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The flagship Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Additive, Hybrid and 3D Electronics. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Register before 12 Sept 2025 for the best rates Lockheed Martin (USA)– Paul Gaylo  explores the transition of flexible hybrid electronics (FHE) from lab to field applications . Case studies on copper printing and flexible RF circuits illustrate how FHE can deliver SWaP-C advantages in defense systems while meeting reliability demands. The talk emphasizes concurrent engineering and early integration of design with advanced manufacturing to overcome barriers to FHE adoption. Fuji Corporation (Japan) – Ryojiro Tominaga  demonstrates additively manufactured multilayer circuits with embedded components . By combining silver nano-ink inkjet printing, UV-curable resin molding, and ultra-low temperature surface mount, they fabricate stacked, three-dimensional devices. This approach enables new device geometries and points toward a paradigm shift in electronics manufacturing. National Research Council Canada (Canada) – Chantal Paquet  introduces Volumetric Additive Manufacturing (VAM)  for 3D electronics. Using tomographic projection, VAM prints entire objects in seconds and enables “overprinting” of functional polymers onto existing structures. Subsequent metallization produces high-resolution 3D conductors. The talk will cover resin development, printing challenges, and the technology path toward scalable 3D electronic fabrication. Explore full Agenda and   Register  before 12 Sept 2025 for the best rates Fraunhofer ENAS (Germany) – Franz Selbmann  showcases ultra-thin Parylene-based PCBs with thicknesses down to 20 µm. Combining Parylene as substrate, dielectric, and encapsulant, these flexible boards integrate redistribution layers, vias, and multiple metal stacks via microsystem and printing techniques. Demonstrated with gold, copper, and aluminum, the resulting PCBs deliver excellent electrical performance under bending and enable direct integration of sensors and components for IoT and wearable electronics. Essemtec (Switzerland)– Irving Rodriguez  explores jetting and SMT mounting technologies  for flexible and stretchable electronics. Advanced all-in-one platforms combine multi-valve jetting of conductive inks, adhesives, and liquid metals with adaptive pick-and-place. Features such as laser height mapping and real-time process control support precision assembly on soft substrates, opening scalable routes to wearable, medical, and soft robotics electronics. TracXon (Netherlands)– Ashok Sridhar  presents a patented high-speed roll-to-roll process for vertical interconnects (VIAs) , a key bottleneck in printed electronics. The new VIA filling system, compatible with both R2R and S2S lines, enables true double-sided and high-density circuitry. By eliminating costly multilayer isolation stacks, this breakthrough moves printed electronics closer to PCB-level complexity and scalable volume manufacturing. VTT (Finland) – Antti Kemppainen  discusses prototyping and process development of flexible hybrid multilayer systems  for medical electronics. The talk covers multilayer sensor designs, dense integration, and elastic/wearable devices, addressing the need for both performance and manufacturability. This talk highlights pathways from concept design through prototyping to upscaling for rapid deployment of advanced medical-grade hybrid electronics. AMAREA Technology (Germany) – Robert Johne  introduces ceramic-based printed electronics via multi-material additive manufacturing . By integrating conductors and resistors directly into ceramic components, AMAREA achieves miniaturized, functional devices without assembly. Applications include embedded electrical circuits in glass-ceramics, metal-ceramic hybrids, and complex multifunctional components. The presentation covers material qualification, process optimization, and practical demonstrations of ceramic-embedded electronics. Lithoz (Austria) – Christoph Hofstetter  highlights additive manufacturing of dielectric ceramics and ceramic-metal systems  using lithography-based ceramic manufacturing (LCM). A dual-vat system enables clean switching between materials, producing dielectric ceramics with permittivity 3–60 and successful co-sintering of ceramics with silver or copper. The results demonstrate LCM’s potential for functional ceramic components with tailored electrical properties, advancing multi-material ceramic electronics. Q5D Technologies (United Kingdom)   - Ben Monteith presents advances in 5-axis laser-assisted selective metallization  for large 3D parts. By combining robotic motion control with laser activation and conductive material deposition, they enable direct integration of wiring and interconnects onto complex geometries. This approach eliminates separate harnesses, reduces weight, and supports high-performance substrates such as polymers, glass, and ceramics—advancing scalable 3D electronic integration. XTPL  presents additive manufacturing for next-generation microelectronics , focusing on micron-scale precision printing with conductive and dielectric nanomaterials. Using silver, copper, and gold pastes, they demonstrate microdispensing for semiconductor packaging, displays, and sensors, enabling miniaturization, flexible design, and cost-efficient production. The talk reviews state-of-the-art methods, highlights yield and repeatability challenges, and outlines practical solutions for scaling microfabrication into industrial production. Printed Electronics Limited (PEL) (United Kingdom)  introduces drop-on-demand deposition of highly viscous functional inks , traditionally confined only to screen printing. Leveraging piezovalve viscous-jet technology, they enable digital deposition of inks far above inkjet viscosity limits (>5,000 cP). Demonstrations include single-pass, high-performance digital printing of heavily loaded conductive materials for next-generation printed electronics. ImageXpert (USA) – Jochen Christiaens  presents a structured methodology for inkjet printhead selection  in advanced printed electronics. The session covers drop volume, nozzle density, waveform tuning, and material compatibility, comparing leading piezoelectric printheads. Case studies highlight performance trade-offs with challenging inks and substrates, giving attendees a practical framework for selecting printheads across R&D and production.

