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Zachary Kelly, PhD . - Senior Research Scientist, Heraeus Electronics, Conshohocken, Pennsylvania Introduction Understanding PTC 4980 and Its Benefits Key Features of PTC 4980 Design Principles for PTC Heating Solutions Case Study: Improving Large-Format PTC Heater Performance 5.1 Initial Challenges Identified 5.2 Optimized Design and Manufacturing Process 5.3 Key Takeaways and Industry Implications Conclusion We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend This paper has been carefully compiled by Heraeus Electronics. Although the content is considered accurate, we cannot guarantee that this paper is suitable for any application. The descriptions and engineering data shown here have been compiled by Heraeus Electronics using commonly accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. 1. Introduction Printed electronics have revolutionized heating solutions across industries by enabling cost-effective, scalable, and customizable manufacturing processes. One of the critical advancements in this field is the use of Positive Temperature Coefficient (PTC) resistor pastes for self-regulating heaters. These materials offer inherent temperature control, reducing the need for external regulation mechanisms and ensuring safer, more energy-efficient heating solutions. Heraeus Electronics has developed PTC4980, a new family of carbon and polymer-based resistor pastes designed specifically for self-regulating heaters. With applications ranging from industrial heating to automotive and medical sectors, these pastes leverage a PTC effect to provide precise thermal management. This white paper explores the principles behind PTC heater inks, design methodologies, and the improvements in large-format printing enabled through collaboration between Heraeus Electronics and Boyd Corporation, preeminent experts in medium to high volume manufacturing for custom user interface and printed electronics. 2. Understanding PTC 4980 and Its Benefits PTC4980 is a specially engineered carbon-polymer paste formulated for applications requiring self-regulating heating. The paste exhibits a positive temperature coefficient of resistance (PTC), meaning that as temperature increases, the electrical resistance also rises. This property enables a self-limiting effect, preventing overheating and reducing the need for complex control circuitry. 3. Key Features of PTC 4980 Designed for operation in the 65°C - 90°C temperature range Blendable high and low resistance variants for tailored performance and tighter engineering tolerances in manufacturing Provides uniform heating across surfaces Scalable to large-format printing applications Reduces energy consumption due to self-regulating properties By leveraging these characteristics, industries can achieve more reliable, safer, and energy-efficient heating solutions tailored to their specific requirements. 4. Design Principles for PTC Heating Solutions Heraeus Electronics works closely with customers to help them optimize their PTC heater design based on specific requirements. To develop an effective PTC heater, a systematic design approach is followed. The process begins with defining the application’s requirements and then optimizing the PTC formulation and print layout for the best performance. Step 1: Define the Application Before designing a heater, it is crucial to determine: Target temperature: The target temperature required for the application Heating area: The surface area in contact with the heating elements Driving voltage: The operating voltage that will be applied Desired heating power: The power needed to achieve optimal performance Thermal load: The type and amount of material that will absorb heat for an application Step 2: Optimizing PTC Paste and Circuit Design This optimization process includes: a.) Blending High (H) and Low (L) Resistance PTC Pastes: Different heating applications require different resistance characteristics. By blending high and low resistance pastes, designers can fine-tune the heater’s resistance to combat the common problem of carbon conductivity drifts, ensuring precise temperature control. b.) Defining the Conductor Bus Bar and Cell Pattern: The arrangement of the heating elements significantly impacts performance. The design must consider: Width, length, and thickness of conductor bus bars Spacing and width of conductor fingers PTC resistors print thickness Number and arrangement of PTC resistor cells By configuring these parameters, a uniform heating profile can be achieved with minimal unwanted heat accumulation. 5. Case Study: Improving Large-Format PTC Heater Performance Heraeus Electronics collaborated with Boyd Corporation to enhance the design and manufacturing of large-format printed heaters. The initial customer prototype exhibited issues related to conductor bus bar heating, which led to overheating, non-uniform temperature distribution, and performance inconsistencies. 5.1 Initial Challenges Identified When the prototype was tested, thermal imaging indicated hotspots along the conductor bars well above the target temperature. To determine the cause, the PTC cells were first individually investigated. Microscopy and thickness measurements determined that the prints were excellent quality, and the thickness was highly consistent within the cell, from cell-to-cell and from print-to-print. Individual PTC cells were isolated for power testing and performed as expected with consistent regulating profiles. So, everything on an individual component level was working as expected. The root cause was found in the overall design. The conductor bus bars heated above the target temperature before the PTC units reached the target regulating temperature due to a mismatch in overall resistance values between the conductor bars and the PTC resistor cells. 5.2 Optimized Design and Manufacturing Process Through mathematical modeling, testing, and design improvements, the following modifications were made: a.) Model: Calculate the required resistance difference between the conductor trace and the PTC trace to mitigate Joule heating in the conductor bus bars. b.) Increase Bus Bar Width/Thickness: By increasing the conductor cross-sectional volume along the trace, it reduces the overall resistance of the conductor trace. c.) Increase PTC trace resistance: The new design ensured that each sub-unit within the heater had the right dimensions to resistance match the conductor with the given input voltage requirements. d.) The improved prototype demonstrated significant enhancements in performance with: Reduced unwanted heating at the conductor bars More uniform heat distribution Improved efficiency and reliability 5. Case Study: Improving Large-Format PTC Heater Performance 5.3 Key Takeaways and Industry Implications The collaboration between Heraeus Electronics and Boyd Corporation highlights the importance of precision design in PTC heater manufacturing. The key insights from this research include: Heater design plays a crucial role in PTC performance: Proper selection of resistance values, conductor patterns, and material thickness ensures efficiency. Avoiding unwanted bus bar heating: High resistance in unintended areas can lead to undesired heating and performance issues. Optimizing conductor layouts prevents this problem. High-volume manufacturing requires robust material formulations: Heraeus Electronics’ PTC resistor pastes are designed to be compatible with large-scale production, enabling cost-effective and high-quality manufacturing. Customization is key: Different applications require different resistance values and power configurations. Heraeus Electronics and Boyd Corporation offer tailored solutions to meet specific industry needs. 6. Conclusion The development of PTC 4980 self-regulating heater inks represents a significant advancement in printed electronics. By providing a scalable, energy-efficient, and safe heating solution, these materials are unlocking new possibilities across industries. This collaboration between Heraeus Electronics and Boyd Corporation has demonstrated the importance of optimizing material formulations and design parameters to achieve superior performance in largeformat printing. As demand for smart heating solutions continues to grow, innovations in PTC resistor pastes will play a vital role in enabling high-performance, cost-effective, and sustainable heating applications. Heraeus Electronics remains committed to advancing the field through continuous research, material development, and collaboration with industry leaders. About Heraeus Electronics Heraeus Electronics is one of the leading manufacturers of materials for packaging technology in the electronics industry. The operating company develops sophisticated material solutions for the automotive industry, power electronics, and advanced packaging in development centers and production facilities in Asia, the USA, and Europe. As a solution provider, Heraeus Electronics offers its customers a broad product portfolio - from materials and material systems to components and services. For more information and product details please visit heraeus-electronics.com The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application. The Heraeus logo and Heraeus are trademarks or registered trademarks of Heraeus Holding GmbH or its affiliates. All rights reserved. Contact Us: Americas Phone +1 610 825 6050 electronics.americas@heraeus.com Asia Pacific Phone +65 6571 7649 electronics.apac@heraeus.com China Phone +86 53 5815 9601 electronics.china@heraeus.com Europe, Middle East and Africa Phone +49 6181 35 4370 electronics.emea@heraeus.com We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

