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In this newsletter we cover the following Is additive manufacturing of PCBs more environmentally friendly than traditional subtractive processes? | Lina Kadura from CEA-Liten Pick and place machines for Flexible Hybrid Electronics? | Irving Rodriquez, Essemtec Print nanoscale structures with varying or gradient material compositions? | Gauthier Briere, Atlant 3D Microdispensing in microLED interconnect production? | XTPl Can perovskite QDs be used as color conversion in microLED displays? | CEA Leti's Prof. François Templier How can the LED industry adapt to the needs of microLED displays? | ALLOS Semiconductor How will perovskite panels perform in the 'real world'? |  Microquanta's Yang Chen Are microLEDs really more efficient than OLED displays? | UCSB, Prof. DenBaars We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick and MicroLED Connect conferences and exhibitions Is additive manufacturing of PCBs more environmentally friendly than traditional subtractive processes? Lina Kadura  from   CEA-Liten  presented at   TechBlick  Innovation Day in April 2025, showing that life cycle analysis (LCAs) demonstrate that the GWP index - the Global Warming Potential - can be reduced by 50% just by switching to additive, without even changing substrates away from FR5!   This clearly demonstrates that additive electronics and printed electronics can make electronics more sustainable and greener Pick and place machines for Flexible Hybrid Electronics? Irving Rodriguez  from   Essemtec   presented recently at the   TechBlick  Innovation Day, showcasing their all-in-one system able to achieve pick-and-place, solder as well as glue jetting a single machine with a footprint less than 1 square meter and with the ability to change the printing value in less than 30 seconds. Here you can also see the machine for flexible hybrid electronics where the special vacuum table holds down the foil (substrate), allowing the placement of 0.1 or 0.2 mm up to 109 mm components on flexible hybrid electronics! The pick and place is often a critical challenge in realising printed hybrid systems and this machine offers a powerful solution. Print nanoscale structures with varying or gradient material compositions? Direct Atomic Layer Processing (DALP) can enable multi-material direct micron- or nano-scale atomic layer deposition or printing! Here the lateral feature size is determined by the microreactor, while the vertical feature size is controlled by the ALD process itself. This allows for highly controlled and repeatable patterning of materials like metals, oxides, and nitrides. Here Gauthier Briere, formerly at Atlant3D, showcases a unique ability of this technology, namely the ability to print ultrafine structure with varying metal gradients / material compositions and heights. This is an ability that almost no other method can match  Microdispensing in microLED interconnect production? Tiled microLED displays usually use electrodes deposited on the edges of the tiles, as these need to connect seamlessly. In December 2024, during our Display Innovation Day, XTPL presented their solution for high-performance Edge-Type conductive interconnect deposition. Here 10um wide lines with 15um spacing using highly conductive and dense silver paste is printed directly around the edges connecting the front and back Can perovskite QDs be used as color conversion in microLED displays? Perovskite quantum dots are highly promising materials, with excellent potential in display applications, especially for color conversion in microLED displays. In December 2024, during our Display Innovation Day, CEA Leti's Prof. François Templier presented the latest research results, including their ability to achieve densities of 1 micron or even less, thanks to the perovskite materials. How can the LED industry adapt to the needs of microLED displays? The LED industry is not optimized for producing microLED for display applications. What kind of changes will the industry adopt in order to mass produce low-cost and high-performance microLED chips? In September 2024, during our flagship 2024 MicroLED-Connect event, ALLOS Semiconductor explained the required manufacturing systems for successful microLED production, and gave an introduction to the company's GaN-On-Silicon 300 mm production technology an d expertise. Are microLEDs really more efficient than OLED displays? And how will vertically-stacked LEDs increase performance? In September 2024, during MicroLED-Connect's flagship event in Eindhoven, UCSB's Prof. DenBaars presented the latest state-of-the-art LED research results, detailed the lab's work on tunnel-junction technology that enables single-chip full color solutions, and explained why native red microLEDs are still a big challenge. How will perovskite panels perform in the 'real world'? Perovskite solar panels are highly promising, but people still wonder just how perovskite panels will perform in the 'real world'. In April 2025, during our Perovskite Innovation Day, Microquanta's Yang Chen details the latest performance of the company's perovskite panels - showing how they generate more electricity than silicon in harsh environments.

The most important conference and exhibition worldwide dedicated to printed electroncis, additive electronics, sustainable electronics, wearable electronics, stretchable electronics, soft electronics, textile electronics and more https://www.techblick.com/electronicsreshaped Discover the Future of Additive, Printed, Sustainable, Hybrid, Wearable & 3D Electronics 🔷100 onsite talks 🔷90+ exhibitors 🔷12 masterclasses 🔷3 tours 🔷600+ participants Join us at Electronics RESHAPED in Berlin on 22 and 23 OCT 2025 - the flagship global meeting point for applied research and industry. Join the movement. Explore & RESHAPE the Future of Electronics – NOW! World-class agenda with 100 onsite talks - Breakthroughs reshaping tomorrow—on stage at TechBlick in Berlin! Incredible agenda including 100 talks organised in 4 parallel tracks from across the entire technology spectrum and across the globe. The agenda features Toyota, Lockheed Martin, Valeo, Antolin, Sato Global, GE Aerospace, Fuji, Panasonic, Kodak and many other incredible large and small companies as well as research centres. No other event worldwide offers such a cutting-edge and comprehensive agenda as TechBlick events. ­ Explore The Agenda NOW ­ Incredible tradeshow with 90+ exhibitors What happening next is already on show here! Dynamic tradeshow floor featuring over 90 exhibitors from around the world, showcasing their latest innovations and products. This is an incredible opportunity to explore the state-of-the-art in the industry and applied research. More than 90% of the available spots are sold. Contacts us now if you wish to join as an exhibitor - tom@techblick.com ­Explore The Exhibition Floor NOW Unparallel networking - TechBlick is where all the key conversations take place! The show offers unparalleled networking in a great atmosphere during the entire event including the extended refreshment breaks. We provide coffee, lunch and beverages as well as drinks to keep everyone together the entire time. Indeed this show has a unique spirit! ­Explore The Exhibition Floor NOW ­