Introducing the program for MicroLED Connect 2025 and AR/VR Connect 202 5 (Conference and Exhibition, 24 &25 Sept 2025, High Tech Campus, Eindhoven, Netherlands) This event is shaping up to be the definitive global forum for microLED and AR/VR display professionals, offering an exceptional program, vibrant exhibition, and unmatched networking opportunities. In this preview, we’ll spotlight several speakers, showcase selected conference themes, and give you a glimpse of what awaits in Berlin. For the complete agenda and event details, click here. Mass Transfer – From Wafer to Display In many icroLED manufacturing platforms, at least one major transfer process is required—often two. Typically, devices move from the epiwafer to an intermediate interposer substrate and later from the interposer to the final display. Executing this step with precision, speed, and cost efficiency remains one of the industry’s most persistent challenges. At MicroLED Connect 2025 , leading innovators will unveil new solutions: Coherent  will present a fully integrated laser-based mass transfer system designed to handle donor wafers and receiver panels—whether they’re backplanes or temporary carriers. Offering exceptional throughput, yield, and flexibility, the system can manage even the tiniest microLED dies. Holst Centre  will introduce a proprietary release stack enabling rapid, selective microcomponent release with adaptive pitch using a cost-effective laser source. Recent results show sub-0.5 μm transfer precision for ultra-thin InP coupons with extreme aspect ratios. Advanced View Technology  (Korea) will share its high-accuracy electrofluidic assembly process for transferring InGaN-based blue nano-LEDs—providing a potential leap beyond OLED and current microLED microdisplay limits. Smartkem  (UK) will update on its Chip-First OTFT backplane  process, where the backplane is built directly onto the LEDs, unlocking a new manufacturing paradigm for microLED displays. MicroLED Growth – GaN, Nanowires, and Nanopyramids From epitaxy breakthroughs to novel nanostructures, new growth techniques are pushing microLED performance to new heights. At MicroLED Connect 2025 , innovators will reveal methods for creating smaller, brighter, and more efficient devices: Hexagem  (Sweden) will showcase a bottom-up InGaN process for producing dislocation-free hexagonal platelets with tunable emission from blue to deep red (>670 nm). This plasma-damage-free approach delivers up to 60% IQE for deep red quantum wells, with red devices maintaining >630 nm wavelengths at drive currents up to 50 A/cm²—ideal for ultra-bright, wide-gamut displays. CEA-Leti  (France) will present progress on monolithic RGB InGaN nanopyramids grown via MOVPE on patterned epitaxial graphene/SiC masks, achieving <1 µm diameters with outstanding optical properties. Veeco  (USA) will show how its MOCVD systems enable the world’s smallest microLED emitters, highlighting recent deposition breakthroughs. Two Photon Research Inc.  (USA) will reveal a kinetic Monte Carlo simulation platform for modeling selective area GaN nano-column growth, offering deep insight for optimizing high-performance microLEDs. Full-Color Strategies – QDs, Native Red, and Tunable Emission Delivering vibrant, full-color microLED displays can follow multiple routes—native RGB, color conversion, or tunable LEDs. MicroLED-Connect will cover all approaches with updates from global leaders: QNA Technology  will present a UV-LED + QD conversion approach, eliminating pixel crosstalk and enabling high efficiency. Panasonic Production Engineering  will detail its precision inkjet printing platform for depositing quantum dots, featuring novel ink circulation, pulsation minimization, and per-nozzle waveform control. Raysolve Optoelectronics  (China) will showcase a wafer-level full-color microdisplay (0.13”, 320×240 resolution, 500,000 nits peak brightness) using QD-based color conversion. Innovation Semiconductors  will introduce a monolithic, single-emitter color-tunable microLED architecture leveraging crystal plane variations and V-groove geometry. Aledia  (France) will update on GaN nanowire NanoLEDs, enabling RGB emission from the same material system by tuning nanowire size. Why You Should Attend These three themes represent only a fraction of the content on offer. The agenda spans display makers, AR developers, materials specialists, equipment suppliers, investors, and more. MicroLED-Connect 2025 is your chance to see the newest display prototypes, gain insider knowledge, and make industry-defining connections. Early-bird pricing is available until 15 August—reserve your place today. The Exhibition – Meet the Entire Supply Chain The MicroLED-Connect exhibition gathers the full ecosystem—equipment vendors, material innovators, panel makers, and solution providers—under one roof. View the floor plan and exhibitor list here.  A limited number of booths remain; contact us if you want to showcase your technology to a highly targeted microLED audience.

