Speaker: John Fahlteich | Company: Fraunhofer FEP | Date: 11-12 May 2021 | Full Presentation Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs). Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described. Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings. John Fahlteich Group Leader coFlex | Deputy Head of Department R2R Technologies @ Fraunhofer FEP Bio Dr. John Fahlteich born 1981, graduated from the University of Leipzig with a diploma in physics in 2005. In 2010, he earned a PhD from the Technical University of Chemnitz with a thesis about vacuum deposited permeation barrier layers. In total, he has now 15 years of experience in Roll-to-Roll Thin Film Coating on Plastic Web. John is a Research Group Leader in the Business Unit “Plasma Technology” at Fraunhofer FEP. As of today, he published over 40 papers, conference contributions and patents as well as three book chapters in the field. John is currently principal consortium coordinator of three Horizon 2020 funded Projects (Switch2Save, NanoQI, and the Open Innovation Test Bed FlexFunction2Sustain). Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Researchers from the University of Notre Dame and the University of Florida have developed a sensor that could diagnose a heart attack in less than 30 minutes, according to a study published in Lab on a Chip"A multiplexed ion-exchange membrane-based miRNA (MIX·miR) detection platform for rapid diagnosis of myocardial infarction". "Currently, it takes health care professionals hours to diagnose a heart attack. Initial results from an echocardiogram can quickly show indications of heart disease, but to confirm a patient is having a heart attack, a blood sample and analysis is required. Those results can take up to eight hours." “The current methods used to diagnose a heart attack are not only time intensive, but they also have to be applied within a certain window of time to get accurate results,” said Pinar Zorlutuna, the Sheehan Family Collegiate Professor of Engineering at Notre Dame and lead author of the paper. “Because our sensor targets a combination of miRNA, it can quickly diagnose more than just heart attacks without the timeline limitation.” "By targeting three distinct types of microRNA or miRNA, the newly developed sensor can distinguish between an acute heart attack and a reperfusion — the restoration of blood flow, or reperfusion injury, and requires less blood than traditional diagnostic methods to do so. The ability to differentiate between someone with inadequate blood supply to an organ and someone with a reperfusion injury is an unmet, clinical need that this sensor addresses." “The technology developed for this sensor showcases the advantage of using miRNA compared to protein-based biomarkers, the traditional diagnostic target,” said Hsueh-Chia Chang, the Bayer Professor of Chemical and Biomolecular Engineering at Notre Dame and co-author of the paper. “Additionally, the portability and cost efficiency of this device demonstrates the potential for it to improve how heart attacks and related issues are diagnosed in clinical settings and in developing countries.” "A patent application has been filed for the sensor and the researchers are working with Notre Dame’s IDEA Center to potentially establish a startup company that would manufacture the device." "Bioengineers Chang and Zorlutuna are both affiliated with Notre Dame’s Institute for Precision Health. Additional co-authors from Notre Dame are Stuart Ryan Blood, Cameron DeShetler, Bradley Ellis, Xiang Ren, George Ronan and Satyajyoti Senapati. Co-authors from the University of Florida are David Anderson, Eileen Handberg, Keith March and Carl Pepine. The study was funded by the National Institutes of Health National Heart, Lung, and Blood Institute." Source:https://research.nd.edu/news/low-cost-portable-device-could-diagnose-heart-attacks-in-minutes/

A group of researchers from Istituto Italiano di Tecnologia, Politecnico di Milano and Gyeongsang National University has published Nature Communications paper "A sub-150-nanometre-thick and ultraconformable solution-processed all-organic transistor" where they managed to fabricate the first example of ultra-thin fully solution processed organic transistors of thinner than 150 nm and low bending radii, below 0.8 μm. "Recent advancements in the field of electronics have paved the way to the development of new applications, such as tattoo electronics, where the employment of ultra conformable devices is required, typically achievable with a significant reduction in their total thickness. Organic materials can be considered enablers, owing to the possibility of depositing films with thicknesses at the nanometric scale, even from solution. However, available