The first ever conference and exhibition worldwide focused on perovskite industry Explore the cutting-edge technology, manufacturing advances, and real-world applications of perovskites 🔷First-ever show worldwide dedicated to perovskite industry 🔷World-class global agenda 🔷Vibrant exhibition 🔷Masterclasses and tours Join us at the Perovskite Connect in Berlin on 22 and 23 OCT 2025 - the flagship global meeting point for applied research and industry. Explore & RESHAPE the Future of Perovskites– NOW! Next Early Birds Discount Ends on 18 July 2025 World-class global agenda  - The next perovskite breakthroughs unveiled at at Perovskite Connect in Berlin! Incredible curated agenda featuring all the key players, material and component innovations, and manufacturing advances - from across the world. Speakers include the likes of Microquanta, Oxford PV, Swift Solar, Beyond Silicon, Inc., Caelux Corporation, SparkNano, Helmholtz-Zentrum Berlin, Sofab Inks, CEA, Solaires Entreprises Inc, and many more. No other perovskite event worldwide will offer such an incredible global agenda focused on industry and applied research. ­ Explore The Agenda NOW ­Next Early Birds Discount Ends on 18 July 2025 Dynamic tradeshow - Perovskite Connect - where the perovskite industry is on show The co-located exhibition floor showcases the depth and breadth of the global perovskite ecosystem featuring leading producers and pilot lines, material and equipment developers as well as applied research centres. The floorplan is shown below. The exhibition is co-located with the Future of Electronics RESHAPED conference and exhibition, featuring a total of over 90+ booths There is only ONE spot left in the Perovskite Connection exhibition section - contact khasha@techblick.com if you are interested. ­Explore The Exhibition Floor NOW ­ Co-located with the Future of Electronics RESHAPED - Perovskite Connect - where the industry's defining conversations take place Perovskite Connect is part of the Future of Electronics RESHAPED show, offering full access to 100+ onsite talks, 90+ exhibitors and networking with over 600 participants from around the world over extended refreshment breaks and drinks receptions. Explore The Joint Program NOW ­ Next Early Birds Discount Ends on 18 July 2025

Author : Sabine Kaced | sabine.kaced@linxens.com How can the Roll-to-Roll Process Transform the Creation of Flexible Printed Electronics in Healthcare? The healthcare industry is experiencing a revolution, driven by advancements in wearable devices and biosensors that monitor patients non-invasively and in real time. At the forefront of this transformation is the Roll-to-Roll (R2R) process, a manufacturing breakthrough that is reshaping how flexible printed electronics are created. Linxens Healthcare is leading the way in leveraging R2R technology and contract manufacturing capabilities to deliver cost-effective, scalable and precise solutions for innovative healthcare monitoring. Harnessing the power of Roll-to-Roll technology At Linxens Healthcare, we harness the power of the R2R process to produce cutting-edge electronic skin patches equipped with electrochemical sensors, integrated electronic components, and skin adhesives. With years of expertise in printed electronics and converting, Linxens Healthcare has established itself as a trusted partner for the development and manufacturing of flexible healthcare solutions. Inside the Roll-to-Roll Process: Driving Innovation in Healthcare R2R is a high-throughput manufacturing technique that involves the continuous processing of flexible substrates - such as plastic films, metal foils, or textiles - through various stages of printing, coating, and assembly. At Linxens Healthcare, we utilize advanced printing methods like screen printing, gravure printing, inkjet printing, and flexographic printing, to deposit functional inks onto the substrate with exceptional precision. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Our R2R workflow includes: Substrate Handling: Feeding flexible substrates through rollers for precise alignment and tension control. Layer Deposition: Printing conductive, dielectric, or active material layers using techniques tailored to the application’s requirements. Drying/Curing: Employing thermal or UV curing to solidify printed layers and achieve optimal conductivity and chemical properties. Lamination and Assembly: Integrating additional components, such as microchips, sensors, and adhesives, onto the substrate. Inspection and Testing: Ensuring every product meets the highest quality standards. Transforming Healthcare Applications Linxens Healthcare’s R2R capabilities enable the seamless integration of electrochemical sensors, electronic components, and medical-grade adhesives into flexible skin patches. These advancements create unparalleled opportunities to monitor vital signs including heart rate, respirations, hydration levels, blood glucose levels and more in real time, offering both patients and healthcare providers actionable insight. Key Advantages of Linxens Healthcare’s R2R technology Precision and Miniaturization Our R2R technology enables high-resolution printing of electrodes and interconnects, critical for accurate physiological signal detection. With advanced techniques like inkjet printing, we achieve nanometer-scale conductive patterns essential for compact and lightweight wearable designs. Material Compatibility Our expertise extends to working with a wide range of functional inks, including conductive silver and carbon, as well as bio-functional coatings. These materials are essential for creating durable and biocompatible electrochemical sensors that maintain performance standards in various medical environments Seamless Integration of Components Our R2R manufacturing process allows the integration of microelectronics, such as Bluetooth modules or near-field communication (NFC) chips, directly onto flexible substrates. This integration enhances device performance and supports wireless data transmission to smartphones or cloud platforms. Adhesive Application We apply medical-grade adhesives with precision, ensuring a secure and comfortable fit on the skin. This ensures optimal sensor performance and a positive user comfort in all applications. Scalability and Cost-Effectiveness Linxens Healthcare’s R2R process drastically reduces production time and costs, allowing us to efficiently scale from prototyping to mass production. This scalability enables us to meet the growing demand for wearable healthcare devices, making advanced monitoring technologies more accessible and affordable.   