The Future of Electronics RESHAPED ECC, Berlin, Germany | 22 & 23 OCT 2025 Join us in Berlin on 22–23 October 2025 for The Future of Electronics RESHAPED — the global home of Additive, Printed, Sustainable, Hybrid, Wearable and 3D Electronics. World-Class Agenda - 100 Onsite Talks From Around the World! The map below highlights where our speakers for The Future of Electronics RESHAPED event are coming from — a testament to the truly global scope of our agenda. World-class experts will showcase the latest innovations and application developments. ­ Register NOW at early bird rate ­Perovskite Connect This year, we are excited to co-locate the first-ever Perovskite Connect event alongside The Future of Electronics RESHAPED conference and exhibition. There will be a combined agenda. Perovskite Connect is the only event worldwide dedicated to the fast-growing perovskite industry. The speaker map below shows just how global this event also is — with world-leading experts and innovators joining us from across the globe. All attendees will have full access to both events Global Exhibition Floor - over 90 exhibitors from around the world An incredible tabletop exhibition featuring 90+ companies . Here you can immerse yourself in the world of Additive, Printed, Sustainable, 3D and Wearable Electronics! Explore NOW ­ ACT NOW: Exhibition Booths Almost Sold Out The exhibition floor is almost sold out with only a few spots available. Contact Tom@TechBlick.com now if you wish to join us! Explore Floorplan NOW

Perovskite Connect 2025 is shaping up to be the must-attend event for the perovskite industry , bringing together leading innovators, researchers, and manufacturers from across the globe. Taking place on 22–23 October 2025  at the ECC in Berlin , this specialist conference will run alongside the flagship Future of Electronics RESHAPED  show. The agenda will spotlight the entire perovskite value chain — from materials and production processes to cutting-edge applications in solar energy and beyond. In addition to its high-level talks, Perovskite Connect will offer an international exhibition and abundant networking opportunities. In this preview, we highlight just a few of the speakers and themes that will define the event. You can view the full program and details here . Next-Generation Perovskite Solar Developers In an earlier feature , we introduced several perovskite PV pioneers — including Microquanta, Oxford PV, Perovskia, and Swift Solar. Perovskite Connect 2025 will welcome many more  notable solar technology companies: Halocell Energy  will unveil its fully scalable roll-to-roll printing process for producing lightweight, flexible perovskite solar modules. These modules are optimised for low-light conditions and extended lifetimes, making them ideal for IoT devices requiring long-term autonomous operation. Beyond Silicon  (USA) will focus on its solution-processing method for manufacturing bifacial perovskite/silicon tandem panels, offering potential cost and performance breakthroughs. PV-ART  (India) will share details of its 2-terminal monolithic silicon/CdTe-perovskite tandem cell, which has achieved an impressive 29.8% conversion efficiency. Caelux  (USA) will address economic and logistical bottlenecks in conventional solar, showing how high energy density designs can improve efficiency, reduce land use, and lower costs. Transformative Process Innovations One of the great advantages of perovskite technology is the potential for cost-effective, scalable manufacturing . At Perovskite Connect 2025, several speakers will present disruptive approaches to production: SALD  will demonstrate how its Spatial Atomic Layer Deposition (s-ALD) platform enables high-speed, roll-to-roll compatible deposition of functional layers in perovskite solar cells, from passivation to advanced moisture barriers. SPARKNANO  will outline its advancements in s-ALD technology, engineered specifically for large-scale perovskite panel production. Aerosol  (UK) will introduce its aerosol-assisted solvent treatment process, which significantly boosts device performance. Prof. Luigi Vesce  (University of Rome Tor Vergata) will showcase a fully printed manufacturing method for perovskite modules, using scalable techniques like blade coating, slot-die coating, and screen printing. The approach supports a variety of architectures — including HTL-free — and promises both technical and commercial viability for next-generation PV solutions. Co-Located with Future of Electronics RESHAPED Perovskite Connect will be hosted alongside The Future of Electronics RESHAPED , a major printed electronics conference featuring a broad spectrum of materials, process, and technology developments. Attendees will have full access to both events, enabling cross-industry learning and networking. With limited capacity and high demand, Perovskite Connect 2025 is the perfect opportunity to meet the innovators shaping the future of solar. Register today   and be part of the perovskite industry’s most influential gathering.

In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge. LIFT: R2R Digital Printing of High Viscosity Materials | Coatema How does Gravure Printing work in Printed Electronics? | Komori How to print micro bumps in a single step for semiconductor electronic packaging? | Hummink Can copper paste be used in Si TOPCon solar cell metal lisation to reduce silver consumption per cell and per watt ? | ISC Konstanz and Copprint How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? | Kateeva Can we inkjet print screen printable and high viscosity pastes? | Quantica Laser-based additive electronics to simplify the RDL metallization process | Akoneer Time To Explore The World of Additive, Sustainable, Hybrid and 3D Electronics! Join the Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects. Explore & RESHAPE The Future of Electronics  NOW R2R Digital Printing of High Viscosity Materials? This is where inkjet struggled due to requirement for low viscosity inks and also nozzle clogging. LIFT can be a solution enabling R2R digital printing of materials with a range of viscosity levels, finally addressing a key industry limitation? Here in this short video Thomas Kolbusch from Coatema explains how R2R LIFT process works. This is a great explanation so we recommend watching it Video length: 1.5 min How does Gravure Printing work in Printed Electronics? Ever wondered how gravure printing actually works - especially in printed electronics? Hear Doug Schardt from Komori Corporation give a concise 2-min explanation of this wonderful process able to achieve very fine feature with all manners of inks, resists, etc at great scale and throughput. Video length: 2min How to print micro bumps in a single step for semiconductor electronic packaging? High Precision Capillary Printing (HPCaP) developed by Hummink enables the ability to print in a single step micro-bumps with ability to control diameter and aspect ratio. This capability enables amazing applications in semiconducting packaging. In particular, in laboratory and prototyping settings, this can accelerate the development process despite the actual printing step being relatively slow, since it eliminates many process steps. Video