processes do not allow obtaining devices with thicknesses below hundreds of nanometres, thus setting a limit. Here, we show an all-organic field-effect transistor that is less than 150 nm thick and that is fabricated through a fully solution-based approach. Such unprecedented thickness permits the device to conformally adhere onto nonplanar surfaces, such as human skin, and to be bent to a radius lower than 1 μm, thereby overcoming another limitation for field-effect transistors and representing a fundamental advancement in the field of ultrathin and tattoo electronics." "Here, we demonstrate that it is possible to fabricate an all solution-processed OFET with a total thickness <150 nm, which is the thinnest freestanding transistor ever fabricated, by adopting an approach based on solution-assisted delamination of free-standing ultrathin insulating poly(vinyl formal) (PVF) layers employed as a self-standing (or self-supporting) gate dielectric. As a consequence, we also demonstrate the smallest bending radius (0.7 µm) reported thus far for any transistor technology. Due to its ultralow thickness, the device shows high transparency, together with an extremely high level of conformability, and is able to confirm on complex 3D surfaces, such as human skin. Such a result pushes even further the boundaries of ultrathin organic electronics towards solution-based and large-area produced imperceptible systems suitable for integration on top of prefabricated objects to make them “smarter” or “connected” without altering their aspect, with simple lamination processes driven by van der Waals forces. In addition to higher mechanical robustness and flexibility, a thinner device implies lower volumes of materials, especially substrates, a critical aspect for the sustainability of electronics conceived to be disposable."

"A team of bioengineers at the UCLA Samueli School of Engineering has invented a novel soft and flexible self-powered bioelectronic device. The technology converts human body motions — from bending an elbow to subtle movements such as a pulse on one’s wrist — into electricity that could be used to power wearable and implantable diagnostic sensors". The research results are published by Nature materials "Giant magnetoelastic effect in soft systems for bioelectronics" "The researchers discovered that the magnetoelastic effect, which is the change of how much material is magnetized when tiny magnets are constantly pushed together and pulled apart by mechanical pressure, can exist in a soft and flexible system — not just one that is rigid. To prove their concept, the team used microscopic magnets dispersed in a paper-thin silicone matrix to generate a magnetic field that changes in strength as the matrix undulated. As the magnetic field’s strength shifts, electricity is generated." “Our finding opens up a new avenue for practical energy, sensing and therapeutic technologies that are human-body-centric and can be connected to the Internet of Things,” said study leader Jun Chen, an assistant professor of bioengineering at UCLA Samueli. “What makes this technology unique is that it allows people to stretch and move with comfort when the device is pressed against human skin, and because it relies on magnetism rather than electricity, humidity and our own sweat do not compromise its effectiveness.” "Chen and his team built a small, flexible magnetoelastic generator (about the size of a U.S. quarter) made of a platinum-catalyzed silicone polymer matrix and neodymium-iron-boron nanomagnets. They then affixed it to a subject’s elbow with a soft, stretchy silicone band. The magnetoelastic effect they observed was four times greater than similarly sized setups with rigid metal alloys. As a result, the device generated electrical currents of 4.27 milliamperes per square centimeter, which is 10,000 times better than the next best comparable technology." "In fact, the flexible magnetoelastic generator is so sensitive that it could convert human pulse waves into electrical signals and act as a self-powered, waterproof heart-rate monitor. The electricity generated can also be used to sustainably power other wearable devices, such as a sweat sensor or a thermometer." "There have been ongoing efforts to make wearable generators that harvest energy from human body movements to power sensors and other devices, but the lack of practicality has hindered such progress. For example, rigid metal alloys with magnetoelastic effects do not bend sufficiently to compress against the skin and generate meaningful levels of power for viable applications." "Other devices that rely on static electricity tend not to generate enough energy. Their performance can also suffer in humid conditions, or when there is sweat on the skin. Some have tried to encapsulate such devices in order to keep water out, but that cuts down their effectiveness. The UCLA team’s novel wearable magnetoelastic generators, however, tested well even after being soaked in artificial perspiration for a week." For more information: https://samueli.ucla.edu/ucla-bioengineers-develop-new-class-of-human-powered-bioelectronics/