Partner with Linxens Healthcare for Next-Generation Solutions Choosing to partner with Linxens Healthcare means gaining access to industry-leading expertise in printed electronics and contract manufacturing. Our approach includes: Enhanced Customization:  From rapid prototyping to customized designs, we adapt solutions to specific healthcare applications and user needs. Scalability: Scale from prototyping to mass volume production in million range without compromising on quality. Reliability and Quality: Inline monitoring systems ensure our products meet stringent healthcare standards. Market Competitiveness: Mass-producing high-quality devices at lower costs helps our partners stay ahead in the market. Future Outlook: Shaping the Future of Healthcare Monitoring Linxens Healthcare’s R2R technology opens the way for the next generation of wearable healthcare solutions. From multi-parameter monitoring patches to real-time data transmission devices, we empower patients and healthcare providers with innovative tools. With a focus on materials innovation, advanced printing techniques, and automation, Linxens Healthcare is committed to transforming how vital signs are monitored and managed. Our expertise in printed electronics and contract manufacturing positions us as a leader in delivering high-performance solutions that redefine the healthcare experience. Partner with Linxens Healthcare today and experience the future of flexible printed electronics in healthcare. https://healthcare.linxens.com/ | LinkedIn Linxens Healthcare We are Exhibiting in Boston and in Berlin. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston 22-23 October 2025 in Berlin

We are excited to announce that TechBlick’s flagship event, Future of Electronics RESHAPED USA , will take place on 10–11 June 2026  at the iconic Computer History Museum  in Mountain View, California . 🗓 Event:   Future of Electronics RESHAPED USA 📅 Dates:  10 & 11 June 2026 📍 Venue:  Computer History Museum 📌 Location:  Mountain View, California 🎤 Organised by:  TechBlick This premier international event is North America’s largest and most important exhibition and conference focused on the latest advancements in: Additive Electronics Printed Electronics Hybrid Electronics 3D Electronics Sustainable Electronics Soft Electronics Wearable & Textile Electronics Flexible & Stretchable Electronics Formed & R2R Electronics ... and more! 🔜 More details, including our 80+ exhibitor floorplan, will be announced in June 2025. In the meantime, explore our upcoming  and past  editions of Future of Electronics RESHAPED: Upcoming 2025 (Boston) 2025 (Berlin) Past 2024 (Boston) 2024 (Berlin) 2023 (Berlin) 2022 (Eindhoven)

Future of Electronics RESHAPED USA - Where The Global Additive, Printed, Hybrid, 3D Electronics Industry Connect   Join us and 500 professionals in Boston on 11 and 12 June 2025 to RESHAPE The Future of Electronics, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Textile-Based, R2R, Soft, Stretchable, InMold, etc   ✅70+ Onsite Talks ✅70+ Onsite Exhibitors (All exhibitor spots SOLD OUT) ✅8 Masterclasses ✅2 Tours ✅500  Attendees ✅1500 Talks in the On-Demand Talk Library and Online Annual Access to All Future of Online and Onsite Events   FINAL Early Bird Rates END on 30 MAY World-Class Agenda Explore the world-class agenda featuring 70 invited contributions covering the full spectrum of applications, processes, materials, and R&D. Explore the agenda here. SOLD OUT Exhibition A sold-out dynamic exhibition awaits you offering you the chance to see and experience the latest and find your next partners, manufacturers and suppliers. What will be next in additive, hybrid and 3D electronics is already on show here! Explore exhibitors here Year-Round Program You will also have access to all our past events as well as on-demand version of all upcoming onsite talks including all talks and masterclasses taking place at our Future of Electronics RESHAPED Europe. The agenda will be released soon but you can see a sneak peek here

National Research Council of Canada, Ottawa, Canada 3D electronics afford a means to miniaturize and enhance the performance and integration of electronic devices; however, adoption of 3D-printed electronics has been delayed by the lack of processes to effectively produce high-resolution metallic interconnects with good electrical performance on complex 3D shapes. While direct-write 3D printing has demonstrated the ability to generate conformal conductive interconnects, the technique is slow and yields low print resolution. The National Research Council of Canada (NRC) has developed a new fabrication approach based on tomographic volumetric additive manufacturing (VAM) that can produce electronics on complex 3D shapes with high manufacturing speed, high conductivity and 3D design freedom. Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend VAM is an emerging 3D printing technique developed in 2019 [1,2] and has since advanced as an additive manufacturing approach that can yield complex 3D objects with ultra-high speeds, with no support structures or layering artifacts. [3-7] The approach projects light patterns onto a rotating vial containing liquid photoresin. When the absorbed light dose reaches a critical threshold, the photoresin cures, resulting in solid polymer. The shape of the solid polymer follows the shape of the patterned light dose inside the printing volume, enabling printing of solid 3D objects. Unlike other 3D printing techniques that are based on layer-by-layer approaches, VAM can be used to 3D-print a polymer on top of an existing structure (Figure 1). The NRC is exploiting this particularly powerful feature of VAM to introduce conductive features to complex 3D shapes. In this approach, VAM is utilized to pattern a functional polymer onto the surface of a 3D object. The printed polymer is functional, allowing it to act as a template for electroless plating of a metal yielding an object with 3D conductive features. Figure 1. Light images of our test pattern are projected on a rotating square rod. Figure 2. a) The polymer patterned on the square rod acts as a template for copper plating. To realize 3D electronics with VAM, the NRC developed the projection algorithm to account for occlusion due to the opaque base object, the hardware to ensure alignment with projected light and the photoresins to serve as templating layers for copper plating (Figure 2). With this approach, we have demonstrated good print accuracy and resolution, as demonstrated in Figures 3a and b. Our test pattern illustrated the method can produce traces with widths of 70 µm, surface roughness of less than 0.10µm (RMS) with sheet resistances of below 100 mΩ/[]. To further demonstrate the strength of this approach, a multidirectional spiral RF antenna was designed and printed on a hemisphere using VAM. The spiral antenna (Figure 3c) was printed in less than a minute and was treated with copper electroless plating solutions, collectively resulting in a process that requires less than 10 minutes to complete.* The approach is particularly remarkable for its ability to print on any arbitrary object and material type and therefore can be a powerful tool for integrating antennas, metasurfaces or electromagnetic interference shielding onto the surfaces of objects. In summary, this new approach offers speed, resolution, cost efficiency and the ability to print in 3D in an unrestrained way, offering an alternative to extrusion or direct-write 3D printing, which generate conformal conductive interconnects that are slow, require complex 5-axis equipment and yield low print resolution. Figure 3. a) A test pattern of copper traces printed using the NRC’s VAM approach; b) the target line widths versus the measured line widths of copper traces; b) a spiral antenna printed on a hemisphere and c) S11 response from the spiral antenna. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now. References [1] D. Loterie, P. Delrot, C. Moser, Nature Communications 2020, 11, 852. [2] B. E. Kelly, I. Bhattacharya, H. Heidari, M. Shusteff, C. M. Spadaccini, H. K. Taylor, Science 2019, 363, 1075 [3] D. Webber, Y. Zhang, K. L. Sampson, M. Picard, T. Lacelle, C. Paquet, J. Boisvert, A. Orth, Optica, OPTICA 2024, 11, 665. [4] I. Bhattacharya, J. Toombs, H. Taylor, Additive Manufacturing 2021, 47, 102299. [5] A. Orth, K. L. Sampson, Y. Zhang, K. Ting, D. A. van Egmond, K. Laqua, T. Lacelle, D. Webber, D. Fatehi, J. Boisvert, C. Paquet, Additive Manufacturing 2022, 56, 102869. [6] A. Orth, D. Webber, Y. Zhang, K. L. Sampson, H. W. de Haan, T. Lacelle, R. Lam, D. Solis, S. Dayanandan, T. Waddell, T. Lewis, H. K. Taylor, J. Boisvert, C. Paquet, Nat Commun 2023, 14, 4412. [7] D. Webber, A. Orth, V. Vidyapin, Y. Zhang, M. Picard, D. Liu, K. L. Sampson, T. Lacelle, C. Paquet, J. Boisvert, Additive Manufacturing 2024, 94, 104480. *Design and measurement of the spiral antenna were performed by Prof. Amaya and Hojjat Jamshidi Zarmehri from the University of Carleton, Ottawa, Ontario, Canada

Author: Johanna Zikulnig, Silicon Austria Labs As the sensor market surges ahead, driven by megatrends like the Internet of Things (IoT), digital healthcare, and smart packaging, it's becoming increasingly urgent to consider not just how sensors are made, but also but also what happens to them at the end of their life cycle. At Silicon Austria Labs (SAL), we are investigating a critical yet often neglected aspect of this growth from manufacturing until the end-of-life (EoL) of printed and hybrid sensors. Our research focuses on sustainability-driven design to address environmental implications. Why Now? Three Key Drivers 1. Ubiquitous Sensing The global sensor market is expanding rapidly, with an estimated annual growth of ~9% [1]. From automotive to digital health and industrial automation, sensors are being embedded everywhere to enable real-time monitoring and smart control. Driven by the rise of IoT-enabled environments, this trend will only accelerate. 2. Emergence of Single-Use Applications Fields like point-of-care (PoC) diagnostics [2] and smart packaging [3] are seeing unprecedented growth. These applications often require low-cost, disposable sensors integrated directly into products or packaging. Printed electronics have emerged as a key enabling technology in this context, offering thin, flexible, and scalable solutions that meet performance and cost demands. While functionally effective, these single-use applications raise red flags for sustainability. 3. Electronic Waste is the Fastest-Growing Waste Stream Electronics already represent the fastest-growing waste stream globally [4], yet printed sensors embedded in non-traditional products like packaging or textiles rarely end up in conventional e-waste streams. Instead, they are discarded alongside household or municipal waste, leading to a silent loss of valuable materials and a missed opportunity for resource recovery. Do not miss the TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now.   What Happens When the Sensing Ends? Printed sensors are typically composed of hybrid material systems, combining elements such as polymer substrates, functional inks, and often a semiconductor chip for wireless communication or data processing. Figure 1 presents examples of in-mold-electronic and PoC devices. As these technologies are increasingly deployed in everyday applications from packaging to diagnostics the question arises: What happens at the end of their short life? Figure 1: Example of (a) in-mold-electronics and (b) PoC diagnostic device enabled by printed electronics technologies (KERMIT project: www.kermitsense.eu). Based on the European Union’s waste hierarchy [5], SAL has examined end-of-life (EoL) options for printed single-use sensors. Landfilling: While biodegradable components, such as certain substrate materials, can break down over time, they may emit methane (CH₄), nitrous oxide (N₂O), and CO₂, all of which contribute to climate change. However, non-degradable components such as metal electrodes and microchips are even more concerning, as they remain in the environment for generations. Incineration (with Energy Recovery): While a small amount of energy can be recovered from the combustion of carbon-based components, non-combustible materials like silver and copper are too small to be extracted from bottom ash. These valuable and strategic metals are lost to landfilling or downcycling into construction materials, undermining circularity and resource conservation. Recycling: In theory, recycling is the most desirable path, yet it is rarely feasible in practice. The mixture of materials, use of encapsulants, and embedded chips make it difficult to separate and recover components. Currently, no standardized recycling infrastructure exists for these small, integrated devices. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin. Contact us for your special discount coupon to attend Bridging the Gap Between Innovation and Waste In a recent study published in Scientific Reports [6], we used life cycle assessment (LCA) to analyze the environmental hotspots associated with printed sensors. Contrary to expectations, we found that substrates, which are often the largest component by weight, contribute relatively little to overall environmental impact. Instead, it is the functional materials, such as nanoparticle-based inks or embedded semiconductor chips, that dominate environmental burdens. This challenges the intuitive assumption that "bulk equals burden" and emphasizes the need for system-level evaluation in sustainable design. Moreover, there is a blind spot that compounds the problem: printed sensors integrated into disposable products, such as packaging or textiles, do not typically enter the regulated e-waste stream. Instead, they are discarded as part of municipal waste, where they are neither recognized as electronics nor sorted for material recovery. This results in the loss of valuable functional materials – many of which are scarce, energy-intensive to produce, or considered strategic or critical by the EU [7] – and represents a missed opportunity to close resource loops. But this challenge also reveals a unique strength of printed electronics: Unlike conventional electronics, printed and hybrid electronics offer the possibility to work with novel or unconventional materials. This opens the door to reducing dependency on critical raw materials – a strategic global priority. Emerging sensor designs increasingly feature bio-based polymers, carbon-rich inks, and functional materials sourced from renewable streams. These innovations don’t just reduce environmental impact, but they diversify material sources, potentially shielding the industry from future supply shocks or geopolitical risks. Consequently, sustainability also presents a business opportunity: By designing systems around novel, secure, and recyclable material streams, companies can establish greater control over their supply chains and reduce exposure to material volatility. In the long term, such an approach could lead to industry-specific closed-loop ecosystems, where materials are deliberately selected not only for function but also for recoverability, safe degradation, or reintegration into new production cycles. To realize this vision, however, end-of-life considerations must be part of the innovation process from the start. Without that, the full potential of printed electronics as an enabler of a sustainable, resource-resilient future will remain unexploited. Rethinking Design: From Disposable to Responsible As printed single-use sensors continue to gain traction, the industry has the opportunity – and responsibility – to integrate environmental considerations from the outset. We need: • More transparency on materials and recyclability • Cross-sector collaboration to define end-of-life pathways • Continued development of eco-conscious sensor designs At Silicon Austria Labs, we see sustainability not as a barrier but as an opportunity. The future of electronics is not just smart. It must be sustainable. Let’s build that future together. For collaboration opportunities or further information, visit www.silicon-austria-labs.com or connect with us on LinkedIn (https://www.linkedin.com/company/silicon-austria-labs/).   About Silicon Austria Labs (SAL)  Silicon Austria Labs GmbH (SAL) was founded in 2018 as a top non-university research center in the field of Electronics and Software Based Systems. At its locations in Graz, Villach and Linz, research is conducted on key technologies in the fields of Microsystems, Sensor Systems, Power Electronics, Intelligent Wireless Systems and Embedded Systems. SAL brings together key players from industry and science and thus valuable expertise and know-how, and conducts cooperative, application-oriented research along the value chain. The aim is to accelerate the value creation process from idea to innovation – with excellent research and economic benefits. Owners are the Republic (50.1%), the Provinces of Styria and Carinthia (10% each), the Province of Upper Austria (4.95%) and the Association for the Electric and Electronics Industry (24.95%).    References: [1] Sensor Market Size, Share & Analysis | Growth Report [2032] [2] Point Of Care Diagnostics Market Size & Share Report, 2030 (grandviewresearch.com) [3] https://www.gminsights.com/industry-analysis/smart-packaging-market [4] Global E-Waste Monitor 2020 (UNITAR) [5] Waste Framework Directive - European Commission (europa.eu) [6] Zikulnig, J., Carrara, S., & Kosel, J. (2025). A life cycle assessment approach to minimize environmental impact for sustainable printed sensors. Scientific Reports, 15(1), 10866. [7] https://single-market-economy.ec.europa.eu/sectors/raw-materials/areas-specific-interest/critical-raw-materials/critical-raw-materials-act_en? We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend Do not miss TechBlick event on 11-12 June 2025 in Boston. Our Final Attendee Discount Ends Soon!  Book you tickets now.

#PrintedElectronics #MultiMaterialPrinting #LaserPrinting #Disruption #AdditiveElectronics Author: Masoud Mahjouri-Samani | CEO and Founder NanoPrintek, info@nanoprintek.com In labs across the world - whether in industry, government, or academia - there’s a shared frustration: the path from concept to product is too slow, too expensive, and often restricted by the limitations of the tools themselves. For decades, R&D and Production labs have had to work around the constraints of ink-based printing systems - formulating complex inks, fighting clogs and contamination, dealing with post-processing steps, and adapting their ideas to match the tool rather than the other way around. At NanoPrintek , that paradigm is being reimagined. Figure 1. The paradigm is being reimagined. NanoPrintek’s ink-free multimaterial printing platform  doesn’t just eliminate inks - it eliminates the compromises that come with them. Instead of using liquid formulations with short shelf life and questionable reliability, NanoPrintek’s technology prints directly from solid pellets of the desired material — metal, ceramic, dielectric, or composite. Using a combination of laser-induced nanoparticle generation  and real-time laser sintering , the platform creates pure, high-performance printed features right where you want them - on many substrates. There’s no drying time, no curing stage, and no solvents to remove. What you get is a clean, fast, and incredibly versatile system that can take you from idea to functional device in a matter of hours. Figure 2. Examples of printing various materials directly from raw sources. A New Way to Print — Without Inks, Without Limits Imagine being able to print a complete multimaterial device structure from solid materials in one run  without ever touching a drop of ink . We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action That’s exactly what NanoPrintek’s printers offer. The technology works by ablating nanoparticles from a target pellet using a finely tuned laser, propelling them toward a substrate, and then sintering them instantly into a fully formed pattern. Everything happens in real time, without chemicals, binders, or additional processing. The result? A simplified, cost-effective, and sustainable process  that lets researchers print what they want, how they want it — whether on paper, glass, plastic, or even stretchable polymers. Figure 3. Printing on various substrates. Figure 4. From single materials to hybrid structures From Concept to Device - Without the Waste There’s also a sustainability story here that can’t be ignored. By removing inks from the equation, NanoPrintek eliminates the use of harmful solvents and binders. There’s no runoff, no chemical waste, and no energy-intensive curing steps. You use only what you need, when you need it —and the solid targets are shelf-stable, clean to handle, and easy to store. This makes the system not only better for the planet but also safer and more convenient for its users. Real Impact Across Key Sectors What makes this platform especially compelling is how broadly it applies. In the defense sector, the ability to print multimaterial circuits on-site - without fragile fluids or bulky equipment - opens doors for field-ready prototyping and battlefield repairs. In aerospace , the platform's compact footprint and low power needs make it a strong candidate for in-situ manufacturing aboard spacecraft or remote bases. In the energy  space, researchers are using NanoPrintek to explore next-gen batteries and supercapacitors with complex material architectures that would be impossible to formulate into inks. In biomedicine , the clean, solvent-free printing process is ideal for developing sensors on biocompatible or biodegradable substrates, from smart bandages to neural interfaces. Across all of these domains, the common thread is clear: less time preparing materials, less cost, and more time innovating with them . We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action The Future of Printed Electronics Is Ink-Free NanoPrintek’s ink-free multimaterial printing isn’t just a new technology — it’s a new way of thinking about additive manufacturing. It puts the focus back on speed, flexibility, and creative freedom , without the overhead of traditional processes. And for researchers and developers who are pushing the boundaries of what’s possible, it offers a clear path to get there — faster, cheaper, cleaner, and with more control than ever before. In a world that demands agility, sustainability, and precision, NanoPrintek is delivering the tools to keep you ahead of the curve . Want to learn more about how ink-free printing can transform your lab, research center, or advanced manufacturing team? Visit www.nanoprintek.com  or reach out to info@nanoprintek.com Proudly engineered and manufactured in the USA. We are Exhibiting in Boston and Berlin. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend. We will bring our machine so join us to see it in action