length: 1.2min Can copper paste be used in Si TOPCon solar cell metallisation to reduce silver consumption per cell and per watt? If silver consumption per solar wafer remains unchanged, silver shortages will limit the growth of the photovoltaic industry. It is thus vital to switch away from silver or reduce silver consumption. But adding printed copper with the right performance and reliability has been difficult to achieve and demonstrate. Here, ISC Konstanz has demonstrated that YES one CAN use indeed Cu paste with excellent performance AND high stability!! Here you can see the results from Ag consumption has been reduced from 126 mg to 60 mg (with additional of 97mg of Cu as bus bars) with same or higher performance. Furthermore, the solar cells are stabe passing • 3x IEC @ TCT (600 cycles) requirements passed without considerable degradation • 2x IEC @ DHT (2000h) requirements passed without considerable degradation • 3x IEC @ DHT (3000h) requirements passed without any degradation by the group with the encapsulation material EVA Video length: 1.2min How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? Inkjet in printed electronics is often a small desktop machine throwing up the question can it ever be scaled up to huge areas. Here you can see see that yes it can. This is an example of area printing but still a great demonstrator. This video by Kateeva shows this beast of a machine and wonderful engineering in action demonstrating the inkjet can be truly scaled in additive and printed electronics Video length: 30s Can we inkjet print screen printable pastes? Inkjet has this major limitation of not being able to print high viscosity or even mid viscosity pastes. This limitation has truly held back inkjet in the world of additive and printed electronics. Quantica has developed a printer head that could enable direct inkjet printing of high viscosity pastes. This could be a game changer provided some challenges are addressed. Learn more here including about some of the challenges such as drying of paste during print at elevated temperature. Video length: 1.3min Can mask-less Additive Electronics simplify the RDL metallization process (both via and conductor layers) reducing number of process steps from ca. 11 down to 2-4 without any masks? This would be a superb achievement? Tadas Kildušis explains how SSAIL (Selective Surface Activation Induced by Laser) process (PI coat, laser pattern, activate, plate) can achieve this

In this newsletter we cover the following Shear thinning of jetted solder and glue for assembly  Fully printed double sided MCU on PET substrates? Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications?  Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost? Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting. Perovskite encapsulation for enhanced stability Microdispensing quantum dots for color conversion   How will perovskite panels perform in the 'real world'? We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick, Future of Electronics RESHAPED and Perovskite Connect conferences and exhibitions Join us at TechBlick’s Future of Electronics RESHAPED  conference and exhibitions in Berlin on 22 and 23 OCT 2025. This is the global home of the additive, printed,  3D hybrid and sustainable electronics, bringing the entire value chain together, from innovators to suppliers and end users. This year as a special theme we will also collocate Perovskite Connect alongside the same show Explore program here now: The Future of Electronics RESHAPED Shear thinning of jetted solder and glue for assembly  Shear thinning is one of the most important physical phenomena in jetting - or in fact in all of printed electronics! This is the physical mechanism on which much of the printed electronics industry relies! Here   Irving Rodriguez  from   Essemtec   explains this behaviour for jetting of solder as well as structural glue, showing how the shear rate increase in the jetting head leads to a drop a significant drop in viscosity Eric Wolf Cancalon Pierre-Jean (PJ) Mirko Cygon Fully printed double sided MCU on PET substrates? Lina Kadura  from   CEA-Liten  presented at   TechBlick  Innovation Day in April 2025, showing a full printed double sided MCU PCB with 4 metal layers and 100+ through vias, accommodating over 40 SMT (400um MCU pitch).  This is an incredible achievement showing that printed PCBs can lead to complex mullti-layer fully functional electronic PCBs for complex systems, showing that PCBs can be printed leading to greener solutions at lower cost? Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications?  Here   Jonathan Chang  from   Panasonic North America  explained at the TechBlick Future of Electronics SHOW USA (Boston, 2025) how they R2R form these films and what the key properties are. Fist the grooves are embossed into PET or PEC later and then the Cu mesh is formed. The mesh has 2um linewidth and is embedded within the film, yielding a smooth surface. The pattern is customised and the R2R process can do top and bottom layers at the same time giving rise to double sided films Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost? In April 2025, during our Perovskite Innovation Day, Utmolight's co-founder Jesse Zheng said that while perovskites are not competitive yet, there are encouraging signs, and with a 10 GW factory, the company could reach cost parity with silicon. Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting. In January 2024, during our Future of PV event, Halocell's Emanuele Calabró showed the superior performance of indoor light harvesting with its panels. Perovskite encapsulation for enhanced stability One of the key challenges that the perovskite industry still faces is the stability of lifetime of perovskite solar panels. In April 2025, during our Perovskite Innovation Day, Intellivation's Robert Malay introduced the company's encapsulation solutions, and discussed the challenges facing perovskite solar panel makers. Microdispensing quantum dots for color conversion  XTPL developed a unique printing technology that offers high-performance and high precision material deposition, with several possible applications in the display industry. In December 2024, during our Display Innovation Day, XTPL presented their solution for micro bump deposition, and also presented a demonstration of QD deposition for microLED color conversion, a collaboration project with X-Display. Perovskite materials and exciting researchers and developers all over the world, as the industry is on the verge of mass commercialization starting with solar panels. In April 2025, during our Perovskite Innovation Day, Noctiluca's Łukasz Sytniewski explained why the company identified the perovskite solar industry as the key next market for the company, and detailed its new material R&D activities. How will perovskite panels perform in the 'real world'? Perovskite solar panels are highly promising, but people still wonder just how perovskite panels will perform in the 'real world'. In April 2025, during our Perovskite Innovation Day, Microquanta's Yang Chen details the latest performance of the company's perovskite panels - showing how they generate more electricity than silicon in harsh environments.