"Swedish tech company DP Patterning, which offers innovative technology for flexible circuit board production, focuses its efforts on the German automotive industry, as its innovation revolutionizes circuit board manufacturing and disrupts an industry where every gram and step towards more sustainable manufacturing counts." "Flexible Printed Circuit Boards (FPCBs) are used in many electronic products and are globally mass-produced. They are an integral part of today’s technology and society and are used in everyday consumer appliances such as phones, wireless antennas, and to a large extent, newly produced vehicles." "Swedish-founded DP Patterning has invented a unique mechanical process called Dry Phase Patterning technology for producing FPCBs, which is more environmentally friendly and cost-efficient than other alternatives. The technology is designed for System & Solution Providers with electronic assembly capacity and for in-house production, it is customizable and simplifies the process of production by reducing transports and lead times as well as significantly cutting costs. By bringing the production of Flexible PCBs in-house, an entire step in the traditional chain of production can be saved." says "We’ve come up with an innovation that eliminates the traditional and hazardous chemical etching processes, typically conducted in distant countries, and replaces that with the in-house reel-to-reel process" Staffan continues "As the demand for green-tech production increases together with an increased interest in in-house production independent of trade wars and logistic cross border-challenges, we believe that our product can truly disrupt the traditional way of how the automotive industry produces new vehicles. We’re now putting all of our efforts toward the German market, the cradle of the European automotive industry." "The DP Patterning supports manufacturers and front-runners in the automotive, LED lighting, and RFID sectors, while continuously researching and developing green-tech system solutions to individual customer requirements." For more information visit: https://dppatterning.com/swedish-circuit-board-innovation-company-dp-patterning-set-to-disrupt-german-automotive-industry/

"The leading converting equipment manufacturer GM has announced that it is joining forces with SCIPRIOS GmbH to provide tailor-made, cutting-edge R&D coating solutions for both scientific research and industrial production in all areas of printed electronics." "Over the past decade, GM has successfully applied its deep knowledge of coating technology to specialized expand into the solar cell and other functional materials segments with its own specialised range of roll-to-roll thin-film coating machinery. As innovation in these markets continues to grow, so does the demand for expertise in handling the delicately printed, sensitive thin films used in printed electronics applications." "One of GM’s first customers in this area was the Solar Factory of the Future (SFF) at the Energy Campus in Nürnberg, Germany, a collaboration that is still ongoing. SCIPRIOS (Science-PrintingSemiconductors) was founded in 2018 as a spin-off from the SFF and the Bavarian Center for Applied Energy Research (ZAE Bayern). Headed up by Managing Directorspecialized Dr. Tobias Stubhan, the technology start-up provides turnkey pilot production lines for printed photovoltaics including printing, structuring, backend, and complete module processes." “This official announcement of our partnership is based on several years of fruitful collaboration,” says Uffe Nielsen, GM’s CEO. “Earlier this year, we took the next step and introduced the second generation of our SOLAR Coating Platform, which has been developed with SCIPRIOS. We are now extending that cooperation to also include sales, customer support and service, and consumables, as well as coating workshops and demos.” "The SOLAR-300 is a unique coating and printing platform available in widths of 330, 500, or 550 mm, or in a custom size. Completely modular, it can be configured with multiple slot die-coating stations, gravure coating, flexo printing, and rotary screen printing, and features the option to add laser cutting and inkjet printing in-line for manufacturing printed electronic devices in one pass. The machine has been designed so that is it suitable for both R&D and as a production machine, making it easy to upgrade to full-scale manufacturing." “Our partnership will equip researchers around the world with the tools that facilitate the development and upscaling of organic and perovskite photovoltaics, photodetectors, batteries, supercapacitors,, OLEDs for displays and lighting applications, fuel cells, smart windows and more for a brighter and more sustainable future,” concluded Uffe Sources: https://www.sciprios.de/news/ https://gm.dk/news/gm-announces-solar-printed-electronics-partnership-with-sciprios/