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) is just less than a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations and material innovations as well as applications, manufacturing, and enabling technologies related to flexible hybrid electronics in wearable sensors and biosensors In this particular article, we focus on several applications beyond wearables/sensors as well as additional critical process innovations that advances the art of additive, hybrid and 3D electronics. Final Early Bird Discount Ends Soon! NASA Goddard Space Flight Center : NASA’s 3D Printed Electronics Lab enables custom antennas, sensors, and circuits to be printed directly onto spacecraft surfaces, enhancing performance and reducing SWaP. Printed solutions allow precise control over materials and geometry, improving reliability and accelerating mission design cycles. Raytheon | An RTX Business presents advances in Printed Hybrid Electronics (PHE) for next-gen RF systems. Using direct-write additive manufacturing, Raytheon develops printed interconnects and passive components to reduce SWaP, eliminate soldering, and enable conformal designs. Work at RURI focuses on board-level printing of coatings, resistors, capacitors, and inductors for reliable, compact, and structurally integrated electronics. Boeing Research & Technology - John D. Williams discusses advances and ongoing challenges in adopting additive electronics in aerospace systems. Final Early Bird Discount Ends Soon! Jones Healthcare Group presents intelligent packaging solutions designed to improve medication adherence through integrated printed electronics. Smart packaging enables real-time tracking, reminders, and data logging—enhancing patient outcomes and supporting connected healthcare systems IEE Sensing presents automotive use cases for printed electronics, from legacy safety systems to emerging needs in smart mobility, sensing, and infotainment. Hybrid electronics enable sensor fusion and edge computing for in-cabin monitoring and beyond. Dracula Technologies highlights scalable inkjet-printed organic photovoltaics for powering IoT devices via indoor light. Fully printed IOPV modules support autonomous, battery-free operation with shape customization. Final Early Bird Discount Ends Soon! Greensource Fabrication outlines U.S. PCB reshoring enabled by Zero Liquid Discharge (ZLD) systems and IC substrate capabilities via Semi-Additive Processes. A roadmap for sustainable and advanced domestic production will be presented. DEVCOM Army Research Lab presents a study on the durability of printed hybrid electronics under extreme mechanical shock. Using a “mill-and-fill” method with sintered silver traces on polymeric substrates, assemblies were subjected to up to 100,000 g impacts. Findings revealed low-cycle fatigue behavior, with cumulative shock leading to cracking, electrical degradation, and eventual component detachment. E Ink outlines advances in color-changing ePaper technology, enabling ultra-low power, full-color displays for outdoor signage and other sustainable applications. The new platform combines ACeP™ pigment mechanisms with microcapsule structures to deliver high-contrast, wide-temperature-range displays up to 75". The talk highlights real-world use cases and sustainability benefits of these dynamic surfaces. Final Early Bird Discount Ends Soon! TracXon introduces a patented, high-speed roll-to-roll process for printing vertical interconnects (VIAs), addressing a key bottleneck in printed electronics. This breakthrough enables double-sided, high-density circuitry without costly multi-layer isolation stacks. TracXon’s VIA filling system integrates with existing R2R and S2S lines, bringing printed electronics closer to PCB-level complexity. Essemtec presents precision jetting and mounting platforms for flexible substrates, addressing challenges like adhesive rheology and fine-pitch component placement in printed electronics. Notion Systems outlines industrial deployment of inkjet and EHD printing for miniaturized electronics. The session covers resolution, material compatibility, and real-world case studies, concluding with insights into ongoing R&D. Final Early Bird Discount Ends Soon! Altium discusses a cloud-based vision for agile electronics development, enabling real-time collaboration across engineering, procurement, and project teams. The platform integrates AI-assisted requirements, shared design environments, and supply chain visibility - streamlining the path from concept to manufacture and transforming hardware development into a truly agile process. Advanced Printed Electronics Solutions discusses strategies for scaling additive electronics through improved CAD/CAM tools and adaptive manufacturing. The talk addresses key barriers to broader adoption - design complexity, performance, and volume production - and highlights how emerging technologies enable both mass customization and scalable manufacturing. 3DFlexible presents a conformal circuit printing approach using AM-enhanced 5-axis CNC platforms. By integrating printing and post-processing tools with automated tool changing and multi-axis motion, the system enables precise, multi-layer deposition on complex surfaces. This cost-effective, reliable solution advances conformal electronics manufacturing on standard CNC hardware. Final Early Bird Discount Ends Soon! FineX – Panasonic showcases roll-to-roll fine mesh production for transparent conductive films used in EMI shielding, de-icing, photovoltaics, and displays. The solution addresses scalability and cost barriers of micron-scale “invisible” meshes. MicroContinuum, Inc presents a scalable roll-to-roll subtractive process for producing multilayer nano/micro-patterned films combining polymers, metals, and dielectrics. These flexible substrates enable advanced applications like OLED lighting, IR energy harvesting, and metamaterials. A key focus is improving OLED efficiency via nanoarray light extraction and transparent metal mesh electrodes. Carpe Diem Tech will also present the latest advances on nanoimprint lithography for flexible printed hybrid electronic and optical applications. Final Early Bird Discount Ends Soon!