Brad Martin , VueReal | bmartin@vuereal.com   MicroLEDs promise to reshape the future of displays and lighting - with higher brightness, lower power consumption, and longer lifespans than OLEDs. But for most innovators, that promise has remained just out of reach. Not due to lack of ideas or demand, but because of one persistent barrier: access.   That’s now starting to change, thanks to the arrival of Reference Design Kits (RDKs): pre-integrated microLED modules that empower engineers, designers, and developers to prototype and experiment - without custom fabrication, high-volume commitments, or massive investment. By dramatically lowering the barrier to entry and leveraging flexible manufacturing methods, RDKs are unlocking a new era of innovation - accelerating both the pace of discovery and the path to mass adoption. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 The Real Bottleneck: Access, Not Imagination Unlike OLED panels - which are widely available for prototyping and development - microLEDs have historically been locked behind technical and supply chain hurdles. Most companies simply can’t get their hands on the technology. Traditional microLED manufacturing typically requires highly specialized equipment, high-volume commitments, and extensive engineering integration, putting it out of reach for the majority of companies.   Even those who want to explore microLEDs in earnest are left to imagine what is possible rather than test, iterate, and build. This creates a fundamental mismatch between the potential of microLED and the ability of teams to work with it. A Shift Toward Flexible Manufacturing That dynamic is now beginning to change. Advances in high-precision transfer technologies - such as MicroSolid Printing - have introduced a new manufacturing model, one that supports high, medium, and low volume production without the need for dedicated fabrication facilities. With these processes, microLED modules can be produced flexibly, whether for single prototypes, pilot runs, or limited product lines. The result is lower capital expenditure, faster iteration, and greater accessibility for engineering and product teams of all sizes. Crucially, this unlocks the ability to offer microLED technology as a modular, off-the-shelf component: the Reference Design Kit.     Reference Design Kits: The Bridge Between Promise and Product RDKs mark a major shift in how companies interact with microLED technology. Rather than needing to co-develop complex custom solutions from scratch, product teams can now acquire pre-built modules - complete with drive electronics, integration documentation, and support - to start experimenting immediately. These kits serve two essential purposes: Proof of Feasibility : RDKs demonstrate that microLED mass transfer and integration are not just theoretical - they’re commercially viable today. Platform for Innovation : RDKs empower teams to explore use cases, iterate quickly, and build proofs of concept in-house without large development contracts or IP entanglements. Reference Design Kits Bringing the Ecosystem to Life The arrival of accessible RDKs is catalyzing a new wave of ecosystem development across the semiconductor and display industries. OEMs, integrators, and supply chain partners can now collaborate on real prototypes, share feedback, and accelerate the learning curve for microLED integration. This collaborative environment not only speeds up product development but also helps establish new standards, best practices, and supply relationships - reshaping the value chain for next-generation displays and lighting. From “What If” to “What’s Next” Until recently, microLED Reference Design Kits (RDKs) simply did not exist. Now, with the first commercially available kits on the market, engineers and designers finally have a way to experiment with real, working microLED modules. The result: immediate momentum across a wide range of industries. Among the concepts generating early excitement: Ultra-Thin Automotive Lighting : Sleek, bright taillights and signal indicators that offer new levels of design flexibility. Transparent Steering Wheel or Windshield Displays : See-through displays that deliver information without obstructing a driver’s view. Advanced Puddle Lighting and Side-Mirror Signals : Compact, high-brightness modules that open the door to new safety and communication features. AR/VR Microdisplays : Ultra-bright, high-resolution microdisplays for next-generation headsets. Laminated Glass Displays : Embedded microLEDs within structural glass for automotive, architectural, and other applications. Innovations in auto with microLED These are just a few of the applications already under exploration. The real power of RDKs lies in the countless other ideas they will unlock - many of which will emerge once developers can experiment directly, without barriers.   To capitalize on this shift, forward-looking companies should: Foster Cross-Functional Exploration : Bring together hardware, UX, and product teams to brainstorm and prototype with RDKs. Embrace Rapid Iteration : Use RDKs to test ideas early and often, accelerating learning and reducing development risk. Codevelop with your RDK Manufacturer : Offer feedback, request features, and participate in the co-creation of future modules and form factors. The Road Ahead The mass adoption of microLEDs is no longer a distant promise. With RDKs enabled by flexible, fab-free manufacturing models, access is now democratized. The technology is moving out of the lab and into the hands of the innovators who will shape its future. This ecosystem-driven approach will not only accelerate product launches but also foster new collaborations and standards across the industry.   As microLED technology becomes truly accessible, expect a radical transformation in how displays and lighting are conceived and delivered across markets. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 Sidebar: What is MicroSolid Printing? MicroSolid Printing is a high-precision, additive mass transfer process that enables the rapid and flexible assembly of microLED arrays onto a variety of substrates. Unlike traditional methods that require dedicated fabrication facilities and high-volume runs, MicroSolid Printing also supports low- to medium-volume production - allowing manufacturers to deliver microLED modules in any quantity, from single prototypes to pilot runs. This process dramatically lowers capital expenditure and accelerates product development cycles, making microLED technology accessible to a much broader range of innovators. What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?

Custom resistive inks are formulated with carbon, metal, or hybrid particles, along with binders and solvents, to support applications in dimmers, sensors, and potentiometers. Their resistivity can be adjusted through particle concentration or trace geometry while balancing viscosity and adhesion.   Contact: sales@voltera.io  or +1 888-381-3332 ext: 1   MATERIALS USED Carbon black Polyvinylpyrrolidone (PVP) 2-(2-Butoxyethoxy)ethyl acetate Ethanol Voltera Conductor 3 silver ink ACI FS0142 flexible silver Ink Solder wire   SUBSTRATES USED Polyethylene terephthalate (PET) 2" × 3" FR1 board   TOOLS AND ACCESSORIES NOVA materials dispensing system V-One PCB printer 150 µm Subrex nozzle Nordson EFD 7018333 dispensing tip Voltera disposable nozzle Dual asymmetric centrifugal mixer Magnetic stirrer Bambu X1 Carbon 3D printer We are Exhibiting! Visit our booth at the TechBlick Berlin on 22-23 October 2025 Project overview Purpose In this project, we demonstrate the development of a carbon resistive ink through testing different ink formulations and validating the performance through a potentiometer and an LED circuit.   