Speaker: Ajay Virkar | Company: C3Nano | Date: 11-12 May 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Conference Agenda | 13-14 October 2021 Add to your Calendar iCalendar (majority of email clients) | Google Calendar | Microsoft Outlook Calendar Office 365 Calendar | Yahoo Calendar Co-located LIVE (online) Event With Exclusive "In-Person Virtual" Exhibition & Networking Leading Global Speakers Include: And Many More... TechBlick’s fifth event in 2021 on 13-14 October will cover three overlapping themes: (1) Wearable Sensors & Continuous Vital Signs Monitoring, (2) Electronic Textiles & Skin Patches, and (3) Printed Sensors & Actuators. Handpicked leading companies will present the latest developments in wearable as well as remote sensing technologies for continuous measurement and modulation of body parameters including glucose, heart rate, blood pressure, sweat, brain and beyond. We cover invasive as well as non- invasive approaches. Furthermore, we cover electronic skin patches, e-textiles, brain-computer interfaces as well as remote non-contact camera-, radar-, or voice-based technologies. We bring together all aspects from end user perspectives to mass production progress to enabling materials and components, and finally, to the latest research breakthroughs. The main themes of the event are: Wearable Sensors, Smart Skin Patches, Printed Electronics. Remote Sensors, E-Textiles, Stretchable Electronics, and Fitness/Healthcare Monitoring SUB TOPICS: Wearables Sensors. Electronic Skin Patches. Stretchable Electronics. Printed Electronics. E-Textiles. Brain Computer Interfaces. Neuron Monitoring and Modulation. Invasive and Non-Invasive Continuous Glucose Monitoring. Implantables. Camera + AI. Voice as a Biomarker. Ultrasound. mmWave Radar + AI. Textile Computing. Smart Fabrics. Embroidered Electronics. Soft Circuits. Functional Fabrics. Conductive Inks. PCB on Textile. Textile-Based Object Recognition AI. Internet of Connected Fabrics. Muscle and Brain Simulation. TechBlick is a year-round event series with over 350+ Analyst picked live online presentations on emerging technologies. With a single Annual Pass you have 12 month access to our platform where you can join our live "in-person virtual" conferences, watch over 200 (and growing) on-demand presentations from past events, and engage with our ever-expanding portfolio of industry-led masterclasses. How Do "In-Person Virtual" Events Work? Our events are LIVE and online, but are truly interactive. See the 3-min demo video to see how an in-person virtual LIVE exhibition and networking works. You will also find our participant testimonials below too. Hear what our members say about TechBlick events "The TechBlick event on Printed Electronics has been a true success. One of the best virtual events - that I have ever attended. Great talks and networking opportunities." Swarovski "I loved the Techblick online experience. It was really immersive and compared to other digital events it had a real trade show feel." e2ip "The on-line netwoking/exhibition session was very similar to off-line netwokring/exibition.." LG Electronics "Khasha and his team have developed a wonderful "borderless" platform for exploring emerging technologies. Already looking forward to the next virtual conference" Panasonic Electronic Materials "I have enjoyed theTechBlick event. Even though I can't always listen live due to the time difference, I can join later, which is very useful for me." Fujikura Kasei "The networking session last week was very interesting! The virtual venue made me feel like having real conversation, it accelerated interactive communication with people. I really hope to join again next time" JX Nippon Mining & Metals Corporation "I am really impressed with what you put together. The breakout room works really well, almost better than in real world." IP Group "The event was awesome! TechBlick is a great platform." Applied Materials "Great work and the networking is awesome!" Eastprint Meet and Mingle with Our Exhibitors "In-Person Virtual" How does speed networking work online? A detailed overview of the platform including LIVE exhibitions How Does a Virtual Booth Work? How Does Real-Time Networking Work?