Authors: Julien Vitiello, Elisa Duquet, Louis Caillard, Achille Guitton, Marc Pascual, Maroua Ben Haddada, Frederic Raynal, Amin M’barki Corresponding author: julien.vitiello@hummink.com Hummink S.A.S, 5 rue Charlot, 75003 Paris, France Keywords: Display repair, additive manufacturing, High Precision Capillary Printing (HPCaP), capillary forces, Atomic Force Microscopy (AFM) Abstract In the field of display repair, particularly for OLED and microLED technologies, there is a growing need for precise and scalable solutions to restore high-resolution defects without compromising performance. While several repair methods exist, they often fall short in resolution, versatility, or ease of integration. High Precision Capillary Printing (HPCaP) overcomes these limitations by leveraging capillary forces and mechanical resonance to deposit inks with micron and sub-micron precision, enabling accurate, reliable, and non-destructive repair of critical display components. 1. Introduction According to MarketsandMarkets the global display market size is expected to reach around USD 174 billion in 2029 growing at a CAGR of 5.1% from 2024 to 2029. The increased demand for displays in various industries especially the IT and healthcare industries, and the increased demand of interactive displays such as wearable devices, AR/VR products in addition to the adoption of flexible displays are the major factors driving this market growth. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 MicroLED production processes for displays face significant challenges, as many screens are rendered defective. These defects often manifest as non-functioning black pixels or pixels displaying incorrect colors, typically caused by faulty LEDs or malfunctioning circuit boards. Despite meticulous manufacturing practices, such errors are nearly inevitable, resulting in rejected displays that hinder productivity, increasing cost and waste. The defects in these displays are increasingly microscopic, often below 5 micrometers, making traditional repair methods insufficient. LED defects can also vary widely, from line breaks and particle contamination to pixel malfunctions, requiring versatile and precise repair solutions. HPCaP (High Precision Capillary Printing) by Hummink is currently the only technology capable of printing at micron and submicron scales and thus repairing micronic defects. We are Speaking! Register to hear my presentation at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 2. High Precision Capillary Printing (HPCaP) HPCaP is a technology strongly inspired by Atomic Force Microscopy (AFM) [1].It uses a macroscopic resonator as a detecting mechanism for contact and printing feedback. The uniqueness of this technology resides in its usage of capillary forces and resonance as the only driving force for printing. A macroresonator oscillating at a resonance frequency of about 1 kHz is attached to a mechanical bridge. The oscillation is generated by a piezodither that excites the macroresonator. The bridge, driven by a piezostage, allows the resonator to move with a 5 nm precision in Z axis. State-of-the- art electronics are used to control the resonance of the macroresonator through 3 different parameters: the resonance phase, amplitude, and frequency. Any shift in these values can be controlled to achieve different printing features, indirectly modifying the print geometry (thickness, line width...). Amplitude can be adjusted between 5 nm and 100 nm, and any frequency shift of 100 mHz or more can be accurately detected. A pipette is attached to the extremity of the macroresonator and oscillates in phase with the latter. Fig. 1 a) Schematic representation of the macroresonator (right) and a close-up on the glass pipette in contact with a substrate. b) Graphical representation of the underlying control loop in HPCaP technology Since the dispensed volume is in the nanoliter range (orders of magnitude lower than the pipette volume), a single pipette can print up to hundreds of kilometers, depending on the dispensing diameter. Fig.1,(a) shows that the first step of the HPCaP printing process is to approach the pipette to the substrate surface. As the macroresonator is oscillating at its proper resonance frequency, a slight change of a few hundreds of mHz can be observed as in figure 1, (b) once a meniscus is formed between the ink inside the pipette and the substrate. This meniscus is stabilized by the macroresonator’s oscillation, and the frequency shift is then locked by the electronic feedback loop. After this initial step, capillary printing can be achieved by moving the substrate in the XY axis. As the frequency shift value must remain constant, the Z-fine bridge will move the resonator in the Z direction to perfectly follow the topography of the substrate. Fig. 2 presents the results of high-precision printing using a pipette with a 1.5 µm diameter. (a) displays a cross-section from a 3D map revealing a printed silver line with a thickness of 100 nm achieved in a single pass. (b) shows a 3D topographic map acquired with a Hitachi TM4000PlusII SEM. (c) is an SEM image of the printed pattern, consisting of three silver lines with a linewidth of 2.5 µm and a gap of 1.5 µm. These lines exhibit a bulk conductivity of 6 µΩ·cm. Thanks to the versatility of the ink formulation, HPCaP enables the printing of virtually any material. Fig.3 shows polymer (Polyvinylpyrrolidone) lines with a linewidth of 430±40 nm and a pitch of 1±0.05 µm. Similar sub-micronic gratings were printed with SU8 to create a distributed feedback laser [2]. Fig. 2 a) Cross-section of the 3D map showing a line of 100 nm thickness by a single printing pass b) 3D map acquired with the SEM (Hitachi TM4000PlusII). c) SEM image of the same lines of 2.5 µm line width and 1.5 µm gap. Fig. 3 SEM image of printed Polyvinylpyrrolidone (PVP) lines (dark horizontal lines) at the sub- micron scale, with a gap of 1 micron (light gray horizontal lines) 3. Results In this section, we showcase the key outcomes and repair capabilities of Hummink’s HPCaP technology in the context of display repair. The HPCaP printhead addresses a critical industry challenge: repairing high-resolution defects that conventional tools cannot handle, ultimately boosting production yield and salvaging previously discarded panels. In fig 4 we highlight a typical process that is used for display repair. As seen in this schematic, HPCaP technology can be used in tandem with laser etching to deposit conductive lines as well as encapsulating polymers. To achieve this, several capabilities must be demonstrated by HPCaP technology: micrometric resolution and precision for defect correction. Substrate versatility and automatic adaptation to substrate topography. Diverse material compatibility. Fig. 4. Display repair process for top and buried conductive lines. Laser etching is initially used to remove defective lines (top and buried). Printing techniques such as HPCaP is used to print new conductive lines and fill cavities with polymer. 3.1. Micrometric Resolution for Defect Correction Achieving micron and even sub-micron resolution is essential for the repair of fine-line defects in MicroLED displays. As shown in figure 2 and 3, HPCaP enables material deposition at nanometric precision, allowing seamless restoration of damaged conductive paths or pixels without degrading the display’s visual or electrical performance. This ultra-fine control ensures that repaired traces maintain the original geometry and conductivity, which is crucial for optical consistency across the screen. 3.2. Substrate versatility and automatic adaptation to substrate topography Substrates to be repaired are typically already patterned and can be a combination of different materials with topology variation. An advantage of HPCaP is that printing can be done on any substrate following its topography completely automatically. HPCaP has successfully printed on surfaces with topographies, fig.5 shows a silver trace of line width 10 µm printed on wet-etched silicon wafer with a step of 100 µm and a slope angle of 54.7°. To climb the step, the printing speed was decreased from 200 µm/s on flat wafers to 25 µm/s on the slope part. HPCaP functions like an AFM, enabling automatic printing on diverse topographies without the need for additional commands in the g-code. Advanced electronics in the printing process continuously gather feedback from the substrate, adjusting the pipette's z-axis movement to match its topography and facilitate precise printing accordingly. Fig. 5. On the right is a SEM image of a silver trace printed on a wet- etched silicon wafer with a step of 100 µm and a slope of 54.7° angle as illustrated on the left of the figure 3.3. Diverse material compatibility Being able to print different inks on the same substrate is crucial for display repair. This versatility can be leveraged to be able to deposit conductive lines as well as encapsulating polymers with the same technology. The strength of capillary forces allows HPCaP to print inks with viscosity ranging between 0 to 100,000 cP. With minimal adjustments in rheological, capillary, and colloidal properties, any ink can be printed. In fig.6, we demonstrate the ability to print conductive silver lines of 2 µm linewidth and 2 µm pitch on a silicon wafer and coat these traces with a polymer (PVP). Such encapsulation is often required to prevent electrical shorts and oxidation of the metallic traces. The same ink can also be used to fill cavities and can be printed on with conductive ink after reticulation. Fig. 6. SEM image showing conductive line encapsulated using a polymer SU8. Both materials were deposited using HPCaP technology. 3.4. Display repair HPCaP has successfully printed conductive lines on multimaterial patterned substrates to repair defective conductive lines. No damage has been observed on underlying TFT devices 4. Conclusion As MicroLED technology advances, defects in displays are becoming smaller and more diverse, increasing the need for precise, scalable, and reliable repair solutions. HPCaP’s innovative printing technology offers a transformative approach to repairing LED displays, ensuring minimal waste and optimal production efficiency. Hummink is also currently working to expand this sustainable strategy to other industries, such as semiconductor packaging. 5. References [1] Canale, L., Laborieux, A., Mogane, A. A., Jubin, L., Comtet, J., Lainé, A., Bocquet,L., Siria, A., & Niguès, A. (2018).Micromegascope.Nanotechnology, 29(35),355501. https://doi.org/ 10.1088/1361-6528/aacbad [2] Pascual, M., Bigan, N., M’Barki, A., Mental, R.,Allegro, I., & Lemmer, U. (2023). All-printed SU8- perovskite DFB Laser. Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI. https://doi.org/10.1117/12.2661336 What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?