Design We divided the design into four parts: Developing the carbon resistive ink Printing the potentiometer circuit Printing the LED circuit 3D printing the enclosure with a sliding wiper   Desired outcome The goal was to develop an ink with great printability, which, for this project, we measured by viscosity (between 1,000–10,000 cPs, compatible with direct ink writing  and screen printing ). We also aimed to achieve excellent adhesion to the substrate, with no flaking or cracking after curing at 90°C for 5 minutes. In addition, the ink should support a potentiometer to function properly, which means the resistance range should fall between 600 Ω to 6000 Ω.   Functionality When connected to the LED dimmer board (powered by a 9V battery), sliding the wiper altered the potentiometer’s resistance, dimming or brightening three LEDs. Resistivity was tunable by adjusting carbon concentration, curing time and temperature, or printing thicker or shorter traces.   While this formulation served as a functional prototype, higher carbon loadings (up to 20%) could be explored for enhanced conductivity, though viscosity adjustments would be necessary to maintain printability. Users can also change resistance by modifying the size of the conductive pad.   Developing the carbon resistive ink* The development of custom functional inks, whether conductive, dielectric, resistive, or semiconducting, requires balancing particle loading, solvent compatibility, and binder selection to achieve target electrical and mechanical properties. While conductive inks rely on metallic particles like silver for low resistivity, resistive inks prioritize tunable compositions.   Guided by these principles, we formulated a carbon-based resistive ink using carbon black for its cost-effectiveness and moderate conductivity, paired with PVP as a binder to enhance particle dispersion and substrate adhesion. The solvent blend, 2-(2-butoxyethoxy)ethyl acetate and ethanol, balanced evaporation rates and ink stability, critical for nozzle performance and film uniformity. Our iterative testing refined these ratios for compatibility with NOVA and the intended application. Carbon resistive ink developed by Voltera’s Applications team We started by dissolving 1.04 g of PVP into 4.88 g of ethanol using a magnetic stirrer at 1,500 rpm for 15 minutes. We then added 0.48 g of carbon black to the PVP-ethanol solution to minimize airborne particles, followed by the dropwise incorporation of 1.6 g of 2-(2-butoxyethoxy)ethyl acetate. We stirred the mixture for an additional 15 minutes under parafilm to prevent solvent evaporation, which resulted in a stable, homogenous ink.   The final composition included 13% PVP as a binder, 6% carbon black for conductivity, 20% 2-(2-butoxyethoxy)ethyl acetate as a solvent, and 61% ethanol to stabilize the dispersion. This combination achieved a viscosity of about 1,500 cps, enabling smooth dispensing through the Nordson EFD 7018333 dispensing tip with an inner diameter of 250 µm. Final ink formulation** * Follow the guidelines in the safety data sheet when handling the carbon black powder. ** The formulation in the table is for an 8 g resistive ink and is scalable using the provided weight percentages.   Printing the potentiometer circuit This circuit consists of two layers: Bottom conductive layer (in blue): Includes silver traces for solderable contacts, as well as a conductive pad to be glued onto the wiper of the potentiometer. Sliding the wiper up and down alters the carbon resistor’s effective length and changes the resistance of the circuit. Top resistive layer (in red): Carbon traces for the resistive element Potentiometer circuit design Bottom conductive layer NOVA settings, bottom conductive layer Bottom conductive layer, print result Top resistive layer NOVA settings, top resistive layer Final print The wiper of the potentiometer Printing the LED dimmer circuit This circuit was designed to visually demonstrate resistance changes by linking three LEDs to the potentiometer. Silver traces printed on an FR1 substrate formed conductive pathways, connecting the 9V power input to the potentiometer and LEDs. LED circuit design Once the circuit was cured, we manually placed and soldered the LEDs and reflowed the solder paste on V-One’s heated bed. The LED circuit board, soldered Printing the enclosure To house the potentiometer, we designed and 3D-printed a custom enclosure using PLA filament. The enclosure features a built-in sliding wiper mechanism for adjusting resistance and a compartment to securely hold the circuit components. After fabricating the enclosure, we cut the potentiometer circuit from the PET sheet and carefully taped it into the enclosure. Next, we soldered wires to the silver pads on the circuit to establish robust electrical connections. We then taped the conductive pad onto the wiper to ensure reliable contact with the resistive layer. After placing the wiper inside the enclosure, we twisted it 90 degrees to lock it into place. Finally, we connected the potentiometer to the LED dimmer circuit, which enabled real-time resistance adjustments for LED brightness control. The potentiometer circuit in the enclosure We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October in Berlin Challenges and advice Clogging the nozzle During initial ink formulation trials, the carbon black particles aggregated in the solvent, which caused nozzle clogs and led to incomplete traces. After some investigation, we realized that the issue stemmed from insufficient dispersion stability — carbon particles settled unevenly in the solvent, forming dense clusters that blocked the nozzle.   To address this, we introduced PVP as a dispersant and binder. We also adjusted the solvent ratio, reducing the volatile 2-(2-butoxyethoxy)ethyl acetate and increasing ethanol to improve particle suspension. Additionally, we recommend using a dual asymmetric centrifugal mixer to ensure homogeneous ink mixing. Lastly, we recommend using larger nozzles for particle-laden formulations to reduce shear stress during dispensing, as evidenced by better print results produced by the 330 µm nozzle, compared to the 200 µm nozzle.   Conclusion As our first custom ink project, the bulk of work involved was iterating on ink formulation, trying to find the balance between printability and functionality. Using NOVA , we validated a new material in less than a month and created a repeatable process for developing carbon resistive ink. NOVA enabled our materials R&D process by allowing us to get immediate feedback on printability, iterate formulations right on our benchtop, and create novel electronics.   If you’re interested in our other projects involving novel inks, take a look at: Printing ECG Electrodes with Biocompatible Gold Ink on TPU Printing an RFID Tag with Copper Ink on Paper Printing Electroluminescent Ink on Paper and PET   Want to be notified when we post new white papers? Sign up for our newsletter . We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin

Prototyping robotics offers great potential in electronics education, providing a fun way to learn about sensors and motion control. Building a line-following robot can be both educational and practical, with applications in automated delivery systems and robot racing competitions. Contact: sales@voltera.io  or +1 888-381-3332 ext: 1 MATERIALS USED Voltera Conductor 3 silver ink Voltera T4 solder paste Voltera solder wire SUBSTRATES USED FR1 board TOOLS AND ACCESSORIES V-One PCB printer Bambu Lab 3D printer Nordson EFD 7018395 dispensing tip Walfront infrared proximity sensors Texas Instruments L293DNE motor driver Texas Instruments NE555DR timers LEDs Rivets We are Exhibiting! Visit our booth at the TechBlick Berlin on 22-23 October 2025 Project overview Purpose The goal of this project was to prototype a circuit board that controls a line-following robot, using a simple design that could be used to teach electronics in a hands-on way. Design For the control board, we separated the ground traces and other signal traces on opposite sides of the FR1 board, with through-holes to mount key components like the 16-pin L293DNE motor driver. These through-holes also serve to accommodate other components such as LEDs, infrared proximity sensors, and motors, which could not be surface-mounted due to their size and functional requirements. Figure 1: Circuit design We divided the robot’s main body into small parts and printed them with a 3D printer. Desired outcome Once connected to power, a 9V battery, the assembled robot should be able to distinguish its designated paths from the background and navigate along the paths, making turns as needed. Functionality By using infrared proximity sensors, motors, and a motor driver, our design enabled the robot to move along the yellow tape on the black floor and navigate corners, all without relying on a microcontroller or onboard code, which would have introduced unnecessary complexity. For the purpose of this project, we did not require a specific travel speed. However, the design can be customized for other activities, such as robot racing or obstacle avoidance challenges by reducing the overall weight of the robot, adjusting the configuration of sensors, or choosing high speed rated motors. Printing the control board Printing the front side Before dispensing the silver ink, we drilled 39 through-holes with a diameter of 1.6 mm on the FR1 board using V-One. Figure 2: Through-holes drilled with a V-One PCB printer On the front side of the board, two infrared proximity sensors detect the paths and send signals to the motor driver, which controls the robot's movement by turning the motors on or off. Figure 3: Schematic for the control board, front side Figure 4: V-One dispensing settings Printing the back side The back side of the board consists of traces that connect to the ground pins of the components and complete the circuit. Figure 5: Schematic for the control board, back side Post-processing the control board. When both sides were complete, we inserted rivets into the through-holes and dispensed solder paste for resistors and the NE555 timer using V-One’s built-in solder paste dispensing workflow. We then populated the components and manually soldered the motor driver, capacitor, motors, infrared proximity sensors, and LEDs. Figure 6: Control board with components 3D printing the main body To house the control board and serve as the robot’s movement platform, we designed a main body divided into four parts. These parts were 3D printed using PLA filament: Two wheels Two motor brackets A case A lid Figure 7: Design of the main body We then put the control board into the case and assembled the parts. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October in Berlin Challenges and advice Soldering issues Conductive ink, when applied to FR1, can sometimes adhere less robustly compared to traditional copper traces on a PCB. This makes it prone to being lifted off the board during soldering if excessive heat, pressure, or mechanical stress is applied. To improve solderability, we lowered the curing temperature of the ink. This adjustment enhanced wettability, allowing solder to adhere more effectively to conductive pads, especially for sensitive connections and larger components. Conclusion Through this project, we developed a line-following robot controlled by a double-sided PCB, using a relatively simple design and readily accessible components. This highlights the feasibility of incorporating advanced robotics and electronics concepts into educational programs. Depending on the students' skill levels and the intended applications the design can be adjusted to make it more or less challenging. If you’re interested in exploring other PCB prototyping projects we have completed, take a look at:   Printing a Flexible PCB with Silver Ink on PET Dispensing Solder Paste on Factory Fabricated PCBs Printing Strain Gauges on TPU laminated on a Glove for Remote Hand Control We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin

MicroLED Displays for Digital Signage Insights from JCDecaux’s R&D Director, Thomas Morel, on next-generation microLED technologies for large-scale signage and outdoor displays. Quantum Dot Stability for MicroLED Color Conversion QNA Technology presents UV LED-based QD color conversion with enhanced stability for microLED applications. Advancements in Red GaN MicroLED Production Prof. Daisuke Lida (KAUST) discusses cutting-edge techniques to achieve high-efficiency red GaN microLEDs, addressing production and cost challenges. Key Features of Smart Glasses: Fashion & Vision Google AR Director Bernard Kress highlights fashion and prescription lens integration as the top factors shaping the future of AR smart glasses. Impact of Outer Shell on Cadmium Sulfide QD Performance Fraunhofer IAP’s Dr. Manuel Gensler explains how the outer shell diameter affects the optical and electronic performance of CdS quantum dots. VC Funding & Challenges for Semiconductor Startups Cyril Vančura (imec.xpand VC) shares why “fast fail” strategies don’t work for microLED and semiconductor startups, and how to secure sustainable growth. We cover these topics through short (1-minute) handpicked snippets from recent live talks at TechBlick, at Future of Electronics RESHAPED and MicroLED Connect + AR/VR Connect conferences and exhibition series. MicroLEDs for Digital Signage? JCDecaux  a global leader in digital signage and has been using novel cutting-edge technologies and business models for many years. Hear JCDecaux's R&D Directory,   Thomas Morel  explain the company's views on next-generation microLED displays for signage applications.  Are quantum dots stable enough for microLED color conversation Quantum Dots are highly promising for color conversion in microLED displays. But the  stability of the material is still a technical challenge. In September 2024, during our flagship 2024 MicroLED-Connect event, QNA Technology introduced its unique UV LED color conversion QD technology, and showed the impressive stability its QDs offer. What is the state of the art in red GaN MicroLED production Producing high-efficiency red microLEDs is one of the major challenges towards efficient and low-cost microLED displays. During MicroLED Connect 2024, Prof. Daisuke Lida, from KAUST, explained the state-of-the-art in red microLED production and the latest research at KAUST. What are the most important features of smart glasses? In September 2024, during our flagship 2024  MicroLED Connect + AR/VR Connect event, Google's AR Director Bernard Kress gave an excellent talk about the future of smart glasses. Interestingly, Bernard says that the two most important considerations are fashion, and prescription vision integration! Impact of outer shell on performance of Cadmium Sulfide QDs During MicroLED Connect 2024, Dr. Manuel Gensler from the Fraunhofer IAP explained how the performance changes when you increase the diameter of the outer shell of Cadmium Sulfide Quantum Dots. Join MicroLED Connect and AR/VR Connect to stay updated on the latest microLED innovations and network with industry leaders—whether at our flagship onsite event, our annual series of virtual meetings, or through our extensive content library. Why fast fail is not an option for semiconductor startups. The MicroLED Industry is still at a very early stage, and there are many early stage companies and startups that develop microLED technologies. And these companies need funds... During MicroLED Connect 2024,   Cyril Vančura  , partner at   imec.xpand  VC gave excellent tips for early stage microLED startups. In this short video, you'll see Cryil explain why fast fail is not an option for semiconductor startups.