"ams Osram has announced a series of 2835 (2.8×3.5-mm) LEDs under the Osconiq brand including an emitter that uses quantum dot (QD) technology to more efficiently deliver excellent color rendering and warm CCTs. The new series further includes an LED with a cyan peak intended for lighting for health and wellbeing or circadian lighting applications. An 80-CRI mem2ber of the family for commercial and industrial (C&I) lighting applications completes the new series." "The 2835 opportunity has certainly caught the attention of LED manufacturers. Lumileds just announced higher-performing 2835 LEDs a few weeks ago and that was after a similar performance push in February. Osram has previously offered 2835 LED in its Duris family of LEDs that target mainstream, specification-grade lighting products. The Osconiq family generally targets architectural, professional-grade luminaires." "The three LEDs in the Osconiq E 2835 series cover a breadth of potential deployments in the C&I and adjacent application spaces. The standard Osconiq E 2835 CRI 80 is a component that can serve in mainstream C&I applications and that would allow a luminaire manufacturer to offer a product line with luminaires varying in color quality that all use LEDs from the same family. The company said the 80-CRI component might be used in office and retail applications". "The most significant member of the new series is perhaps the Osconiq E 2835 CRI 90 QD component. The use of QDs in the phosphor formulation provides a sharper cutoff of red energy outside the human visual range and therefore a more efficient LED at warm CCTs with excellent color rendering. The then-Osram Opto Semiconductors business unit announced commercial availability of the first QD-enabled LED for general lighting back in the summer of 2019." "ams Osram said the 2835 QD LED offers the expected evolutionary efficacy improvements from the 3030, but largely uses the same technology platform. The company said efficacy would exceed 200 lm/W even at warm CCTs and 90 CRI. The LED will be offered over the range of 2200K to 6500K CCT. The color quality is, of course, important for the intended applications, including high-end retail and hospitality, but it will also enable luminaire makers to meet the Single Lighting Regulation (SLR) policy on light source efficacy that the European Union is mandating by September 2021. The prescribed efficacy levels apply to 90-CRI LEDs and also require LEDs to offer R9 (saturated red) rendering at levels of 50 or better. The QD technology will play a big role in that new policy." "The QD performance could soon be pushed further. For now, RoHS regulations on hazardous substances limit the cadmium presence to a maximum of 100 ppm (parts per million) in the phosphor formulation, and thus far cadmium-free QD technology remains elusive for general illumination deployment. But ams Osram said lighting applications where the QDs are sealed and protected such as in its phosphor formulation may get exemptions from the cadmium limits by the end of this year." "ams Osram said the 2835 QD LED offers the expected evolutionary efficacy improvements from the 3030, but largely uses the same technology platform. The company said efficacy would exceed 200 lm/W even at warm CCTs and 90 CRI. The LED will be offered over the range of 2200K to 6500K CCT." "The color quality is, of course, important for the intended applications, including high-end retail and hospitality, but it will also enable luminaire makers to meet the Single Lighting Regulation (SLR) policy on light source efficacy that the European Union is mandating by September 2021. The prescribed efficacy levels apply to 90-CRI LEDs and also require LEDs to offer R9 (saturated red) rendering at levels of 50 or better. The QD technology will play a big role in that new policy." "The QD performance could soon be pushed further. For now, RoHS regulations on hazardous substances limit the cadmium presence to a maximum of 100 ppm (parts per million) in the phosphor formulation, and thus far cadmium-free QD technology remains elusive for general illumination deployment. But ams Osram said lighting applications where the QDs are sealed and protected such as in its phosphor formulation may get exemptions from the cadmium limits by the end of this year." "The final member of the new E 2835 family is the Osconiq E 2835 Cyan, and that LED squarely targets lighting for health and wellbeing applications. The LED is not QD-based. Rather, the LED appears to be based on a pair of blue pumps with the more powerful one operating in the cyan region centered at about 480 nm, while the traditional blue pump down at the 450-nm wavelength produces a relatively lesser energy peak." "Now ams Osram will have a similar tool for luminaire makers that want to offer products that can improve circadian health. The 480-nm peak would be utilized in the morning to boost alertness and ultimately to improve sleep patterns. And the cyan LED could be combined with the QD in a two-channel system that also could deliver a warm red-centric SPD later in the day and before bedtime." Source:https://www.ledsmagazine.com/leds-ssl-design/article/14207478/ams-osram-expands-qd-offer-and-adds-a-2835-for-humancentric-ssl