A decimal counter is a digital circuit that cycles through zero to nine using logic components. It is essential in clocks and timers. Making a decimal counter using seven-segment displays offers great opportunities for students to learn sequential logic, clock signals, and circuit integration. Materials used Voltera V-One PCB printer Voltera disposable nozzles Linear voltage regulator Switching voltage regulator NE555DR timer Variable resistor  Seven-segment displays   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Purpose The goal of this project was to demonstrate PCB development through key concepts:  Linear and switching regulators Variable resistors Seven-segment displays Prototyping techniques Conductive trace printing Component placement Solder reflow Project overview Design The original PCB layouts were provided by ITIZ , Voltera’s authorized reseller in Korea. We modified the design to create an integrated circuit system, which was comprised of three interconnected PCBs: Voltage regulator board Pulse generator board Decimal counter board ITIZ design of the boards Desired outcome When connected to a 7V–12V DC source, the system should function as follows:  The voltage regulator board converts the input to a steady 5V output. The pulse generator board uses this 5V supply to create adjustable pulse signals. The decimal counter board drives two seven-segment displays to count from 00 to 99 at a speed controlled by the pulse generator. Functionality When powered by a 9V battery, the circuit successfully counted from 0 to 99 at an adjustable speed. A reset button allowed restarting the sequence, and the integration of both a linear regulator (78M05) and switching regulator (LM2575) on the same board provided a practical way to compare their efficiency, thermal behavior, and noise generation. Printing the boards on V-One Voltage regulator board This board converts a 9V input into a steady 5V output. It includes the following components: Table 1 Voltage regulator board design Voltage regulators  maintain a stable output voltage regardless of fluctuations in input voltage or load conditions. They play a critical role in circuit stability by preventing voltage spikes or drops that could damage components. In this circuit, we included two different types of regulators for ease of comparison.  The 78M05 linear regulator (U1) dissipates excess energy as heat, providing a stable 5V output at lower efficiency. In contrast, the LM2575 switching regulator (U2) achieves higher efficiency by rapidly switching an internal transistor to store energy in an inductor (L1) and capacitor (C6), though this can introduce noise into the circuit due to rapid switching.  Table 2 V-One print settings for all three boards V-One probing the voltage regulator board Pulse generator board This board uses a 555 timer IC (NE555) to generate adjustable pulse signals that drive the decimal counter board. It includes the following components: Table 3 Pulse generator board design The NE555 timer  (U1) is a versatile and widely-used integrated circuit (IC) that can generate stable time delays or oscillations, depending on the external components configured around it. On this board, it operates in astable mode  to generate continuous pulse signals. The variable resistor (R3) functions as a potentiometer  in this circuit, altering the charging and discharging time of capacitor C1. This adjusts the pulse frequency, which controls the counting speed of the seven-segment displays on the decimal counter board. The green LED (D1) blinks in sync with the output pulses. Table 4 V-One dispensing silver ink on pulse generator board Decimal counter board This board drives two seven-segment displays to count from 00 to 99, with adjustable speed (by the pulse generator board) and a reset function. It includes the following components: Table 5 Decimal counter board design A seven-segment display  consists of seven individual LEDs arranged to form the shape of the number 8. By turning specific segments on or off, the display can represent any numeral between 0 and 9.  In this circuit, the 74LS93 counters (U1, U2) process incoming pulses into binary-coded decimal  (BCD) outputs. The 74LS47 decoders (U3, U4) convert BCD signals into segment activation patterns for the seven-segment displays (FND1, FND2). A manual reset button (SW1) allows restarting the count. Table 6 V-One dispensing silver ink on decimal counter board Post-processing Populating and reflow After all three circuits were cured, we dispensed solder paste using V-One and carefully populated the components using a pair of tweezers. The solder paste was then reflowed on V-One’s heated bed. Table 7 V-One dispense settings for solder paste V-One dispensing solder paste on decimal counter board Connecting the boards The three boards were linked using JST-SM connectors and wires. We connected the voltage regulator board to a battery and the pulse generator. We then connected the pulse generator outputs to the decimal counter’s clock input pins. The connected boards Printing enclosures To protect the circuits from any impact during handling, we designed and 3D printed three enclosures using PLA filament. 3D printed enclosures for the boards Challenges and advice  Troubleshooting interconnected circuits Errors in interconnected systems could originate from any board, which made troubleshooting a bit more complex than a single board. To streamline the process, we recommend checking component polarity and orientation before populating the components, and reference their datasheets when necessary. Additionally, it’s helpful to check for continuity with a multimeter, or with an oscilloscope to calculate and view the frequency of the pulses. Conclusion This project highlights the potential of additive PCB prototyping in electronics education. By combining theory and practice, students can explore how digital counting systems function, understand the role of BCD-to-seven-segment conversion, and observe how timing signals interact with display components. Direct ink writing platforms like V-One empower the next generation of engineers to innovate beyond breadboards and rapidly iterate on electronics designs.  If you are interested in exploring other PCB prototyping projects we have completed, take a look at: Printing a Control Board for a Line Following Robot with Silver Ink on FR1 Printing a Flexible PCB with Silver Ink on PET Dispensing Solder Paste on Factory Fabricated PCBs Want to be notified when we post new white papers? Sign up for our newsletter . We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

In the fast-paced world of advanced manufacturing, precision, speed, and reliability are non-negotiable. Enter the Intlvac Icarus Indium Solder Bump Deposition System—a game-changing solution designed to meet the rigorous demands of high-volume production. With over 30 years of expertise in system manufacturing and coating services, Intlvac has engineered a system that delivers exceptional performance, minimal maintenance, and rapid turnaround times. A solder bump is a small, raised deposit of indium solder that is typically applied to the surface of a microelectronic device. Solder bumps are commonly used in semiconductor packaging and flip-chip bonding processes, microprocessors, integrated circuits, and other electronic components. They provide an efficient and reliable method for connecting chips to substrates, allowing for high-performance and compact devices. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025   Why Indium Bumps? Indium bumps are essential for advanced applications due to their unique properties. They enable higher packing density and increased device speeds, making them ideal for flip-chip bonding in pixel readout applications. Additionally, indium offers strong mechanical properties and superconductivity at temperatures below 3.4K, ensuring reliable performance in demanding environments. Its role as an under-bump diffusion barrier further enhances device performance by preventing material intermixing and maintaining structural integrity. More than 10 years of research have advanced our technology, allowing us to produce higher-quality bumps High-Throughput Production with Unmatched Precision The Icarus system is optimized for efficiency, completing 200 mm diameter wafers in under 90 minutes. Its proprietary technology ensures precise control over film thickness, supporting bump heights ranging from 1 to 40 microns. This makes it ideal for applications in microelectronics, microLEDs, flip-chip bonding, and optoelectronics—industries where precision is paramount. The system’s capacity for hundreds of depositions without opening the main chamber significantly reduces downtime. When indium refills are required, the process is streamlined, taking only minutes to exchange the empty crucible with a pre-charged one. Intlvac Technology. Icarus is suitable for both square and round bump arrays, exhibiting consistent fill with exceptional uniformity. Tackling Dendritic Growth for Superior Performance One of the standout features of the Icarus system is its ability to suppress dendritic growth, a common challenge in indium deposition. Dendritic growth, characterized by uneven spikes that compromise mechanical and electrical performance, is effectively controlled through elevated deposition rates and low deposition temperatures. The result? High-quality indium films with: Spit-free deposition up to 70 Å/s <5% uniformity