Author: Rudy Ghosh, Vice President - Business and Applications Development, NovaCentrix #PrintedElectronics #AdditiveElectronics #GoldInks #CondutiveInks #Innovation #HighAspectRatio The performance demands of next-generation electronic systems—especially in biomedical devices, sensors, and RF platforms—are outpacing what traditional fabrication methods can deliver. Increasingly, designers require conductive materials that can support not only fine-line patterning but also vertically structured, high-aspect-ratio features on unconventional substrates. At NovaCentrix, we’ve developed advanced gold inks optimized for exactly these challenges, engineered for compatibility with high-resolution deposition systems like inkjet and aerosol jet printers. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend Material Design for 3D and High-Fidelity Printing NovaCentrix’s Metalon® gold inks are designed to meet the precision demands of modern additive electronics—particularly in biomedical engineering—where fine features, complex 3D geometries, and biocompatibility are all critical requirements. Two of our flagship inks, JG-125 and JG-024UA, exemplify this focus on performance and process adaptability. JG-125 is a water-based gold nanoparticle ink optimized for inkjet printing, offering excellent stability, adhesion, and print fidelity on flexible and rigid substrates. It is well-suited for applications requiring fine-line patterning and high electrical conductivity, and can be processed with conventional thermal curing or advanced photonic techniques. JG-024UA, on the other hand, is tailored for aerosol jet printing using ultrasonic atomization. With its higher solids content and carefully tuned rheology, this formulation supports the stable, high-resolution deposition needed for 3D microstructures, such as vertically printed micropillars and high-density interconnects. In addition to their print fidelity and process compatibility, both JG-125 and JG-024UA deliver excellent electrical performance. When thermally cured, these inks achieve volume resistivities as low as 1.3 × 10⁻⁵ Ω-cm—less than 6X that of bulk gold. These inks can also be photonically-cured offering flexibility for temperature-sensitive substrates. This level of conductivity is critical for fine-feature and high-aspect-ratio designs where signal integrity, miniaturization, and reliability go hand in hand. Together, these inks form a versatile platform for printed electronics—enabling both 2D and 3D additive manufacturing across biomedical, RF, and sensor applications, where precision, reliability, and biocompatibility are essential. In addition to our ink formulations, we also offer stable gold nanoparticle dispersions in water, available in concentrations ranging from 1% to 50% by weight. These are suitable for a variety of research applications beyond printed electronics. Aerosol-Based Printing in Focus: Enabling High-Aspect-Ratio Microstructures Figure 1: High resolution printing of JG-027UA-10% using IDS NanoJet Aerosol printing. Figure 2: Printed 3D interconnects using Optomec's Aerosol Jet printing technology with JG-024. Aerosol jet printing (AJP) has emerged as a go-to technique for fine-line, high-aspect-ratio printing, especially when working with free-form or temperature-sensitive substrates. Our collaborations have allowed us to fine-tune ink formulations for our partners at IDS (JG-027UA-10%) and Optomec (JG-024UA), yielding compelling results in both resolution and z-axis structuring. One of the most compelling demonstrations of this capability comes from KU Leuven, where researchers used a NovaCentrix-developed gold ink in a comprehensive design of experiments (DOE) study to fabricate arrays of 3D micropillars using ultrasonic-mode AJP on glass and flexible TPU films. Using a 45 wt% AuNP-based ink (diluted 2:1 with MilliQ water for 3D builds), the team was able to: Print micropillar arrays as small as 50 µm in diameter Achieve heights up to 436 µm with an aspect ratio of 9.3 Maintain shape fidelity using layer-by-layer builds in <10 minutes per structure Validate high electrical conductivity Demonstrate excellent biocompatibility with human fibroblast cell cultures The optimized print condition delivered the best shape fidelity and vertical resolution with minimal overspray. Sintering at 200°C post-printing ensured dense and continuous conductive networks. Figure 3: Layer by layer printing of micropillars with print resolution down to 40 microns and pillar height ~ 500 microns. Pictures courtesy of Dr. Miriam Seiti, Prof. Eleonora Ferraris, Advanced Manufacturing Laboratory at KU Leuven. Proof-of-Concept: 3D Flexible Microelectrode Arrays Taking this a step further, the team printed fully gold-based 3D MEA chips directly onto flexible TPU substrates. These devices, inspired by commercial 60MEA architectures, featured vertically printed micropillars on electrode pads with resolution down to 40 µm and a total device size under 12 mm. Notably, the devices retained their integrity and performance even under bending—highlighting the mechanical resilience of both the ink and the printing process. This kind of structure—difficult or impossible to manufacture with conventional lithographic techniques—demonstrates the unique opportunity that additive manufacturing, combined with precision-engineered inks, brings to advanced electronics. Figure 4: Flexible 3D printed microelectrode array (MEA) chip on Thermoplastic Polyurethanes (TPU) foil. Pictures courtesy of Dr. Miriam Seiti, Prof. Eleonora Ferraris, Advanced Manufacturing Laboratory at KU Leuven. Broader Applications and Industry Validation In addition to the KU Leuven work, NovaCentrix gold inks have been featured in several other high-impact 2024 studies, supporting applications such as: Flexible ceramic rectennas for wireless power (University of Washington) Organic electrochemical transistors (American University of Beirut and The University of Hong Kong) Thermoelectric generators (INRS-Canada) Biosensors for healthcare diagnostics (Old Dominion University) Each of these examples underscores the versatility of our ink platform: printable on flexible substrates, compatible with sintering or photonic curing, and fine-tuned for mechanical, electrical, and biological integration. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend Looking Ahead The convergence of materials science and additive manufacturing is reshaping the future of electronics. By collaborating with researchers, equipment manufacturers, and device designers, NovaCentrix is helping to close the gap between materials capability and system-level need. Our commitment is simple: to provide high-performance, application-driven ink solutions that unlock design freedom, miniaturization, and functional complexity—without compromising manufacturability or reliability. If you have any specific conductive ink questions that need a customized materials solution we would love to chat. Please reach out at rudy.ghosh@novacentrix.com We are Exhibiting in Boston. Visit our booth at the TechBlick event on 11-12 June 2025 in Boston Contact us for your special discount coupon to attend