Perovskite Connect 2025 Conference and Exhibition | ECC, Berlin, Germany | 22 & 23 OCT 2025 | Co-located with Future of Electronics RESHAPED Europe 2025 Perovskite Connect 2025 is set to be the industry’s premier event, with a world-class agenda, exhibition and networking opportunities. Co-located with Europe’s leading printed electronics event, Perovskite-Connect will focus on the perovskite supply chain, solar applications, recent innovations, materials and processes. In this article we will introduce some of our speakers and themes at the event. You can explore the full agenda and event details here . Perovskite solar applications – utility solar is not the only game in town The main application for perovskite materials today, and the one that attracts most of the attention, is of course solar energy generation. While many companies focus on solar panels for utility – gird purposes, many companies are looking for alternative applications – such as indoor solar, agrivoltaics, building- and vehicle-integrated panels and more. At Perovskite-Connect, we will explore all of these themes! Here we show some of our planned talks that will focus on perovskite solar applications. At Perovskite Connect 2025, Microquanta , China-based leading perovskite solar panel developer, will discuss the commercial readiness of perovskite PVs for utility-grade solar, and will share lessons the company has learned through real-world deployment and industrial validation. Microquanta believes that perovskite PV is evolving into a commercially ready solar technology—poised not only to complement, but to surpass traditional silicon in key applications. UK-based tandem perovskite solar panel developer Oxford PV recently announced the world’s first commercial tandem perovskite-silicon panels. The company’s presentation at Perovskite-Connect will explore the rapid development and exceptional performance of perovskite-silicon tandems, highlighting recent advancements and charting the roadmap to further improvements. A particular emphasis will be placed on scaling and manufacturability. Perovskia develops high performance indoor and outdoor perovskite solar panels. The company will detail its unique perovskite production process, and the high customization it offers for its customers that seek to integrate high-performance solar panel into their products, without compromising on design. Finally, Swift Solar will give a lecture that details the company’s journey to develop a high-throughput manufacturing technique and improve its process reliability, in order to achieve consistently high yields. Swift Solar will also highlight its expanded testing infrastructure, designed to evaluate large volumes of devices over extended durations, and will present results from experimental studies. Perovskite materials innovations As the perovskite industry matures, there’s a growing demand to increase panel efficiency, reduce costs, increase lifetime and stability, and more. The design of novel perovskite stack materials is a key pillar of the industry’s effort to commercialize perovskite panels.  At Perovskite-Connect 2025, Sofab Inks will discuss its effort to explore materials that can increase the performance of perovskite devices, and are also scalable for mass production. The company’s soluble ETL and HTL materials offer a solution for the industry that balances performance and manufacturability.  Germany-based Karlsruhe Institute of Technology (KIT) will introduce its research into metallization and interconnection materials that can be processed at low temperatures. One of its key achievements is the TECC wire concept which uses round copper wires for cell interconnection. These polymer-coated wires offer good adhesion to the cell structure, high performance, low silver content and a gentle processing condition. Nano-C is also developing interface materials for single-junction and tandem perovskite panels. The company will discuss how its experience with fullerenes and fullerene derivatives has enabled it to develop novel electron transporting interface materials that allow for passivation and prevention of delamination, and will also discuss specific use cases of the materials and its industrial scale manufacturing of fullerenes and new generation fullerene derivatives . Finally, industrial adhesive developer DELO will explain why high-barrier encapsulants are essential for the protection of perovskite solar cells, and will demonstrate how it developed new adhesive solutions specifically designed for perovskite solar cells. Perovskite Connect 2025: time to reserve your ticket now! These are just a few sample themes from our exciting world-class agenda, that includes a range of solar panel makers, equipment manufacturers, process developers, researchers and more. Perovskite-Connect is co-located with The Future of Electronics Reshaped printed electronics event, a highly relevant conference with a focus on printed materials, processes and technologies. Perovskite Connect 2025 – the Exhibition The Perovskite-Connect exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, material makers, solar panel makers and more.

Please note that just before the TechBlick Future of Electronics RESHPAED and Perovskite Connect conference on 22 and 23 OCT 2025 in Berlin, the 13th edition of the renowned Metallization and Interconnection Workshop for Solar Cells (MIW) will take place in Berlin during the same week. This specialized workshop focuses on current and emerging approaches to the metallization and interconnection of solar cells, attracting over 120 experts from industry and academia worldwide. Over the course of two days, a series of scientific presentations—selected through a rigorous review process—will be delivered. A key feature of the workshop is its strong emphasis on discussing results and trends, making it equally valuable for both newcomers and seasoned professionals. TechBlick has entered into a partnership with MIW so that visitors to TechBlick receive a discount of EUR 120 on the admission price for the MIW workshop. Further information about the MIW workshop can be found at https://miworkshop.info/