variation across 200 mm wafers Advanced thermal bonding for precise temperature control (+60°C to -75°C) Superior lift-off yields and consistent bump arrays Competitors' outdated technology struggled to suppress dendritic growth, leading to poor bump uniformity and compromised mechanical and electrical performance. The Intlvac Icarus system effectively addresses and eliminates these challenges. Optimized for Uniformity and Fill Achieving uniform coating and optimal hole filling is no small feat, but the Icarus system excels here too. By aligning deposition flux perpendicularly to the substrate, it prevents hole closure and ensures consistent results across both square and round bump arrays. This precision allows for up to 200 depositions of 2μm films without requiring access to the main chamber. Deposition uniformity of ±5% over 200mm wafer without substrate rotation Ultra-High Purity Indium for Next-Level Applications Intlvac takes purity seriously. Starting with 5N (99.999%) grade indium, the company performs additional purification steps under vacuum to eliminate residual impurities. The result is an oxide-free, ultra-pure indium film that meets the stringent demands of industries like quantum computing, optoelectronics, and microelectronics. Indium’s unique properties, such as its low melting point (156.6°C), high thermal conductivity, and compatibility with complex crystal structures, make it an ideal material for forming reliable electrical contacts in semiconductor devices. Its ductility and thermal stability further enhance its suitability for applications requiring efficient heat dissipation and low processing temperatures. Comparison of low-rate (left) and high-rate (right) indium deposition. Advanced Features for Seamless Operation The Icarus system is packed with features that enhance its performance and usability: Automatic Load-Lock:  Transfers and pre-conditions wafers up to 200 mm, removing contaminants and water vapor without physical etching. Cryogenic Temperature Control:  Films are grown at temperatures as low as -90°C, enhancing shear strength and adhesion while preventing lateral atom migration. Dry Substrate Bonding:  A Drichuck pad ensures efficient heat transfer and substrate cooling, maintaining optimal wafer temperatures for superior deposition quality. Physical Vapor Deposition (PVD ): Compared to electroplating, PVD offers superior adhesion, uniformity, and density, with precise control over coating thickness and minimal environmental impact on film properties.     Redefining High-Volume Bump Fabrication With its combination of ultra-high-purity indium, precise thermal control, and industry-leading uniformity, the Icarus system sets a new standard in high-volume bump fabrication. Whether you're manufacturing  microLEDs , optoelectronics , or quantum devices , this system delivers consistent, repeatable performance with minimal maintenance and rapid turnaround times. In a world where production schedules are tighter than ever, the Intlvac Icarus Indium Solder Bump Deposition System empowers manufacturers to stay ahead—without compromising on quality or reliability. What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?

Perovskite Connect conference and exhibition | 22 & 23 OCT 2025, ECC, Berlin | Co-located with the Future of Electronics RESHAPED Berlin 2025 Perovskite Connect 2025   is shaping up to be the must-attend event for the perovskite industry , bringing together leading innovators, researchers, and manufacturers from across the globe. Taking place on 22–23 October 2025  at the ECC in Berlin , this specialist conference will run alongside the flagship   Future of Electronics RESHAPED  show. This article highlights some of the key talks that will take place during this conference.  Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Oxford PV – Edward Crossland  presents the world’s first commercial perovskite-silicon tandem module . Breaking silicon’s efficiency limits, tandem technology delivers higher performance with minimal changes to existing production lines. The talk highlights Oxford PV’s milestone 2024 shipment, recent advances, and solutions for durability, scalability, and environmental compliance, demonstrating readiness for large-scale deployment. Hangzhou Microquanta Semiconductor – Yang Chen  discusses the commercial readiness of perovskite PV . Drawing on lessons from industrial validation and field deployment, the talk addresses solutions to challenges in stability, efficiency, and scalable manufacturing. Insights into certification and real-world testing show how perovskite PV is evolving into a commercially viable alternative to silicon. Swift Solar – Maximilian Hoerantner  presents advancing perovskite-silicon tandem PV from lab to fab . The talk focuses on achieving high efficiency and stability while scaling manufacturing processes to wafer level. Topics include device stack optimization, reliability testing under light and thermal stress, and development of high-throughput production methods to make tandem PV commercially viable. Solar and Renewable Industry Leader – Gunter Erfurt  explores the future of European and U.S. solar manufacturing . With global competition challenged by Chinese overcapacity, the talk emphasizes the importance of industrial policy, mass production capability, and innovation-driven ecosystems to secure resilient, competitive solar industries in Europe and the U.S. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates University of Rome Tor Vergata – Luigi Vesce  presents scalable, ambient-air processing of printed perovskite PV modules . Using blade, slot-die, and screen printing for all functional layers, the process integrates low-temperature carbon electrodes and interfacial passivation to boost stability and efficiency. Modules achieve T₈₀ lifetimes >1000 h at MPP under ambient-air fabrication, demonstrating a sustainable, fully printed pathway to industrial perovskite photovoltaics. CubicPV – Adam Lorenz  presents durable perovskite-silicon tandems with scalable architecture and manufacturing . Cubic’s decoupled tandem design maximizes performance, durability, and cost efficiency with simplified manufacturing. Accelerated aging tests—including light + heat at up to 105 °C—validate stability and field readiness. Recent results include NREL-certified ~22% perovskite top cells and tandem efficiencies approaching 30%. Solaires Entreprises – Sahar Sam  discusses scaling perovskite PV modules from lab to fab . Drawing on pilot-scale slot-die and blade coating efforts, the talk addresses coating optimization, interface challenges, and process integration for large-area modules. Lessons from pre-commercial validation highlight technical barriers and the collaborative strategies needed to achieve reliable, scalable manufacturing. Institut Photovoltaïque d’Île-de-France (IPVF) – Nicolas VANDAMME  presents the IPVF pilot line for perovskite solar cells and modules . Opening in 2025, this Paris-Saclay facility provides lab-to-fab manufacturing, testing, and qualification of perovskite devices across substrates, encapsulants, and precursors. Supported by leading industrial and academic partners, the platform accelerates development and industrialization of next-generation PV technologies Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Sofab Inks – Blake Martin  presents novel materials for scalable perovskite solar panel production . The talk explores soluble-process materials that balance high performance with manufacturability, addressing key bottlenecks in scaling perovskite PV from lab to industrial production. Karlsruhe Institute of Technology – Norbert Willenbacher  discusses low-temperature metallization and interconnection materials for perovskite cells with reduced silver use . Leveraging the capillary suspension concept, printable pastes achieve high conductivity with low filler content. Concepts such as TECC wires and thermoplastic busbars demonstrate resource-efficient, low-temperature interconnection methods to support sustainable PV manufacturing. Nano-C – Henning Richter  presents innovative interface materials for perovskite photovoltaics . Building on fullerene chemistry, Nano-C has developed new electron-transporting materials with functional groups for passivation, adhesion, and stability. These tailored molecules optimize band alignment, prevent delamination, and are being scaled for industrial deployment in both single-junction and tandem perovskite devices. DELO Industrial Adhesives – Sebastian Stasch  presents advanced adhesives for protecting perovskite solar cells . High-barrier encapsulants form durable, flexible seals against moisture, extending lifetime and efficiency. Leveraging experience from organic PV, DELO introduces new adhesive solutions engineered to meet the unique stability and performance challenges of perovskite technology. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Halocell Energy – Tom Fontaine  presents roll-to-roll flexible perovskite solar modules . A scalable printing process delivers lightweight, high power density modules optimized for low-light and IoT applications. The talk addresses key challenges in large-scale deposition and material efficiency for long-lifetime flexible PV. TNO | Solliance – Anuja Vijayan  discusses roll-to-roll slot-die coating for scalable, stable perovskite PV . Using green solvents and ambient processing, R2R-coated polymer substrates achieved PCEs up to 13%, with metal foil devices exceeding 15% and stability beyond 3000 h at 85–100 °C. The work demonstrates strong reproducibility and modular fabrication potential for large-scale production. Heliatek – Martin Hermenau  presents commercial lightweight flexible PV modules . Heliatek introduces the first IEC 61215-certified OPV module and outlines integration of perovskite stacks into existing R2R pilot lines. The talk highlights lessons from vacuum multilayer deposition and encapsulation technologies for scaling flexible perovskite PV. OET Energy Technologies / Coatema  present scaling printed photovoltaics from 3rd-gen innovation to Giga Fab industrialization . The Flex2Energy initiative establishes the first Giga Fab for automated OPV/PPV production, integrating R2R printing, in-line metrology, AI-driven analytics, and Industry 4.0 frameworks. Applications include building-, vehicle-, and agriculture-integrated PVs, positioning printed photovoltaics at the forefront of the clean energy transition. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Caelux Corporation – Scott Graybeal  presents high-density solar to meet future energy needs . With U.S. power demand surging from AI and electrification, Caelux highlights how higher energy density modules improve project economics by reducing land use, installation costs, and exposure to interest rate volatility. These advanced modules can retrofit legacy systems or integrate with next-gen technologies to deliver more cost-effective solar power. CEA – Noella Lemaitre  presents challenges for upscaling perovskite/silicon tandem solar cells . While small-area 2T tandems have reached record efficiencies of 34.9%, scaling to industrially relevant sizes requires advances in interface layers, perovskite deposition on textured silicon, low-temperature screen printing, and long-term stability of encapsulated devices. The talk highlights pathways from lab-scale PCE >30% devices toward manufacturable, durable tandem modules. Panacol – Lena Reinke  discusses advanced bonding technologies for flexible electronics . Specialized adhesives provide robust encapsulation against moisture, oxygen, and stress while conductive formulations replace soldering, ensuring reliable electrical interconnections. These adhesive solutions enhance durability and performance in flexible devices such as photovoltaics, batteries, and sensors. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates AeroSolar – Joe Briscoe  presents aerosol treatment for scalable perovskite solar cells . Using a solvent- or additive-based aerosol CVD process, post-deposition recrystallization improves nanoscale and macroscale film uniformity, reducing defects and trap states. The method enhances efficiency, stability, and manufacturing yield, offering a scalable route to large-area, commercially viable perovskite modules. SparkNano  - Alexander Bouman presents spatial ALD for scalable perovskite solar manufacturing . By decoupling precursor exposures, roll-to-roll s-ALD achieves deposition rates >100× faster than conventional ALD, with web speeds up to 80 m/min and widths of 1.5 m at 50–150 °C. The talk highlights scalable SnO₂ electron transport layer deposition and how the Omega system delivers throughput, uniformity, and substrate compatibility essential for gigawatt-scale PSC production. SALD B.V. – Hindrik de Vries  presents a paradigm shift in roll-to-roll spatial ALD for perovskite solar cells . A novel R2R s-ALD tool achieves web speeds 100× faster than conventional ALD while maintaining atomic-scale thickness control and conformality. Demonstrated applications include passivation, charge transport, and high-performance barrier layers, enabling scalable, high-quality thin films for perovskite photovoltaics. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates SOLRA-PV – Yousef Farraj  presents industrialization of perovskite-based indoor photovoltaics . Optimized device stacks for artificial light, combined with scalable printing and advanced encapsulation, deliver efficient, stable modules tailored for IoT and consumer electronics. These indoor PV panels enable battery-free operation, advancing sustainable electronics and reducing e-waste. P3C Technology and Solutions Pvt – Sooraj Kumar  presents scaling perovskite solar module technology in India . Through parallel platforms—rigid MySUN Glass  and flexible MySUN Flexible —P3C is advancing from lab-scale results to real-world field deployments across EVs, railways, and aerospace. The talk covers performance benchmarks, environmental stability, encapsulation strategies, and a commercialization roadmap for mass production and market adoption in India’s growing PV ecosystem. Perovskia Solar – Anand Verma  presents digitally printed perovskite PV for IoT and consumer electronics . Custom-designed cells operate efficiently under indoor and outdoor light, enabling battery-free or battery-extended smart devices such as sensors, wearables, and electronic shelf labels. With Swiss-based industrial production scaling to one million units annually, Perovskia highlights its scalable processes and integration-ready solutions. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Perovskite Connect talks are a part of the  full conference agenda

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Material, Ink and Paste Innovations. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Heraeus Electronics – Ryan Banfield  presents bridging additive and subtractive technologies through solderable polymer thick films. The talk highlights advances in polymer thick-film conductors that overcome long-standing barriers of poor solderability and thermal stability. This breakthrough enables flexible, low-cost circuits while reducing reliance on environmentally intensive subtractive manufacturing processes. Blackleaf – Michael Friess  presents graphene-based electric heating inks for next-generation surface heating. Using sustainable graphene production and tailored formulations, Lackleaf develops flexible heating foils and coatings that enable efficient, uniform thermal control across diverse industrial surfaces. ELANTAS Europe - Berit Schuster  presents printed electronics paste technologies for automotive applications. The talk highlights formulation strategies for functional pastes used in in-mold touch interfaces, sensors, and heating elements. Key requirements such as electrical performance, adhesion, flexibility, and thermal stability are addressed, emphasizing application-specific customization to ensure reliable, durable integration in future mobility solutions. Henkel – Thibaut Soulestin  presents high-performance inks for cost-efficient printed electronics. The talk highlights conductive silver and silver-coated copper inks for large-area antennas, ink systems compatible with conductive adhesives for hybrid integration, and pad-printed inks enabling direct functionality on 3D surfaces—reducing complexity and manufacturing cost. Explore the Full Agenda and Register before 12 September 2025 for the best rates Sofab Inks – Blake Martin  presents novel materials for scalable perovskite solar panels. The talk addresses material innovations enabling high efficiency and manufacturability in large-scale production. Focus is placed on soluble processes and next-generation formulations that balance performance with cost-effective scalability for perovskite photovoltaics. Karlsruhe Institute of Technology – Norbert Willenbacher  presents low-temperature metallization and interconnection materials for perovskite solar cells with reduced silver use. Leveraging the capillary suspension concept, printable pastes achieve high conductivity at low filler content, while thermoplastic busbars and TECC wire concepts enable efficient copper-based interconnection under gentle processing. These innovations support scalable, resource-efficient PV manufacturing with lower CO₂ impact. Nano-C – Henning Richter  presents innovative interface materials for perovskite photovoltaics. Building on decades of fullerene expertise, Nano-C develops functionalized C60/C70 derivatives that stabilize perovskite phases, enhance adhesion to metal oxides, and enable optimized band alignment. The talk highlights passivation strategies, improved device stability, and scalable manufacturing of next-generation electron transport materials to accelerate commercial deployment. DELO Industrial Adhesives – Sebastian Stasch  presents advanced encapsulants for perovskite solar cells. High-barrier adhesives are engineered to protect against moisture, improving durability, stability, and efficiency. Building on expertise in organic photovoltaics, DELO introduces new formulations tailored to the unique requirements of perovskites, enabling longer lifetimes and enhanced performance. P anacol – Lena Reinke  presents advanced bonding technologies for flexible substrates and devices. The talk covers encapsulation adhesives that protect against moisture, oxygen, and stress, and electrically conductive adhesives that replace soldering for lightweight, flexible interconnections. These solutions enhance performance, durability, and reliability in photovoltaics, batteries, and sensors. Explore the Full Agenda and Register before 12 September 2025 for the best rates RISE – Lars Herlogsson presents screen-printed stretchable electronics with liquid metals. The talk highlights advances in gallium-based liquid metal inks and water-spray sintering methods enabling multilayer, fully screen-printed