"Toshiba, the Japanese world-leader in development of perovskite photovoltaic modules for next-generation solar power generation, has developed a new coating method for the perovskite layer that boosts power conversion efficiency (PCE) to 15.1% for Toshiba’s 703cm^2 module, the highest for any large, polymer film-based perovskite photovoltaic module. The innovative coating method for perovskite layer also greatly reduces production time and costs, contributing to a lower cost for solar power generation." "Success in achieving carbon neutrality will require much greater use of photovoltaic power generation, and a significant expansion in locations where photovoltaic modules can be installed. Today’s most widely used photovoltaic modules are made with crystalline silicon and are heavy, and this, plus their rigidity, limits where they can be installed. The polymer film-based perovskite photovoltaic module is an attractive next-generation alternative, as it is thin, light and flexible, and can be installed in locations where it is difficult to use silicon photovoltaic modules, such as low load-bearing roofs and office windows. Recent improvements in the PCE of perovskite photovoltaic modules has brought them to a level comparable to that of silicon photovoltaic modules." "Toshiba’s latest breakthrough is the development of a new perovskite layer coating method. The company previously developed a two-step coating process that first applied a layer of PbI2 (lead iodide) ink to a substrate, followed by a layer of MAI (methyammonium iodide, CH3NH3I) ink, triggering a reaction that formed an MAPbI3 layer. However, this multi-step approach had a low coating rate and often left unreacted sections in the perovskite layer (Figure 1, left). The alternative is a one-step process that applies MAPbI3 ink directly, but it is not easy to control crystallization of the MAPbI3 and obtain a uniform perovskite layer across a large area (Figure 1, right). A new coating method that solves these problems was required." "Toshiba has developed a one-step meniscus coating method that uses improved ink, film drying processes and production equipment to form a uniform perovskite layer over an area as large as 703cm^2. These innovations halve the steps for deposition of the perovskite layer, and raise the coating speed to 6 meters per minute on a 5×5 cm^2 module, a rate that meets requirements for mass production (Figure 2, left)." "Applied to Toshiba’s previously reported 703cm^2 polymer film-based perovskite photovoltaic modules, the one-step meniscus coating method achieves a PCE of 15.1%, the world's highest ever for a polymer film-based large-area perovskite photovoltaic module. (Figure 2, right). This higher PCE and the faster, simplified production process, significantly advance progress toward the commercialization of highly efficient, low-cost, polymer film-based perovskite photovoltaic modules." "Toshiba’s printing technology for the production of film-based perovskite solar cell modules involves forming the substrate with a resin film, such as polyethylene terephthalate. It uses a planar inverted structure that can be produced at a temperature below 150 degrees Celsius for the cell structure. The company managed to form a uniform thin layer of methylammonium lead iodide by utilizing a meniscus printing technology that is developed by conducting research on organic thin-film solar cells. It is said that this improves the efficiency of panels by lowering the degree to which the cells vary from each other." "The flexible and lightweight panel is indicated by Toshiba as suitable for locations where it is difficult to install conventional crystalline silicon modules, such as low-load-bearing roofs and office windows. “Toshiba estimates that the new perovskite photovoltaic modules would generate power equivalent to two-thirds of the annual power consumption by homes in Tokyo if installed on a roof area of 164.9km^2, roughly equal to the roof surface area of all buildings in Tokyo,” the manufacturer further explained." "Toshiba will continue research on perovskite photovoltaic modules, aiming to increase PCE to 20% or more, and to enlarge the active area to 900cm2, the size required for practical application. The company estimates achieving these targets will cut the manufacturing cost of perovskite photovoltaic modules to \15/W (approx. $0.14/W)." "The newly developed coating technology and the perovskite solar modules that apply it are research results under a New Energy and Industrial Technology Development Organization (NEDO) project, Development of Technologies to Promote Photovoltaic Power Generation as a Main Power Source." For more information visit https://www.global.toshiba/ww/technology/corporate/rdc/rd/topics/21/2109-01.html https://www.pv-magazine.com/2021/09/09/toshiba-achieves-efficiency/ ^900cm^2,

