and materials with high particle loading.
Prior to the tour, Quantica will give a 30-minute presentation about the company and technology. Exploring:
A high-level overview of various digital printing techniques for electronics including inkjet printing
Bottlenecks and limitations of the current technology including the difficulty to print high viscosity fluids
How Quantica’s technology overcome these bottlenecks