stretchable circuits. Applications span wearable, biomedical, and soft robotic devices, with emphasis on scalable, large-area manufacturing. University of Coimbra – Mahmoud Tavakoli  presents scalable, h igh-resolution liquid metal circuits for 3R electronics (Resilient, Repairable, Recyclable ). The talk introduces gallium-based liquid metal composites as candidates for soft, sustainable electronics, addressing challenges in precision deposition, multilayer circuit integration, and chip interfacing. Additive manufacturing, screen printing, and laser patterning approaches are discussed, with applications ranging from flexible PCBs to emerging 3R batteries and optoelectronic devices. University of Manchester – Katy Ainsworth  presents graphene and 2D material inks for printed and flexible electronics. The talk highlights conductive, optical, and multifunctional applications enabled by graphene and related materials, supported by pilot-scale printing capabilities. Examples include sensors, flexible devices, and energy-efficient heating elements, demonstrating pathways from lab innovation to scalable industrial adoption. CondAlign – Morten Lindberget  presents n ovel anisotropic conductive films f rom launch to volume production. Based on particle alignment technology, these films enable reduced filler content, lower costs, improved performance, and smaller carbon footprint compared to conventional ACF and TIM products. The talk addresses the path from qualification and sustainability validation to industrial-scale processes and commercial adoption. Explore the Full Agenda and Register before 12 September 2025 for the best rates Canatu – Jussi Rahomäki  presents CNT-based transparent film heaters for ADAS cameras. These wire-free heaters deliver fast, uniform de-icing and de-fogging with high transmittance and ultra-low haze, ensuring clear vision in harsh weather. Seamlessly integrated into laminated windshields, the technology enables reliable ADAS performance for next-generation autonomous vehicles. Panasonic – Takatoshi Abe  presents Toughtelon, a multifunctional shock-absorbent film material for advanced display applications. This multilayer composite achieves significant thickness reduction while offering self-healing, high flexural durability, and wide-temperature resilience. Demonstrating ~165% greater impact resistance than conventional materials, Toughtelon is customizable for flexible, slim, and mechanically robust device components. INKTIO - Jaime Benavides  presents digital manufacturing of flexible photocatalytic electronics . Using inkjet deposition and digital thermal processing, TiO₂-based electrodes with a platinum cocatalyst are fabricated directly on PET substrates, achieving 98% pollutant degradation under solar illumination. The fully scalable, roll-to-roll compatible process enables on-demand production of photocatalytic devices for self-cleaning, air purification, and water treatment, while reducing cost and material waste. Explore the Full Agenda and Register before 12 September 2025 for the best rates

The flagship Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Additive, Hybrid and 3D Electronics. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Register before 12 Sept 2025 for the best rates Lockheed Martin (USA)– Paul Gaylo  explores the transition of flexible hybrid electronics (FHE) from lab to field applications . Case studies on copper printing and flexible RF circuits illustrate how FHE can deliver SWaP-C advantages in defense systems while meeting reliability demands. The talk emphasizes concurrent engineering and early integration of design with advanced manufacturing to overcome barriers to FHE adoption. Fuji Corporation (Japan) – Ryojiro Tominaga  demonstrates additively manufactured multilayer circuits with embedded components . By combining silver nano-ink inkjet printing, UV-curable resin molding, and ultra-low temperature surface mount, they fabricate stacked, three-dimensional devices. This approach enables new device geometries and points toward a paradigm shift in electronics manufacturing. National Research Council Canada (Canada) – Chantal Paquet  introduces Volumetric Additive Manufacturing (VAM)  for 3D electronics. Using tomographic projection, VAM prints entire objects in seconds and enables “overprinting” of functional polymers onto existing structures. Subsequent metallization produces high-resolution 3D conductors. The talk will cover resin development, printing challenges, and the technology path toward scalable 3D electronic fabrication. Explore full Agenda and   Register  before 12 Sept 2025 for the best rates Fraunhofer ENAS (Germany) – Franz Selbmann  showcases ultra-thin Parylene-based PCBs with thicknesses down to 20 µm. Combining Parylene as substrate, dielectric, and encapsulant, these flexible boards integrate redistribution layers, vias, and multiple metal stacks via microsystem and printing techniques. Demonstrated with gold, copper, and aluminum, the resulting PCBs deliver excellent electrical performance under bending and enable direct integration of sensors and components for IoT and wearable electronics. Essemtec (Switzerland)– Irving Rodriguez  explores jetting and SMT mounting technologies  for flexible and stretchable electronics. Advanced all-in-one platforms combine multi-valve jetting of conductive inks, adhesives, and liquid metals with adaptive pick-and-place. Features such as laser height mapping and real-time process control support precision assembly on soft substrates, opening scalable routes to wearable, medical, and soft robotics electronics. TracXon (Netherlands)– Ashok Sridhar  presents a patented high-speed roll-to-roll process for vertical interconnects (VIAs) , a key bottleneck in printed electronics. The new VIA filling system, compatible with both R2R and S2S lines, enables true double-sided and high-density circuitry. By eliminating costly multilayer isolation stacks, this breakthrough moves printed electronics closer to PCB-level complexity and scalable volume manufacturing. VTT (Finland) – Antti Kemppainen  discusses prototyping and process development of flexible hybrid multilayer systems  for medical electronics. The talk covers multilayer sensor designs, dense integration, and elastic/wearable devices, addressing the need for both performance and manufacturability. This talk highlights pathways from concept design through prototyping to upscaling for rapid deployment of advanced medical-grade hybrid electronics. AMAREA Technology (Germany) – Robert Johne  introduces ceramic-based printed electronics via multi-material additive manufacturing . By integrating conductors and resistors directly into ceramic components, AMAREA achieves miniaturized, functional devices without assembly. Applications include embedded electrical circuits in glass-ceramics, metal-ceramic hybrids, and complex multifunctional components. The presentation covers material qualification, process optimization, and practical demonstrations of ceramic-embedded electronics. Lithoz (Austria) – Christoph Hofstetter  highlights additive manufacturing of dielectric ceramics and ceramic-metal systems  using lithography-based ceramic manufacturing (LCM). A dual-vat system enables clean switching between materials, producing dielectric ceramics with permittivity 3–60 and successful co-sintering of ceramics with silver or copper. The results demonstrate LCM’s potential for functional ceramic components with tailored electrical properties, advancing multi-material ceramic electronics. Q5D Technologies (United Kingdom)   - Ben Monteith presents advances in 5-axis laser-assisted selective metallization  for large 3D parts. By combining robotic motion control with laser activation and conductive material deposition, they enable direct integration of wiring and interconnects onto complex geometries. This approach eliminates separate harnesses, reduces weight, and supports high-performance substrates such as polymers, glass, and ceramics—advancing scalable 3D electronic integration. XTPL  presents additive manufacturing for next-generation microelectronics , focusing on micron-scale precision printing with conductive and dielectric nanomaterials. Using silver, copper, and gold pastes, they demonstrate microdispensing for semiconductor packaging, displays, and sensors, enabling miniaturization, flexible design, and cost-efficient production. The talk reviews state-of-the-art methods, highlights yield and repeatability challenges, and outlines practical solutions for scaling microfabrication into industrial production. Printed Electronics Limited (PEL) (United Kingdom)  introduces drop-on-demand deposition of highly viscous functional inks , traditionally confined only to screen printing. Leveraging piezovalve viscous-jet technology, they enable digital deposition of inks far above inkjet viscosity limits (>5,000 cP). Demonstrations include single-pass, high-performance digital printing of heavily loaded conductive materials for next-generation printed electronics. ImageXpert (USA) – Jochen Christiaens  presents a structured methodology for inkjet printhead selection  in advanced printed electronics. The session covers drop volume, nozzle density, waveform tuning, and material compatibility, comparing leading piezoelectric printheads. Case studies highlight performance trade-offs with challenging inks and substrates, giving attendees a practical framework for selecting printheads across R&D and production.