Axxicon offers a microfluidic bonding technology guide and webinar to ease the decision of choosing the suitable microfluidic bonding for a high-quality consumable product. Figuring out the key criteria to consider and how several technical choices, at different stages of the process impact each other can be stressful when choosing the right microfluidic bonding technique. As an engineer, you must address design and process issues early to produce a high-quality consumable product. Requirements for the selection of your bonding process Each microfluidic product and application has unique requirements, and the bonding process you choose must meet those criteria as well. Common requirements are: Optical properties In some applications, it is essential to compromise the optical properties of the consumable like transparency, prevent autofluorescence Chemical and biological compatibility Biocompatibility, contact of reagents or samples with glues, VOCs Pressure stability For some applications pressures within the consumable can increase. Channel dimensions integrity The dimensions of structures like channels or cavities should stay within tolerance after bonding Design limitations Not all bonding processes might be compatible with all designs. Distance of features, available surface for bonding, this all can be relevant Reagent storage on-chip (before bonding) For example coatings or bio-reagents can be stored on-chip, but can they also survive the bonding process? Material compatibility Not all bonding processes work with all materials Shelf life How will the consumable be stored? Will there be reagents in the consumable during storage? Scalability and cost In product development scalability and cost is always relevant. In the end, the bonded product has to be produced in volumes and for a certain target price. It can be challenging to put these requirements together and choose a suitable process as there is no black and white answer. Luckily, we have outlined methods for selecting the best process for your specific application requirements in the remainder of this article. Also, our webinar on-demand will give you additional insight. Common bonding technologies There are a variety of bonding techniques available, some of which are more advanced than others. Let's look at the more mature ones that are commonly utilized in microfluidic consumables currently. Solvent Bonding With this technique, a solvent is used to form a strong, long-lasting bond between two polymer layers. This method is extremely adaptable and can be used with virtually any microfluidic design. However, if you add bio-reagents before bonding, this will not be a suitable option. The time required to bond a product is relatively long (10s of seconds), which will have an impact on the final price of the polymer consumable. Thermal Bonding Because no additives are used, this method provides a very pure and very strong material bond. As this process involves heat, no biochemicals or bio-materials should be present on the chip prior to bonding. The used heat can also cause some deformation of the microfluidic structures. The time it takes to bond layers together with this technique is longer, making it a costly operation with limited scaling possibilities. Adhesive Bonding This bonding process is extremely versatile due to the numerous options for application techniques, adhesive types, and curing parameters when necessary. Almost any structure can be bonded, and the process is simple to optimize. It is easy to scale up the process and offers a low-cost solution for producing microfluidic consumables in small to large quantities. However, it might not be compatible with all assays and in some cases might affect the dimensions of the microfluidic structures. Not all microfluidic designs might be compatible with the application methods. Shelf life varies per adhesive. Tape assisted bonding There is a wide range of tapes available that are suitable for a broad variety of products and assays. It is a low-cost process that is ideal for rapid testing and development. Tape surface properties can be customized. However, high hydrophilic tapes are hard to come by. Thinner tapes are difficult to process and can present difficulties, such as tape folding, and trapping bubbles. Laser welding Using this process the bond