From AI-powered AR smartglasses to defect-free red micro-LEDs: Innovations shaping the future of electronics This edition dives into work by LetinAR, Arkema, ADDEV Materials, Micropen Technologies, and Verticle. You’ll learn how LetinAR’s plastic reflective waveguides are bringing high-performance AI into everyday smartglasses, how Arkema’s printable piezoelectric polymers are enabling smarter human-machine interfaces, and how ADDEV’s ultra-thin heating film is already being used by battery manufacturers for safety testing. We also explore Micropen’s unique 5-axis printing system for space-grade materials and Verticle’s solution to a long-standing bottleneck in red micro-LEDs: defect-free mesa etching. LetinAR | Advancements in plastic reflective waveguides for enhanced AI integration in AR smartglasses Arkema | Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions ADDEV Materials | Flexible Printed Substrate as a Smart Heating Solution for Industrial applications Exxelia Micropen | Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing Verticle | Defect-free AlGaInP micro-LEDs by wet chemical etching The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥 FINAL Early Bird rates expire on May 30, 2025 . 💥  Register Now! LetinAR | Advancements in plastic reflective waveguides for enhanced AI integration in AR smartglasses Jiwon Rho Plastic reflective waveguides have significantly contributed to reducing manufacturing costs and minimizing the form factor of augmented reality (AR) smartglasses while delivering high-quality visuals through OLED microdisplays. This presentation will introduce LetinAR’s latest developments in optimizing AR systems for seamless integration with artificial intelligence (AI). The focus is on enhancing visual performance and power efficiency to enable all-day use of intelligent, context-aware AI experiences. Novel design methodologies for plastic reflective waveguides are introduced, which improve optical efficiency and display quality. Strategies for incorporating AI processing capabilities into AR smartglasses without compromising compactness or battery life are also discussed. Experimental results demonstrate substantial improvements in visual clarity and energy consumption, highlighting the potential for practical, AI-driven AR applications in everyday use. What you will learn in this presentation: How plastic injection molding-based optics can significantly reduce manufacturing costs, making smartglasses more accessible to a broader market. Why reflective optics offer superior image quality a key factor for enhancing user experience in real-world applications. A clear breakdown of the four main categories of smartglasses: VST Headsets, OST Headsets, AR Glasses, and AI Glasses. An inside look at LetinAR’s latest advancements in optical performance and how they are shaping the future of smart eyewear. Download the full presentation here Arkema  | Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions Mickael Pruvost Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products. Download the full presentation here The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website  here. Final Attendee Early Bird Registration is now open! Register today and take advantage of our FINAL Early Bird rates  before they expire on May 30, 2025 . 🔗 Register Now! TechBlick.Com ADDEV Materials  | Flexible Printed Substrate as a Smart Heating Solution for Industrial applications Aziz Rezig This talk will explore: An introduction to NEOHEATER, a flexible and ultra-thin (≈125 µm) smart heating film designed via screen-printing, optimized for high-temperature industrial applications. Real-world use cases across sectors such as space, aerospace, automotive, and broader industrial applications. Insights into how NEOHEATER is used to simulate thermal runaway in battery modules, including: Design specifics: 56 x 35 mm heater with adhesive backing Capability to reach 250°C for 5 minutes at 30W, enabling controlled testing environments Key advantages of the technology: slim profile, ease of integration, strong adhesion, and rapid heat-up time. Performance in cold environments, with examples targeting a 70°C temperature differential (from -7°C to 67°C using 60W input). Ongoing development of flexible temperature sensors for real-time power regulation and control of NEOHEATER systems. A detailed business case: Heated armrest solution featuring: Integration of thermal sensors, Bluetooth connectivity, and API-driven temperature control Precision temperature tracking with ±1°C sensitivity Applications in automotive, healthcare, and industrial environments Download the full presentation here Exxelia Micropen  | Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing Roberta Greco Novel dielectric materials that are polymer-nanocomposite based are now available for use in additive manufacturing products. Lightweight and thermoformable, the Wave-Pro material is the next generation dielectric material for a variety of different antenna and space applications. Using the Micropen to direct write patterns on thermoformed shapes has opened the door to a wide range of technology options where bare alumina was unable to compete. The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra- precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible, irregular, and highly three-dimensional shapes. This talk will provide an overview of the Micropen additive dispense integration of the new Wave-Pro material set and custom CMI formulated ink system. Download the full presentation here Verticle  | Defect-free AlGaInP micro-LEDs by wet chemical etching Mike Yoo Micro-LED is known as the best display technology for the next generation displays, however real commercialization has been repeatedly delayed due to lack of advanced process technologies. Besides the mass transfer, RGB integration and enhancing efficiency of the small LED die appears more critical to be resolved. The biggest hurdle for RGB integration is making small red LED die having comparable efficiency to the blue and green. AlGaInP native red, quantum dot, and InGaN reds have been widely attempted. While AlGaInP red appears to be a strong contender, however, fatal disadvantage is an outrageously low efficiency due to sidewall defects formed by mesa dry etching, thus, defect-free mesa etching technology has been highly sought. Recently, we have achieved a crucial breakthrough in developing mesa etching of the AlGaInP native red micro-LED by “defect-free” wet chemical etching. In the past most of the efforts have been focused on the post dry etching recovery, However, they are helpful for partial recovery only. More importantly, they are not effective for the small die because sidewall defect penetration depth is close to or excess of the micro-LED die. According to our cathodoluminescence results, the sidewall defect penetration depth of the dry etched micro-LED is more than 7 m, while it is less than 0.2 m for the wet etched micro-LED. Thus, effective mesa area of the dry etched red micro-LED is only 28% of the wet etched, which implies that almost no or negligible number of defects exist in the wet etched red micro-LED. Further, our wet etching is capable to etch thicker than 6 m AlGaInP epi layers with etch rate similar to dry etching. In particular, it is one-step etching for any combination of binary, trinary, and quaternary compound semiconductor alloys without need for multiple photo-lithography processes. The chip sidewall is highly vertical and anisotropic; thus, no undercuts are observed after mesa etching. Both defect-free etching and promising etch profile results indicate that our wet etching technology is ready to apply for mass production process for mesa etching of the phosphide-base native red micro-LEDs. Download the full presentation here The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration:   🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🔥  Register Now! TechBlick.com