Introducing the program for MicroLED Connect 2025 and AR/VR Connect 202 5 (Conference and Exhibition, 24 &25 Sept 2025, High Tech Campus, Eindhoven, Netherlands) This event is shaping up to be the definitive global forum for microLED and AR/VR display professionals, offering an exceptional program, vibrant exhibition, and unmatched networking opportunities. In this preview, we’ll spotlight several speakers, showcase selected conference themes, and give you a glimpse of what awaits in Berlin. For the complete agenda and event details, click here. Mass Transfer – From Wafer to Display In many icroLED manufacturing platforms, at least one major transfer process is required—often two. Typically, devices move from the epiwafer to an intermediate interposer substrate and later from the interposer to the final display. Executing this step with precision, speed, and cost efficiency remains one of the industry’s most persistent challenges. At MicroLED Connect 2025 , leading innovators will unveil new solutions: Coherent  will present a fully integrated laser-based mass transfer system designed to handle donor wafers and receiver panels—whether they’re backplanes or temporary carriers. Offering exceptional throughput, yield, and flexibility, the system can manage even the tiniest microLED dies. Holst Centre  will introduce a proprietary release stack enabling rapid, selective microcomponent release with adaptive pitch using a cost-effective laser source. Recent results show sub-0.5 μm transfer precision for ultra-thin InP coupons with extreme aspect ratios. Advanced View Technology  (Korea) will share its high-accuracy electrofluidic assembly process for transferring InGaN-based blue nano-LEDs—providing a potential leap beyond OLED and current microLED microdisplay limits. Smartkem  (UK) will update on its Chip-First OTFT backplane  process, where the backplane is built directly onto the LEDs, unlocking a new manufacturing paradigm for microLED displays. MicroLED Growth – GaN, Nanowires, and Nanopyramids From epitaxy breakthroughs to novel nanostructures, new growth techniques are pushing microLED performance to new heights. At MicroLED Connect 2025 , innovators will reveal methods for creating smaller, brighter, and more efficient devices: Hexagem  (Sweden) will showcase a bottom-up InGaN process for producing dislocation-free hexagonal platelets with tunable emission from blue to deep red (>670 nm). This plasma-damage-free approach delivers up to 60% IQE for deep red quantum wells, with red devices maintaining >630 nm wavelengths at drive currents up to 50 A/cm²—ideal for ultra-bright, wide-gamut displays. CEA-Leti  (France) will present progress on monolithic RGB InGaN nanopyramids grown via MOVPE on patterned epitaxial graphene/SiC masks, achieving <1 µm diameters with outstanding optical properties. Veeco  (USA) will show how its MOCVD systems enable the world’s smallest microLED emitters, highlighting recent deposition breakthroughs. Two Photon Research Inc.  (USA) will reveal a kinetic Monte Carlo simulation platform for modeling selective area GaN nano-column growth, offering deep insight for optimizing high-performance microLEDs. Full-Color Strategies – QDs, Native Red, and Tunable Emission Delivering vibrant, full-color microLED displays can follow multiple routes—native RGB, color conversion, or tunable LEDs. MicroLED-Connect will cover all approaches with updates from global leaders: QNA Technology  will present a UV-LED + QD conversion approach, eliminating pixel crosstalk and enabling high efficiency. Panasonic Production Engineering  will detail its precision inkjet printing platform for depositing quantum dots, featuring novel ink circulation, pulsation minimization, and per-nozzle waveform control. Raysolve Optoelectronics  (China) will showcase a wafer-level full-color microdisplay (0.13”, 320×240 resolution, 500,000 nits peak brightness) using QD-based color conversion. Innovation Semiconductors  will introduce a monolithic, single-emitter color-tunable microLED architecture leveraging crystal plane variations and V-groove geometry. Aledia  (France) will update on GaN nanowire NanoLEDs, enabling RGB emission from the same material system by tuning nanowire size. Why You Should Attend These three themes represent only a fraction of the content on offer. The agenda spans display makers, AR developers, materials specialists, equipment suppliers, investors, and more. MicroLED-Connect 2025 is your chance to see the newest display prototypes, gain insider knowledge, and make industry-defining connections. Early-bird pricing is available until 15 August—reserve your place today. The Exhibition – Meet the Entire Supply Chain The MicroLED-Connect exhibition gathers the full ecosystem—equipment vendors, material innovators, panel makers, and solution providers—under one roof. View the floor plan and exhibitor list here.  A limited number of booths remain; contact us if you want to showcase your technology to a highly targeted microLED audience.

The Future of Electronics RESHAPED ECC, Berlin, Germany | 22 & 23 OCT 2025 Join us in Berlin on 22–23 October 2025 for The Future of Electronics RESHAPED — the global home of Additive, Printed, Sustainable, Hybrid, Wearable and 3D Electronics. World-Class Agenda - 100 Onsite Talks From Around the World! The map below highlights where our speakers for The Future of Electronics RESHAPED event are coming from — a testament to the truly global scope of our agenda. World-class experts will showcase the latest innovations and application developments. ­ Register NOW at early bird rate ­Perovskite Connect This year, we are excited to co-locate the first-ever Perovskite Connect event alongside The Future of Electronics RESHAPED conference and exhibition. There will be a combined agenda. Perovskite Connect is the only event worldwide dedicated to the fast-growing perovskite industry. The speaker map below shows just how global this event also is — with world-leading experts and innovators joining us from across the globe. All attendees will have full access to both events Global Exhibition Floor - over 90 exhibitors from around the world An incredible tabletop exhibition featuring 90+ companies . Here you can immerse yourself in the world of Additive, Printed, Sustainable, 3D and Wearable Electronics! Explore NOW ­ ACT NOW: Exhibition Booths Almost Sold Out The exhibition floor is almost sold out with only a few spots available. Contact Tom@TechBlick.com now if you wish to join us! Explore Floorplan NOW

Perovskite Connect 2025 is shaping up to be the must-attend event for the perovskite industry , bringing together leading innovators, researchers, and manufacturers from across the globe. Taking place on 22–23 October 2025  at the ECC in Berlin , this specialist conference will run alongside the flagship Future of Electronics RESHAPED  show. The agenda will spotlight the entire perovskite value chain — from materials and production processes to cutting-edge applications in solar energy and beyond. In addition to its high-level talks, Perovskite Connect will offer an international exhibition and abundant networking opportunities. In this preview, we highlight just a few of the speakers and themes that will define the event. You can view the full program and details here . Next-Generation Perovskite Solar Developers In an earlier feature , we introduced several perovskite PV pioneers — including Microquanta, Oxford PV, Perovskia, and Swift Solar. Perovskite Connect 2025 will welcome many more  notable solar technology companies: Halocell Energy  will unveil its fully scalable roll-to-roll printing process for producing lightweight, flexible perovskite solar modules. These modules are optimised for low-light conditions and extended lifetimes, making them ideal for IoT devices requiring long-term autonomous operation. Beyond Silicon  (USA) will focus on its solution-processing method for manufacturing bifacial perovskite/silicon tandem panels, offering potential cost and performance breakthroughs. PV-ART  (India) will share details of its 2-terminal monolithic silicon/CdTe-perovskite tandem cell, which has achieved an impressive 29.8% conversion efficiency. Caelux  (USA) will address economic and logistical bottlenecks in conventional solar, showing how high energy density designs can improve efficiency, reduce land use, and lower costs. Transformative Process Innovations One of the great advantages of perovskite technology is the potential for cost-effective, scalable manufacturing . At Perovskite Connect 2025, several speakers will present disruptive approaches to production: SALD  will demonstrate how its Spatial Atomic Layer Deposition (s-ALD) platform enables high-speed, roll-to-roll compatible deposition of functional layers in perovskite solar cells, from passivation to advanced moisture barriers. SPARKNANO  will outline its advancements in s-ALD technology, engineered specifically for large-scale perovskite panel production. Aerosol  (UK) will introduce its aerosol-assisted solvent treatment process, which significantly boosts device performance. Prof. Luigi Vesce  (University of Rome Tor Vergata) will showcase a fully printed manufacturing method for perovskite modules, using scalable techniques like blade coating, slot-die coating, and screen printing. The approach supports a variety of architectures — including HTL-free — and promises both technical and commercial viability for next-generation PV solutions. Co-Located with Future of Electronics RESHAPED Perovskite Connect will be hosted alongside The Future of Electronics RESHAPED , a major printed electronics conference featuring a broad spectrum of materials, process, and technology developments. Attendees will have full access to both events, enabling cross-industry learning and networking. With limited capacity and high demand, Perovskite Connect 2025 is the perfect opportunity to meet the innovators shaping the future of solar. Register today   and be part of the perovskite industry’s most influential gathering.