is formed by melting layers together with a laser. It creates a very pure and strong bond. The time required to form this type of bond is short, and it provides in-line capabilities for a production line. However, as the processing time increases with the complexity of the microfluidic structures it might not be a low-cost process for some consumables. Also most laser welding processes available need a non-transparent part for bonding. Ultrasonic welding In this technique, energy directors use ultrasonic vibrations to create a pure bond between the layers. It is a fast process using a well-established technology with a low development effort. This process, however, has an impact on your microfluidic design because energy directors must be implemented. Also if your product has very small and intricate features, this may not be the most accurate bonding method for your product. But how to decide? With all of this information, how do you choose the bonding process that is best for your unique polymer consumables, assay, and set up? Returning to the requirements for microfluidic bonding mentioned earlier, we can examine the various bonding technologies that can meet those requirements. The image below depicts the most appropriate microfluidic bonding technologies for the aforementioned requirements. Source: https://blog.axxicon.com/microfluidic-bonding-technology-guide-for-polymer-consumables

ISBC and Sappi have collaborated to present an innovative new smart paper with embedded RFID chips. The chips are embedded into the paper sheets causing no effect over the paper surface – it remains flat and smooth. "Printed electronics are decidedly on the move. Radio-frequency identification (RFID) is no longer a niche technology. It is already being used to great effect in many areas of everyday life: in our passports, ID cards and travel cards, clothes, library books, and much more. The vast scale and intricacy of the RFID market also offer new opportunities for the printing industry. " "With this in mind, ISBC from Singapore has developed and presented on the market an innovative product: ISBC RFID Paper. The product is sheet-fed and made with 100% fiber-based Swiss Matt paper substrate from specialty paper manufacturer Sappi. The smart RFID Paper supplier was looking for an alternative to plastic for smart printing and Sappi’s Swiss Matt paper – used mostly as an inkjet paper for large-format printing – was settled on due to its white surface, print results, and scratch- and water resistance. The companies also report that the product is as easy to print as a regular sheet of paper, reportedly making it a cost-efficient solution for printers." "Another advantage of the ‘sandwich product’ is that it can be printed with various kinds of printing techniques and machines – therefore eliminating costly in-house development work and avoiding investments in new equipment, software, and business processes. The desired information can simply be transferred to the paper-embedded RFID chip: for the encoding process, ISBC has developed a special encoding machine and training materials. ISBC RFID Paper line made from Swiss Matt is used mainly for business cards, postcards, stickers, promotional flyers, POS materials, access & loyalty cards, brand protection labels, diplomas among many other applications." "In terms of resource conservation and environmental protection, RFID Paper delivers significant advantages over conventional plastic tags. Ivan Demidov, ISBC founder, and inventor says: “Our patented technology is unique on the market. It offers end-users a PVC-free, more sustainable, and future-proof option.” Paper-based RFID tags reduce waste both during production and at the end of the product’s lifecycle. Printing processes also consume less energy and resources, which leads to a reduced carbon footprint for forward-looking, sustainability-conscious B2B and B2C companies." "ISBC RFID Paper is suitable for a wide range of applications in numerous industries. Specifically, it can be used for contactless tickets on buses, trains, trams, and other means of transportation, as well as for prepaid cards and gift cards, business cards, and access control, including key cards for hotel rooms, ski passes, or admission wristbands for events and trade fairs. The paper-based sensors and labels can also be integrated into diplomas and other certificates to verify document authenticity. Conventional postcards can also be enhanced by integrating an RFID tag with interactive URLs." Sources: https://www.labelsandlabeling.com/news/new-products/sappi-and-isbc-develop-rfid-paper https://ope-journal.com/news/sappi-and-isbc-smart-paper-with-embedded-rfid-tags-opens-up-new-business-opportunities https://packagingeurope.com/sappi-and-isbc-bring-together-digital-and-paper-sectors/