In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge. LIFT: R2R Digital Printing of High Viscosity Materials | Coatema How does Gravure Printing work in Printed Electronics? | Komori How to print micro bumps in a single step for semiconductor electronic packaging? | Hummink Can copper paste be used in Si TOPCon solar cell metal lisation to reduce silver consumption per cell and per watt ? | ISC Konstanz and Copprint How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? | Kateeva Can we inkjet print screen printable and high viscosity pastes? | Quantica Laser-based additive electronics to simplify the RDL metallization process | Akoneer Time To Explore The World of Additive, Sustainable, Hybrid and 3D Electronics! Join the Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects. Explore & RESHAPE The Future of Electronics  NOW R2R Digital Printing of High Viscosity Materials? This is where inkjet struggled due to requirement for low viscosity inks and also nozzle clogging. LIFT can be a solution enabling R2R digital printing of materials with a range of viscosity levels, finally addressing a key industry limitation? Here in this short video Thomas Kolbusch from Coatema explains how R2R LIFT process works. This is a great explanation so we recommend watching it Video length: 1.5 min How does Gravure Printing work in Printed Electronics? Ever wondered how gravure printing actually works - especially in printed electronics? Hear Doug Schardt from Komori Corporation give a concise 2-min explanation of this wonderful process able to achieve very fine feature with all manners of inks, resists, etc at great scale and throughput. Video length: 2min How to print micro bumps in a single step for semiconductor electronic packaging? High Precision Capillary Printing (HPCaP) developed by Hummink enables the ability to print in a single step micro-bumps with ability to control diameter and aspect ratio. This capability enables amazing applications in semiconducting packaging. In particular, in laboratory and prototyping settings, this can accelerate the development process despite the actual printing step being relatively slow, since it eliminates many process steps. Video length: 1.2min Can copper paste be used in Si TOPCon solar cell metallisation to reduce silver consumption per cell and per watt? If silver consumption per solar wafer remains unchanged, silver shortages will limit the growth of the photovoltaic industry. It is thus vital to switch away from silver or reduce silver consumption. But adding printed copper with the right performance and reliability has been difficult to achieve and demonstrate. Here, ISC Konstanz has demonstrated that YES one CAN use indeed Cu paste with excellent performance AND high stability!! Here you can see the results from Ag consumption has been reduced from 126 mg to 60 mg (with additional of 97mg of Cu as bus bars) with same or higher performance. Furthermore, the solar cells are stabe passing • 3x IEC @ TCT (600 cycles) requirements passed without considerable degradation • 2x IEC @ DHT (2000h) requirements passed without considerable degradation • 3x IEC @ DHT (3000h) requirements passed without any degradation by the group with the encapsulation material EVA Video length: 1.2min How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? Inkjet in printed electronics is often a small desktop machine throwing up the question can it ever be scaled up to huge areas. Here you can see see that yes it can. This is an example of area printing but still a great demonstrator. This video by Kateeva shows this beast of a machine and wonderful engineering in action demonstrating the inkjet can be truly scaled in additive and printed electronics Video length: 30s Can we inkjet print screen printable pastes? Inkjet has this major limitation of not being able to print high viscosity or even mid viscosity pastes. This limitation has truly held back inkjet in the world of additive and printed electronics. Quantica has developed a printer head that could enable direct inkjet printing of high viscosity pastes. This could be a game changer provided some challenges are addressed. Learn more here including about some of the challenges such as drying of paste during print at elevated temperature. Video length: 1.3min Can mask-less Additive Electronics simplify the RDL metallization process (both via and conductor layers) reducing number of process steps from ca. 11 down to 2-4 without any masks? This would be a superb achievement? Tadas Kildušis explains how SSAIL (Selective Surface Activation Induced by Laser) process (PI coat, laser pattern, activate, plate) can achieve this

In this newsletter we cover the following Shear thinning of jetted solder and glue for assembly  Fully printed double sided MCU on PET substrates? Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications?  Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost? Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting. Perovskite encapsulation for enhanced stability Microdispensing quantum dots for color conversion   How will perovskite panels perform in the 'real world'? We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick, Future of Electronics RESHAPED and Perovskite Connect conferences and exhibitions Join us at TechBlick’s Future of Electronics RESHAPED  conference and exhibitions in Berlin on 22 and 23 OCT 2025. This is the global home of the additive, printed,  3D hybrid and sustainable electronics, bringing the entire value chain together, from innovators to suppliers and end users. This year as a special theme we will also collocate Perovskite Connect alongside the same show Explore program here now: The Future of Electronics RESHAPED Shear thinning of jetted solder and glue for assembly  Shear thinning is one of the most important physical phenomena in jetting - or in fact in all of printed electronics! This is the physical mechanism on which much of the printed electronics industry relies! Here   Irving Rodriguez  from   Essemtec   explains this behaviour for jetting of solder as well as structural glue, showing how the shear rate increase in the jetting head leads to a drop a significant drop in viscosity Eric Wolf Cancalon Pierre-Jean (PJ) Mirko Cygon Fully printed double sided MCU on PET substrates? Lina Kadura  from   CEA-Liten  presented at   TechBlick  Innovation Day in April 2025, showing a full printed double sided MCU PCB with 4 metal layers and 100+ through vias, accommodating over 40 SMT (400um MCU pitch).  This is an incredible achievement showing that printed PCBs can lead to complex mullti-layer fully functional electronic PCBs for complex systems, showing that PCBs can be printed leading to greener solutions at lower cost? Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications?  Here   Jonathan Chang  from   Panasonic North America  explained at the TechBlick Future of Electronics SHOW USA (Boston, 2025) how they R2R form these films and what the key properties are. Fist the grooves are embossed into PET or PEC later and then the Cu mesh is formed. The mesh has 2um linewidth and is embedded within the film, yielding a smooth surface. The pattern is customised and the R2R process can do top and bottom layers at the same time giving rise to double sided films Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost? In April 2025, during our Perovskite Innovation Day, Utmolight's co-founder Jesse Zheng said that while perovskites are not competitive yet, there are encouraging signs, and with a 10 GW factory, the company could reach cost parity with silicon. Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting. In January 2024, during our Future of PV event, Halocell's Emanuele Calabró showed the superior performance of indoor light harvesting with its panels. Perovskite encapsulation for enhanced stability One of the key challenges that the perovskite industry still faces is the stability of lifetime of perovskite solar panels. In April 2025, during our Perovskite Innovation Day, Intellivation's Robert Malay introduced the company's encapsulation solutions, and discussed the challenges facing perovskite solar panel makers. Microdispensing quantum dots for color conversion  XTPL developed a unique printing technology that offers high-performance and high precision material deposition, with several possible applications in the display industry. In December 2024, during our Display Innovation Day, XTPL presented their solution for micro bump deposition, and also presented a demonstration of QD deposition for microLED color conversion, a collaboration project with X-Display. Perovskite materials and exciting researchers and developers all over the world, as the industry is on the verge of mass commercialization starting with solar panels. In April 2025, during our Perovskite Innovation Day, Noctiluca's Łukasz Sytniewski explained why the company identified the perovskite solar industry as the key next market for the company, and detailed its new material R&D activities. How will perovskite panels perform in the 'real world'? Perovskite solar panels are highly promising, but people still wonder just how perovskite panels will perform in the 'real world'. In April 2025, during our Perovskite Innovation Day, Microquanta's Yang Chen details the latest performance of the company's perovskite panels - showing how they generate more electricity than silicon in harsh environments.